Some contents are subject to change without notice.
2,415,919,104-BIT ( 33,554,432-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
The MH32S72AQJA is 33554432 - word x 72-bit
Synchronous DRAM module. This consist of eighteen
industry standard 32M x 4 Synchronous DRAMs in
TSOP.
The TSOP on a card edge dual in-line package provides
any application where high densities and large of
quantities memory are required.
This is a socket-type memory module ,suitable for
CLK
Max.
Access Time
MITSUBISHI LSIs
MH32S72AQJA-7, -8
85pin
94pin
1pin
10pin
Utilizes industry standard 32M X 4 Synchronous DRAMs in
TSOP package , industry standard Resistered buffer in TSSOP
package and industry standard PLL in TSSOP package
Single 3.3V +/- 0.3V supply
LVTTL Interface
Burst length 1/2/4/8/Full Page(programmable)
Burst Write / Single Write(programmable)
Auto precharge / All bank precharge controlled by A10
Auto refresh and Self refresh
4096 refresh cycles every 64ms
Discrete IC and module design conform to
PC/100 specification.
(module Spec. Rev. 1.2 and SPD 1.2A)
Main memory unit for computers, Microcomputer memory.
95pin
124pin
125pin
168pin
11pin
40pin
41pin
84pin
MIT-DS-0371-0.2
MITSUBISHI
ELECTRIC
17/Mar./2000
1
Preliminary Spec.
Some contents are subject to change without notice.
MITSUBISHI LSIs
MH32S72AQJA-7, -8
2,415,919,104-BIT ( 33,554,432-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
PIN NO.PIN NAMEPIN NO.PIN NAMEPIN NO.PIN NAMEPIN NO.PIN NAME
the bank to which a command is applied.BA must be set
Power Supply
Register enable:When REGE is low,All control signals and
Some contents are subject to change without notice.
2,415,919,104-BIT ( 33,554,432-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
MITSUBISHI LSIs
MH32S72AQJA-7, -8
CK0
CKE0
/S0,2
/RAS,/CAS,/W
A0-11
Input
Input
Input
Input
Input
Master Clock:All other inputs are referenced to the rising
edge of CK
Clock Enable:CKE controls internal clock.When CKE is
low,internal clock for the following cycle is ceased. CKE is
also used to select auto / self refresh. After self refresh
mode is started, CKE E becomes asynchronous input.Self
refresh is maintained as long as CKE is low.
Chip Select: When /S is high,any command means
No Operation.
Combination of /RAS,/CAS,/W defines basic commands.
A0-11 specify the Row/Column Address in conjunction with
BA.The Row Address is specified by A0-11.The Column
Address is specified by A0-10.A10 is also used to indicate
precharge option.When A10 is high at a read / write
command, an auto precharge is performed. When A10 is
BA0-1
DQ0-63
CB0-7
DQM0-7
Vdd,Vss
REGE
Input
Input/Output
Input
Output
high at a precharge command, both banks are precharged.
Bank Address:BA0,1 is not simply BA.BA0,1 specifies
with ACT,PRE,READ,WRITE commands
Data In and Data out are referenced to the rising edge
of CK
Din Mask/Output Disable:When DQMB is high in burst
write.Din for the current cycle is masked.When DQMB is
high in burst read,Dout is disabled at the next but one cycle.
Power Supply for the memory mounted module.
address are buffered. (Buffer mode) When REGE is
high,All control and address are latched. (Latch mode)
MIT-DS-0371-0.2
MITSUBISHI
ELECTRIC
17/Mar./2000
4
Preliminary Spec.
BASIC FUNCTIONS
Each command is defined by control signals of /RAS,/CAS and /WE at CK rising edge. In
READ command starts burst read from the active bank indicated by BA.First output
Some contents are subject to change without notice.
MITSUBISHI LSIs
MH32S72AQJA-7, -8
2,415,919,104-BIT ( 33,554,432-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
The MH32S72AQJA provides basic functions,bank(row)activate,burst read / write,
bank(row)precharge,and auto / self refresh.
addition to 3 signals,/S,CKE and A10 are used as chip select,refresh option,and
precharge option,respectively.
To know the detailed definition of commands please see the command truth table.
ACT command activates a row in an idle bank indicated by BA.
Read(READ) [/RAS =H,/CAS =L, /WE =H]
data appears after /CAS latency. When A10 =H at this command,the bank is
deactivated after the burst read(auto-precharge,READA).
Write(WRITE) [/RAS =H, /CAS = /WE =L]
WRITE command starts burst write to the active bank indicated by BA. Total data
length to be written is set by burst length. When A10 =H at this command, the bank
is deactivated after the burst write(auto-precharge,WRITEA).
Precharge(PRE) [/RAS =L, /CAS =H,/WE =L]
PRE command deactivates the active bank indicated by BA. This command also
terminates burst read / write operation. When A10 =H at this command, both banks
are deactivated(precharge all, PREA).
Auto-Refresh(REFA) [/RAS =/CAS =L, /WE =CKE =H]
PEFA command starts auto-refresh cycle. Refresh address including bank address
are generated internally. After this command, the banks are precharged automatically.
MIT-DS-0371-0.2
MITSUBISHI
17/Mar./2000
ELECTRIC
5
Preliminary Spec.
Precharge All Bank
Some contents are subject to change without notice.
2,415,919,104-BIT ( 33,554,432-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
COMMAND TRUTH TABLE
MITSUBISHI LSIs
MH32S72AQJA-7, -8
COMMAND
DeselectDESELHXHXXXXXX
No OperationNOPHXLHHHXXX
Row Adress Entry &
Bank Activate
Single Bank PrechargePREHXLLHLVLX
Column Address Entry
& Write
Column Address Entry
& Write with Auto-
Precharge
Column Address Entry
& Read
Column Address Entry
& Read with Auto
Precharge
MNEMONIC
ACTHXLLHHVVV
PREA
WRITE
WRITEAHXLHLLVHV
READHXLHLHVLV
READAHXLHLHVHV
CKE
CKE
n-1
n
HXLLHLXHX
HXLHLLVLV
/S
/RAS
/CAS
/WE BA0,1A10
A11
X
X
V
X
X
V
V
V
V
A0-9
Auto-RefreshREFAHHLLLHXXX
Self-Refresh EntryREFSHLLLLHXXX
Self-Refresh ExitREFSXLHHXXXXXX
LHLHHHXXX
Burst TerminateTERM
Mode Register Set
MRS
HXLHHLXXX
HXLLLLLL
X
X
X
X
X
L
H =High Level, L = Low Level, V = Valid, X = Don't Care, n = CK cycle number
NOTE:
1.A7-9 = 0, A0-6 = Mode Address
V*1
MIT-DS-0371-0.2
MITSUBISHI
ELECTRIC
17/Mar./2000
6
Preliminary Spec.
Some contents are subject to change without notice.
2,415,919,104-BIT ( 33,554,432-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
FUNCTION TRUTH TABLE
MITSUBISHI LSIs
MH32S72AQJA-7, -8
Current State/S/RAS /CAS/WEAddress
IDLEHXXXXDESELNOP
LHHHXNOPNOP
LHHL
LHLX
LLHH
LLHL
LLLHXREFA
LLLL
ROW ACTIVEHXXXXDESELNOP
LHHHXNOPNOP
LHHLBA
LHLHBA,CA,A10READ/READA
LHLLBA,CA,A10
LLHHBA,RAACTBank Active/ILLEGAL*2
LLHLBA,A10PRE/PREAPrecharge/Precharge All
LLLHXREFAILLEGAL
ABBREVIATIONS:
H = Hige Level, L = Low Level, X = Don't Care
BA = Bank Address, RA = Row Address, CA = Column Address, NOP = No Operation
NOTES:
clock cycle.
2. ILLEGAL to bank in specified state; function may be legal in the bank indicated by BA,
depending on the state of that bank.
3. Must satisfy bus contention, bus turn around, write recovery requirements.
4. NOP to bank precharging or in idle state.May precharge bank indicated by BA.
5. ILLEGAL if any bank is not idle.
ILLEGAL = Device operation and / or date-integrity are not guaranteed.
MIT-DS-0371-0.2
MITSUBISHI
17/Mar./2000
ELECTRIC
10
Preliminary Spec.
Some contents are subject to change without notice.
MH32S72AQJA-7, -8
2,415,919,104-BIT ( 33,554,432-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
FUNCTION TRUTH TABLE FOR CKE
MITSUBISHI LSIs
Current State
SELF - HXXXXXX
REFRESH*1LHHXXXX
POWERHXXXXXX
DOWNLHXXXXX
ALL BANKSHHXXXXX
IDLE*2HLLLLHX
CKE
CKE
n-1
LHLHHHX
LHLHHLX
LHLHLXX
LHLLXXX
LLXXXXX
LLXXXXX
HLHXXXX
HLLHHHX
HLLHHLX
HLLHLXX
HLLLXXX
n
/RAS /CAS/WEAdd
/S
Action
INVALID
Exit Self-Refresh(Idle after tRC)
Exit Self-Refresh(Idle after tRC)
ILLEGAL
ILLEGAL
ILLEGAL
NOP(Maintain Self-Refresh)
INVALID
Exit Power Down to Idle
NOP(Maintain Self-Refresh)
Refer to Function Truth Table
Enter Self-Refresh
Enter Power Down
Enter Power Down
ILLEGAL
ILLEGAL
ILLEGAL
LXXXXXX
ANY STATEHHXXXXX
other thanHLXXXXX
listed aboveLHXXXXX
LLXXXXX
Refer to Current State = Power Down
Refer to Function Truth Table
Begin CK0 Suspend at Next Cycle*3
Exit CK0 Suspend at Next Cycle*3
Maintain CK0 Suspend
ABBREVIATIONS:
H = High Level, L = Low Level, X = Don't Care
NOTES:
1. CKE Low to High transition will re-enable CK and other inputs asynchronously.
A minimum setup time must be satisfied before any command other than EXIT.
2. Power-Down and Self-Refresh can be entered only from the All banks idle State.
3. Must be legal command.
MIT-DS-0371-0.2
MITSUBISHI
17/Mar./2000
ELECTRIC
11
Preliminary Spec.
POWER ON SEQUENCE
After these sequence, the SDRAM is idle state and ready for normal operation.
MODE REGISTER
LENGTH
BURST
Some contents are subject to change without notice.
MITSUBISHI LSIs
MH32S72AQJA-7, -8
2,415,919,104-BIT ( 33,554,432-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
Before starting normal operation, the following power on sequence is necessary to prevent
a SDRAM from damaged or malfunctioning.
1. Apply power and start clock. Attempt to maintain CKE high, DQMB0-7 high and NOP
condition at the inputs.
2. Maintain stable power, stable clock, and NOP input conditions for a minimum of 200us.
3. Issue precharge commands for all banks. (PRE or PREA)
4. After all banks become idle state (after tRP), issue 8 or more auto-refresh commands.
5. Issue a mode register set command to initialize the mode register.
Burst Length, Burst Type and /CAS Latency can be programmed by setting the mode
register(MRS). The mode register stores these date until the next MRS command, which
may be issue when both banks are in idle state. After tRSC from a MRS command, the
SDRAM is ready for new command.
CK
/S
/RAS
/CAS
/WE
BT= 0BT= 1
1
2
4
8
R
R
R
FP
SEQUENTIAL
INTERLEAVED
V
1
2
4
8
R
R
R
R
LATENCY
MODE
00
CL
0 0 0
0 0 1
0 1 0
0 1 1
1 0 0
1 0 1
1 1 0
1 1 1
A11 A10 A9A8A7A6A5A4 A3A2A1A0BA1BA0
00
/CAS LATENCY
WM
R
R
2
3
R
R
R
R
00
LTMODEBTBL
BURST
TYPE
BA0,1 A11-0
BL
0 0 0
0 0 1
0 1 0
0 1 1
1 0 0
1 0 1
1 1 0
1 1 1
0
1
WRITE
MODE
MIT-DS-0371-0.2
1
0
BURST
SINGLE BIT
MITSUBISHI
R:Reserved for Future Use
FP: Full Page
ELECTRIC
17/Mar./2000
12
Preliminary Spec.
Some contents are subject to change without notice.
2,415,919,104-BIT ( 33,554,432-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
CK
MITSUBISHI LSIs
MH32S72AQJA-7, -8
Command
Address
DQ
CL= 3
BL= 4
Initial Address BL
A2
0
0
0
0
1
A1
0
0
1
1
0
A0
0
1
0
1
8
0
Read
Y
/CAS Latency
1
0
2
1
3
2
4
3
5
4
Sequential
3
2
4
3
5
4
6
5
7
6
Q0Q1Q2Q3
Burst Length
Column Addressing
5
4
6
5
7
6
0
7
1
0
7
6
0
7
1
0
2
1
3
2
Burst Type
1
0
0
1
3
2
2
3
5
4
Write
Y
D0D1
Burst Length
Interleaved
3
2
2
3
1
0
0
1
7
6
D3
D2
5
4
4
5
7
6
6
7
1
0
7
6
6
7
5
4
4
5
3
2
0
1
1
1
-
-
-
-
-
-
MIT-DS-0371-0.2
1
0
1
1
1
0
0
0
1
0
1
1
1
0
-
-
1
6
5
7
6
0
7
1
0
2
1
4
3
2
0
3
1
0
2
1
0
0
7
1
0
2
1
3
2
0
3
1
0
1
2
2
1
3
2
3
4
MITSUBISHI
4
3
5
4
5
6
4
5
7
6
6
7
1
0
0
1
3
2
2
3
1
0
1
0
6
7
5
4
4
5
3
2
2
3
1
0
1
0
0
1
3
2
3
2
17/Mar./2000
2
3
1
0
1
0
13
ELECTRIC
Preliminary Spec.
ABSOLUTE MAXIMUM RATINGS
mA
RECOMMENDED OPERATING CONDITION
CAPACITANCE
@1MHz
Some contents are subject to change without notice.
2,415,919,104-BIT ( 33,554,432-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
MITSUBISHI LSIs
MH32S72AQJA-7, -8
Symbol
Vdd
VI
VO
IO
Pd
Topr
Tstg
Operating Temperature
Parameter
Supply Voltage
Input Voltage
Output Voltage
Output Current
Power Dissipation
Storage Temperature
(Ta=0 ~ 70°C, unless otherwise noted)
Symbol
Parameter
Condition
with respect to Vss
with respect to Vss
with respect to Vss
Ta=25°C
Min.
Limits
Typ.
Ratings
-0.5 ~ 4.6
-0.5 ~ 4.6
-0.5 ~ 4.6
50
20.7
0 ~ 70
-45 ~ 100
Max.
Unit
V
V
V
W
°C
°C
Unit
Vdd
Vss
VIH
VIL
Note)
1:VIH(max)=5.5V for pulse width less than 10ns.