MITSUBISHI MGFC47A7785 User Manual

< C band internally matched power GaAs FET >
MGFC47A7785
7.7 – 8.5 GHz BAND / 47W
DESCRIPTION
FEATURES
Class A operation Internally matched to 50(ohm) system High output power P1dB=46.7dBm (TYP.) @f=7.7 – 8.5GHz High power gain GLP=5.7dB (TYP.) @f=7.7 – 8.5GHz High power added efficiency PAE=30% (TYP.) @f=7.7 – 8.5GHz
APPLICATION
Solid-state power amplifier for satellite earth-station
communication transmitter and VSAT
RECOMMENDED BIAS CONDITIONS
VDS=10V ID=9.8A RG=10ohm
Absolute maximum ratings (Ta=25C)
Symbol Parameter Ratings Unit
VGDO VGSO Gate to source breakdown voltage -10 V IGR Reverse gate current -130 mA IGF Forward gate current 168 mA PT *1 Total power dissipation 168 W Tch Cannel temperature 175 C Tstg Storage temperature -65 to +175 C
*1 : Tc=25C
Electrical characteristics
Symbol Parameter Test conditions Limits Unit
VGS(off) P1dB GLP Linear Power Gain 4.7 5.7 - dB
ID Drain current - 11 - A
PAE Power added efficiency
IM3*2 3rd order IM distortion -39 -42 - dBc
Rth(ch-c) *3
*2 : Item -51,2 tone test,Po=35dBm Single Carrier Level,f=8.5GHz,Delta f=10MHz *3 : Channel-case
Gate to drain
Gate to source cut-off voltage VDS=3V,ID=168mA -1 - -4 V
Output power at 1dB gain compression
Thermal resistance delta Vf method - 0.8 0.9
breakdown voltage -20 V
(Ta=25C)
IDS=10V,ID(RF off)=9.8A f=7.7 – 8.5GHz
OUTLI NE DRA WING
. N
I M 2
2
.
2
.
0
0
-
/
-
/
+
+
4
4
.
.
0
.
2
7
8
1
. N
I M
2
5 0
.
2
.
0
0
-
-
/
/
+
+
1
.
3
.
0
2
GF-53
24+/-0.3
(3)
20.4+/-0.2
16.7
Unit : millimete rs
(1)
0.7+/-0.15
(2)
8
.
5 1
3
.
1
(1) : Gate (2) : Sou rc e (3) : D rain
Keep Safety first in your circuit designs!
Mitsubishi Electric Corporation puts the maximum effort into making semiconductor products better and more reliable , but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury , fire or property damage. Remember to give due consideration to safety when making your circuit designs , with appropriate measure such as (I) placement of substitutive , auxiliary circuits , (ii) use of non-flammable material or (iii) prevention against any malfunction or mishap.
Min. Typ. Max.
45.7 46.7 - dBm
- 30 - %
C/W
.
x
a m
7
.
4
Publication Date : Apr., 2011
1
< C band internally matched power GaAs FET >
)
MGFC47A7785
7.7 – 8.5 GHz BAND / 47W
MGFC47A5864 S-parameters( Ta=25deg.C , VDS=10(V),IDS=8(A) )
S11,S22
Smith Chart
Z=50
Ω
0.5
0.2
0.0
-0.2
-0.5
1.0
5.0
1.00.2 0.5 2.0 5.0
-5.0
-1.0
S11 S22
S21,S22
Polar Ch art
5
5.0
4
4.0
2.0
3
2
3.0
|S21|
2.0
1
1.0
0.0
0.01
0.02
0.03
0.04
0.05
SCALE FOR
|S12|
SCALE FOR
-5 -4 -3 -2 -1 0 1 2 3 4 5
-2.0
0
-1
-2
-3
-4
-5
S21 S12
S Parameters(TYP.)
f
(GHz) MAG. ANG(deg.
S11 S21 S12 S 22
[MAG] [ANG] [MAG] [ANG] [MAG] [ANG]
5.60 0.702 -163.8 2.723 10.1 0.024 -23.0 0.225 -76.8
5.65 0.676 -175.6 2.836 0.3 0.027 -42.2 0.194 -86.4
5.70 0.646 171.6 2.932 -9.7 0.030 -57.8 0.164 -97.8
5.75 0.621 158.6 3.011 -19.8 0.036 -71.4 0.132 -111.2
5.80 0.595 144.8 3.072 -30.0 0.040 -82.1 0.106 -129.1
5.85 0.576 131.1 3.091 -40.0 0.044 -95.0 0.087 -148.9
5.90 0.556 116.8 3.108 -49.8 0.049 -105.8 0 .077 -175.9
5.95 0.540 102.9 3.111 -59.5 0.053 -117.2 0 .075 158.2
6.00 0.528 89.8 3.082 - 6 9.1 0.056 -126.1 0.083 135.8
6.05 0.518 76.5 3.061 - 7 8.5 0.059 -135.8 0.090 119.1
6.10 0.514 64.2 3.033 - 8 7.4 0.062 -144.8 0.102 106.2
6.15 0.510 51.9 2.999 - 9 6.3 0.066 -153.7 0.110 97.2
6.20 0.508 40.5 2.961 -104.9 0.068 -162.2 0.118 87.5
6.25 0.502 29.4 2.933 -113.6 0.072 -170.7 0.125 81.7
6.30 0.498 18.8 2.888 -121.8 0.074 -177.0 0.126 74.6
6.35 0.493 8.4 2.859 -130.1 0.074 174.0 0.128 68.4
6.40 0.486 -2.0 2.817 -138.4 0.076 166.5 0.130 62.4
6.45 0.483 - 11.9 2.793 -146.5 0.078 158.4 0.129 57.7
6.50 0.473 - 22.4 2.770 -154.6 0.081 152.1 0.126 52.8
6.55 0.471 - 33.0 2.751 -163.1 0.082 144.0 0.120 48.6
6.60 0.463 - 44.9 2.727 -171.4 0.084 135.6 0.111 44.0
This S-Parameter data show measurements performed on each single-ended FET
Publication Date : Apr., 2011
2
< C band internally matched power GaAs FET >
MGFC47A7785
7.7 – 8.5 GHz BAND / 47W
Mitsubishi Electric Corporation puts the maximum effort into making semiconductor product s better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of non-flammable material or (iii) prevention against any malfunction or mishap.
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Keep safety first in your circuit designs!
Notes regarding these materials
© 2011 MITSUBISHI ELECTRIC CORPORATION. ALL RIGHTS RESERVED.
Publication Date : Apr., 2011
3
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