Some contents are subject to change without notice.
1,207,959,552-BIT ( 16,777,216-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
The MH16S72DCFA is 16777216 - word x 72-bit Synchronous
DRAM module. This consist of eighteen industry standard
16M x 4 Synchronous DRAMs in TSOP.
The TSOP on a card edge dual in-line package provides any
application where high densities and large of quantities memory
are required.
This is a socket-type memory module ,suitable for easy
interchange or addition of module.
MITSUBISHI LSIs
MH16S72DCFA-6
85pin
1pin
Max.
Utilizes industry standard 16M X 4 Synchronous DRAMs in
TSOP package , industry standard Resistered buffer in TSSOP
package,industry standard PLL in TSSOP package
Single 3.3V +/- 0.3V supply
Max.Clock frequency 133MHz
Fully synchronous operation referenced to clock rising edge
4-bank operation controlled by BA0,BA1(Bank Address)
/CAS latency -2/3(programmable,at buffer mode)
LVTTL Interface
Burst length 1/2/4/8/Full Page(programmable)
Burst type- Sequential and interleave burst (programmable)
Random column access
Burst Write / Single Write(programmable)
Auto precharge / All bank precharge controlled by A10
Auto refresh and Self refresh
4096 refresh cycles every 64ms
Discrete IC and module design conform to
PC133 specification.
Access Time from CLK
[component level]
5.4ns
(CL = 4 at Latch mode)
94pin
95pin
124pin
125pin
10pin
11pin
40pin
41pin
Main memory or graphic memory in computer systems
MIT-DS-0349-0.1
MITSUBISHI
ELECTRIC
168pin
84pin
15/Oct. /1999
1
Preliminary Spec.
/WE
Some contents are subject to change without notice.
MITSUBISHI LSIs
MH16S72DCFA-6
1,207,959,552-BIT ( 16,777,216-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
PIN NO.PIN NAMEPIN NO.PIN NAMEPIN NO.PIN NAMEPIN NO.PIN NAME
Register enable:When REGE is low,All control signals and
Some contents are subject to change without notice.
1,207,959,552-BIT ( 16,777,216-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
MITSUBISHI LSIs
MH16S72DCFA-6
CK0
/S0,2
/RAS,/CAS,/W
A0-11
Input
Input
Input
Input
Input
Master Clock:All other inputs are referenced to the rising
edge of CK
Clock Enable:CKE controls internal clock.When CKE is
low,internal clock for the following cycle is ceased. CKE is
also used to select auto / self refresh. After self refresh
mode is started, CKE E becomes asynchronous input.Self
refresh is maintained as long as CKE is low.
Chip Select: When /S is high,any command means
No Operation.
Combination of /RAS,/CAS,/W defines basic
commands.
A0-11 specify the Row/Column Address in conjunction with
BA.The Row Address is specified by A0-11.The Column
Address is specified by A0-9.A10 is also used to indicate
precharge option.When A10 is high at a read / write
command, an auto precharge is performed. When A10 is
BA0-1
DQ0-63
CB0-7
DQM0-7
Vdd,Vss
REGE
Input
Input/Output
Input
Input
high at a precharge command, both banks are precharged.
Bank Address:BA0,1 is specifies the four bank to which
a command is applied.BA must be set with ACT ,PRE
,READ ,WRITE commands
Data In and Data out are referenced to the rising edge
of CK
Din Mask/Output Disable:When DQMB is high in burst
write.Din for the current cycle is masked.When DQMB is high
in burst read,Dout is disabled at the next but one cycle.
Power Supply for the memory mounted
module.
address are buffered. (Buffer mode) When REGE is
high,All control and address are latched. (Latch mode)
MIT-DS-0349-0.1
MITSUBISHI
ELECTRIC
15/Oct. /1999
4
Preliminary Spec.
BASIC FUNCTIONS
READ command starts burst read from the active bank indicated by BA.First output
Some contents are subject to change without notice.
MITSUBISHI LSIs
MH16S72DCFA-6
1,207,959,552-BIT ( 16,777,216-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
The MH16S72DCFA provides basic functions,bank(row)activate,burst read / write,
bank(row)precharge,and auto / self refresh.
Each command is defined by control signals of /RAS,/CAS and /WE at CK rising edge. In
addition to 3 signals,/S,CKE and A10 are used as chip select,refresh option,and precharge
option,respectively.
To know the detailed definition of commands please see the command truth table.
ACT command activates a row in an idle bank indicated by BA.
Read(READ) [/RAS =H,/CAS =L, /WE =H]
data appears after /CAS latency. When A10 =H at this command,the bank is
deactivated after the burst read(auto-precharge,READA).
Write(WRITE) [/RAS =H, /CAS = /WE =L]
WRITE command starts burst write to the active bank indicated by BA. Total data
length to be written is set by burst length. When A10 =H at this command, the bank
is deactivated after the burst write(auto-precharge,WRITEA).
Precharge(PRE) [/RAS =L, /CAS =H,/WE =L]
PRE command deactivates the active bank indicated by BA. This command also
terminates burst read / write operation. When A10 =H at this command, both banks
are deactivated(precharge all, PREA).
Auto-Refresh(REFA) [/RAS =/CAS =L, /WE =CKE =H]
PEFA command starts auto-refresh cycle. Refresh address including bank address
are generated internally. After this command, the banks are precharged automatically.
MIT-DS-0349-0.1
MITSUBISHI
15/Oct. /1999
ELECTRIC
5
Preliminary Spec.
Precharge
Some contents are subject to change without notice.
1,207,959,552-BIT ( 16,777,216-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
COMMAND TRUTH TABLE
MITSUBISHI LSIs
MH16S72DCFA-6
COMMANDMNEMONIC
DeselectDESELHXHXXXXXX
No OperationNOPHXLHHHXXX
Row Adress Entry &
Bank Activate
Single Bank PrechargePREHXLLHLVLX
Precharge All BankPREAHXLLHLXHX
Column Address Entry
& Write
Column Address Entry
& Write with Auto-
Column Address Entry
& Read
Column Address Entry
& Read with Auto
Precharge
Auto-RefreshREFAHHLLLHXXX
Self-Refresh EntryREFSHLLLLHXXX
Self-Refresh ExitREFSX
Burst TerminateTBSTHXLHHLXXX
Mode Register SetMRSHXLLLLLLV*1
ACTHXLLHHVVV
WRITEHXLHLLVLV
WRITEAHXLHLLVHV
READHXLHLHVLV
READAHXLHLHVHV
CKE
CKE
n-1
LHHXXXXXX
LHLHHHXXX
n
/RAS /CAS/WE BA0,1A10A0-9
/S
A11
X
X
V
X
X
X
X
X
X
X
X
X
X
X
L
H =High Level, L = Low Level, V = Valid, X = Don't Care, n = CK cycle number
NOTE:
1.A7-9 = 0, A0-6 = Mode Address
MIT-DS-0349-0.1
MITSUBISHI
15/Oct. /1999
ELECTRIC
6
Preliminary Spec.
Begin Write,Latch CA,
Terminate Burst,Latch CA,
Terminate Burst,Latch CA,
Some contents are subject to change without notice.
MITSUBISHI LSIs
MH16S72DCFA-6
1,207,959,552-BIT ( 16,777,216-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
FUNCTION TRUTH TABLE
Current State/S/RAS /CAS/WEAddressCommandAction
IDLEHXXXXDESELNOP
LHHHXNOPNOP
LHHLBATBSTILLEGAL*2
LHLXBA,CA,A10READ/WRITE ILLEGAL*2
LLHHBA,RAACTBank Active,Latch RA
LLHLBA,A10PRE/PREANOP*4
LLLHXREFAAuto-Refresh*5
LLLL
ROW ACTIVEHXXXXDESELNOP
LHHHXNOPNOP
LHHLBATBSTNOP
LHLHBA,CA,A10READ/READA
LHLLBA,CA,A10
LLHHBA,RAACTBank Active/ILLEGAL*2
LLHLBA,A10PRE/PREAPrecharge/Precharge All
LLLHXREFAILLEGAL
LLLL
READHXXXXDESELNOP(Continue Burst to END)
LHHHXNOPNOP(Continue Burst to END)
LHHLBATBSTTerminate Burst
ABBREVIATIONS:
H = Hige Level, L = Low Level, X = Don't Care
BA = Bank Address, RA = Row Address, CA = Column Address, NOP = No Operation
NOTES:
1. All entries assume that CKE was High during the preceding clock cycle and the current
clock cycle.
2. ILLEGAL to bank in specified state; function may be legal in the bank indicated by BA,
depending on the state of that bank.
3. Must satisfy bus contention, bus turn around, write recovery requirements.
4. NOP to bank precharging or in idle state.May precharge bank indicated by BA.
5. ILLEGAL if any bank is not idle.
ILLEGAL = Device operation and / or date-integrity are not guaranteed.
MIT-DS-0349-0.1
MITSUBISHI
15/Oct. /1999
10
ELECTRIC
Preliminary Spec.
Action
2. Power-Down and Self-Refresh can be entered only form the All banks idle State.
Some contents are subject to change without notice.
MITSUBISHI LSIs
MH16S72DCFA-6
1,207,959,552-BIT ( 16,777,216-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
FUNCTION TRUTH TABLE FOR CKE
CKE
Current State
SELF - HXXXXXXINVALID
REFRESH*1LHHXXXXExit Self-Refresh(Idle after tRC)
CKE
n-1
LHLHHHXExit Self-Refresh(Idle after tRC)
LHLHHLXILLEGAL
LHLHLXXILLEGAL
LHLLXXXILLEGAL
LLXXXXXNOP(Maintain Self-Refresh)
n
/RAS /CAS/WEAdd
/S
POWERHXXXXXXINVALID
DOWNLHXXXXXExit Power Down to Idle
LLXXXXXNOP(Maintain Self-Refresh)
ALL BANKSHHXXXXXRefer to Function Truth Table
IDLE*2HLLLLHXEnter Self-Refresh
HLHXXXXEnter Power Down
HLLHHHXEnter Power Down
HLLHHLXILLEGAL
HLLHLXXILLEGAL
HLLLXXXILLEGAL
LXXXXXXRefer to Current State = Power Down
ANY STATEHHXXXXXRefer to Function Truth Table
other thanHLXXXXXBegin CK0 Suspend at Next Cycle*3
listed aboveLHXXXXXExit CK0 Suspend at Next Cycle*3
LLXXXXXMaintain CK0 Suspend
ABBREVIATIONS:
H = High Level, L = Low Level, X = Don't Care
NOTES:
1. CKE Low to High transition will re-enable CK and other inputs asynchronously.
A minimum setup time must be satisfied before any command other than EXIT.
3. Must be legal command.
MIT-DS-0349-0.1
MITSUBISHI
ELECTRIC
15/Oct. /1999
11
Preliminary Spec.
POWER ON SEQUENCE
1. Clock will be applied at power up along with power. Attempt to maintain CKE high, DQMB
MODE REGISTER
LENGTH
Some contents are subject to change without notice.
MITSUBISHI LSIs
MH16S72DCFA-6
1,207,959,552-BIT ( 16,777,216-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
Before starting normal operation, the following power on sequence is necessary to prevent
a SDRAM from damaged or malfunctioning.
high and NOP condition at the inputs along with power.
2. Maintain stable power, stable cock, and NOP input conditions for a minimum of 200µs.
3. Issue precharge commands for all banks. (PRE or PREA)
4. After all banks become idle state (after tRP), issue 8 or more auto-refresh commands.
5. Issue a mode register set command to initialize the mode register.
After these sequence, the SDRAM is idle state and ready for normal operation.
Burst Length, Burst Type and /CAS Latency can be programmed by setting the mode
register(MRS). The mode register stores these date until the next MRS command, which
may be issue when both banks are in idle state. After tRSC from a MRS command, the
SDRAM is ready for new command.
CK
/S
/RAS
/CAS
/WE
BT= 0BT= 1
1
2
4
8
R
R
R
FP
SEQUENTIAL
INTERLEAVED
V
1
2
4
8
R
R
R
R
LATENCY
MODE
00
CL
0 0 0
0 0 1
0 1 0
0 1 1
1 0 0
1 0 1
1 1 0
1 1 1
A11 A10 A9A8A7 A6A5A4 A3A2A1 A0BA1BA0
00
/CAS LATENCY
WM
R
R
2
3
R
R
R
R
00
LTMODEBTBL
BURST
BURST
TYPE
BA0,1 A11-0
BL
0 0 0
0 0 1
0 1 0
0 1 1
1 0 0
1 0 1
1 1 0
1 1 1
0
1
0
WRITE
MODE
MIT-DS-0349-0.1
1
BURST
SINGLE BIT
R:Reserved for Future Use
FP: Full Page
MITSUBISHI
15/Oct. /1999
ELECTRIC
12
Preliminary Spec.
Some contents are subject to change without notice.
1,207,959,552-BIT ( 16,777,216-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
tCLCK Low pulse width
tTTransition time of CK
tISInput Setup time(all inputs)
tIHInput Hold time(all inputs)
tRCRow Cycle time
tRFCRow Refresh Cycle time
tRCDRow to Column Delay
tRASRow Active time
tRPRow Precharge time
tWR
Write Recovery time
tRRDAct to Act Deley time
tRSCMode Register Set Cycle time
tSRX
tPDEPower Down Exit time
tREFRefresh Interval time
CL=3
CL=4
Min.Max.
10
7.5
2.5
2.5
1
1.5
0.8
67.5
75
20
45
20
15
15
10
7.5
7.5
MITSUBISHI LSIs
Limits
Unit
10
100K
64
ms
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
CK
1.4V
Any AC timing is
referenced to the input
signal crossing
Signal
MIT-DS-0349-0.1
1.4V
MITSUBISHI
through 1.4V.
15/Oct. /1999
ELECTRIC
16
Preliminary Spec.
SWITCHING CHARACTERISTICS
Parameter
Output Hold time
Self Refresh Exit time
Note:1 The timing requirements are assumed tT=1ns.If tT is longer than 1ns,(tT-1)ns
should be added to the parameter.
Some contents are subject to change without notice.
MITSUBISHI LSIs
MH16S72DCFA-6
1,207,959,552-BIT ( 16,777,216-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
BUFFER MODE
Limits
Symbol Parameter
CL=2
tCLKCK cycle time
CL=3ns
tCHCK High pulse widthns
tCLCK Low pulse width
tTTransition time of CK
tISInput Setup time(all inputs)
tIHInput Hold time(all inputs)ns
tRCRow Cycle time
tRFCRow Refresh Cycle time
tRCDRow to Column Delay
tRASRow Active time
tRPRow Precharge time
tWR
Write Recovery time
tRRDAct to Act Deley time
tRSCMode Register Set Cycle time
tSRX
tPDEPower Down Exit time