Some contents are subject to change without notice.
1073741824-BIT (16777216 - WORD BY 64-BIT)SynchronousDRAM
DESCRIPTION
The MH16S64AMA is 16777216 - word by 64-bit
Synchronous DRAM module. This consists of sixteen
industry standard 16Mx4 Synchronous DRAMs in
TSOP and one industory standard EEPROM in
TSSOP.
The mounting of TSOP on a card edge Dual Inline
package provides any application where high
densities and large quantities of memory are
required.
This is a socket type - memory modules, suitable for
easy interchange or addition of modules.
FEATURES
Frequency
-8
-10100MHz8ns(CL=3)
125MHz
CLK Access Time
(Component SDRAM)
6ns(CL=3)
MITSUBISHI LSIs
MH16S64AMA -8,-10,-12
85pin
94pin
95pin
1pin
10pin
11pin
-1283MHz
Utilizes industry standard 16M x 4 Synchronous DRAMs
TSOP and industry standard EEPROM in TSSOP
168-pin (84-pin dual in-line package)
single 3.3V±0.3V power supply
Clock frequency 125MHz/100MHz/83MHz
Fully synchronous operation referenced to clock rising
edge
Dual bank operation controlled by BA0,1(Bank Address)
/CAS latency- 2/3(programmable)
Burst length- 1/2/4/8(programmable)
Burst type- sequential / interleave(programmable)
Column access - random
Auto precharge / All bank precharge controlled by A10
Auto refresh and Self refresh
4096 refresh cycle /64ms
LVTTL Interface
8ns(CL=3)
124pin
125pin
Back side
168pin
Front side
40pin
41pin
84pin
APPLICATION
main memory or graphic memory in computer systems
MIT-DS-0127-0.0
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4. Mar.1997
Preliminary Spec.
Some contents are subject to change without notice.
PIN NO.PIN NAMEPIN NO.PIN NAMEPIN NO.PIN NAMEPIN NO.PIN NAME
Some contents are subject to change without notice.
Block Diagram
/S0
DQMB0DQMB4
DQM /CS
DQ0
DQ1
DQ2
DQ3
I/O 0
I/O 1
I/O 2
I/O 3
D0
MITSUBISHI LSIs
MH16S64AMA -8,-10,-12
1073741824-BIT (16777216 - WORD BY 64-BIT)SynchronousDRAM
DQ32
DQ33
DQ34
DQ35
DQM /CS
I/O 0
I/O 1
I/O 2
I/O 3
D8
DQ4
DQ5
DQ6
DQ7
DQMB1
DQ8
DQ9
DQ10
DQ11
DQ12
DQ13
DQ14
DQ15
/S2
DQMB2DQMB6
DQ16
DQ17
DQ18
DQ19
DQ20
DQ21
DQ22
DQ23
DQMB3
DQ24
DQ25
DQ26
DQ27
DQM /CS
I/O 0
I/O 1
I/O 2
I/O 3
DQM /CS
I/O 0
I/O 1
I/O 2
I/O 3
DQM /CS
I/O 0
I/O 1
I/O 2
I/O 3
DQM/CS
DQM /CS
I/O 0
I/O 0
I/O 1
I/O 1
I/O 2
I/O 2
I/O 3
I/O 3
DQM/CS
DQM /CS
I/O 0
I/O 0
I/O 1
I/O 1
I/O 2
I/O 2
I/O 3
I/O 3
DQM/CS
DQM /CS
I/O 0
I/O 0
I/O 1
I/O 1
I/O 2
I/O 2
I/O 3
I/O 3
D1
D2
D3
D4
D0
D5
D0
D6
D0
DQ36
DQ37
DQ38
DQ39
DQMB5
DQ40
DQ41
DQ42
DQ43
DQ44
DQ45
DQ46
DQ47
DQ48
DQ49
DQ50
DQ51
DQ52
DQ53
DQ54
DQ55
DQMB7
DQ56
DQ57
DQ58
DQ59
DQM /CS
I/O 0
I/O 1
I/O 2
I/O 3
DQM /CS
I/O 0
I/O 1
I/O 2
I/O 3
DQM /CS
I/O 0
I/O 1
I/O 2
I/O 3
DQM /CS
I/O 0
I/O 1
I/O 2
I/O 3
DQM /CS
I/O 0
I/O 1
I/O 2
I/O 3
DQM /CS
I/O 0
I/O 1
I/O 2
I/O 3
D9
D10
D11
D12
D13
D14
DQM/CS
DQ28
DQ29
DQ30
DQ31
/RAS
/CAS
/WE
BA0,BA1,A<11:0>D0 - D15
CK,DQ=10Ω
Vcc
Vss
DQM /CS
I/O 0
I/O 0
I/O 1
I/O 1
I/O 2
I/O 2
I/O 3
I/O 3
D7
D0
D0 - D15
D0 - D15
D0 - D15
D0 - D15
D0 - D15
MIT-DS-0127-0.0
DQ60
DQ61
DQ62
DQ63
CKE0D0 - D7
3.3V
CKE1D8 - D15
MITSUBISHI
ELECTRIC
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3
SCL
DQM /CS
I/O 0
I/O 1
I/O 2
I/O 3
SA0 SA1 SA2
D15
CK0
CK1
CK2
CK3
SERIAL PD
A0 A1 A2
4SDRAMs
4SDRAMs
4SDRAMs
4SDRAMs
SDA
4. Mar.1997
Preliminary Spec.
Some contents are subject to change without notice.
MITSUBISHI LSIs
MH16S64AMA -8,-10,-12
1073741824-BIT (16777216 - WORD BY 64-BIT)SynchronousDRAM
Serial Presence Detect Table I
ByteFunction describedSPD enrty dataSPD DATA(hex)
0Defines # bytes written into serial memory at module mfgr12880
1Total # bytes of SPD memory device256 Bytes08
2Fundamental memory typeSDRAM04
3# Row Addresses on this assemblyA0-A110C
4# Column Addresses on this assemblyA0-A90A
5# Module Banks on this assembly1BANK01
6Data Width of this assembly...x6440
7... Data Width continuation000
8Voltage interface standard of this assemblyLVTTL01
9SDRAM Cycletime at Max. Supported CAS Latency (CL). -88ns80
Cycle time for CL=3-1010nsA0
-1212nsC0
10SDRAM Access from Clock-86ns60
tAC for CL=3-108ns80
-128ns80
11DIMM Configuration type (Non-parity,Parity,ECC)Non-PARITY00
12Refresh Rate/Typeself refresh(15.625uS)80
13SDRAM width,Primary DRAMx404
14Error Checking SDRAM data widthN/A00
Minimum Clock Delay,Back to Back Random Column Addresses
15
16Burst Lengths Supported1/2/4/80F
17# Banks on Each SDRAM device4bank04
18CAS# LatencyCL=2/306
19CS# Latency001
20Write Latency001
21SDRAM Module Attributesnon-buffered,non-registered00
22SDRAM Device Attributes:GeneralPrecharge All,Auto precharge06
23SDRAM Cycle time(2nd highest CAS latency)-813nsD0
Cycle time for CL=2-1014nsE0
-1215nsF0
24SDRAM Access form Clock(2nd highest CAS latency) -87ns70
tAC for CL=2-108ns80
-129ns90
25SDRAM Cycle time(3rd highest CAS latency)-8N/A00
Cycle time for CL=-10N/A00
-12N/A00
26SDRAM Access form Clock(3rd highest CAS latency)-8N/A00
tAC for CL=-10N/A00
-12N/A00
27Precharge to Active Minimum-824ns18
-1030ns1E
-1230ns1E
28Row Active to Row Active Min.-816ns10
-1020ns14
-1224ns18
101
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Preliminary Spec.
Some contents are subject to change without notice.
MITSUBISHI LSIs
MH16S64AMA -8,-10,-12
1073741824-BIT (16777216 - WORD BY 64-BIT)SynchronousDRAM
Serial Presence Detect Table II
29RAS to CAS Delay Min-824ns18
-1030ns1E
-1230ns1E
30Active to Precharge Min-856ns38
-1060ns3C
-1270ns46
31Density of each bank on module128MByte20
32-61Superset Information (may be used in future)option00
62SPD Revisionrev 101
63Checksum for bytes 0-62Check sum for -843
Check sum for -10B7
Check sum for -1205
64-71Manufactures Jedec ID code per JEP-108EMITSUBISHI1CFFFFFFFFFFFFFF
72Manufacturing locationMiyoshi,Japan01
Tajima,Japan02
NC,USA03
Germany04
73-90Manufactures Part NumberMH16S64AMA-84D483136533634414D412D382D38202020202020
Some contents are subject to change without notice.
PIN FUNCTION
MITSUBISHI LSIs
MH16S64AMA -8,-10,-12
1073741824-BIT (16777216 - WORD BY 64-BIT)SynchronousDRAM
CK
(CK0 ~ CK3)
CKE0Input
/S
(/S0,/S2)
/RAS,/CAS,/WEInputCombination of /RAS,/CAS,/WE defines basic commands.
A0-11Input
Input
Input
Master Clock:All other inputs are referenced to the rising
edge of CK
Clock Enable:CKE controls internal clock.When CKE is
low,internal clock for the following cycle is ceased. CKE is
also used to select auto / self refresh. After self refresh
mode is started, CKE E becomes asynchronous input.Self
refresh is maintained as long as CKE is low.
Chip Select: When /S is high,any command means
No Operation.
A0-11 specify the Row/Column Address in conjunction with
BA.The Row Address is specified by A0-11.The Column
Address is specified by A0-9.A10 is also used to indicate
precharge option.When A10 is high at a read / write
command, an auto precharge is performed. When A10 is
high at a precharge command, both banks are precharged.
BA0,1Input
DQ0-63
DQMB0-7Input
Vdd,Vss
SCL
SDA
SA0-3
MIT-DS-0127-0.0
Bank Address:BA0,1 is not simply BA.BA specifies the
bank to which a command is applied.BA0,1 must be set
with ACT,PRE,READ,WRITE commands
Input/Output
Power Supply Power Supply for the memory mounted module.
Input
Output
Input
Data In and Data out are referenced to the rising edge of
CK
Din Mask/Output Disable:When DQMB is high in burst
write.Din for the current cycle is masked.When DQMB is high
in burst read,Dout is disabled at the next but one cycle.
Serial clock for serial PD
Serial data for serial PD
Address input for serial PD
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Preliminary Spec.
Some contents are subject to change without notice.
MITSUBISHI LSIs
MH16S64AMA -8,-10,-12
1073741824-BIT (16777216 - WORD BY 64-BIT)SynchronousDRAM
BASIC FUNCTIONS
The MH16S64AMA provides basic functions,bank(row)activate,burst read / write,
bank(row)precharge,and auto / self refresh.
Each command is defined by control signals of /RAS,/CAS and /WE at CK rising edge. In
addition to 3 signals,/S,CKE and A10 are used as chip select,refresh option,and
precharge option,respectively.
To know the detailed definition of commands please see the command truth table.
CK
/SChip Select : L=select, H=deselect
/RASCommand
/CASCommand
/WE
CKE
A10
Command
Refresh Option @refresh
command
Precharge Option @precharge or read/write
command
define basic commands
Activate(ACT) [/RAS =L, /CAS = /WE =H]
ACT command activates a row in an idle bank indicated by BA.
Read(READ) [/RAS =H,/CAS =L, /WE =H]
READ command starts burst read from the active bank indicated by BA.First output
data appears after /CAS latency. When A10 =H at this command,the bank is
deactivated after the burst read(auto-precharge,READA).
Write(WRITE) [/RAS =H, /CAS = /WE =L]
WRITE command starts burst write to the active bank indicated by BA. Total data
length to be written is set by burst length. When A10 =H at this command, the bank is
deactivated after the burst write(auto-precharge,WRITEA).
Precharge(PRE) [/RAS =L, /CAS =H,/WE =L]
PRE command deactivates the active bank indicated by BA. This command also
terminates burst read / write operation. When A10 =H at this command, both banks are
deactivated(precharge all, PREA).
Auto-Refresh(REFA) [/RAS =/CAS =L, /WE =CKE =H]
PEFA command starts auto-refresh cycle. Refresh address including bank address are
generated internally. After this command, the banks are precharged automatically.
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Preliminary Spec.
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COMMAND TRUTH TABLE
MITSUBISHI LSIs
MH16S64AMA -8,-10,-12
1073741824-BIT (16777216 - WORD BY 64-BIT)SynchronousDRAM
COMMANDMNEMONIC
DeselectDESELHXHXXXXXX
No OperationNOPHXLHHHXXX
Row Adress Entry &
Bank Activate
Single Bank PrechargePREHXLLHLVLX
Precharge All Bank
Column Address Entry
& Write
Column Address Entry
& Write with Auto-
Precharge
Column Address Entry
& Read
Column Address Entry
& Read with Auto
Precharge
Auto-RefreshREFAHHLHLLHXXX
Self-Refresh EntryREFSHLLLLHXXX
Self-Refresh ExitREFSXLHH
Burst TerminateTERM
Mode Register Set
ACTHXLLHHVVV
PREA
WRITE
WRITEAHXLHLLVHV
READHXLHLHVLV
READAHXLHLHVHV
MRS
CK
n-1CKn
HXLLHLVHX
HXLLHHLVLV
LHLHHHXXX
HXLHHLXXX
HXLLLLLL
/S
/RAS
LX
/CAS
/WE
XXXXX
BA
A10
A0-9
,A11
V*1
H =High Level, L = Low Level, V = Valid, X = Don't Care, n = CK cycle number
NOTE:
1.A7-9 = 0, A0-6 = Mode Address
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Preliminary Spec.
Some contents are subject to change without notice.
FUNCTION TRUTH TABLE
MITSUBISHI LSIs
MH16S64AMA -8,-10,-12
1073741824-BIT (16777216 - WORD BY 64-BIT)SynchronousDRAM
Current State/S/RAS /CAS/WEAddress
IDLEHXXXXDESELNOP
LHHHXNOPNOP
LHHL
LHLX
LLHH
LLHL
LLLHXREFA
LLLL
ROW ACTIVEHXXXXDESELNOP
LHHHXNOPNOP
LHHLBATBSTNOP
LHLHBA,CA,A10READ/READA
LHLLBA,CA,A10
LLHHBA,RAACTBank Active/ILLEGAL*2
LLHLBA,A10PRE/PREAPrecharge/Precharge All
LLLHXREFAILLEGAL
ABBREVIATIONS:
H = Hige Level, L = Low Level, X = Don't Care
BA = Bank Address, RA = Row Address, CA = Column Address, NOP = No Operation
NOTES:
1. All entries assume that CKE was High during the preceding clock cycle and the current
clock cycle.
2. ILLEGAL to bank in specified state; function may be legal in the bank indicated by BA,
depending on the state of that bank.
3. Must satisfy bus contention, bus turn around, write recovery requirements.
4. NOP to bank precharging or in idle state.May precharge bank indicated by BA.
5. ILLEGAL if any bank is not idle.
ILLEGAL = Device operation and / or date-integrity are not guaranteed.
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Preliminary Spec.
Some contents are subject to change without notice.
MH16S64AMA -8,-10,-12
1073741824-BIT (16777216 - WORD BY 64-BIT)SynchronousDRAM
FUNCTION TRUTH TABLE FOR CKE
MITSUBISHI LSIs
Current State
SELF -HXXXXXX
REFRESH*1LHHXXXX
POWERHXXXXXX
DOWNLHXXXXX
ALL BANKSHHXXXXX
IDLE*2HLLLLHX
ANY STATEHHXXXXX
other thanHLXXXXX
listed aboveLHXXXXX
CK
n-1CKn
LHLHHHX
LHLHHLX
LHLHLXX
LHLLXXX
LLXXXXX
LLXXXXX
HLHXXXX
HLLHHHX
HLLHHLX
HLLHLXX
HLLLXXX
LXXXXXX
LLXXXXX
/RAS /CAS/WEAdd
/S
Action
INVALID
Exit Self-Refresh(Idle after tRC)
Exit Self-Refresh(Idle after tRC)
ILLEGAL
ILLEGAL
ILLEGAL
NOP(Maintain Self-Refresh)
INVALID
Exit Power Down to Idle
NOP(Maintain Self-Refresh)
Refer to Function Truth Table
Enter Self-Refresh
Enter Power Down
Enter Power Down
ILLEGAL
ILLEGAL
ILLEGAL
Refer to Current State = Power Down
Refer to Function Truth Table
Begin CK0 Suspend at Next Cycle*3
Exit CK0 Suspend at Next Cycle*3
Maintain CK0 Suspend
ABBREVIATIONS:
H = High Level, L = Low Level, X = Don't Care
NOTES:
1. CKE Low to High transition will re-enable CK and other inputs asynchronously.
A minimum setup time must be satisfied before any command other than EXIT.
2. Power-Down and Self-Refresh can be entered only form the All banks idle State.
3. Must be legal command.
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4. Mar.1997
Preliminary Spec.
Some contents are subject to change without notice.
1073741824-BIT (16777216 - WORD BY 64-BIT)SynchronousDRAM
SIMPLIFIED STATE DIAGRAM
MITSUBISHI LSIs
MH16S64AMA -8,-10,-12
SELF
REFRESH
REFS
REFSX
WRITE
SUSPEND
WRITEA
SUSPEND
MODE
REGISTER
SET
CLK
SUSPEND
CKEL
CKEH
WRITEAREADA
CKEL
WRITEA
CKEH
MRS
IDLE
ACT
CKEL
CKEH
ROW
ACTIVE
WRITEREAD
READA
READ
READA
PRE
WRITE
WRITEA
WRITE
WRITEA
PREPRE
REFA
CKEL
CKEH
READA
POWER
DOWN
READ
AUTO
REFRESH
CKEL
CKEH
CKEL
CKEH
READ
SUSPEND
READA
SUSPEND
POWER
APPLIED
MIT-DS-0127-0.0
POWER
ON
PRE
PRE
CHARGE
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Automatic Sequence
Command Sequence
4. Mar.1997
Preliminary Spec.
Some contents are subject to change without notice.
MITSUBISHI LSIs
MH16S64AMA -8,-10,-12
1073741824-BIT (16777216 - WORD BY 64-BIT)SynchronousDRAM
POWER ON SEQUENCE
Before starting normal operation, the following power on sequence is necessary to prevent a
SDRAM from damaged or malfunctioning.
1. Apply power and start clock. Attempt to maintain CKE high, DQMB0-7 high and NOP
condition at the inputs.
2. Maintain stable power, stable cock, and NOP input conditions for a minimum of 500É s.
3. Issue precharge commands for all banks. (PRE or PREA)
4. After all banks become idle state (after tRP), issue 8 or more auto-refresh commands.
5. Issue a mode register set command to initialize the mode register.
After these sequence, the SDRAM is idle state and ready for normal operation.
MODE REGISTER
Burst Length, Burst Type and /CAS Latency can be programmed by setting the mode
register(MRS). The mode register stores these date until the next MRS command, which may
be issue when both banks are in idle state. After tRSC from a MRS command, the SDRAM is
ready for new command.