MITSUBISHI MGFC45V3436A User Manual

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< C band internally matched power GaAs FET >
MGFC45V3436A
3.4 – 3.6 GHz BAND / 32W
DESCRIPTION
FEATURES
Class A operation Internally matched to 50(ohm) system High output power P1dB=32W (TYP.) @f=3.4 – 3.6GHz High power gain GLP=12.0dB (TYP.) @f=3.4 – 3.6GHz High power added efficiency P.A.E.=36% (TYP.) @f=3.4 – 3.6GHz Low distortion [item -51] IM3=-45dBc (TYP.) @Po=34.5dBm S.C.L
APPLICATION
item 01 : 3.4 – 3.6 GHz band power amplifier item 51 : 3.4 – 3.6 GHz band digital radio communication
QUALITY
IG
RECOMMENDED BIAS CONDITIONS
VDS=10V ID=8A RG=25ohm
OUTLINE
N
I M
2
R1. 2
2
2
.
.
0
0
-
-
/
/
+
+
4
0
.
.
7
8
1
N
I M
2
4
.
0
-
/
+ 3
.
4
4
.
1
GF-38
24 +/- 0.3
(1)
20.4 +/- 0.2
16.7
0.6 +/- 0.15
(3)
(1) gate (2) source(flange) (3)drain
Absolute maximum ratings (Ta=25C)
Symbol Parameter Ratings Unit
VGDO VGSO Gate to source breakdown voltage -15 V ID Drain current 25 A IGR Reverse gate current -80 mA IGF Forward gate current 168 mA PT *1 Total power dissipation 150 W Tch Cannel temperature 175 C Tstg Storage temperature -65 to +175 C
*1 : Tc=25C
Gate to drain
breakdown voltage -15 V
Electrical characteristics
(Ta=25C)
Symbol Parameter Test conditions Limits Unit
IDSS gm
VGS(off) P1dB GLP Linear Power Gain 11 12 - dB
ID Drain current - 8 - A
P.A.E. Power added efficiency - 36 - % IM3 *2 3rd order IM distortion
Rth(ch-c) *3
Saturated drain current VDS=3V,VGS=0V - 24 Transconductance VDS=3V,ID=8A - 8 Gate to source cut-off voltage VDS=3V,ID=160mA -2 - -5 V
Output power at 1dB gain compression
Thermal resistance delta Vf method - 0.8 1
*2 :item -51 ,2 tone test,Po=34.5dBm Single Carrier Level ,f=3.4,3.5,3.6GHz,delta f=10MHz *3 :Channel-case
VDS=10V,ID(RF off)=8A f=3.4 – 3.6GHz
Keep Safety first in your circuit designs!
Mitsubishi Electric Corporation puts the maximum effort into making semiconductor products better and more reliable , but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury , fire or property damage. Remember to give due consideration to safety when making your circuit designs , with appropriate measure such as (I) placement of substitutive , auxiliary circuits , (ii) use of non-flammable material or (iii) prevention against any malfunction or mishap.
Min. Typ. Max.
- A
- S
44 45 - dBm
-42 -45 - dBc
(2)
C/W
uni t : m
5
2
.
0
.
0
0
-
/
-
/
+
+
4
.
1
.
2
0
Publication Date : Apr., 2011
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< C band internally matched power GaAs FET >
L
MGFC45V3436A
3.4 – 3.6 GHz BAND / 32W
MGFC45V3436A TYPICAL CHARACTERISTICS( Ta=25deg.C )
47
46
45
VDS=10V IDS=8.0A
44
43
42
OUTPUT POWER P1dB (dBm)
41
40
3.3 3.4 3.5 3.6 3.7
42
40
38
36
VDS=10V IDS=8A f1=3.600GHz f2=3.605GHz 2-tone test
34
32
30
OUTPUT POWER Po (dBm S.C.
28
26
P1 dB , G L P v s. f
P1dB
GLP
FREQUENCY f (GHz)
Po,IM3 vs. f
Po
IM3
16
15
14
13
12
11
10
9
20
10
0
-10
-20
-30
-40
-50
-60
46
VDS= 10V
44
IDS=8A f=3.5GHz
42 40 38 36 34 32
LINEAR POWER GAIN GLP (dB)
OUTPU T PO W ER Po (dBm)
30 28 26
17 19 21 23 25 27 29 31 33 35 37
IM3 (dBc
24
16 18 20 22 24 26 28 30
INPUT POWER Pin (dBm S.C.L.)
-70
MGFC45V3436A S-parameters( Ta=25deg.C , VDS=10(V),IDS=8.0(A) )
f
(GHz)
3.30 0.54 -95 3.01 104 0.03 43 0.60 13
3.35 0.51 -121 3.27 87 0.03 29 0.56 3
3.40 0.49 -146 3.45 73 0.04 13 0.50 -6
3.45 0.50 -171 3.58 59 0.04 -12 0.44 -17
3.50 0.51 165 3.71 42 0.05 -21 0.39 -29
3.55 0.53 144 3.80 27 0.06 -37 0.34 -42
3.60 0.55 125 3.82 14 0.06 -52 0.29 -56
3.65 0.56 110 3.81 -1 0.06 -69 0.24 -74
3.70 0.56 93 3.84 -15 0.07 -80 0.22 -94
Magn. Angle(deg.) Magn. Angle(deg.) Magn. Angle(deg.) Magn. Angle(deg.)
S11 S21 S12 S22
S Parameters(Typ.)
Po, P.A.E. vs. Pin
Po
INPUT POWER Pin (dBm)
P.A.E.
100
80
60
40
20
0
POW ER ADDE D E FFICI ENC Y ( % )
Publication Date : Apr., 2011
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< C band internally matched power GaAs FET >
MGFC45V3436A
3.4 – 3.6 GHz BAND / 32W
Mitsubishi Electric Corporation puts the maximum effort into making semiconductor product s better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of non-flammable material or (iii) prevention against any malfunction or mishap.
•These materials are intended as a reference to assist our customers in the selection of the Mitsubishi semiconductor product best suited to the customer’s application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Mitsubishi Electric Corporation or a third party.
•Mitsubishi Electric Corporation assumes no responsibility for any damage, or infringement of any third-party’s rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials.
•All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Mitsubishi Electric Corporation without notice due to product improvements or other reasons. It is therefore recommended that customers contact Mitsubishi Electric Corporation or an authorized Mitsubishi Semiconductor product distributor for the latest product information before purchasing a product listed herein. The information described here may contain technical inaccuracies or typographical errors. Mitsubishi Electric Corporation assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Mitsubishi Electric Corporation by various means, including the Mitsubishi Semiconductor home page (http://www.MitsubishiElectric.com/).
•When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Mitsubishi Electric Corporation assumes no responsibility for any damage, liability or other loss resulting from the information contained herein.
•Mitsubishi Electric Corporation semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Mitsubishi Electric Corporation or an authorized Mitsubishi Semiconductor product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use.
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•If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or re-export contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited.
•Please contact Mitsubishi Electric Corporation or an authorized Mitsubishi Semiconductor product distributor for further details on these materials or the products contained therein.
Keep safety first in your circuit designs!
Notes regarding these materials
© 2011 MITSUBISHI ELECTRIC CORPORATION. ALL RIGHTS RESERVED.
Publication Date : Apr., 2011
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