Mitsubishi MH16S72DDFA-8, MH16S72DDFA-7 Datasheet

Preliminary Spec.
DESCRIPTION
APPLICATION
easy interchange or addition of module.
FEATURES
Type name
6ns (CL = 2, 3)
MH16S72DDFA-7
Frequency
[component level]
100MHz
6ns (CL = 3)
MH16S72DDFA-8
100MHz
Some contents are subject to change without notice.
1,207,959,552-BIT ( 16,777,216-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
The MH16S72DDFA is 16777216 - word x 72-bit Synchronous DRAM module. This consist of eighteen industry standard 16M x 4 Synchronous DRAMs in TSOP. The TSOP on a card edge dual in-line package provides any application where high densities and large of quantities memory are required. This is a socket-type memory module ,suitable for
CLK
Max.
Access Time
MITSUBISHI LSIs
MH16S72DDFA-7, -8
85pin
94pin
1pin
10pin
Utilizes industry standard 16M X 4 Synchronous DRAMs in TSOP package , industry standard Resistered buffer in TSSOP package and industry standard PLL in TSSOP package Single 3.3V +/- 0.3V supply LVTTL Interface Burst length 1/2/4/8/Full Page(programmable) Burst Write / Single Write(programmable) Auto precharge / All bank precharge controlled by A10 Auto refresh and Self refresh 4096 refresh cycles every 64ms
Discrete IC and module design conform to PC/100 specification. (module Spec. Rev. 1.2 and SPD 1.2A)
Main memory unit for computers, Microcomputer memory.
95pin
124pin
125pin
168pin
11pin
40pin
41pin
84pin
MIT-DS-0347-0.1
MITSUBISHI ELECTRIC
15/Oct./1999
1
Preliminary Spec.
Some contents are subject to change without notice.
MITSUBISHI LSIs
MH16S72DDFA-7, -8
1,207,959,552-BIT ( 16,777,216-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
PIN NO. PIN NAME PIN NO. PIN NAME PIN NO. PIN NAME PIN NO. PIN NAME
1 2 DQ0 44 NC 3 DQ1 45 /S2 4 DQ2 46 DQMB2 5 DQ3 47 DQMB3 6 VDD 48 NC 7 DQ4 49 VDD 8 DQ5 50 NC
9 DQ6 51 NC 10 DQ7 52 11 DQ8 53 12 13 DQ9 55 DQ16 14 DQ10 56 DQ17 15 DQ11 57 DQ18 16 DQ12 58 DQ19 17 DQ13 59 VDD 18 VDD 60 DQ20 19 DQ14 61 NC 20 DQ15 62 21 22 23 VSS 65 DQ21 24 NC 66 DQ22 25 NC 67 DQ23 26 VDD 68 27 28 DQMB0 70 DQ25 29 DQMB1 71 DQ26 30 /S0 72 DQ27 31 NC 73 VDD 32 VSS 74 DQ28 33 A0 75 DQ29 34 A2 76 DQ30 35 A4 77 DQ31 36 A6 78 VSS 37 A8 79 38 39 40 VDD 82 SDA 41 VDD 83 SCL
42 CK0 84 VDD
VSS
VSS
CB0 CB1
/WE
A10 BA1
43
54 VSS
63 64 VSS
69 DQ24
80 NC 81
VSS 85
CB2 CB3
Vref,NC
CKE1
VSS 110
CK2
WP
86 87 88 89 90 91 92 93 94 95 96 97 98
99 100 101 102 103 104 105 106 107 108 109
111 112 113 114 115 116 117 118 119 120 121 122 123 124 125
126
VSS 127 DQ32 128 DQ33 129 DQ34 130 DQMB6 DQ35 131 DQMB7
VDD 132 DQ36 133 VDD DQ37 134 NC DQ38 135 NC DQ39 136 DQ40 137
VSS 138 VSS DQ41 139 DQ48 DQ42 140 DQ49 DQ43 141 DQ50 DQ44 142 DQ51 DQ45 143 VDD
VDD 144 DQ52 DQ46 145 NC DQ47 146
CB4
CB5
VSS 149 DQ53
NC 150 DQ54 NC 151 DQ55
VDD 152 VSS
/CAS 153 DQ56 DQMB4 154 DQ57 DQMB5 155 DQ58
NC
/RAS 157 VDD
VSS 158 DQ60
A1 159 DQ61 A3 160 DQ62 A5 161 DQ63 A7 162 VSS
A9 163 BA0 A11
VDD 166 SA1 CK1 167 SA2
NC
147 148 VSS
156 DQ59
164 NC 165 SA0
168 VDD
VSS
CKE0
NC
NC
CB6 CB7
Vref,NC
REGE
CK3
NC = No Connection
MIT-DS-0347-0.1
MITSUBISHI ELECTRIC
15/Oct./1999
2
Preliminary Spec.
D0D1D2D3D4D5D6D7D8D9D10
D11
D12
D13
D14
D15
D16
D17
Some contents are subject to change without notice.
1,207,959,552-BIT ( 16,777,216-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
Add
CKE0
/S0,2
DQM0-7
/W
/RAS
/CAS
MITSUBISHI LSIs
MH16S72DDFA-7, -8
DQ0 DQ1
DQ2 DQ3 DQ4 DQ5 DQ6 DQ7
DQ8 DQ9 DQ10 DQ11 DQ12 DQ13 DQ14 DQ15
CB0 CB1
CB2 CB3
DQ16 DQ17
DQ18 DQ19
DQ20 DQ21
DQ22 DQ23
DQ32 DQ33
DQ34 DQ35 DQ36 DQ37 DQ38 DQ39
DQ40 DQ41 DQ42 DQ43 DQ44 DQ45 DQ46 DQ47
CB4 CB5
CB6 CB7
DQ48 DQ49
DQ50 DQ51
DQ52 DQ53
DQ54 DQ55
CK0
PLL
CK1 - CK3
MIT-DS-0347-0.1
DQ24 DQ25
DQ26 DQ27
DQ28 DQ29 DQ30 DQ31
Terminated
MITSUBISHI ELECTRIC
DQ56 DQ57
DQ58 DQ59
DQ60 DQ61
DQ62 DQ63
SCL
VDD
VSS
SERIAL PD
15/Oct./1999
SDA
D0 to D17
D0 to D17
3
Preliminary Spec.
PIN FUNCTION
the bank to which a command is applied.BA must be set
Power Supply
Register enable:When REGE is low,All control signals and
Some contents are subject to change without notice.
MITSUBISHI LSIs
MH16S72DDFA-7, -8
CK0
CKE0
/S0,2
/RAS,/CAS,/W
A0-11
Input
Input
Input
Input
Input
Master Clock:All other inputs are referenced to the rising edge of CK
Clock Enable:CKE controls internal clock.When CKE is low,internal clock for the following cycle is ceased. CKE is also used to select auto / self refresh. After self refresh mode is started, CKE E becomes asynchronous input.Self refresh is maintained as long as CKE is low.
Chip Select: When /S is high,any command means No Operation.
Combination of /RAS,/CAS,/W defines basic commands.
A0-11 specify the Row/Column Address in conjunction with BA.The Row Address is specified by A0-11.The Column Address is specified by A0-9.A10 is also used to indicate precharge option.When A10 is high at a read / write command, an auto precharge is performed. When A10 is
BA0-1
DQ0-63 CB0-7
DQM0-7
Vdd,Vss
REGE
Input
Input/Output
Input
Output
high at a precharge command, both banks are precharged. Bank Address:BA0,1 is not simply BA.BA0,1 specifies
with ACT,PRE,READ,WRITE commands Data In and Data out are referenced to the rising edge
of CK Din Mask/Output Disable:When DQMB is high in burst
write.Din for the current cycle is masked.When DQMB is high in burst read,Dout is disabled at the next but one cycle.
Power Supply for the memory mounted module.
address are buffered. (Buffer mode) When REGE is high,All control and address are latched. (Latch mode)
MIT-DS-0347-0.1
MITSUBISHI ELECTRIC
15/Oct./1999
4
Preliminary Spec.
BASIC FUNCTIONS
Each command is defined by control signals of /RAS,/CAS and /WE at CK rising edge. In
READ command starts burst read from the active bank indicated by BA.First output
Some contents are subject to change without notice.
MITSUBISHI LSIs
MH16S72DDFA-7, -8
1,207,959,552-BIT ( 16,777,216-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
The MH16S72DDFA provides basic functions,bank(row)activate,burst read / write, bank(row)precharge,and auto / self refresh.
addition to 3 signals,/S,CKE and A10 are used as chip select,refresh option,and precharge option,respectively. To know the detailed definition of commands please see the command truth table.
CK
/S /RAS /CAS /WE CKE A10
Chip Select : L=select, H=deselect Command Command Command Refresh Option @refresh command Precharge Option @precharge or read/write command
define basic commands
Activate(ACT) [/RAS =L, /CAS = /WE =H]
ACT command activates a row in an idle bank indicated by BA.
Read(READ) [/RAS =H,/CAS =L, /WE =H]
data appears after /CAS latency. When A10 =H at this command,the bank is deactivated after the burst read(auto-precharge, READA).
Write(WRITE) [/RAS =H, /CAS = /WE =L]
WRITE command starts burst write to the active bank indicated by BA. Total data length to be written is set by burst length. When A10 =H at this command, the bank is deactivated after the burst write(auto-precharge, WRITEA).
Precharge(PRE) [/RAS =L, /CAS =H,/WE =L]
PRE command deactivates the active bank indicated by BA. This command also terminates burst read / write operation. When A10 =H at this command, both banks are deactivated(precharge all, PREA).
Auto-Refresh(REFA) [/RAS =/CAS =L, /WE =CKE =H]
PEFA command starts auto-refresh cycle. Refresh address including bank address are generated internally. After this command, the banks are precharged automatically.
MIT-DS-0347-0.1
MITSUBISHI
15/Oct./1999
5
Preliminary Spec.
Precharge All Bank
Some contents are subject to change without notice.
1,207,959,552-BIT ( 16,777,216-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
COMMAND TRUTH TABLE
MITSUBISHI LSIs
MH16S72DDFA-7, -8
COMMAND
Deselect
No Operation
Row Adress Entry &
Bank Activate
Single Bank Precharge
Column Address Entry
& Write
Column Address Entry
& Write with Auto-
Precharge
Column Address Entry
& Read
Column Address Entry
& Read with Auto
Precharge
MNEMONIC
DESEL
NOP
ACT
PRE
PREA
WRITE
WRITEA
READ
READA
CK
n-1
CK
H H
H
H H
H
H
H
H
/S
n X
X
X
X X
X
X
X
X
/RAS
H L
L
L L
L
L
L
L
X H
L
L L
LH
H
H
H
/CAS
X H
H
H H
H
L
L
L
/WE
X H
H
L L
L
L
H
H
BA
X X
V
V V
V
V
V
V
A10
X X
V
L H
L
H
L
H
A0-9
X X
V
X X
V
V
V
V
Auto-Refresh
Self-Refresh Entry
Self-Refresh Exit
Burst Terminate
Mode Register Set
REFA REFS
REFSX
TERM
MRS
H H
L L
H H
H L
H H
X X
HL
L L
L
LX
H L
H H
L L
L
L L
X H
H L
H H
X H
L L
X X
X X
X L
H =High Level, L = Low Level, V = Valid, X = Don't Care, n = CK cycle number
NOTE:
1.A7-9 = 0, A0-6 = Mode Address
X X
X X
X L
X X
X X
X
V*1
MIT-DS-0347-0.1
MITSUBISHI ELECTRIC
15/Oct./1999
6
Preliminary Spec.
Some contents are subject to change without notice.
1,207,959,552-BIT ( 16,777,216-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
FUNCTION TRUTH TABLE
MITSUBISHI LSIs
MH16S72DDFA-7, -8
Current State
IDLE
ROW ACTIVE
READ
/S
/RAS
H L
L L
L L
L L
H L
L L
L
L L
L L
H L
L
L
/CAS
X H
H H
L L
L
L X
H H
H
H L
L L
L X
H H
H
/WE
X H
H L
H H
L L
X H
H L
L
H H
L L
X H
H
L
X H
L X
H L
H
L X
H L
H
L H
L H
L X
H L
H
Address
X X
BA BA,CA,A10
BA,RA BA,A10
X Op-Code,
Mode-Add X X BA
BA,CA,A10
BA,CA,A10
BA,RA BA,A10
X Op-Code,
Mode-Add X
X BA
BA,CA,A10
Command
DESEL
NOP
TBST
READ/WRITE
ACT
PRE/PREA
REFA
MRS
DESEL
NOP
TBST
READ/READA
WRITE/
WRITEA
ACT
PRE/PREA
REFA
MRS
DESEL
NOP
TBST
READ/READA
Action
NOP NOP
ILLEGAL*2 ILLEGAL*2
Bank Active,Latch RA NOP*4
Auto-Refresh*5 Mode Register Set*5 NOP
NOP NOP
Begin Read,Latch CA, Determine Auto-Precharge Begin Write,Latch CA,
Determine Auto-Precharge Bank Active/ILLEGAL*2
Precharge/Precharge All ILLEGAL
ILLEGAL NOP(Continue Burst to END)
NOP(Continue Burst to END) Terminate Burst
Terminate Burst,Latch CA, Begin New Read,Determine
Auto-Precharge*3
MIT-DS-0347-0.1
Terminate Burst,Latch CA,
L
L L
L
L
H
L L
L L
L
H H
L
L
L
BA,CA,A10
BA,RA
H L
BA,A10 X
H
Op-Code,
L
Mode-Add
MITSUBISHI
WRITE/WRITEA
ACT
PRE/PREA
REFA
MRS
Begin Write,Determine Auto­Precharge*3
Bank Active/ILLEGAL*2 Terminate Burst,Precharge
ILLEGAL ILLEGAL
15/Oct./1999
7
Preliminary Spec.
FUNCTION TRUTH TABLE
Some contents are subject to change without notice.
1,207,959,552-BIT ( 16,777,216-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
MITSUBISHI LSIs
MH16S72DDFA-7, -8
(continued)
Current State
WRITE
READ with
AUTO
PRECHARGE
WRITE with
AUTO
PRECHARGE
/S
/RAS
H L
L
L
L
L L
L L
H L L
L L
L L L
L H
L L
L L L
L L
L
/CAS
X H
H
H
H
L L
L L
X H H H
H L
L L
L X
H H H
H L
L L
L
/WE
X H
H
L
L
H H
L L
X H H
L L
H H L
L X
H H
L L H
H L
L
X H
L
H
L
H L
H L
X H L H
L H
L H
L X
H L H
L H
L H
L
Address X X BA
BA,CA,A10
BA,CA,A10
BA,RA BA,A10
X Op-Code,
Mode-Add X X BA BA,CA,A10
BA,CA,A10 BA,RA
BA,A10 X
Op-Code, Mode-Add X X BA
BA,CA,A10 BA,CA,A10 BA,RA
BA,A10 X
Op-Code, Mode-Add
Command
DESEL
NOP
TBST
READ/READA
WRITE/
WRITEA
ACT
PRE/PREA
REFA
MRS
DESEL
NOP
TBST
READ/READA
WRITE/
WRITEA
ACT
PRE/PREA
REFA
MRS
DESEL
NOP
TBST
READ/READA
WRITE/
WRITEA
ACT
PRE/PREA
REFA
MRS
Action NOP(Continue Burst to END) NOP(Continue Burst to END) Terminate Burst Terminate Burst,Latch CA, Begin Read,Determine Auto­Precharge*3 Terminate Burst,Latch CA, Begin Write,Determine Auto­Precharge*3 Bank Active/ILLEGAL*2 Terminate Burst,Precharge
ILLEGAL ILLEGAL
NOP(Continue Burst to END) NOP(Continue Burst to END) ILLEGAL
ILLEGAL ILLEGAL Bank Active/ILLEGAL*2
ILLEGAL*2 ILLEGAL
ILLEGAL NOP(Continue Burst to END)
NOP(Continue Burst to END) ILLEGAL
ILLEGAL ILLEGAL Bank Active/ILLEGAL*2
ILLEGAL*2 ILLEGAL
ILLEGAL
MIT-DS-0347-0.1
MITSUBISHI ELECTRIC
15/Oct./1999
8
Preliminary Spec.
Some contents are subject to change without notice.
MH16S72DDFA-7, -8
1,207,959,552-BIT ( 16,777,216-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
FUNCTION TRUTH TABLE(continued)
MITSUBISHI LSIs
Current State
PRE -
CHARGING
ROW
ACTIVATING
/S
/RAS H L L L L
L L
L H
L L
L L
L L
L
/CAS
X H H
H L
L L
L
X H
H H
L L
L
L
/WE X H H L H
H L
L X
H H
L H
H L
L
X H L
X H
L H
L
X H
L X
H L
H
L
Address
X X BA BA,CA,A10 BA,RA BA,A10
X Op-Code,
Mode-Add X X
BA BA,CA,A10
BA,RA BA,A10 X Op-Code, Mode-Add
Command
DESEL
NOP
TBST
READ/WRITE
ACT
PRE/PREA
REFA
MRS
DESEL
NOP
TBST
READ/WRITE
ACT
PRE/PREA
REFA
MRS
Action
NOP(Idle after tRP) NOP(Idle after tRP) ILLEGAL*2 ILLEGAL*2 ILLEGAL*2 NOP*4(Idle after tRP)
ILLEGAL
ILLEGAL
NOP(Row Active after tRCD NOP(Row Active after tRCD
ILLEGAL*2 ILLEGAL*2
ILLEGAL*2 ILLEGAL*2 ILLEGAL
ILLEGAL
WRITE RE-
COVERING
MIT-DS-0347-0.1
H L
L L
L L
L
L
X H H H L
L L
L
X H
H L
H H
L
L
X
X
H
X BA
L X
BA,CA,A10 BA,RA
H L
BA,A10 X
H
Op-Code,
L
Mode-Add
MITSUBISHI
DESEL
NOP
TBST
READ/WRITE
ACT
PRE/PREA
REFA
MRS
NOP NOP
ILLEGAL*2 ILLEGAL*2
ILLEGAL*2 ILLEGAL*2
ILLEGAL
ILLEGAL
15/Oct./1999
9
Preliminary Spec.
1. All entries assume that CKE was High during the preceding clock cycle and the current
Some contents are subject to change without notice.
MH16S72DDFA-7, -8
1,207,959,552-BIT ( 16,777,216-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
FUNCTION TRUTH TABLE(continued)
MITSUBISHI LSIs
Current State
RE-
FRESHING
MODE
REGISTER
SETTING
/S
H L L L
L L
L
L
H L L
L L
L
/RAS
X H H
H L L L
L
X H H H
L L
/CAS
X H H L
H H
L
L
X H H
L H
H
/WE
X H L
X H L H
L
X H L X
H L
Address X X BA BA,CA,A10
BA,RA BA,A10
X Op-Code,
Mode-Add X X BA BA,CA,A10 BA,RA BA,A10
Command
DESEL
NOP
TBST
READ/WRITE
ACT
PRE/PREA
REFA
MRS
DESEL
NOP
TBST
READ/WRITE
ACT
PRE/PREA
Action
NOP(Idle after tRC) NOP(Idle after tRC)
ILLEGAL ILLEGAL
ILLEGAL ILLEGAL
ILLEGAL
ILLEGAL
NOP(Idle after tRSC) NOP(Idle after tRSC) ILLEGAL
ILLEGAL ILLEGAL
ILLEGAL
L
L
L
L
L
L
H
L
X Op-Code,
Mode-Add
REFA
MRS
ILLEGAL
ILLEGAL
ABBREVIATIONS: H = Hige Level, L = Low Level, X = Don't Care BA = Bank Address, RA = Row Address, CA = Column Address, NOP = No Operation
NOTES:
clock cycle.
2. ILLEGAL to bank in specified state; function may be legal in the bank indicated by BA, depending on the state of that bank.
3. Must satisfy bus contention, bus turn around, write recovery requirements.
4. NOP to bank precharging or in idle state.May precharge bank indicated by BA.
5. ILLEGAL if any bank is not idle.
ILLEGAL = Device operation and / or date-integrity are not guaranteed.
MIT-DS-0347-0.1
MITSUBISHI
15/Oct./1999
10
Preliminary Spec.
2. Power-Down and Self-Refresh can be entered only form the All banks idle State.
Some contents are subject to change without notice.
MH16S72DDFA-7, -8
1,207,959,552-BIT ( 16,777,216-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
FUNCTION TRUTH TABLE FOR CKE
MITSUBISHI LSIs
Current State
SELF -
REFRESH*1
POWER
DOWN
ALL BANKS
IDLE*2
CK
n-1
CK
n H L
L L L
L L H L L H H H H H H H
X
H H
H H H
L
X
H
L
H
L
L
L
L
L
L
/S
X H
L L L
L X X X X X L H L L L L
/RAS
X X H
H H L X
X X X
X L X
H H H L
/CAS
X X
H H L
X X X X X X L X H H L X
/WE
X X H
L X X X
X X X
X H X
H L X X
Add
X
INVALID Exit Self-Refresh(Idle after tRC)
X
Exit Self-Refresh(Idle after tRC)
X
ILLEGAL
X
ILLEGAL
X
ILLEGAL
X
NOP(Maintain Self-Refresh)
X X
INVALID Exit Power Down to Idle
X
NOP(Maintain Self-Refresh)
X X
Refer to Function Truth Table Enter Self-Refresh
X
Enter Power Down
X
Enter Power Down
X
ILLEGAL
X
ILLEGAL
X
ILLEGAL
X
Action
ANY STATE
other than
listed above
L H
H L L
X
H
L
H
L
X X
X X X
X X
X X
X
X X
X X X
X X
X X
X
Refer to Current State = Power Down
X X
Refer to Function Truth Table Begin CK0 Suspend at Next Cycle*3
X X
Exit CK0 Suspend at Next Cycle*3
X
Maintain CK0 Suspend
ABBREVIATIONS: H = High Level, L = Low Level, X = Don't Care
NOTES:
1. CKE Low to High transition will re-enable CK and other inputs asynchronously. A minimum setup time must be satisfied before any command other than EXIT.
3. Must be legal command.
MIT-DS-0347-0.1
MITSUBISHI
15/Oct./1999
11
Preliminary Spec.
POWER ON SEQUENCE
After these sequence, the SDRAM is idle state and ready for normal operation.
MODE REGISTER
LENGTH
LATENCY
Some contents are subject to change without notice.
MITSUBISHI LSIs
MH16S72DDFA-7, -8
1,207,959,552-BIT ( 16,777,216-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
Before starting normal operation, the following power on sequence is necessary to prevent a SDRAM from damaged or malfunctioning.
1. Apply power and start clock. Attempt to maintain CKE high, DQMB high and NOP condition at the inputs.
2. Maintain stable power, stable cock, and NOP input conditions for a minimum of 500µs.
3. Issue precharge commands for all banks. (PRE or PREA)
4. After all banks become idle state (after tRP), issue 8 or more auto-refresh commands.
5. Issue a mode register set command to initialize the mode register.
Burst Length, Burst Type and /CAS Latency can be programmed by setting the mode register(MRS). The mode register stores these date until the next MRS command, which may be issue when both banks are in idle state. After tRSC from a MRS command, the SDRAM is ready for new command.
CK
/S
MODE
BA0
0
BA1
0
CL 0 0 0 0 0 1 0 1 0 0 1 1 1 0 0 1 0 1 1 1 0 1 1 1
A10
A11
0
0
/CAS LATENCY
A9
WM
A8
0
R R
2
3
R R
R R
A7
0
A6
A5
LTMODE
A4
A3
BT
BURST
BURST
TYPE
A2
A1
BL
A0
BA0,1 A11-0
BL
0 0 0 0 0 1
0 1 0 0 1 1
1 0 0 1 0 1 1 1 0 1 1 1
0
1
/RAS /CAS
/WE
BT= 0
1 2
4 8
R R
R
FP
SEQUENTIAL INTERLEAVED
V
BT= 1
1 2
4 8
R R
R R
WRITE
MODE
MIT-DS-0347-0.1
0
1
BURST SINGLE BIT
MITSUBISHI
R:Reserved for Future Use FP: Full Page
15/Oct./1999
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Preliminary Spec.
Some contents are subject to change without notice.
1,207,959,552-BIT ( 16,777,216-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
CK
MITSUBISHI LSIs
MH16S72DDFA-7, -8
Command
Address
DQ
Initial Address
A2
0 0
0 0 1
A1
0 0
1 1
0
A0
0 1
0 1 0
CL= 3 BL= 4
BL
8
Read
Y
/CAS Latency
1
0
2
1
3
2
4
3
5
4
Sequential
3
2
4
3
5
4
6
5
7
6
Q0 Q1 Q2 Q3
Burst Length
Column Addressing
5
4
6
5
7
6
0
7
1
0
7
6
0
7
1
0
2
1
3
2
Burst Type
1
0
0
1
3
2
2
3
5
4
Write
Y
D0 D1
Burst Length
Interleaved
3
2
2
3
1
0
0
1
7
6
D3
D2
5
4
4
5
7
6
6
7
1
0
7
6
6
7
5
4
4
5
3
2
0
1 1
1
-
-
-
-
-
-
MIT-DS-0347-0.1
1 0
1 1
1 0
0 0
1 0
1 1
1 0
-
-
1
6
5
7
6
0
7
1
0
2
1
4
3
2
0
3
1
0
2
1
0
0
7
1
0
2
1
3
2
0
3
1
0 1
2
2
1
3
2 3
4
MITSUBISHI
4
3
5
4 5
6
4
5
7
6
6
7
1
0
0
1
3
2
2
3
1
0 1
0
6
7
5
4
4
5
3
2
2
3
1
0 1
0
0
1
3
2 3
2
15/Oct./1999
2
3
1
0 1
0
13
Preliminary Spec.
ABSOLUTE MAXIMUM RATINGS
mA
RECOMMENDED OPERATING CONDITION
CAPACITANCE
f=1MHz
Some contents are subject to change without notice.
1,207,959,552-BIT ( 16,777,216-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
MITSUBISHI LSIs
MH16S72DDFA-7, -8
Symbol
Vdd
VI
VO
IO
Pd
Topr
Tstg
Operating Temperature
Parameter
Supply Voltage
Input Voltage
Output Voltage Output Current
Power Dissipation
Storage Temperature
(Ta=0 ~ 70°C, unless otherwise noted)
Symbol
Parameter
Condition
with respect to Vss with respect to Vss
with respect to Vss
Ta=25°C
Min.
Limits
Typ.
Ratings
-0.5 ~ 4.6
-0.5 ~ 4.6
-0.5 ~ 4.6 50
20.7
0 ~ 70
-45 ~ 100
Max.
Unit
V V
V
W
°C °C
Unit
Vdd Vss
VIH
VIL
Note) 1:VIH(max)=5.5V for pulse width less than 10ns.
2.VIL(min)=-1.0 for pulse width less than 10ns.
High-Level Input Voltage all inputs
Low-Level Input Voltage all inputs
Supply Voltage Supply Voltage
3.0 0
2.0
-0.3
3.3 0
(Ta=0 ~ 70°C, Vdd = 3.3 +/- 0.3V, Vss = 0V, unless otherwise noted)
Symbol
CI(A) CI(C)
CI(K)
CI/O
Parameter
Input Capacitance, address pin
Input Capacitance, control pin
Input Capacitance, CK0 pin
Input Capacitance, I/O pin
Test Condition
VI = Vss
Vi=25mVrms
Limits(max.)
Vdd+0.3
25 25
40 22
3.6 0
0.8
V V
V
V
Unit
pF pF
pF pF
MIT-DS-0347-0.1
MITSUBISHI ELECTRIC
15/Oct./1999
14
Preliminary Spec.
AVERAGE SUPPLY CURRENT from Vdd
AC OPERATING CONDITIONS AND CHARACTERISTICS
Limits
(max)
precharge stanby
in power-down mode
precharge stanby current
in non power-down mode
active stanby current
Some contents are subject to change without notice.
MITSUBISHI LSIs
MH16S72DDFA-7, -8
1,207,959,552-BIT ( 16,777,216-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
(Ta=0 ~70°C, Vdd = 3.3 ± 0.3V, Vss = 0V, unless otherwise noted)
Parameter
operating current one bank active (discrete)
current
in non power-down mode
one bank active (discrete)
burst current
auto-refresh current self-refresh current
Note) 1:Icc(max) is specified at the output open condition.
2.Input signals are changed one time during 30ns.
Symbol
Icc1
Icc2P
Icc2PS
Icc2N Icc2NS
Icc3N Icc3NS
Icc4 Icc5
Icc6
tRC=min.tCLK=min, BL=1,CL=3 CKE=L,tCLK=15ns, /CS>Vcc-0.2V
CKE=CLK=L, /CS>Vcc-0.2V
CKE=H,tCLK=15ns,VIH>Vcc-0.2V,VIL<0.2V CKE=H,CLK=L,VIH>Vcc-0.2V,VIL<0.2V(fixed)
CKE=H,tCLK=15ns CKE=H,CLK=L
tCLK=min, BL=4, CL=3,all banks active(discerte)
tRC=min, tCLK=min CKE <0.2V
Test Condition
(Ta=0 ~ 70°C, Vdd = 3.3 ± 0.3V, Vss = 0V, unless otherwise noted)
-7,-8 1285
61
43 385 295
565 475
1285
2005
43
Unit
mA
mA mA
mA mA
mA
mA
mA mA
mA
Symbol
VOH(DC) VOL(DC)
IOZ
Ii
MIT-DS-0347-0.1
High-Level Output Voltage(DC) Low-Level Output Voltage(DC) Off-stare Output Current Q floating VO=0 ~ Vdd Input Current
Parameter
Test Condition
IOH=-2mA IOL=2mA
VIH=0 ~ Vdd+0.3V
MITSUBISHI ELECTRIC
Limits
Min.
2.4
-5
-5 5
Max.
0.4 5
Unit
V
V uA uA
15/Oct./1999
15
Preliminary Spec.
AC TIMING REQUIREMENTS
tSRX
Note:1 The timing requirements are assumed tT=1ns.If tT is longer than 1ns,(tT-1)ns
should be added to the parameter.
Some contents are subject to change without notice.
MITSUBISHI LSIs
MH16S72DDFA-7, -8
1,207,959,552-BIT ( 16,777,216-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
(Ta=0 ~ 70°C, Vdd = 3.3 +/- 0.3V, Vss = 0V, unless otherwise noted) Input Pulse Levels: 0.8V to 2.0V Input Timing Measurement Level: 1.4V
LATCH MODE
Limits
Symbol
tCLK
tCH
tCL
tT tIS tIH
tRC
tRCD
tRAS
tRP
tWR tRRD tRSC
tPDE tREF
Parameter
CK cycle time
CL=3 CL=4
CK High pulse width CK Low pilse width Transition time of CK Input Setup time(all inputs) Input Hold time(all inputs) Row cycle time Row to Column Delay Row Active time Row Precharge time Write Recovery time Act to Act Deley time Mode Register Set Cycle time
Self Refresh Exit time
Power Down Exit time
Refresh Interval time
Min.
-7 Max.
10 10
3 3 1 10 2
1 70 20 50 100000 20 20 20 10 10
10
64
Min.
13 10
3 3 1 2
1 70 20 50 20 20 20 10 10 10
-8 Max.
10
100000
64
Unit
ns ns ns ns ns ns ns
ns ns ns ns ns ns ns ns
ns
ms
CK
1.4V
Any AC timing is referenced to the input signal crossing through 1.4V.
Signal
MIT-DS-0347-0.1
MITSUBISHI
1.4V
15/Oct./1999
16
Preliminary Spec.
SWITCHING CHARACTERISTICS
tSRX
Some contents are subject to change without notice.
1,207,959,552-BIT ( 16,777,216-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
BUFFER MODE
Symbol
tCLK
tCH
tCL
tT tIS tIH
tRC
tRCD
tRAS
tRP
tWR
tRRD tRSC
tPDE tREF
Parameter
CK cycle time
CL=3 CL=4
CK High pulse width CK Low pilse width Transition time of CK Input Setup time(all inputs) Input Hold time(all inputs) Row cycle time Row to Column Delay Row Active time Row Precharge time Write Recovery time Act to Act Deley time Mode Register Set Cycle time
Self Refresh Exit time
Power Down Exit time
Refresh Interval time
MITSUBISHI LSIs
MH16S72DDFA-7, -8
Limits
-7
Min.
10 10
3 3 ns 1 10 ns 7 ns
0 ns 70 ns 20 ns 50 20 ns 20 ns 20 ns 10 10
10
Max.
100000
64
Min.
-8 Max.
13 10 ns
3 3 1 7
0 70 20 50 20 20 20
10 10
10
10
100000
64
Unit
ns ns
ns
ns ns
ns
ms
Note:1 The timing requirements are assumed tT=1ns. If tT is longer than 1ns, (tT-1)ns should be added to the parameter.
(Ta=0 ~ 70°C, Vdd = 3.3 +/- 0.3V, Vss = 0V, unless otherwise noted)
LATCH MODE
Limits
Min.
-7 Max.
6 6
Symbol
tAC
Parameter
Access time from CK
CL=3 CL=4
Output Hold time
tOH
from CK Delay time, output low
tOLZ
impedance from CK
Delay time, output high
tOHZ
Note) 1 If clock rising time is longer than 1ns,(tT/2-0.5)ns should be added to parameter.
impedance from CK
3 0
3
6
Min.
3 0
3
-8 Max.
7
6
6
Unit
ns
ns ns
ns
MIT-DS-0347-0.1
MITSUBISHI ELECTRIC
15/Oct./1999
17
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