Some contents are subject to change without notice.
MITSUBISHI LSIs
MH16S64FFB -10,-10L
1073741824-BIT (16777216 - WORD BY 64-BIT)SynchronousDRAM
DESCRIPTION
The MH16S64FFB is 16777216 - word by 64-bit
Synchronous DRAM module. This consists of eight
industry standard 16Mx8 Synchronous DRAMs in
TSOP and one industory standard EEPROM in
TSSOP.
The mounting of TSOP on a card edge Dual Inline
package provides any application where high
densities and large quantities of memory are
required.
This is a socket type - memory modules, suitable for
easy interchange or addition of modules.
FEATURES
Frequency
-10,10L8.0ns(CL=3)100MHz
CLK Access Time
(Component SDRAM)
Utilizes industry standard 16M x 8 Synchronous DRAMs
TSOP and industry standard EEPROM in TSSOP
144-pin (72-pin dual in-line package)
single 3.3V±0.3V power supply
Clock frequency 100MHz(max.)
Fully synchronous operation referenced to clock rising
edge
4 bank operation controlled by BA0,1(Bank Address)
/CAS latency- 2/3(programmable)
Burst length- 1/2/4/8/Full Page(programmable)
Burst type- sequential / interleave(programmable)
Column access - random
Auto precharge / All bank precharge controlled by A10
Auto refresh and Self refresh
4096 refresh cycle /64ms
LVTTL Interface
PCB Outline
(Front)
(Back)
APPLICATION
main memory or graphic memory in computer systems
1
2
143
144
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Preliminary Spec.
Some contents are subject to change without notice.
PIN CONFIGURATION
MITSUBISHI LSIs
MH16S64FFB -10,-10L
1073741824-BIT (16777216 - WORD BY 64-BIT)SynchronousDRAM
Some contents are subject to change without notice.
Block Diagram
/S0
MITSUBISHI LSIs
MH16S64FFB -10,-10L
1073741824-BIT (16777216 - WORD BY 64-BIT)SynchronousDRAM
DQMB0
DQ0
DQ1
DQ2
DQ3
DQ4
DQ5
DQ6
DQ7
DQMB1
DQ8
DQ9
DQ10
DQ11
DQ12
DQ13
DQ14
DQ15
DQMB2DQMB6
DQ16
DQ17
DQ18
DQ19
DQ20
DQ21
DQ22
DQ23
DQML
DQML
DQML
I/O 0
I/O 1
I/O 2
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
I/O 0
I/O 1
I/O 2
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
I/O 0
I/O 1
I/O 2
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
/CS
D0
/CS
D1
/CS
D2
DQMB4
DQ32
DQ33
DQ34
DQ35
DQ36
DQ37
DQ38
DQ39
DQMB5
DQ40
DQ41
DQ42
DQ43
DQ44
DQ45
DQ46
DQ47
DQ48
DQ49
DQ50
DQ51
DQ52
DQ53
DQ54
DQ55
DQML
I/O 0
I/O 1
I/O 2
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
DQML
I/O 0
I/O 1
I/O 2
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
DQML
I/O 0
I/O 1
I/O 2
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
/CS
D4
/CS
D5
/CS
D6
DQMB3DQMB7
DQ24
DQ25
DQ26
DQ27
DQ28
DQ29
DQ30
DQ31
/RAS
/CAS
/WE
BA0,BA1,A<11:0>D0 - D7
Vcc
CK=10Ω
Vss
DQML
I/O 0
I/O 1
I/O 2
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
/CS
D3
D0 - D7
D0 - D7
D0 - D7
D0 - D7
D0 - D7
MIT-DS-0280-0.1
CKE0
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DQ56
DQ57
DQ58
DQ59
DQ60
DQ61
DQ62
DQ63
D0 - D7
DQML
I/O 0
I/O 1
I/O 2
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
SCL
/CS
D7
CK0
CK1
SERIAL PD
A0 A1 A2
15. Jan.1999
2SDRAMs
2SDRAMs
2SDRAMs
2SDRAMs
SDA
Preliminary Spec.
MITSUBISHI LSIs
Some contents are subject to change without notice.
MH16S64FFB -10,-10L
1073741824-BIT (16777216 - WORD BY 64-BIT)SynchronousDRAM
Serial Presence Detect Table I
ByteFunction describedSPD enrty dataSPD DATA(hex)
0Defines # bytes written into serial memory at module mfgr12880
1Total # bytes of SPD memory device256 Bytes08
2Fundamental memory typeSDRAM04
3# Row Addresses on this assemblyA0-A110C
4# Column Addresses on this assembly
5# Module Banks on this assembly1BANK01
6Data Width of this assembly...x6440
7... Data Width continuation000
8Voltage interface standard of this assemblyLVTTL01
9
10SDRAM Access from Clock
11DIMM Configuration type (Non-parity,Parity,ECC)Non-PARITY00
12Refresh Rate/Typeself refresh(15.625uS)80
13SDRAM width,Primary DRAM
14Error Checking SDRAM data widthN/A00
15Minimum Clock Delay,Back to Back Random Column Addresses101
16Burst Lengths Supported
17# Banks on Each SDRAM device4bank04
18CAS# Latency
25SDRAM Cycle time(3rd highest CAS latency)N/A00
26
27Precharge to Active Minimum
28Row Active to Row Active Min.20ns14
29RAS to CAS Delay Min
30Active to Precharge Min
SDRAM Cycletime at Max. Supported CAS Latency (CL).
Cycle time for CL=3
tAC for CL=3
Cycle time for CL=2
SDRAM Access form Clock(2nd highest CAS latency)
tAC for CL=2
SDRAM Access form Clock(3rd highest CAS latency)
A0-A90A
10ns
8ns80
x808
1/2/4/8/Full page8F
2/306
15nsF0
8ns80
N/A00
30ns1E
30ns1E
60ns3C
A0
0E
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Preliminary Spec.
Some contents are subject to change without notice.
Serial Presence Detect Table II
MITSUBISHI LSIs
MH16S64FFB -10,-10L
1073741824-BIT (16777216 - WORD BY 64-BIT)SynchronousDRAM
31Density of each bank on module
32Command and Address signal input setup timeN/A00
33Command and Address signal input hold timeN/A00
34Data signal input setup timeN/A
35Data signal input hold timeN/A00
36-61
62SPD Revisionrev 101
63Checksum for bytes 0-62
64-71Manufactures Jedec ID code per JEP-108EMITSUBISHI1CFFFFFFFFFFFFFF
72Manufacturing locationMiyoshi,Japan01
73-90Manufactures Part Number
91-92Revision CodePCB revisionrrrr
93-94Manufacturing dateyear/week codeyyww
95-98Assembly Serial Numberserial numberssssssss
99-125Manufacture Specific Dataoption00
126Intetl specification frequency
127Intel specification CAS# Latency support06
128+Unused storage locationsopen00
Superset Information (may be used in future)option00
Some contents are subject to change without notice.
PIN FUNCTION
MITSUBISHI LSIs
MH16S64FFB -10,-10L
1073741824-BIT (16777216 - WORD BY 64-BIT)SynchronousDRAM
CK
(CK0 ~ CK1)
CKE0Input
/S0
/RAS,/CAS,/WEInputCombination of /RAS,/CAS,/WE defines basic commands.
A0-11Input
Input
Input
Master Clock:All other inputs are referenced to the rising
edge of CK
Clock Enable:CKE controls internal clock.When CKE is
low,internal clock for the following cycle is ceased. CKE is
also used to select auto / self refresh. After self refresh
mode is started, CKE becomes asynchronous input.Self
refresh is maintained as long as CKE is low.
Chip Select: When /S0 is high,any command means
No Operation.
A0-11 specify the Row/Column Address in conjunction with
BA.The Row Address is specified by A0-11.The Column
Address is specified by A0-9.A10 is also used to indicate
precharge option.When A10 is high at a read / write
command, an auto precharge is performed. When A10 is
high at a precharge command, both banks are precharged.
BA0,1Input
DQ0-63
DQMB0-7Input
Vdd,Vss
SCL
SDA
SA0-3
Input/Output
Power Supply Power Supply for the memory mounted module.
Input
Output
Input
Bank Address:BA0,1 is not simply BA.BA specifies the
bank to which a command is applied.BA0,1 must be set
with ACT,PRE,READ,WRITE commands
Data In and Data out are referenced to the rising edge of
CK
Din Mask/Output Disable:When DQMB is high in burst
write.Din for the current cycle is masked.When DQMB is high
in burst read,Dout is disabled at the next but one cycle.
Serial clock for serial PD
Serial data for serial PD
Address input for serial PD
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15. Jan.1999
Preliminary Spec.
Some contents are subject to change without notice.
MITSUBISHI LSIs
MH16S64FFB -10,-10L
1073741824-BIT (16777216 - WORD BY 64-BIT)SynchronousDRAM
BASIC FUNCTIONS
The MH16S64FFB provides basic functions,bank(row)activate,burst read / write,
bank(row)precharge,and auto / self refresh.
Each command is defined by control signals of /RAS,/CAS and /WE at CK rising edge. In
addition to 3 signals,/S0,CKE and A10 are used as chip select,refresh option,and
precharge option,respectively.
To know the detailed definition of commands please see the command truth table.
CK
/S0Chip Select : L=select, H=deselect
/RASCommand
/CASCommand
/WE
CKE
A10
Command
Refresh Option @refresh command
Precharge Option @precharge or read/write command
define basic commands
Activate(ACT) [/RAS =L, /CAS = /WE =H]
ACT command activates a row in an idle bank indicated by BA.
Read(READ) [/RAS =H,/CAS =L, /WE =H]
READ command starts burst read from the active bank indicated by BA.First output
data appears after /CAS latency. When A10 =H at this command,the bank is
deactivated after the burst read(auto-precharge,READA).
Write(WRITE) [/RAS =H, /CAS = /WE =L]
WRITE command starts burst write to the active bank indicated by BA. Total data
length to be written is set by burst length. When A10 =H at this command, the bank is
deactivated after the burst write(auto-precharge,WRITEA).
Precharge(PRE) [/RAS =L, /CAS =H,/WE =L]
PRE command deactivates the active bank indicated by BA. This command also
terminates burst read / write operation. When A10 =H at this command, both banks are
deactivated(precharge all, PREA).
Auto-Refresh(REFA) [/RAS =/CAS =L, /WE =CKE =H]
REFA command starts auto-refresh cycle. Refresh address including bank address are
generated internally. After this command, the banks are precharged automatically.
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Preliminary Spec.
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1073741824-BIT (16777216 - WORD BY 64-BIT)SynchronousDRAM
COMMAND TRUTH TABLE
COMMANDMNEMONIC
DeselectDESELHXHXXXXXX
No OperationNOPHXLHHHXXX
CKE
n-1
CKE
n
MITSUBISHI LSIs
MH16S64FFB -10,-10L
/S0
/RAS
/CAS
/WE BA0,1A10
A11
X
X
A0-9
Row Adress Entry &
Bank Activate
Single Bank PrechargePREHXLLHLVLX
Precharge All Bank
Column Address Entry
& Write
Column Address Entry
& Write with Auto-
Precharge
Column Address Entry
& Read
Column Address Entry
& Read with Auto
Precharge
Auto-RefreshREFAHHLLLHXXX
Self-Refresh EntryREFSHLLLLHXXX
Self-Refresh ExitREFSXLHHXXXXXX
Burst TerminateTERM
Mode Register Set
ACTHXLLHHVVV
PREA
WRITE
WRITEAHXLHLLVHV
READHXLHLHVLV
READAHXLHLHVHV
MRS
HXLLHLXHX
HXLHLLVLV
LHLHHHXXX
HXLHHLXXX
HXLLLLLL
V
X
X
X
X
X
X
X
X
X
X
X
L
V*1
H =High Level, L = Low Level, V = Valid, X = Don't Care, n = CK cycle number
NOTE:
1.A7-9 = 0, A0-6 = Mode Address
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Preliminary Spec.
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1073741824-BIT (16777216 - WORD BY 64-BIT)SynchronousDRAM
FUNCTION TRUTH TABLE
MITSUBISHI LSIs
MH16S64FFB -10,-10L
Current State/S0/RAS /CAS/WEAddress
IDLEHXXXXDESELNOP
LHHHXNOPNOP
LHHL
LHLX
LLHH
LLHL
LLLHXREFA
LLLL
ROW ACTIVEHXXXXDESELNOP
LHHHXNOPNOP
LHHLBA
LHLHBA,CA,A10READ/READA
LHLLBA,CA,A10
LLHHBA,RAACTBank Active/ILLEGAL*2
LLHLBA,A10PRE/PREAPrecharge/Precharge All
LLLHXREFAILLEGAL
INVALID
Exit Power Down to Idle
NOP(Maintain Self-Refresh)
Refer to Function Truth Table
Enter Self-Refresh
Enter Power Down
Enter Power Down
ILLEGAL
ILLEGAL
ILLEGAL
Refer to Current State = Power Down
Refer to Function Truth Table
Begin CK0 Suspend at Next Cycle*3
Exit CK0 Suspend at Next Cycle*3
Maintain CK0 Suspend
ABBREVIATIONS:
H = High Level, L = Low Level, X = Don't Care
NOTES:
1. CKE Low to High transition will re-enable CK and other inputs asynchronously.
A minimum setup time must be satisfied before any command other than EXIT.
2. Power-Down and Self-Refresh can be entered only from the All banks idle State.
3. Must be legal command.
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Preliminary Spec.
Some contents are subject to change without notice.
1073741824-BIT (16777216 - WORD BY 64-BIT)SynchronousDRAM
SIMPLIFIED STATE DIAGRAM
MITSUBISHI LSIs
MH16S64FFB -10,-10L
SELF
REFRESH
REFS
REFSX
WRITE
SUSPEND
MODE
REGISTER
SET
CLK
SUSPEND
TBST(for Full Page)TBST(for Full Page)
CKEL
WRITE
CKEH
WRITEAREADA
MRS
CKEH
WRITE
CKEL
WRITEA
WRITE
WRITEA
IDLE
ACT
ROW
ACTIVE
READ
REFA
CKEL
CKEH
READ
READA
READ
READA
AUTO
REFRESH
POWER
DOWN
CKEL
CKEH
READ
SUSPEND
POWER
APPLIED
MIT-DS-0280-0.1
WRITEA
SUSPEND
CKEL
CKEH
POWER
ON
WRITEA
PRE
PRE
PREPRE
PRE
CHARGE
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READA
CKEL
CKEH
READA
SUSPEND
Automatic Sequence
Command Sequence
15. Jan.1999
Preliminary Spec.
Some contents are subject to change without notice.
MITSUBISHI LSIs
MH16S64FFB -10,-10L
1073741824-BIT (16777216 - WORD BY 64-BIT)SynchronousDRAM
POWER ON SEQUENCE
Before starting normal operation, the following power on sequence is necessary to prevent a
SDRAM from damaged or malfunctioning.
1. Apply power and start clock. Attempt to maintain CKE high, DQMB0-7 high and NOP
condition at the inputs.
2. Maintain stable power, stable clock, and NOP input conditions for a minimum of 200us.
3. Issue precharge commands for all banks. (PRE or PREA)
4. After all banks become idle state (after tRP), issue 8 or more auto-refresh commands.
5. Issue a mode register set command to initialize the mode register.
After these sequence, the SDRAM is idle state and ready for normal operation.
MODE REGISTER
Burst Length, Burst Type and /CAS Latency can be programmed by setting the mode
register(MRS). The mode register stores these date until the next MRS command, which may
be issue when both banks are in idle state. After tRSC from a MRS command, the SDRAM is
ready for new command.
LATENCY
MODE
00
CL
0 0 0
0 0 1
0 1 0
0 1 1
1 0 0
1 0 1
1 1 0
1 1 1
A11 A10 A9A8A7 A6A5A4 A3A2A1 A0BA1BA0
00
/CAS LATENCY
WM
R
R
2
3
R
R
R
R
00
LTMODEBTBL
BURST
LENGTH
BURST
TYPE
BA0,1 A11-0
BL
0 0 0
0 0 1
0 1 0
0 1 1
1 0 0
1 0 1
1 1 0
1 1 1
0
1
CK
/S0
/RAS
/CAS
/WE
BT= 0BT= 1
1
2
4
8
R
R
R
FP
SEQUENTIAL
INTERLEAVED
V
1
2
4
8
R
R
R
R
WRITE
MODE
MIT-DS-0280-0.1
BURST
0
1
SINGLE BIT
MITSUBISHI
R:Reserved for Future Use
FP: Full Page
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Preliminary Spec.
Some contents are subject to change without notice.
MITSUBISHI LSIs
MH16S64FFB -10,-10L
1073741824-BIT (16777216 - WORD BY 64-BIT)SynchronousDRAM
[ /CAS LATENCY]
/CAS latency,CL,is used to synchronize the first output data with the CLK frequency,i.e.,the
speed of CLK determines which CL should be used.First output data is available after CL
cycles from READ command.
/CAS Latency Timing(BL=4)
CK
Command
Address
ACT
tRCD
X
READ
Y
DQ
CL=2
DQ
Q0Q1Q2Q3
CL=3
Q0Q1Q2Q3
CL=2
CL=3
[ BURST LENGTH ]
The burst length,BL,determines the number of consecutive wrutes or reads that will be
automatically performed after the initial write or read command.For BL=1,2,4,8,full page the
output data is tristated(Hi-Z) after the last read.For BL=FP (Full Page),the TBST (Burst
Terminate) command should be issued to stop the output of data.
Burst Length Timing(CL=2)
tRCD
CK
Command
Address
ACT
X
READ
Y
DQ
DQ
DQ
DQ
DQ
MIT-DS-0280-0.1
Q0
Q0 Q1
Q0 Q1 Q2Q3
Q0 Q1 Q2Q3Q5 Q6Q4Q7
Q0 Q1 Q2Q3Q5 Q6Q4Q7
m=1023
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Q8
Qm Q0 Q1
Full Page counter rolls over
and continues to count.
BL=1
BL=2
BL=4
BL=8
BL=FP
15. Jan.1999
Preliminary Spec.
Some contents are subject to change without notice.
CK
Command
Read
MITSUBISHI LSIs
MH16S64FFB -10,-10L
1073741824-BIT (16777216 - WORD BY 64-BIT)SynchronousDRAM
Some contents are subject to change without notice.
MITSUBISHI LSIs
MH16S64FFB -10,-10L
1073741824-BIT (16777216 - WORD BY 64-BIT)SynchronousDRAM
OPERATION DESCRIPTION
BANK ACTIVATE
The SDRAM has four independent banks. Each bank is activated by the ACT command with
the bank address(BA0,1). A row is indicated by the row address A11-0. The minimum
activation interval between one bank and the other bank is tRRD.The number of banks which
are active concurrently is not limited.
PRECHARGE
The PRE command deactivates indicated by BA. When both banks are active, the precharge
all command(PREA,PRE + A10=H) is available to deactivate them at the same time. After tRP
from the precharge, an ACT command can be issued.
Bank Activation and Precharge All (BL=4, CL=3)
CLK
Command
A0-9
A10
2ACT command/tRCmin
ACT
tRRD
Xa
Xa
ACT
Xb
tRCD
Xb
READ
Y
0
tRCmin
tRAS
PRE
1
ACT
tRP
Xb
Xb
A11
BA0,1
DQ
Xa
00
XbXb
00
01
Qa0Qa1Qa2Qa3
Precharge all
01
READ
After tRCD from the bank activation, a READ command can be issued. 1st output date is
available after the /CAS Latency from the READ, followed by (BL-1) consecutive date when
the Burst Length is BL. The start address is specified by A8-0, and the address sequence of
burst data is defined by the Burst Type. A READ command may be applied to any active bank,
so the row precharge time(tRP) can be hidden behind continuous output data(in case of BL=8)
by interleaving the dual banks. When A10 is high at a READ command, the
auto-precharge(READA) is performed. Any command (READ, WRITE, PRE, ACT) to the
same bank is inhibited till the internal precharge is complete. The internal precharge start at
BL after READA. The next ACT command can be issued after (BL + tRP) from the previous
READA.
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15. Jan.1999
Preliminary Spec.
Some contents are subject to change without notice.
Multi Bank Interleaving READ (BL=4, CL=3)
CK
Command
A0-9
ACT
tRCD
Xa
MITSUBISHI LSIs
MH16S64FFB -10,-10L
1073741824-BIT (16777216 - WORD BY 64-BIT)SynchronousDRAM
READ
Y
ACT
Xb
READ
Y
PRE
A10
A11
BA0,1
DQ
Xa
XaXb
00
0
00
/CAS latency
Xb
10
Qa0Qa1Qa2Qa3Qb0Qb1Qb2
0
0
10
00
Burst Length
READ with Auto-Precharge (BL=4, CL=3)
CK
BL + tRP
Command
A0-9
A10
A11XaXa
BA0,1
ACT
Xa
Xa
00
READ
tRCDtRP
Y
1
00
BL
ACT
Xa
Xa
00
DQ
CK
Command
CL=3
CL=2
MIT-DS-0280-0.1
Qa0Qa1Qa2Qa3
Internal precharge begins
READ Auto-Precharge Timing (BL=4)
ACTREAD
BL
DQQa0Qa1Qa2Qa3
DQQa0Qa1Qa2Qa3
Internal Precharge Start Timing
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Preliminary Spec.
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MITSUBISHI LSIs
MH16S64FFB -10,-10L
1073741824-BIT (16777216 - WORD BY 64-BIT)SynchronousDRAM
WRITE
After tRCD from the bank activation, a WRITE command can be issued. 1st input data is set
at the same cycle as the WRITE. Following(BL-1) data are written into the RAM, when the
Burst Length is BL. The start address is specified by A8-0, and the address sequence of burst
data is defined by the Burst Type. A WRITE command may be applied to any active bank, so
the row precharge time(tRP) can be hidden behind continuous input data by interleaving the
multiple banks. From the last input data to the PRE command, the write recovery time (tWR) is
required. When A10 is high at a WRITE command, the auto-precharge(WRITEA) is
performed. Any command(READ, WRITE, PRE, ACT) to the same bank is inhibited till the
internal precharge is complete. The internal precharge begins at tWR after the last input data
cycle. The next ACT command can be issued after tRP from the internal precharge timing.
The Mode Register can be WRITE command is issued and the remaining burst length is
ignored.The read data burst length os unaffected while in this mode.
Multi Bank Interleaving WRITE (BL=4)
CK
Command
A0-9
A10
A11XaXb0
BA0,1
DQ
ACT
Xa
Xa
00
tRCD
Write
ACT
tRCD
Y
Xb
0
Xb
00
10
Da0Da1Da2Da3
WRITE with Auto-Precharge (BL=4)
CK
Command
A0-9
ACT
Xa
Write
tRCDtRP
Y
Write
tWR
PRE
Y
0
0
10
00
Db0Db1Db2Db3
PRE
0
0
10
ACT
Xa
A10
A11
BA0,1
DQ
MIT-DS-0280-0.1
Xa
XaXa
00
1
00
Da0Da1Da2Da3
Internal precharge begins
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Xa
00
15. Jan.1999
Preliminary Spec.
Some contents are subject to change without notice.
MITSUBISHI LSIs
MH16S64FFB -10,-10L
1073741824-BIT (16777216 - WORD BY 64-BIT)SynchronousDRAM
[ BURST WRITE ]
A burst write operation is enabled by setting A9=0 at MRS.A burst write stats in
the same cycle as a write command set.(The latency of data input is 0.) The
burst length can be set to 1,2,4,8,and full-page,like burst read operations.
tRCD
CK
Command
Address
DQ
DQ
DQ
DQ
DQ
ACT
X
READ
Y
Q0
Q0 Q1
Q0 Q1 Q2Q3
Q0 Q1 Q2Q3Q5 Q6Q4Q7
Q0 Q1 Q2Q3Q5 Q6Q4Q7
m=511
Q8
Qm Q0 Q1
Full Page counter rolls over
and continues to count.
[ SINGLE WRITE ]
A single write operation is enabled by setting A9=1 at MRS.In a single write
operation,data is written only to the column address specified by the write
command set cycle without regard to the burst length setting.(The latency of data
input is 0.)
BL=1
BL=2
BL=4
BL=8
BL=FP
CK
Command
Address
DQQ0
MIT-DS-0280-0.1
ACT
X
tRCD
READ
Y
MITSUBISHI
ELECTRIC
( / 55 )
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15. Jan.1999
Preliminary Spec.
Some contents are subject to change without notice.
MITSUBISHI LSIs
MH16S64FFB -10,-10L
1073741824-BIT (16777216 - WORD BY 64-BIT)SynchronousDRAM
BURST INTERRUPTION
[ Read Interrupted by Read ]
Burst read option can be interrupted by new read of any bank. Random column access is
allowed. READ to READ interval is minimum 1 CK
Read Interrupted by Read (BL=4, CL=3)
CK
Command
A0-9
A10
A11
BA0,1
DQ
READ
Yi
0
00
READ
Yj
0
00
READ
Yk
0
10
Qai0Qaj1 Qbk0 Qbk1
Qaj0Qbk2Qal0
READ
Yl
0
01
Qal1 Qal2 Qal3
[ Read Interrupted by Write ]
Burst read operation can be interrupted by write of the same or the other bank. Random
column access is allowed. In this case, the DQ should be controlled adequately by using the
DQMB0-7 to prevent the bus contention. The output is disabled automatically 1 cycle after
WRITE assertion.
Read Interrupted by Write (BL=4, CL=3)
CK
Command
A0-9
A10
A11
BA0,1
DQMB0-7
Q
D
MIT-DS-0280-0.1
READ
Yi
0
0
Write
Yj
0
0
Qai0
Daj0 Daj1 Daj2 Daj3
DQM control Write control
MITSUBISHI
ELECTRIC
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22
15. Jan.1999
Preliminary Spec.
Some contents are subject to change without notice.
MITSUBISHI LSIs
MH16S64FFB -10,-10L
1073741824-BIT (16777216 - WORD BY 64-BIT)SynchronousDRAM
[ Read Interrupted by Precharge ]
Burst read operation can be interrupted by precharge of the same or the other bank. Read
to PRE interval is minimum 1 CK. A PRE command output disable latency is equivalent to
the /CAS Latency.As a result, READ to PRE interval determines valid data length to be
output.The figure below shows examples of BL=4.
Read Interrupted by Precharge (BL=4)
CK
CL=3
CL=2
Command
DQ
Command
DQ
Command
DQ
Command
DQ
Command
READPRE
Q0Q1
READPRE
Q0Q1
READ PRE
Q0
READ
READPRE
PRE
Q0Q2Q1
Q2
MIT-DS-0280-0.1
DQ
Command
DQ
READ PRE
Q0Q1
Q0
MITSUBISHI
ELECTRIC
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23
15. Jan.1999
Preliminary Spec.
Some contents are subject to change without notice.
MITSUBISHI LSIs
MH16S64FFB -10,-10L
1073741824-BIT (16777216 - WORD BY 64-BIT)SynchronousDRAM
[ Read Interrupted by Burst Terminate ]
Similarly to the precharge, burst terminate command,TBST, can interrupt burst read
operation and disable the data output. READ to TBST interval is minimum of 1 CK. TBST is
mainly used to interrupt FP bursts.The figure below show examples, of how the output data
is terminated with TBST.
Read Interrupted by Burst Terminate (BL=4)
CK
CL=3
CL=2
Command
DQ
Command
DQ
Command
DQ
Command
DQ
Command
DQ
READTBST
Q0Q1
READ
READ TBST
READ
READ
TBST
Q0Q1Q2
Q0
TBST
Q0Q1Q2Q3
TBST
Q0Q1Q2
Q2Q3
MIT-DS-0280-0.1
Command
DQ
READ
TBST
Q0
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ELECTRIC
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15. Jan.1999
Preliminary Spec.
Some contents are subject to change without notice.
MITSUBISHI LSIs
MH16S64FFB -10,-10L
1073741824-BIT (16777216 - WORD BY 64-BIT)SynchronousDRAM
[ Write Interrupted by Write ]
Burst write operation can be interrupted by new write of the same or the other bank.
Random column access is allowed. WRITE to WRITE interval is minimum 1 CK.
Write Interrupted by Write (BL=4)
CK
Command
A0-9
A10
A11
BA0,1
DQ
Write
Write
Yi
Yj
0
0
00
00
Dai0 Daj0Daj1 Dbk0
Write
Yk
0
10
Dbk1 Dbk2
Write
Yl
0
00
Dal0 Dal1Dal2 Dal3
[ Write Interrupted by Read ]
Burst write operation can be interrupted by read of the same or the other bank.
Random column access is allowed. WRITE to READ interval is minimum 1 CK. The
input data on DQ at the interrupting READ cycle is "don't care".
Write Interrupted by Read (BL=4, CL=3)
CK
Command
A0-9,11
A10
A11
BA0,1
DQMB0-7
DQ
MIT-DS-0280-0.1
Write
Yi
0
00
READ
Yj
0
00
Qaj0
Qaj1Dai0
MITSUBISHI
ELECTRIC
25
( / 55 )
Write
Yk
0
10
Dbk0 Dbk1
READ
Yl
0
00
Qbl0
15. Jan.1999
Preliminary Spec.
Some contents are subject to change without notice.
[ Write Interrupted by Precharge ]
Burst write operation can be interrupted by precharge of the same bank. Random
column access is allowed. Because the write recovery time(tWR) is required from the
last data to PRE command.
Write Interrupted by Precharge (BL=4)
CK
MITSUBISHI LSIs
MH16S64FFB -10,-10L
1073741824-BIT (16777216 - WORD BY 64-BIT)SynchronousDRAM
Command
A0-9,11
A10
A11
BA0,1
DQMB0-7
DQ
Write
Yi
0
00
Dai0 Dai1
PRE
tWRtRP
0
00
Dai2
ACT
Xb
Xb
Xb
00
[ Write Interrupted by Burst Terminate ]
A burst terminate command TBST can terminate burst write operation. In this case,
the write recovery time is not required and the bank remains active (Please see the
waveforms below).The WRITE to TBST minimum interval is 1CK.
Command
A0-9
BA0,1
DQMB0-7
MIT-DS-0280-0.1
CK
A10
DQ
Write Interrupted by Burst Terminate (BL=4)
Write
Yi
0
0
Dai0 Dai1
TBST
Dai2
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15. Jan.1999
Preliminary Spec.
Some contents are subject to change without notice.
AUTO REFRESH
Single cycle of auto-refresh is initiated with a REFA(/S0=/RAS=/CAS=L,
/WE=/CKE=H) command. The refresh address is generated internally. 4096 REFA
cycles within 64ms refresh 128Mbit memory cells. The auto-refresh is performed on
4bank concurrentry. Before performing an auto-refresh, all banks must be in the idle
state. Auto-refresh to Auto-refresh interval is minimum tRC.Any command must not be
supplied to the device before tRC from the REFA command.
Auto-Refresh
CK
/S0
/RAS
MITSUBISHI LSIs
MH16S64FFB -10,-10L
1073741824-BIT (16777216 - WORD BY 64-BIT)SynchronousDRAM
NOP or DESLECT
/CAS
/WE
CKE
A0-11
BA0,1
minimum tRC
Auto Refresh on All BanksAuto Refresh on All Banks
MIT-DS-0280-0.1
MITSUBISHI
ELECTRIC
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15. Jan.1999
Preliminary Spec.
Some contents are subject to change without notice.
SELF REFRESH
Self-refresh mode is entered by issuing a REFS command (/CS=/RAS=/CAS=L,
/WE=H, CKE=L). Once the self-refresh is initiated, it is maintained as log as CKE is
kept low.During the self-refresh mode, CKE is asynchronous and the only enabled
input , all other inputs including CK are disabled and ignored, so that power
consumption due to synchronous inputs is saved. To exit the self-refresh, supplying
stable CK inputs, asserting DESEL or NOP command and then asserting
CKE(REFSX) for longer than tSRX. After tRC from REFSX all banks are in the idle
state and a new command can be issued after tRC, but DESEL or NOP commands
must be asserted till then.
Self-Refresh
CK
/S0
MITSUBISHI LSIs
MH16S64FFB -10,-10L
1073741824-BIT (16777216 - WORD BY 64-BIT)SynchronousDRAM
Stable CK
NOP
/RAS
/CAS
/WE
CKE
A0-11
BA0,1
Self Refresh Entry
Self Refresh Exit
tSRX
new command
X
00
minimum tRC
+1 CLOCK
for recovery
MIT-DS-0280-0.1
MITSUBISHI
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15. Jan.1999
Preliminary Spec.
Some contents are subject to change without notice.
CLK SUSPEND
CKE controls the internal CLK at the following cycle. Figure below shows how CKE
works. By negating CKE, the next internal CLK is suspended. The purpose of CLK
suspend is power down, output suspend or input suspend. CKE is a synchronous
input except during the self-refresh mode. CLK suspend can be performed either
when the banks are active or idle, A command at the following cycle is ignored.
ext.CLK
CKE
int.CLK
MITSUBISHI LSIs
MH16S64FFB -10,-10L
1073741824-BIT (16777216 - WORD BY 64-BIT)SynchronousDRAM
CK
CKE
Command
CKE
Command
CK
CKE
PRE
ACT
Power Down by CKE
Standby Power Down
NOP NOP NOP NOP NOP NOP
NOP
Active Power Down
NOP NOP NOP NOP NOP NOP
NOP
DQ Suspend by CKE
Command
MIT-DS-0280-0.1
DQ
Write
D0D1D2D3
29
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READ
MITSUBISHI
ELECTRIC
Q0Q1Q2Q3
15. Jan.1999
Preliminary Spec.
Some contents are subject to change without notice.
DQM CONTROL
DQMB0-7 is a dual function signal defined as the data mask for writes and the output
disable for reads. During writes, DQMB0-7 masks input data word by word. DQMB0-7
to write mask latency is 0.
During reads, DQMB0-7 forces output to Hi-Z word by word. DQMB0-7 to output Hi-Z
latency is 2.
CK
MITSUBISHI LSIs
MH16S64FFB -10,-10L
1073741824-BIT (16777216 - WORD BY 64-BIT)SynchronousDRAM
DQM Function
Command
DQMB0-7
DQ
Write
D0D2D3
masked by DQM=H
READ
Q0Q1Q3
disabled by DQM=H
MIT-DS-0280-0.1
MITSUBISHI
ELECTRIC
30
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15. Jan.1999
Preliminary Spec.
Some contents are subject to change without notice.
ABSOLUTE MAXIMUM RATINGS
MITSUBISHI LSIs
MH16S64FFB -10,-10L
1073741824-BIT (16777216 - WORD BY 64-BIT)SynchronousDRAM
SymbolParameter
Vdd
VI
VO
IO
Pd
Topr
Tstg
Supply Voltage
Input Voltage
Output Voltage
Output Current
Power Dissipation
Operating Temperature
Storage Temperature
ConditionRatingsUnit
with respect to Vss
with respect to Vss
with respect to Vss
Ta=25°C
RECOMMENDED OPERATING CONDITION
(Ta=0 ~ 70°C, unless otherwise noted)
Symbol
Vdd
Parameter
Supply Voltage
-0.5 ~ 4.6
-0.5 ~ 4.6
-0.5 ~ 4.6
50
8
0 ~ 70
-40 ~ 100
Limits
Min.Typ.Max.
3.0
3.3
3.6
V
V
V
mA
W
°C
°C
Unit
V
Vss
VIH
VIL
Note:* VIH (max) = 5.5V for pulse width less than 10ns.
VIL (min) = -1.0V for pulse width less than 10ns.
Note:3 If clock rising time is longer than 1ns,(tT/2-0.5)ns should be added to parameter.
Output Load
Condition
VOUT
50Ω
VTT=1.4V
VREF=1.4V
CK
DQ
CL=2
CL=3
Limits
Min. Max.
8
8
3
0
3
8
Unit
ns
ns
ns
ns
ns
1.4V
1.4V
MIT-DS-0280-0.1
50pF
CK
tACtOH
Output Timing
Measurement
Reference Point
tOHZ
MITSUBISHI
ELECTRIC
1.4V
1.4VDQ
15. Jan.1999
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34
Preliminary Spec.
Some contents are subject to change without notice.
Burst Write (single bank) @BL=4
01234567891011121314151617
CLK
tRC
/CS
MITSUBISHI LSIs
MH16S64FFB -10,-10L
1073741824-BIT (16777216 - WORD BY 64-BIT)SynchronousDRAM
/RAS
/CAS
/WE
CKE
DQM
A0-8
A10
tRAS
tRCD
tWR
X
X
Y
tRP
tRCD
X
X
Y
A9,11
BA0,1
DQ
MIT-DS-0280-0.1
X
0
ACT#0WRITE#0PRE#0ACT#0WRITE#0
00
D0D0D0D0
X
0
Italic parameter indicates minimum case
0
D0D0D0D0
MITSUBISHI
ELECTRIC
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35
15. Jan.1999
Preliminary Spec.
Some contents are subject to change without notice.
Burst Write (multi bank) @BL=4
01234567891011121314151617
CLK
MITSUBISHI LSIs
MH16S64FFB -10,-10L
1073741824-BIT (16777216 - WORD BY 64-BIT)SynchronousDRAM
tRC
/CS
/RAS
/CAS
/WE
CKE
DQM
A0-8
A10
tRRD
tRAS
tRCD
tWR
X
X
Y
X
X
Y
tRP
tWR
tRRD
tRCD
X
X
Y
X
X
A9,11
BA0,1
DQ
MIT-DS-0280-0.1
X
0
ACT#0WRITE#0PRE#0ACT#0WRITE#0
X
01
1
D0D0D0D0
ACT#1WRITE#1PRE#1
0
D1D1D1D1
Italic parameter indicates minimum case
X
0
1
ACT#2
X
0
2
D0D0D0D0
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ELECTRIC
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15. Jan.1999
Preliminary Spec.
Some contents are subject to change without notice.
Burst Read (single bank) @BL=4 CL=3
01234567891011121314151617
CLK
/CS
tRAStRP
/RAS
MITSUBISHI LSIs
MH16S64FFB -10,-10L
1073741824-BIT (16777216 - WORD BY 64-BIT)SynchronousDRAM
tRC
/CAS
/WE
CKE
DQM
A0-8
A10
A9,11
tRCD
DQM read latency =2
X
X
X
Y
tRCD
X
X
X
Y
BA0,1
DQ
MIT-DS-0280-0.1
0
ACT#0READ#0PRE#0ACT#0READ#0
00
CL=3
Q0Q0Q0Q0
READ to PRE ≥BL allows full data out
Italic parameter indicates minimum case
0
0
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ELECTRIC
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37
Q0Q0
15. Jan.1999
Preliminary Spec.
Some contents are subject to change without notice.
Burst Read (multiple bank) @BL=4 CL=3
01234567891011121314151617
CLK
/CS
tRRD
tRAStRP
/RAS
MITSUBISHI LSIs
MH16S64FFB -10,-10L
1073741824-BIT (16777216 - WORD BY 64-BIT)SynchronousDRAM
tRC
tRRD
/CAS
/WE
CKE
DQM
A0-8
A10
A9,11
tRCD
DQM read latency =2
X
X
X
Y
X
X
X
Y
tRCD
X
X
X
Y
X
X
X
BA0,1
DQ
MIT-DS-0280-0.1
0
ACT#0READ#0PRE#0ACT#0READ#0
00
1
CL=3
ACT#1
1
CL=3
Q0Q0Q0Q0
READ#1PRE#1ACT#2
Italic parameter indicates minimum case
0
Q1Q1Q1Q1
0
21
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ELECTRIC
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38
Q0
15. Jan.1999
Preliminary Spec.
Some contents are subject to change without notice.
Burst Write (multi bank) with Auto-Precharge @BL=4
01234567891011121314151617
CLK
tRC
/CS
tRRD
/RAS
MITSUBISHI LSIs
MH16S64FFB -10,-10L
1073741824-BIT (16777216 - WORD BY 64-BIT)SynchronousDRAM
tRRD
/CAS
/WE
CKE
DQM
A0-8
A10
A9,11
tRCD
BL-1+ tWR + tRP
BL-1+ tWR + tRP
X
X
X
Y
X
X
X
YX
tRCD
Y
X
X
tRCD
X
X
X
Y
BA0,1
DQ
MIT-DS-0280-0.1
0
ACT#0WRITE#0 with
ACT#1WRITE#1 with
01
1
D0D0D0D0
AutoPrecharge
D1D1D1D1
AutoPrecharge
( / 55 )
39
ACT#0WRITE#0
Italic parameter indicates minimum case
MITSUBISHI
ELECTRIC
0
0
1
D0D0D0D0
ACT#1WRITE#1
1
D1
15. Jan.1999
Preliminary Spec.
Some contents are subject to change without notice.
Burst Read (multiple bank) with Auto-Precharge @BL=4 CL=3
01234567891011121314151617
CLK
tRC
/CS
tRRD
/RAS
MITSUBISHI LSIs
MH16S64FFB -10,-10L
1073741824-BIT (16777216 - WORD BY 64-BIT)SynchronousDRAM
tRRD
/CAS
/WE
CKE
DQM
A0-8
A10
A9,11
tRCD
BL+tRP
DQM read latency =2
X
X
X
Y
X
X
X
Y
BL+tRP
X
X
X
tRCD
tRCD
Y
X
X
X
Y
BA0,1
DQ
MIT-DS-0280-0.1
0
ACT#0READ#0 with
ACT#1
0
1
Auto-Precharge
CL=3
1
CL=3
Q0Q0Q0Q0
READ#1 with
Auto-Precharge
Italic parameter indicates minimum case
MITSUBISHI
ELECTRIC
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40
0
Q1Q1Q1Q1
ACT#0READ#0
0
1
CL=3
ACT#1
1
Q0
Q0
15. Jan.1999
Preliminary Spec.
Some contents are subject to change without notice.
Page Mode Burst Write (multi bank) @BL=4
01234567891011121314151617
CLK
/CS
tRRD
/RAS
tRCD
/CAS
/WE
MITSUBISHI LSIs
MH16S64FFB -10,-10L
1073741824-BIT (16777216 - WORD BY 64-BIT)SynchronousDRAM
CKE
DQM
A0-8
A10
A9,11
BA0,1
DQ
X
X
X
0
ACT#0WRITE#0WRITE#0
Y
X
X
X
00
1
D0D0D0D0
ACT#1
YY
D0D0D0D0D0D0D0
WRITE#0
Y
1
D1D1D1D1
WRITE#1
0
MIT-DS-0280-0.1
MITSUBISHI
ELECTRIC
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41
Italic parameter indicates minimum case
15. Jan.1999
Preliminary Spec.
Some contents are subject to change without notice.
Page Mode Burst Read (multi bank) @BL=4 CL=3
01234567891011121314151617
CLK
/CS
tRRD
/RAS
tRCD
/CAS
/WE
MITSUBISHI LSIs
MH16S64FFB -10,-10L
1073741824-BIT (16777216 - WORD BY 64-BIT)SynchronousDRAM
CKE
DQM
A0-8
A10
A9,11
BA0,1
DQ
DQM read latency=2
X
X
X
0
ACT#0READ#0READ#0
Y
X
X
X
00
1
CL=3CL=3CL=3
ACT#1
YY
Q0Q0Q0
Q0
READ#0
Y
1
Q0Q0Q0Q0
READ#1
0
Q1Q1Q1Q1
MIT-DS-0280-0.1
MITSUBISHI
ELECTRIC
( / 55 )
42
Italic parameter indicates minimum case
15. Jan.1999
Preliminary Spec.
Some contents are subject to change without notice.
Write Interrupted by Write / Read @BL=4
01234567891011121314151617
CLK
/CS
tRRD
/RAS
MITSUBISHI LSIs
MH16S64FFB -10,-10L
1073741824-BIT (16777216 - WORD BY 64-BIT)SynchronousDRAM
/CAS
/WE
CKE
DQM
A0-8
A10
A9,11
tRCD
X
X
X
Y
X
X
X
tCCD
YY
Y
Y
BA0,1
DQ
MIT-DS-0280-0.1
0
ACT#0WRITE#0
ACT#1
Burst Write can be interrupted by Write or Read of any active bank.
0
1
D0D0D0D0
000
D0D0D1D1Q0Q0Q0
WRITE#0READ#0
WRITE#0
1
CL=3
WRITE#1
Italic parameter indicates minimum case
MITSUBISHI
ELECTRIC
( / 55 )
43
Q0
15. Jan.1999
Preliminary Spec.
Some contents are subject to change without notice.
Read Interrupted by Read / Write @BL=4 CL=3
01234567891011121314151617
CLK
/CS
tRRD
/RAS
tRCD
/CAS
/WE
MITSUBISHI LSIs
MH16S64FFB -10,-10L
1073741824-BIT (16777216 - WORD BY 64-BIT)SynchronousDRAM
CKE
DQM
A0-8
A10
A9,11
BA0,1
DQ
DQM read latency=2
X
X
X
0
ACT#0READ#0WRITE#0
ACT#1
Y
X
X
X
00
1
YY
Y
0
Q0Q0Q0
Q0
READ#0READ#0
READ#0
Y
1
READ#1
Y
0
Q0Q0Q1Q1
blank to prevent bus contention
0
Q0D0D0
MIT-DS-0280-0.1
Burst Read can be interrupted by Read or Write of any active bank.
Italic parameter indicates minimum case
MITSUBISHI
ELECTRIC
( / 55 )
44
15. Jan.1999
Preliminary Spec.
Some contents are subject to change without notice.
Write Interrupted by Precharge @BL=4
01234567891011121314151617
CLK
/CS
tRRD
/RAS
tRCD
/CAS
/WE
MITSUBISHI LSIs
MH16S64FFB -10,-10L
1073741824-BIT (16777216 - WORD BY 64-BIT)SynchronousDRAM
CKE
DQM
A0-8
A10
A9,11
BA0,1
DQ
X
X
X
0
ACT#0WRITE#0
ACT#1
Y
X
X
X
0
1
D0D0D0D0
Burst Write is not interrupted by
Precharge of the other bank.
Y
0
1
PRE#1
Burst Write is interrupted by
Precharge of the same bank.
11
D1D1D1D1D1
PRE#0
WRITE#1
X
X
X
1
ACT#1WRITE#1
Y
MIT-DS-0280-0.1
MITSUBISHI
ELECTRIC
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45
Italic parameter indicates minimum case
15. Jan.1999
Preliminary Spec.
Some contents are subject to change without notice.
Read Interrupted by Precharge @BL=4 CL=3
01234567891011121314151617
CLK
/CS
MITSUBISHI LSIs
MH16S64FFB -10,-10L
1073741824-BIT (16777216 - WORD BY 64-BIT)SynchronousDRAM
/RAS
/CAS
/WE
CKE
DQM
A0-8
A10
X
X
tRRD
tRCD
tRP
tRCD
DQM read latency=2
Y
X
X
Y
X
X
Y
A9,11
BA0,1
DQ
MIT-DS-0280-0.1
X
0
ACT#0READ#0
X
0
1
ACT#1
Burst Read is not interrupted
by Precharge of the other bank.
X
1
Q0Q0Q0
Q0
PRE#0
READ#1ACT#1READ#1
0
1
Q1Q1
PRE#1
Burst Read is interrupted
by Precharge of the same bank.
Italic parameter indicates minimum case
1
MITSUBISHI
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Preliminary Spec.
Some contents are subject to change without notice.
Mode Register Setting
01234567891011121314151617
CLK
MITSUBISHI LSIs
MH16S64FFB -10,-10L
1073741824-BIT (16777216 - WORD BY 64-BIT)SynchronousDRAM
/CS
/RAS
/CAS
/WE
CKE
DQM
A0-8
A10
tRC
M
tRSC
tRCD
X
X
Y
A9,11
BA0,1
DQ
MIT-DS-0280-0.1
Auto-Ref (last of 8 cycles)
Mode
Register
Setting
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X
0
0
ACT#0WRITE#0
Italic parameter indicates minimum case
0
D0
D0D0D0
15. Jan.1999
Preliminary Spec.
Some contents are subject to change without notice.
Auto-Refresh @BL=4
01234567891011121314151617
CLK
/CS
tRC
/RAS
/CAS
/WE
MITSUBISHI LSIs
MH16S64FFB -10,-10L
1073741824-BIT (16777216 - WORD BY 64-BIT)SynchronousDRAM
tRCD
CKE
DQM
A0-8
A10
A9,11
BA0,1
DQ
Auto-Refresh
X
X
X
0
ACT#0WRITE#0
Y
0
D0
D0D0D0
MIT-DS-0280-0.1
Before Auto-Refresh,
all banks must be idle state.
After tRC from Auto-Refresh,
all banks are idle state.
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Italic parameter indicates minimum case
15. Jan.1999
Preliminary Spec.
Some contents are subject to change without notice.
Self-Refresh
01234567891011121314151617
CLK
CLK can be stopped
/CS
/RAS
/CAS
MITSUBISHI LSIs
MH16S64FFB -10,-10L
1073741824-BIT (16777216 - WORD BY 64-BIT)SynchronousDRAM
tRC
/WE
CKE
DQM
A0-8
A10
A9,11
BA0,1
DQ
tSRX
CKE must be low to maintain Self-Refresh
X
X
X
0
MIT-DS-0280-0.1
Self-Refresh Entry
Before Self-Refresh Entry,
all banks must be idle state.
Self-Refresh ExitACT#0
After tRC from Self-Refresh Exit,
all banks are idle state.
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Italic parameter indicates minimum case
15. Jan.1999
Preliminary Spec.
Some contents are subject to change without notice.
DQM Write Mask @BL=4
01234567891011121314151617
CLK
/CS
/RAS
tRCD
/CAS
/WE
MITSUBISHI LSIs
MH16S64FFB -10,-10L
1073741824-BIT (16777216 - WORD BY 64-BIT)SynchronousDRAM
CKE
DQM
A0-8
A10
A9,11
BA0,1
DQ
X
X
X
0
ACT#0WRITE#0WRITE#0WRITE#0
Y
00
D0D0D0D0
Y
Y
0
masked
D0D0D0
masked
MIT-DS-0280-0.1
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ELECTRIC
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Italic parameter indicates minimum case
15. Jan.1999
Preliminary Spec.
Some contents are subject to change without notice.
DQM Read Mask @BL=4 CL=3
01234567891011121314151617
CLK
/CS
/RAS
tRCD
/CAS
/WE
MITSUBISHI LSIs
MH16S64FFB -10,-10L
1073741824-BIT (16777216 - WORD BY 64-BIT)SynchronousDRAM
CKE
DQM
A0-8
A10
A9,11
BA0,1
DQ
DQM read latency=2
X
X
X
0
ACT#0READ#0READ#0READ#0
Y
00
Q0Q0Q0Q0
Y
Y
0
masked
masked
Q0Q0Q0
MIT-DS-0280-0.1
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Italic parameter indicates minimum case
15. Jan.1999
Preliminary Spec.
Some contents are subject to change without notice.
Power Down
01234567891011121314151617
CLK
/CS
/RAS
/CAS
/WE
MITSUBISHI LSIs
MH16S64FFB -10,-10L
1073741824-BIT (16777216 - WORD BY 64-BIT)SynchronousDRAM
CKE
DQM
A0-8
A10
A9,11
BA0,1
DQ
Standby Power Down
CKE latency=1
X
X
X
0
Precharge AllACT#0
Active Power Down
MIT-DS-0280-0.1
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Italic parameter indicates minimum case
15. Jan.1999
Preliminary Spec.
Some contents are subject to change without notice.
CLK Suspend @BL=4 CL=3
01234567891011121314151617
CLK
/CS
/RAS
tRCD
/CAS
/WE
MITSUBISHI LSIs
MH16S64FFB -10,-10L
1073741824-BIT (16777216 - WORD BY 64-BIT)SynchronousDRAM
CKE
DQM
A0-8
A10
A9,11
BA0,1
DQ
CKE latency=1CKE latency=1
X
X
X
0
ACT#0WRITE#0READ#0
Y
00
D0D0D0D0
Y
Q0Q0Q0Q0
CLK suspendedCLK suspended
MIT-DS-0280-0.1
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Italic parameter indicates minimum case
15. Jan.1999
Preliminary Spec.
Some contents are subject to change without notice.
OUTLINE
3.80Max
26.67
MITSUBISHI LSIs
MH16S64FFB -10,-10L
1073741824-BIT (16777216 - WORD BY 64-BIT)SynchronousDRAM
1.00 +/- 0.10
Unit.mm
67.60
63.60
4.00
20.00
Pin143
6.00
32.80
4.60
2.5
MIT-DS-0280-0.1
24.50
2-R Full
2-o1.80
Pin1
23.20
3.30
MITSUBISHI
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3.70
15. Jan.1999
Preliminary Spec.
Some contents are subject to change without notice.
Keep safety first in your circuit designs!
Mitsubishi Electric Corporation puts the maximum effort into making
semiconductor products better and more reliable,but there is always the
possibility that trouble may occur with them. Trouble with semiconductors
consideration to safety when making your circuit designs,with appropriate
measures such as (i) placement of substitutive,auxiliary circuits,(ii) use of
non-flammable material or (iii) prevention against any malfunction or mishap.
Notes regarding these materials
1.These materials are intended as a reference to assist our customers in the
selection of the Mitsubishi semiconductor product best suited to the
customer's application;they do not convey any license under any
intellectual property rights,or any other rights,belonging to Mitsubishi
Electric Corporation or a third party.
MITSUBISHI LSIs
MH16S64FFB -10,-10L
1073741824-BIT (16777216 - WORD BY 64-BIT)SynchronousDRAM
2.Mitsubishi Electric Corporation assumes no responsibility for any damage,
or infringement of any third-party's rights,originating in the use of any
product data,diagrams,charts or circuit application examples contained in
these materials.
3.All information contained in these materials,including product data,
diagrams and charts,represent information on products at the time of
publication of these materials,and are subject to change by Mitsubishi
Electric Corporation without notice due to product improvements or other
reasons. It is therefore recommended that customers contact Mitsubishi
Electric Corporation or an authorized Mitsubishi Semiconductor product
distributor for the latest product information before purchasing a product
listed herein.
4.Mitsubishi Electric Corporation semiconductors are not designed or
manufactured for use in a device or system that is used under
circumstances in which human life is potentially at stake. Please contact
Mitsubishi Electric Corporation or an authorized Mitsubishi Semiconductor
product distributor when considering the use of a product contained herein
for special applications,such as apparatus or systems for transportation,
vehicular,medical,aerospace,nuclear,or undersea repeater use.
5.The prior written approval of Mitsubishi Electric Corporation is necessary to
reprint or reproduce in whole or in part these materials.
6.If these products or technologies are subject the Japanese export
control restrictions,they must be exported under a license from the
Japanese government and cannot be imported into a country other than
the approved destination.
Any diversion or reexport contrary to the export control laws and
regulations of Japan and/or the country of destination is prohibited.
7.Please contact Mitsubishi Electric Corporation or an authorized Mitsubishi
Semiconductor product distributor for further details on these materials or
the products contained therein.
MIT-DS-0280-0.1
MITSUBISHI
ELECTRIC
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55
15. Jan.1999
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