TSOP package , industry standard Resister in TSSOP package ,
(at Latch mode,Components)
Some contents are subject to change without notice.
MH28S72PJG -5,-6,-7
9,663,676,416-BIT ( 134,217,728-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
DESCRIPTION
The MH28S72PJG is 134,217,728 - word x 72-bit
Synchronous DRAM stacked structural module. This
consist of thirty-six industry standard 64M x 4
Synchronous DRAMs in TSOP.
The stacked structure of TSOP on a card edge dual inline package provides any application where high
densities and large of quantities memory are required.
This is a socket-type memory module ,suitable for
easy interchange or addition of module.
MITSUBISHI LSIs
85pin
1pin
FEATURES
Frequency
-5
133MHz
-7
Utilizes industry standard 64M X 4 Synchronous DRAMs in
and industry standard PLL in TSSOP package.
Single 3.3V +/- 0.3V supply
Burst length 1/2/4/8/Full Page (programmable)
Burst type sequential / interleave (programmable)
Column access random
Burst Write / Single Write (programmable)
Auto precharge / Auto bank precharge controlled by A10
Auto refresh and Self refresh
LVTTL Interface
8192 refresh cycles every 64ms
Main memory unit for computers, Microcomputer memory.
100MHz
CLK Access Time
5.4ns(CL=3)133MHz
5.4ns(CL=4)-6
6.0ns(CL=3)
94pin
95pin
124pin
125pin
168pin
10pin
11pin
40pin
41pin
84pin
MIT-DS-406-0.2
MITSUBISHI
ELECTRIC
27/Mar. /2001
1
Preliminary Spec.
Some contents are subject to change without notice.
MITSUBISHI LSIs
MH28S72PJG -5,-6,-7
9,663,676,416-BIT ( 134,217,728-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
PIN NO.PIN NAMEPIN NO.PIN NAMEPIN NO.PIN NAMEPIN NO.PIN NAME
Combination of /RAS,/CAS,/W defines basic commands.
indicate precharge option.When A10 is high at a read / write
the bank to which a command is applied.BA must be set
Register enable:When REGE is low,All control signals and
Some contents are subject to change without notice.
9,663,676,416-BIT ( 134,217,728-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
MITSUBISHI LSIs
MH28S72PJG -5,-6,-7
CK0
CKE0
/S0 - 3
/RAS,/CAS,/W
A0-11
BA0-1
Input
Input
Input
Input
Input
Input
Master Clock:All other inputs are referenced to the rising
edge of CK
Clock Enable:CKE controls internal clock.When CKE is
low,internal clock for the following cycle is ceased. CKE is
also used to select auto / self refresh. After self refresh
mode is started, CKE E becomes asynchronous input.Self
refresh is maintained as long as CKE is low.
Chip Select: When /S is high,any command means
No Operation.
A0-12 specify the Row/Column Address in conjunction with
BA.The Row Address is specified by A0-12.The Column
Address is specified by A0-9,A11.A10 is also used to
command, an auto precharge is performed. When A10 is
high at a precharge command, both banks are precharged.
Bank Address:BA0,1 is not simply BA.BA0,1 specifies
with ACT,PRE,READ,WRITE commands
DQ0-63
CB0-7
DQM0-7
Vdd,Vss
REGE
MIT-DS-406-0.2
Input/Output
Input
Power Supply
Output
Data In and Data out are referenced to the rising edge
of CK
Din Mask/Output Disable:When DQMB is high in burst
write.Din for the current cycle is masked.When DQMB is
high in burst read,Dout is disabled at the next but one cycle.
Power Supply for the memory mounted module.
address are buffered. (Buffer mode) When REGE is
high,All control and address are latched. (Latch mode)
MITSUBISHI
ELECTRIC
27/Mar. /2001
4
Preliminary Spec.
Some contents are subject to change without notice.
MITSUBISHI LSIs
MH28S72PJG -5,-6,-7
9,663,676,416-BIT ( 134,217,728-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
BASIC FUNCTIONS
The MH28S72PJG provides basic functions,bank(row)activate,burst read / write,
bank(row)precharge,and auto / self refresh.
Each command is defined by control signals of /RAS,/CAS and /WE at CK rising edge.
In addition to 3 signals,/S,CKE and A10 are used as chip select,refresh option,and
precharge option,respectively.
To know the detailed definition of commands please see the command truth table.
CK
/S
Chip Select : L=select, H=deselect
/RAS
/CAS
/WE
CKE
A10
Command
Command
Command
Refresh Option @refresh command
Precharge Option @precharge or read/write command
define basic commands
Activate(ACT) [/RAS =L, /CAS = /WE =H]
ACT command activates a row in an idle bank indicated by BA.
Read(READ) [/RAS =H,/CAS =L, /WE =H]
READ command starts burst read from the active bank indicated by BA.First output
data appears after /CAS latency. When A10 =H at this command,the bank is
deactivated after the burst read(auto-precharge,READA).
Write(WRITE) [/RAS =H, /CAS = /WE =L]
WRITE command starts burst write to the active bank indicated by BA. Total data
length to be written is set by burst length. When A10 =H at this command, the bank is
deactivated after the burst write(auto-precharge,WRITEA).
Precharge(PRE) [/RAS =L, /CAS =H,/WE =L]
PRE command deactivates the active bank indicated by BA. This command also
terminates burst read / write operation. When A10 =H at this command, both banks
are deactivated(precharge all, PREA).
Auto-Refresh(REFA) [/RAS =/CAS =L, /WE =CKE =H]
REFA command starts auto-refresh cycle. Refresh address including bank address
are generated internally. After this command, the banks are precharged automatically.
MIT-DS-406-0.2
MITSUBISHI
27/Mar. /2001
ELECTRIC
5
Preliminary Spec.
Precharge All Bank
Some contents are subject to change without notice.
9,663,676,416-BIT ( 134,217,728-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
COMMAND TRUTH TABLE
COMMAND
DeselectDESELHXHXXXXXX
No OperationNOPHXLHHHXXX
MNEMONIC
CKE
n-1
MITSUBISHI LSIs
MH28S72PJG -5,-6,-7
CKE
n
/S
/RAS
/CAS
/WE BA0,1A10
A11
A0-9
X
X
Row Adress Entry &
Bank Activate
Single Bank PrechargePREHXLLHLVLX
Column Address Entry
& Write
Column Address Entry
& Write with Auto-
Precharge
Column Address Entry
& Read
Column Address Entry
& Read with Auto
Precharge
Auto-RefreshREFAHHLLLHXXX
Self-Refresh EntryREFSHLLLLHXXX
Self-Refresh ExitREFSXLHHXXXXXX
Burst TerminateTERM
Mode Register Set
ACTHXLLHHVVV
PREA
WRITE
WRITEAHXLHLLVHV
READHXLHLHVLV
READAHXLHLHVHV
MRS
HXLLHLXHX
HXLHLLVLV
LHLHHHXXX
HXLHHLXXX
HXLLLLLL
V
X
X
V
V
V
V
X
X
X
X
X
L
V*1
H =High Level, L = Low Level, V = Valid, X = Don't Care, n = CK cycle number
NOTE:
1.A11-12 = 0, A0-9 = Mode Address
MIT-DS-406-0.2
MITSUBISHI
ELECTRIC
27/Mar. /2001
6
Preliminary Spec.
Some contents are subject to change without notice.
9,663,676,416-BIT ( 134,217,728-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
FUNCTION TRUTH TABLE
MITSUBISHI LSIs
MH28S72PJG -5,-6,-7
Current State/S/RAS /CAS/WEAddress
IDLEHXXXXDESELNOP
LHHHXNOPNOP
LHHL
LHLX
LLHH
LLHL
LLLHXREFA
LLLL
ROW ACTIVEHXXXXDESELNOP
LHHHXNOPNOP
LHHLBA
LHLHBA,CA,A10READ/READA
LHLLBA,CA,A10
LLHHBA,RAACTBank Active/ILLEGAL*2
LLHLBA,A10PRE/PREAPrecharge/Precharge All
LLLHXREFAILLEGAL
ABBREVIATIONS:
H = Hige Level, L = Low Level, X = Don't Care
BA = Bank Address, RA = Row Address, CA = Column Address, NOP = No Operation
NOTES:
clock cycle.
2. ILLEGAL to bank in specified state; function may be legal in the bank indicated by BA,
depending on the state of that bank.
3. Must satisfy bus contention, bus turn around, write recovery requirements.
4. NOP to bank precharging or in idle state.May precharge bank indicated by BA.
5. ILLEGAL if any bank is not idle.
ILLEGAL = Device operation and / or date-integrity are not guaranteed.
MIT-DS-406-0.2
MITSUBISHI
27/Mar. /2001
ELECTRIC
10
Preliminary Spec.
Some contents are subject to change without notice.
MH28S72PJG -5,-6,-7
9,663,676,416-BIT ( 134,217,728-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
FUNCTION TRUTH TABLE FOR CKE
MITSUBISHI LSIs
Current State
SELF - HXXXXXX
REFRESH*1LHHXXXX
POWERHXXXXXX
DOWNLHXXXXX
ALL BANKSHHXXXXX
IDLE*2HLLLLHX
ANY STATEHHXXXXX
other thanHLXXXXX
listed aboveLHXXXXX
CKE
CKE
n-1
LHLHHHX
LHLHHLX
LHLHLXX
LHLLXXX
LLXXXXX
LLXXXXX
HLHXXXX
HLLHHHX
HLLHHLX
HLLHLXX
HLLLXXX
LXXXXXX
LLXXXXX
n
/RAS /CAS/WEAddAction
/S
INVALID
Exit Self-Refresh(Idle after tRC)
Exit Self-Refresh(Idle after tRC)
ILLEGAL
ILLEGAL
ILLEGAL
NOP(Maintain Self-Refresh)
INVALID
Exit Power Down to Idle
NOP(Maintain Self-Refresh)
Refer to Function Truth Table
Enter Self-Refresh
Enter Power Down
Enter Power Down
ILLEGAL
ILLEGAL
ILLEGAL
Refer to Current State = Power Down
Refer to Function Truth Table
Begin CK0 Suspend at Next Cycle*3
Exit CK0 Suspend at Next Cycle*3
Maintain CK0 Suspend
ABBREVIATIONS:
H = High Level, L = Low Level, X = Don't Care
NOTES:
1. CKE Low to High transition will re-enable CK and other inputs asynchronously.
A minimum setup time must be satisfied before any command other than EXIT.
2. Power-Down and Self-Refresh can be entered only from the All banks idle State.
3. Must be legal command.
MIT-DS-406-0.2
MITSUBISHI
27/Mar. /2001
ELECTRIC
11
Preliminary Spec.
POWER ON SEQUENCE
After these sequence, the SDRAM is idle state and ready for normal operation.
MODE REGISTER
LENGTH
BURST
Some contents are subject to change without notice.
MITSUBISHI LSIs
MH28S72PJG -5,-6,-7
9,663,676,416-BIT ( 134,217,728-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
Before starting normal operation, the following power on sequence is necessary to prevent
a SDRAM from damaged or malfunctioning.
1. Apply power and start clock. Attempt to maintain CKE high, DQMB0-7 high and NOP
condition at the inputs.
2. Maintain stable power, stable clock, and NOP input conditions for a minimum of 200us.
3. Issue precharge commands for all banks. (PRE or PREA)
4. After all banks become idle state (after tRP), issue 8 or more auto-refresh commands.
5. Issue a mode register set command to initialize the mode register.
Burst Length, Burst Type and /CAS Latency can be programmed by setting the mode
register(MRS). The mode register stores these date until the next MRS command, which
may be issue when both banks are in idle state. After tRSC from a MRS command, the
SDRAM is ready for new command.
CK
/S
/RAS
/CAS
/WE
BT= 0BT= 1
1
2
4
8
R
R
R
FP
SEQUENTIAL
INTERLEAVED
V
1
2
4
8
R
R
R
R
LATENCY
MODE*1
00
CL
0 0 0
0 0 1
0 1 0
0 1 1
1 0 0
1 0 1
1 1 0
1 1 1
A11 A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0BA1BA0
00
/CAS LATENCY
WM
R
R
2
3
R
R
R
R
00
LTMODEBTBL
BURST
TYPE
BA0,1 A11-0
BL
0 0 0
0 0 1
0 1 0
0 1 1
1 0 0
1 0 1
1 1 0
1 1 1
0
1
R:Reserved for Future Use
0
1
BURST
SINGLE BIT
FP: Full Page
*1:This value is for components and buffer mode, in case of latch
mode(REGE="H"), 1 latency should be added
WRITE
MODE
MIT-DS-406-0.2
MITSUBISHI
ELECTRIC
27/Mar. /2001
12
Preliminary Spec.
Some contents are subject to change without notice.
9,663,676,416-BIT ( 134,217,728-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
Note)
1:Icc(max) is specified at the output open condition.
2:Only 1physical bank is active for Icc1,Icc4.
3:Both physical bank are refreshed at same time.