Some contents are subject to change without notice.
1,207,959,552-BIT ( 16,777,216-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
The MH16S72AVJB is 16777216 - word x 72-bit Synchronous
DRAM module. This consist of nine industry standard
16M x 8 Synchronous DRAMs in TSOP.
The TSOP on a card edge dual in-line package provides any
application where high densities and large of quantities memory
are required.
This is a socket-type memory module ,suitable for easy
interchange or addition of module.
MITSUBISHI LSIs
MH16S72AVJB-6
85pin
1pin
Max.
Utilizes industry standard 16M X 8 Synchronous DRAMs in
TSOP package , industry standard Resistered buffer in TSSOP
package,industry standard PLL in TSSOP package
Single 3.3V +/- 0.3V supply
Max.Clock frequency 133MHz
Fully synchronous operation referenced to clock rising edge
4-bank operation controlled by BA0,BA1(Bank Address)
/CAS latency -2/3(programmable,at buffer mode)
LVTTL Interface
Burst length 1/2/4/8/Full Page(programmable)
Burst type- Sequential and interleave burst (programmable)
Random column access
Burst Write / Single Write(programmable)
Auto precharge / All bank precharge controlled by A10
Auto refresh and Self refresh
4096 refresh cycles every 64ms
Discrete IC and module design conform to
PC133 specification.
Access Time from CLK
[component level]
5.4ns
(CL = 4 at Latch mode)
94pin
95pin
124pin
125pin
10pin
11pin
40pin
41pin
Main memory or graphic memory in computer systems
MIT-DS-0414-0.1
MITSUBISHI
ELECTRIC
168pin
84pin
27/Mar. /2001
1
Preliminary Spec.
/WE
Some contents are subject to change without notice.
MITSUBISHI LSIs
MH16S72AVJB-6
1,207,959,552-BIT ( 16,777,216-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
PIN NO.PIN NAMEPIN NO.PIN NAMEPIN NO.PIN NAMEPIN NO.PIN NAME
Some contents are subject to change without notice.
1,207,959,552-BIT ( 16,777,216-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
MITSUBISHI LSIs
MH16S72AVJB-6
Add
CKE0
/S0,2
DQM0-7
/W
/RAS
/CAS
10K
REGE
VDD
DQ8
DQ9
DQ10
DQ11
DQ12
DQ13
DQ14
DQ15
DQ16
DQ17
DQ18
DQ19
DQ20
DQ21
DQ22
DQ23
DQ24
DQ25
DQ26
DQ27
DQ28
DQ29
DQ30
From PLL
CK0
DQ31
PLL
CK1 - CK3Terminated
RCKE0
R/S0
R/S2
D0-8
D0-2,5-6
D3-4,7-8
DQ0
DQ1
DQ2
DQ3
DQ4
DQ5
DQ6
DQ7
CB0
CB1
CB2
CB3
CB4
CB5
CB6
CB7
RCKE0
RDQM0-7
D0
D1-2
D3
D4
D5
D6
D7
D8
DQ32
DQ33
DQ34
DQ35
DQ36
DQ37
DQ38
DQ39
DQ40
DQ41
DQ42
DQ43
DQ44
DQ45
DQ46
DQ47
DQ48
DQ49
DQ50
DQ51
DQ52
DQ53
DQ54
DQ55
DQ56
DQ57
DQ58
DQ59
DQ60
DQ61
DQ62
DQ63
SCL
WP
47K
VDD
VSS
SERIAL PD
A0 A1 A2
SA0 SA1 SA2
SDA
D0 to D8
D0 to D8
MIT-DS-0414-0.1
MITSUBISHI
ELECTRIC
27/Mar. /2001
3
Preliminary Spec.
PIN FUNCTION
CKE0
Register enable:When REGE is low,All control signals and
Some contents are subject to change without notice.
1,207,959,552-BIT ( 16,777,216-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
MITSUBISHI LSIs
MH16S72AVJB-6
CK0
/S0,2
/RAS,/CAS,/W
A0-11
Input
Input
Input
Input
Input
Master Clock:All other inputs are referenced to the rising
edge of CK
Clock Enable:CKE controls internal clock.When CKE is
low,internal clock for the following cycle is ceased. CKE is
also used to select auto / self refresh. After self refresh
mode is started, CKE E becomes asynchronous input.Self
refresh is maintained as long as CKE is low.
Chip Select: When /S is high,any command means
No Operation.
Combination of /RAS,/CAS,/W defines basic
commands.
A0-11 specify the Row/Column Address in conjunction with
BA.The Row Address is specified by A0-11.The Column
Address is specified by A0-9.A10 is also used to indicate
precharge option.When A10 is high at a read / write
command, an auto precharge is performed. When A10 is
BA0-1
DQ0-63
CB0-7
DQMB0-7
Vdd,Vss
REGE
Input
Input/Output
Input
Power Supply
Input
high at a precharge command, both banks are precharged.
Bank Address:BA0,1 is specifies the four bank to which
a command is applied.BA must be set with ACT ,PRE
,READ ,WRITE commands
Data In and Data out are referenced to the rising edge
of CK
Din Mask/Output Disable:When DQMB is high in burst
write.Din for the current cycle is masked.When DQMB is high
in burst read,Dout is disabled at the next but one cycle.
Power Supply for the memory mounted
module.
address are buffered. (Buffer mode) When REGE is
high,All control and address are latched. (Latch mode)
MIT-DS-0414-0.1
MITSUBISHI
ELECTRIC
27/Mar. /2001
4
Preliminary Spec.
BASIC FUNCTIONS
READ command starts burst read from the active bank indicated by BA.First output
Some contents are subject to change without notice.
MITSUBISHI LSIs
MH16S72AVJB-6
1,207,959,552-BIT ( 16,777,216-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
The MH16S72AVJB provides basic functions,bank(row)activate,burst read / write,
bank(row)precharge,and auto / self refresh.
Each command is defined by control signals of /RAS,/CAS and /WE at CK rising edge. In
addition to 3 signals,/S,CKE and A10 are used as chip select,refresh option,and precharge
option,respectively.
To know the detailed definition of commands please see the command truth table.
CK
/S
/RAS
/CAS
/WE
CKE
Chip Select : L=select, H=deselect
Command
Command
Command
Refresh Option @refresh command
define basic commands
A10
Precharge Option @precharge or read/write command
Activate(ACT) [/RAS =L, /CAS = /WE =H]
ACT command activates a row in an idle bank indicated by BA.
Read(READ) [/RAS =H,/CAS =L, /WE =H]
data appears after /CAS latency. When A10 =H at this command,the bank is
deactivated after the burst read(auto-precharge, READA).
Write(WRITE) [/RAS =H, /CAS = /WE =L]
WRITE command starts burst write to the active bank indicated by BA. Total data
length to be written is set by burst length. When A10 =H at this command, the bank
is deactivated after the burst write(auto-precharge, WRITEA).
Precharge(PRE) [/RAS =L, /CAS =H,/WE =L]
PRE command deactivates the active bank indicated by BA. This command also
terminates burst read / write operation. When A10 =H at this command, both banks
are deactivated(precharge all, PREA).
Auto-Refresh(REFA) [/RAS =/CAS =L, /WE =CKE =H]
PEFA command starts auto-refresh cycle. Refresh address including bank address
are generated internally. After this command, the banks are precharged automatically.
MIT-DS-0414-0.1
MITSUBISHI
27/Mar. /2001
ELECTRIC
5
Preliminary Spec.
& Read
Some contents are subject to change without notice.
1,207,959,552-BIT ( 16,777,216-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
COMMAND TRUTH TABLE
MITSUBISHI LSIs
MH16S72AVJB-6
COMMANDMNEMONIC
DeselectDESELHXHXXXXXX
No OperationNOPHXLHHHXXX
Row Adress Entry &
Bank Activate
Single Bank PrechargePREHXLLHLVLX
Precharge All BankPREAHXLLHLXHX
Column Address Entry
& Write
Column Address Entry
& Write with Auto-
Precharge
Column Address Entry
Column Address Entry
& Read with Auto
Precharge
Auto-RefreshREFAHHLLLHXXX
Self-Refresh EntryREFSHLLLLHXXX
Self-Refresh ExitREFSX
Burst TerminateTBSTHXLHHLXXX
Mode Register SetMRSHXLLLLLLV*1
ACTHXLLHHVVV
WRITEHXLHLLVLV
WRITEAHXLHLLVHV
READHXLHLHVLV
READAHXLHLHVHV
CKE
CKE
n-1
LHHXXXXXX
LHLHHHXXX
n
/RAS /CAS/WE BA0,1A10A0-9
/S
A11
X
X
V
X
X
V
V
V
V
X
X
X
X
X
L
H =High Level, L = Low Level, V = Valid, X = Don't Care, n = CK cycle number
NOTE:
1.A7-9 = 0, A0-6 = Mode Address
MIT-DS-0414-0.1
MITSUBISHI
27/Mar. /2001
ELECTRIC
6
Preliminary Spec.
Action
Op-Code,
Begin Write,Latch CA,
Op-Code,
Terminate Burst,Latch CA,
Terminate Burst,Latch CA,
Op-Code,
Some contents are subject to change without notice.
MH16S72AVJB-6
1,207,959,552-BIT ( 16,777,216-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
FUNCTION TRUTH TABLE
Current State/S/RAS /CAS/WEAddressCommand
IDLEHXXXXDESELNOP
LHHHXNOPNOP
LHHLBATBSTILLEGAL*2
LHLXBA,CA,A10READ/WRITE ILLEGAL*2
LLHHBA,RAACTBank Active,Latch RA
LLHLBA,A10PRE/PREANOP*4
LLLHXREFAAuto-Refresh*5
MITSUBISHI LSIs
LLLL
ROW ACTIVEHXXXXDESELNOP
LHHHXNOPNOP
LHHLBATBSTNOP
LHLHBA,CA,A10READ/READA
LHLLBA,CA,A10
LLHHBA,RAACTBank Active/ILLEGAL*2
LLHLBA,A10PRE/PREAPrecharge/Precharge All
LLLHXREFAILLEGAL
LLLL
READHXXXXDESELNOP(Continue Burst to END)
LHHHXNOPNOP(Continue Burst to END)
LHHLBATBSTTerminate Burst
ABBREVIATIONS:
H = Hige Level, L = Low Level, X = Don't Care
BA = Bank Address, RA = Row Address, CA = Column Address, NOP = No Operation
NOTES:
1. All entries assume that CKE was High during the preceding clock cycle and the current
clock cycle.
2. ILLEGAL to bank in specified state; function may be legal in the bank indicated by BA,
depending on the state of that bank.
3. Must satisfy bus contention, bus turn around, write recovery requirements.
4. NOP to bank precharging or in idle state.May precharge bank indicated by BA.
5. ILLEGAL if any bank is not idle.
ILLEGAL = Device operation and / or date-integrity are not guaranteed.
MIT-DS-0414-0.1
MITSUBISHI
27/Mar. /2001
10
ELECTRIC
Preliminary Spec.
Action
2. Power-Down and Self-Refresh can be entered only form the All banks idle State.
Some contents are subject to change without notice.
MITSUBISHI LSIs
MH16S72AVJB-6
1,207,959,552-BIT ( 16,777,216-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
FUNCTION TRUTH TABLE FOR CKE
CKE
Current State
SELF - HXXXXXXINVALID
REFRESH*1LHHXXXXExit Self-Refresh(Idle after tRC)
CKE
n-1
LHLHHHXExit Self-Refresh(Idle after tRC)
LHLHHLXILLEGAL
LHLHLXXILLEGAL
LHLLXXXILLEGAL
LLXXXXXNOP(Maintain Self-Refresh)
n
/RAS /CAS/WEAdd
/S
POWERHXXXXXXINVALID
DOWNLHXXXXXExit Power Down to Idle
LLXXXXXNOP(Maintain Self-Refresh)
ALL BANKSHHXXXXXRefer to Function Truth Table
IDLE*2HLLLLHXEnter Self-Refresh
HLHXXXXEnter Power Down
HLLHHHXEnter Power Down
HLLHHLXILLEGAL
HLLHLXXILLEGAL
HLLLXXXILLEGAL
LXXXXXXRefer to Current State = Power Down
ANY STATEHHXXXXXRefer to Function Truth Table
other thanHLXXXXXBegin CK0 Suspend at Next Cycle*3
listed aboveLHXXXXXExit CK0 Suspend at Next Cycle*3
LLXXXXXMaintain CK0 Suspend
ABBREVIATIONS:
H = High Level, L = Low Level, X = Don't Care
NOTES:
1. CKE Low to High transition will re-enable CK and other inputs asynchronously.
A minimum setup time must be satisfied before any command other than EXIT.
3. Must be legal command.
MIT-DS-0414-0.1
MITSUBISHI
ELECTRIC
27/Mar. /2001
11
Preliminary Spec.
POWER ON SEQUENCE
MODE REGISTER
LENGTH
BURST
LATENCY
Some contents are subject to change without notice.
MITSUBISHI LSIs
MH16S72AVJB-6
1,207,959,552-BIT ( 16,777,216-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
Before starting normal operation, the following power on sequence is necessary to prevent
a SDRAM from damaged or malfunctioning.
1. Apply power and start clock. Attempt to maintain CKE high, DQMB0-7 high and NOP
condition at the inputs.
2. Maintain stable power, stable cock, and NOP input conditions for a minimum of 200µs.
3. Issue precharge commands for all banks. (PRE or PREA)
4. After all banks become idle state (after tRP), issue 8 or more auto-refresh commands.
5. Issue a mode register set command to initialize the mode register.
After these sequence, the SDRAM is idle state and ready for normal operation.
Burst Length, Burst Type and /CAS Latency can be programmed by setting the mode
register(MRS). The mode register stores these date until the next MRS command, which
may be issue when both banks are in idle state. After tRSC from a MRS command, the
SDRAM is ready for new command.
CK
/S
/RAS
/CAS
/WE
BT= 0BT= 1
1
2
4
8
R
R
R
FP
SEQUENTIAL
INTERLEAVED
V
1
2
4
8
R
R
R
R
MODE
00
CL
0 0 0
0 0 1
0 1 0
0 1 1
1 0 0
1 0 1
1 1 0
1 1 1
A11 A10 A9A8A7A6A5A4 A3A2A1 A0BA1BA0
00
/CAS LATENCY
WM
R
R
2
3
R
R
R
R
00
LTMODEBTBL
BURST
TYPE
BA0,1 A11-0
BL
0 0 0
0 0 1
0 1 0
0 1 1
1 0 0
1 0 1
1 1 0
1 1 1
0
1
WRITE
MODE
MIT-DS-0414-0.1
0
1
BURST
SINGLE BIT
R:Reserved for Future Use
FP: Full Page
MITSUBISHI
ELECTRIC
27/Mar. /2001
12
Preliminary Spec.
Write
Some contents are subject to change without notice.
1,207,959,552-BIT ( 16,777,216-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
tCLCK Low pulse width
tTTransition time of CK
tISInput Setup time(all inputs)
tIHInput Hold time(all inputs)
tRCRow Cycle time
tRCDRow to Column Delay
tRASRow Active time
tRPRow Precharge time
tWR
Write Recovery time
tRRDAct to Act Deley time
tRSCMode Register Set Cycle time
tSRX
tPDEPower Down Exit time
tREFRefresh Interval time
CL=3
CL=47.5ns
Min.Max.
10
2.5
2.5
1
1.5
0.8
67.5
20
45
20
15
15
15
7.5
7.5
MITSUBISHI LSIs
Limits
10
100K
64
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ms
CK
Signal
MIT-DS-0414-0.1
MITSUBISHI
ELECTRIC
1.4V
1.4V
Any AC timing is
referenced to the input
signal crossing
through 1.4V.
Some contents are subject to change without notice.
MITSUBISHI LSIs
MH16S72AVJB-6
1,207,959,552-BIT ( 16,777,216-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
BUFFER MODE
Limits
Symbol
CL=2
tCLKCK cycle time
CL=3ns
tCHCK High pulse widthns
tCLCK Low pulse width
tTTransition time of CK
tISInput Setup time(all inputs)
tIHInput Hold time(all inputs)ns
tRCRow Cycle time
tRCD
Row to Column Delay
tRASRow Active time
tRPRow Precharge time
tWR
Write Recovery time
tRRDAct to Act Deley time
tRSCMode Register Set Cycle time
tSRX
tPDEPower Down Exit time
tREFRefresh Interval time
Min.Max.
10
7.5
2.5
2.5
1
6.5
0
67.5
20
45
20
15
15
15
7.5
7.5
10
100K
64
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ms
(Ta=0 ~ 70°C
LATCH MODE
Limits
Symbol
Unit
Min.Max.
6
ns
5.4
ns
tACAccess time from CK
tOH
from CK
CL=3
CL=4
CL=3
CL=4
3
2.7
Delay time, output low
tOLZ
tOHZ
impedance from CK
Delay time, output high
impedance from CK
0
2.75.4
ns
ns
NOTE)
1.If clock rising time is longer than 1ns, (tr /2-0.5ns) should be added to the parameter.
MIT-DS-0414-0.1
MITSUBISHI
27/Mar. /2001
ELECTRIC
17
Preliminary Spec.
Parameter
Output Hold time
Some contents are subject to change without notice.
1,207,959,552-BIT ( 16,777,216-WORD BY 72-BIT ) Synchronous DYNAMIC RAM
BUFFER MODE
Symbol
MITSUBISHI LSIs
MH16S72AVJB-6
Limits
Unit
Min.Max.
tACAccess time from CK
tOH
Delay time, output low
tOLZ
tOHZ
impedance from CK
Delay time, output high
impedance from CK
Output Load Condition
from CK
CK
CL=2
CL=3
CL=2
CL=3
6
5.4
3
2.7
0
2.75.4
ns
ns
ns
ns
1.4V
VOUT
Ext.CL=50pF
CK
tOLZ
tACtOH
Output Timing
Measurement
Reference Point
tOHZ
DQ
1.4V
1.4V
1.4VDQ
MIT-DS-0414-0.1
MITSUBISHI
ELECTRIC
27/Mar. /2001
18
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