Mitsubishi MGFC5213 Datasheet

PRELIMINARY
Notice : This is not a final specification Some parametric limits are subject to change.
MITSUBISHI SEMICONDUCTOR <GaAs MMIC>
MGFC5213
DESCRIPTION
The MGFC5213 is a GaAs MMIC chip especially designed for 27.5 ~ 30.0 GHz band High Power Amplifier (HPA) .
BLOCK DIAGRAM
FEATURES
RF frequency : 27.5 to 30.0 GHz
Linear gain : 9 dB P1dB : 29 dBm DC power : Vd = 5 V, Id1 + Id2 = 1080 mA
ABSOLUTE MAXIMUM RATINGS (Ta = 25 ˚C)
Symbol
Vd1, Vd2 Vg1, Vg2
Id1 Id2
Pin Ta Tstg Tmax
Drain supply voltage Gate supply voltage
Drain current 1 Drain current 2 RF input power Backside ambient temp. Storage temp. Maximum assembly temp.
Parameter
Vg1
Vg2
Vd1
Vd2
In Out
Vg1
Vd1
Vg2
Vd1 Vd2
Ratings
6 ~
-3 0.5 480 960
25
~
-20 ~
-65 +300
+70 +175
Units
V
V mA mA
dBm
˚C
˚C
˚C
ELECTRICAL CHARACTERISTICS (Ta = 25 ˚C)
Symbol Parameter
Gain VSWR in VSWR out P1dB
Gain Input VSWR
Output VSWR Output power at 1 dB
compression point
Conditions
Vd = 5 V Id1 = 360 mA Id2 = 720 mA (RF off)
f = 27.5, 30.0 GHz Single tone
MITSUBISHI ELECTRIC
Min.
9.0
29.0
Limits
Max.Typ.
3.0
3.0
Units
dB
-
-
dBm
as of July '98
MITSUBISHI SEMICONDUCTOR <GaAs MMIC>
PRELIMINARY
Notice : This is not a final specification Some parametric limits are subject to change.
DIE SIZE AND BOND PAD LOCATION(UNIT : µM)
MGFC5213
Vg 1
Vg 1
27 5
GN
D RF­in
GN
D
13 0
Vg 2
Vg 2
86 5
106 0
156 0
194 0
Vd 1
Vd 1
Vd 1
Vd 2
GN D
RF­out
GN D
Vd 2
X Dimention 1.94 mm Y Dimention 2.00 mm
MITSUBISHI ELECTRIC
as of July '98
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