Mitsubishi MGFC5215 Datasheet

PRELIMINARY
Notice : This is not a final specification Some parametric limits are subject to change.
MITSUBISHI SEMICONDUCTOR <GaAs MMIC>
MGFC5215
DESCRIPTION
The MGFC5215 is a GaAs MMIC chip especially designed for 27.5 ~ 30.0 GHz band Middle Power Amplifier (MPA) .
BLOCK DIAGRAM
FEATURES
RF frequency : 27.5 to 30.0 GHz
Linear gain : 13 dB P1dB : 23 dBm DC power : Vd = 5 V, Id1 + Id2 = 270 mA
ABSOLUTE MAXIMUM RATINGS (Ta = 25 ˚C)
Symbol
Vd1, Vd2 Vg1, Vg2
Id1 Id2
Pin Ta Tstg Tmax
Drain supply voltage Gate supply voltage
Drain current 1 Drain current 2 RF input power Backside ambient temp. Storage temp. Maximum assembly temp.
Parameter
Vg1 Vg2
In Out
Vd1
Ratings
-3 0.5
-20
-65
6 ~
120 240
16
~ ~
+300
Vd2
+70 +175
Units
V
V mA mA
dBm
˚C
˚C
˚C
ELECTRICAL CHARACTERISTICS (Ta = 25 ˚C)
Symbol Parameter
Gain VSWR in VSWR out P1dB
IM3
Gain Input VSWR
Output VSWR
Output power at 1 dB compression point
Inter modulation level
Conditions
Vd = 5 V Id1 = 90 mA Id2 = 180 mA (RF off)
f = 27.5, 30.0 GHz Single tone
f = 27.5, 30.0 GHz Tow tone(10MHz off) Pout = 20 dBm
MITSUBISHI ELECTRIC
Min.
13.0
23.0
(22.0)
Limits
Max.Typ.
3.0
3.0
Units
dB
-
-
dBm
dBc
as of July '98
MITSUBISHI SEMICONDUCTOR <GaAs MMIC>
PRELIMINARY
Notice : This is not a final specification Some parametric limits are subject to change.
DIE SIZE AND BOND PAD LOCATION(UNIT : µM)
1205
460
GND
950
RF in
Vg1 Vg2
MGFC5215
GND GND
RF out
550
GND
Vd1
350
760
910
R(Vd1)
1210
1700
X Dimention 1.70 mm Y Dimention 0.95 mm
R(Vd2) Vd2
GND
GND
550
MITSUBISHI ELECTRIC
as of July '98
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