HYPER PAGE MODE 1207959552 - BIT ( 16777216 - WORD BY 72 - BIT ) DYNAMIC RAM
DESCRIPTION
The MH16V7245BATJ is 16777216-word x 72-bit dynamic
ram module. This consist of eighteen industry standard 16M
x 4 dynamic RAMs in TSOP and three industry standard input
buffer in TSSOP.
The mounting of TSOP on a card edge dual in-line package
provides any application where high densities and large of
quantities memory are required.
This is a socket-type memory module ,suitable for easy
interchange or addition of module.
FEATURES
/RAS
/CAS Address /OECyclePower
access
access
access
Type name
MH16V7245BATJ-5
MH16V7245BATJ-6
Utilizes industry standard 16M x 4 RAMs TSOP and industry
standard input buffer in TSSOP
168-pin (84-pin dual in-line pacege)
Single 3.3V(+/-0.3V) supply operation
Note : ACT : active, NAC : nonactive, DNC : don' t care, VLD : valid, IVD : Invalid, APD : applied, OPN : open
/RAS/CAS
ACT
ACT
ACT
ACT
ACT
ACT
NAC
ACT
ACT
ACT
ACT
ACT
ACT
DNC
/W
NAC
ACT
ACT
ACT
DNC
NAC
DNC
a number of other functions, e.g., Hyper page mode, /CAS
before /RAS refresh, and delayed-write. The input conditions
for each are shown in Table 1.
InputsInput/Output
/OE
ACT
DNC
DNC
ACT
ACT
DNC
DNC
Row
address address
APD
APD
APD
APD
DNC
DNC
DNC
Column
APD
APD
APD
APD
DNC
DNC
DNC
Input
OPN
VLD
VLD
VLD
OPN
DNC
DNC
Output
VLD
OPN
IVD
VLD
VLD
OPN
OPN
MITSUBISHI LSIs
Refresh
NO
NO
NO
NO
YES
YES
NO
Remark
Hyper page
mode
identical
MIT-DS-0277-0.0
MITSUBISHI
ELECTRIC
( / 23 )
4
5/Nov./1998
Preliminary Spec.
HYPER PAGE MODE 1207959552 - BIT ( 16777216 - WORD BY 72 - BIT ) DYNAMIC RAM
ABSOLUTE MAXIMUM RATINGS
Symbol
Vcc
VI
VO
IO
Pd
Topr
Tstg
Supply voltage
Input voltage
Output voltage
Output current
Power dissipation
Operating temperature
Storage temperature
ParameterConditions
MITSUBISHI LSIs
MH16V7245BATJ -5, -6
Ratings
-0.5~4.6
With respect to Vss
Ta=25°C
-0.5~ 4.6
-0.5~ 4.6
50
21.6
0~70
-40~100
Unit
V
mA
W
°C
°C
RECOMMENDED OPERATING CONDITIONS
Symbol
Vcc
Vss
VIH
VIL
Note 1 : All voltage values are with respect to Vss
Supply voltage
Supply voltage
High-level input voltage, all inputs
Low-level input voltage
ELECTRICAL CHARACTERISTICS
Symbol
VOH
VOL
IOZ
I I
I I (RAS)
ICC1 (AV)
ICC2
ICC4(AV)
ICC6(AV)
Note 2: Current flowing into an IC is positive, out is negative.
3: Icc1 (AV), Icc3 (AV), Icc4 (AV) and Icc6 (AV) are dependent on cycle rate. Maximum current is measured at the fastest cycle rate.
4: Icc1 (AV) and Icc4 (AV) are dependent on output loading. Specified values are obtained with the output open.
5: Under condition of colmun address being changed once or less while /RAS=VIL and /CAS=VIH
High-level output voltage
Low-level output voltage
Off-state output current
Input current (except /RAS)
Input current (/RAS)
Average supply
current
from Vcc operating
Supply current from Vcc , stand-by
Average supply current
from Vcc
Hyper-Page-Mode
Average supply current from Vcc
/CAS before /RAS refresh mode
Note 6: An initial pause of 500us is required after power-up followed by a minimum of eight initialization cycles (any combination of cycles
containing a /RAS-Only refresh or /CAS before /RAS refresh).
Note the /RAS may be cycled during the initial pause . And any 8 /RAS or /RAS /CAS cycles are required after prolonged periods
(greater than 64 ms) of /RAS inactivity before proper device operation is achieved.
7: Measured with a load circuit equivalent to 1TTL loads and 50pF,VOH=2.4V(IOH=-2mA) and VOL=0.4V(IOL=-2mA).
The reference levels for measuring of output signals are 2.0V (VOH) and 0.8V (VOL).
8: Assumes that tRCD≥tRCD(max), tASC≥tASC(max) and tCP≥tCP(max).
9: Assumes that tRCD≤tRCD(max) and tRAD≤tRAD(max). If tRCD or tRAD is greater than the maximum recommended value shown in
this table,tRAC will increase by amount that tRCD exceeds the value shown.
10: Assumes that tRAD≥tRAD(max) and tASC≤tASC(max).
11: Assumes that tCP≤tCP(max) and tASC≥tASC(max).
12: tOEZ (max), tWEZ(max), tOFF(max) and tREZ(max) defines the time at which the output achieves the high impedance state
(IOUT≤ I+/-10uAI) and is not reference to VOH(min) or VOL(max).
13: Output is disable after both /RAS and /CAS go to high
Access time from /CAS
Access time from /RAS
Columu address access time
Access time from /CAS precharge
Access time from /OE
Output hold time /CAS high
Output hold time /RAS high
Output low impedance time from /CAS low
Output disable time after /OE high
Output disable time after /WE high
Output disable time after /CAS high
Output disable time after /RAS high
(Ta=0~70°C, Vcc=3.3V+/-0.3V, Vss=0V, unless otherwise noted , see notes 6,14,15)
Note 14: The timing requirements are assumed tT =2ns.
15: VIH(min) and VIL(max) are reference levels for measuring timing of input signals.
16: tRCD(max) is specified as a reference point only. If tRCD is less than tRCD(max), access time is tRAC. If tRCD is greater than
tRCD(max), access time is controlled exclusively by tCAC or tAA. .
17: tRAD(max) is specified as a reference point only. If tRAD≥tRAD(max) and tASC≤tASC(max), access time is controlled exclusively by tAA.
18: tASC(max) is specified as a reference point only. If tRCD≥tRCD(max) and tASC≥tASC(max), access time is controlled exclusively by
tCAC.
19: Either tDZC or tDZO must be satisfied.
20: Either tRDD or tCDD or tODD must be satisfied.
21: tT is measured between VIH(min) and VIL(max).
Refresh cycle time
/RAS high pulse width
Delay time, /RAS low to /CAS low
Delay time, /CAS high to /RAS low
Delay time, /RAS high to /CAS low
/CAS high pulse width
Column address delay time from /RAS low
Row address setup time before /RAS low
Column address setup time before /CAS low
Row address hold time after /RAS low
Column address hold time after /CAS low
Delay time, data to /CAS low
Delay time, data to /OE low
Delay time, /RAS high to data
Delay time, /CAS high to data
Delay time, /OE high to data
Transition time
Read cycle time
/RAS iow pulse width
/CAS iow pulse width
/CAS hold time after /RAS iow
/RAS hold time after /CAS iow
Read Setup time after /CAS high
Read hold time after /CAS iow
Read hold time after /RAS iow
Column address to /RAS hold time
Column address to /CAS hold time
/RAS hold time after /OE iow
/CAS hold time after /OE iow
ParameterSymbolUnit
Write cycle time
/RAS iow pulse width
/CAS iow pulse width
/CAS hold time after /RAS iow
/RAS hold time after /CAS iow
Write setup time before /CAS low
Write hold time after /CAS iow
/CAS hold time after /W iow
/RAS hold time after W iow
Write pulse width
Data setup time before /CAS iow or W iow
Data hold time after /CAS iow or W iow
MITSUBISHI LSIs
MH16V7245BATJ -5, -6
Limits
-6
MinMax
104
60
10000
10000
10
43
20
0
0
0
35
18
20
15
-6
MinMax
104
10000
60
10000
10
35
20
0
10
10
15
10
-5
15
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
(Note 22)
(Note 22)
(Note 24)
-5
Min
Max
84
50
10000
8
10000
30
18
0
0
0
30
13
18
13
-5
MinMax
84
10000
50
10000
8
30
18
0
8
8
13
8
-5
13
Limits
Read-Write and Read-Modify-Write Cycles
Limits
ParameterSymbol
tRWC
tRAS
tCAS
tCSH
tRSH
tRCS
tCWD
tRWD
tAWD
tOEH
Note 23: tRWC is specified as tRWC(min)=tRAC(max)+tODD(min)+tRWL(min)+tRP(min)+4tT.
24: tWCS, tCWD,tRWD ,tAWD and,tCPWD are specified as reference points only. If tWCS≥tWCS(min) the cycle is an early write cycle
and the DQ pins will remain high impedance throughout the entire cycle. If tCWD≥tCWD(min), tRWD≥tRWD (min), tAWD≥tAWD(min)
and tCPWD≥tCPWD(min) (for Hyper page mode cycle only), the cycle is a read-modify-write cycle and the DQ will contain the
data read from the selected address. If neither of the above condition (delayed write) of the DQ (at access time and until /CAS or /OE
goes back to VIH) is indeteminate.
MIT-DS-0277-0.0
Read write/read modify write cycle time
RAS iow pulse width
CAS iow pulse width
CAS hold time after RAS low
RAS hold time after CAS low
Read setup time before CAS low
Delay time, CAS iow to W iow
Delay time, RAS iow to W iow
Delay time, address to W iow
OE hold time after W iow
MITSUBISHI
(Note23)
(Note24)
(Note24)
(Note24)
-5
MinMax
109
10000
75
38
10000
65
43
0
28
60
40
13
-6
MinMax
133
10000
89
10000
44
77
49
0
32
72
47
15
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
5/Nov./1998
ELECTRIC
( / 23 )7
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