MELSEC iQ-R Laser Displacement Sensor
Control Module User's Manual (Startup)
-R60MH112NA
SAFETY PRECAUTIONS
WARNING
Indicates that incorrect handling may cause hazardous conditions, resulting in
death or severe injury.
CAUTION
Indicates that incorrect handling may cause hazardous conditions, resulting in
minor or moderate injury or property damage.
(Read these precautions before using this product.)
Before using this product, please read this manual and the relevant manuals carefully and pay full attention to safety to handle
the product correctly.
The precautions given in this manual are concerned with this product only. For the safety precautions of the programmable
controller system, refer to the MELSEC iQ-R Module Configuration Manual.
In this manual, the safety precautions are classified into two levels: " WARNING" and " CAUTION".
Under some circumstances, failure to observe the precautions given under " CAUTION" may lead to serious
consequences.
Observe the precautions of both levels because they are important for personal and system safety.
Make sure that the end users read this manual and then keep the manual in a safe place for future reference.
1
[Precautions for Using Laser Products]
WARNING
● The laser products use semiconductor laser light sources. When handling laser products, observe the
following because human access to laser radiation may result in injury.
(1) Do not disassemble the laser products. Doing so may result in exposure to laser radiation.
(2) Shut off the external power supply (all phases) to stop laser emission before replacing a failed
laser product or changing the layout.
● Observe the following handling precautions for the laser products in each class.
(1) Class 3R laser products
• Do not aim the laser beam at people.
• Do not directly look at or come in contact with the laser beam and its reflection from a specular
surface (such as a mirror). In addition, never look at the beam and its reflection through optical
instruments (such as a microscope and a telescope).
• Shorten the beam paths as much as possible to prevent diffusion of laser beams. Terminate the
laser beams at the end of their paths by diffusely reflecting materials of appropriate reflectivity
and thermal properties or by absorbers.
• Locate the beam path above or below the eye level. Wearing protective eyewear is
recommended when handling the laser products.
• Install the laser products carefully so that the laser beam is not unintentionally reflected from
specular surfaces.
(2) Class 2 laser products
• Do not aim the laser beam at people.
• Do not stare into the laser beam and its reflection from specular surfaces.
• To prevent exposure to laser radiation (specularly or diffusely reflected laser beams), install a
protective enclosure with an appropriate reflectance.
• Locate the beam path above or below the eye level.
(3) Class 1 laser products
• Do not stare into the laser beam and its reflection from specular surfaces.
2
[Design Precautions]
WARNING
● Configure safety circuits external to the programmable controller to ensure that the entire system
operates safely even when a fault occurs in the external power supply or the programmable controller.
Failure to do so may result in an accident due to an incorrect output or malfunction.
(1) Emergency stop circuits, protection circuits, and protective interlock circuits for conflicting
operations (such as forward/reverse rotations or upper/lower limit positioning) must be configured
external to the programmable controller.
(2) When the programmable controller detects an abnormal condition, it stops the operation and all
outputs are:
• Turned off if the overcurrent or overvoltage protection of the power supply module is activated.
• Held or turned off according to the parameter setting if the self-diagnostic function of the CPU
module detects an error such as a watchdog timer error.
(3) All outputs may be turned on if an error occurs in a part, such as an I/O control part, where the
CPU module cannot detect any error. To ensure safety operation in such a case, provide a safety
mechanism or a fail-safe circuit external to the programmable controller. For a fail-safe circuit
example, refer to "General Safety Requirements" in the MELSEC iQ-R Module Configuration
Manual.
(4) Outputs may remain on or off due to a failure of a component such as a relay and transistor in an
output circuit. Configure an external circuit for monitoring output signals that could cause a
serious accident.
● In an output circuit, when a load current exceeding the rated current or an overcurrent caused by a
load short-circuit flows for a long time, it may cause smoke and fire. To prevent this, configure an
external safety circuit, such as a fuse.
● For the operating status of each station after a communication failure, refer to manuals relevant to the
network. Incorrect output or malfunction due to a communication failure may result in an accident.
● When connecting an external device with a CPU module or intelligent function module to modify data
of a running programmable controller, configure an interlock circuit in the program to ensure that the
entire system will always operate safely. For other forms of control (such as program modification,
parameter change, forced output, or operating status change) of a running programmable controller,
read the relevant manuals carefully and ensure that the operation is safe before proceeding. Improper
operation may damage machines or cause accidents.
3
[Design Precautions]
WARNING
● Especially, when a remote programmable controller is controlled by an external device, immediate
action cannot be taken if a problem occurs in the programmable controller due to a communication
failure. To prevent this, configure an interlock circuit in the program, and determine corrective actions
to be taken between the external device and CPU module in case of a communication failure.
● Do not write any data to the "system area" and "write-protect area" of the buffer memory in the
module. Also, do not use any "use prohibited" signals as an output signal from the CPU module to
each module. Doing so may cause malfunction of the programmable controller system. For the
"system area", "write-protect area", and the "use prohibited" signals, refer to the user's manual for the
module used.
● If a communication cable is disconnected, the network may be unstable, resulting in a communication
failure of multiple stations. Configure an interlock circuit in the program to ensure that the entire
system will always operate safely even if communications fail. Incorrect output or malfunction due to a
communication failure may result in an accident.
● To maintain the safety of the programmable controller system against unauthorized access from
external devices via the network, take appropriate measures. To maintain the safety against
unauthorized access via the Internet, take measures such as installing a firewall.
● Provide safety measures such as a dual safety mechanism when the module is used for applications
that have the possibility of causing physical injury or serious damage.
[Design Precautions]
CAUTION
● Do not install the control lines or communication cables together with the main circuit lines or power
cables. Keep a distance of 100mm or more between them. Failure to do so may result in malfunction
due to noise.
● During control of an inductive load such as a lamp, heater, or solenoid valve, a large current
(approximately ten times greater than normal) may flow when the output is turned from off to on.
Therefore, use a module that has a sufficient current rating.
● After the CPU module is powered on or is reset, the time taken to enter the RUN status varies
depending on the system configuration, parameter settings, and/or program size. Design circuits so
that the entire system will always operate safely, regardless of the time.
● Do not power off the programmable controller or reset the CPU module while the settings are being
written. Doing so will make the data in the flash ROM and SD memory card undefined. The values
need to be set in the buffer memory and written to the flash ROM and SD memory card again. Doing
so also may cause malfunction or failure of the module.
● When changing the operating status of the CPU module from external devices (such as the remote
RUN/STOP functions), select "Do Not Open by Program" for "Opening Method" of "Module
Parameter". If "Open by Program" is selected, an execution of the remote STOP function causes the
communication line to close. Consequently, the CPU module cannot reopen the line, and external
devices cannot execute the remote RUN function.
● Do not use the laser displacement sensor outside of its specifications (such as ratings or
environments). Doing so may result in overheating or smoke.
4
[Design Precautions]
CAUTION
● Do not disassemble or modify the modules. Doing so may cause failure, malfunction, injury, or a fire.
● Do not touch any terminal while power is on. Doing so will cause electric shock or malfunction.
[Installation Precautions]
WARNING
● Shut off the external power supply (all phases) used in the system before mounting or removing the
module. Failure to do so may result in electric shock or cause the module to fail or malfunction.
[Installation Precautions]
CAUTION
● Use the programmable controller in an environment that meets the general specifications in the Safety
Guidelines included with the base unit. Failure to do so may result in electric shock, fire, malfunction,
or damage to or deterioration of the product.
● To mount a module, place the concave part(s) located at the bottom onto the guide(s) of the base unit,
and push in the module until the hook(s) located at the top snaps into place. Incorrect interconnection
may cause malfunction, failure, or drop of the module.
● To mount a module with no module fixing hook, place the concave part(s) located at the bottom onto
the guide(s) of the base unit, push in the module, and fix it with screw(s). Incorrect interconnection
may cause malfunction, failure, or drop of the module.
● When using an extension cable, connect it to the extension cable connector of the base unit securely.
Check the connection for looseness. Poor contact may cause malfunction.
● When using an SD memory card, fully insert it into the SD memory card slot. Check that it is inserted
completely. Poor contact may cause malfunction.
● Securely insert an extended SRAM cassette or a battery-less option cassette into the cassette
connector of the CPU module. After insertion, close the cassette cover and check that the cassette is
inserted completely. Poor contact may cause malfunction.
● Do not directly touch any conductive parts and electronic components of the module, SD memory
card, extended SRAM cassette, battery-less option cassette, or connector. Doing so can cause
malfunction or failure of the module.
[Wiring Precautions]
WARNING
● Shut off the external power supply (all phases) used in the system before installation and wiring.
Failure to do so may result in electric shock or cause the module to fail or malfunction.
● After installation and wiring, attach a blank cover module (RG60) to each empty slot and an included
extension connector protective cover to the unused extension cable connector before powering on the
system for operation. Failure to do so may result in electric shock.
5
[Wiring Precautions]
CAUTION
● Individually ground the FG and LG terminals of the programmable controller with a ground resistance
of 100 ohms or less. Failure to do so may result in electric shock or malfunction.
● Check the rated voltage and signal layout before wiring to the module, and connect the cables
correctly. Connecting a power supply with a different voltage rating or incorrect wiring may cause fire
or failure.
● Connectors for external devices must be crimped or pressed with the tool specified by the
manufacturer, or must be correctly soldered. Incomplete connections may cause short circuit, fire, or
malfunction.
● Securely connect the connector to the module. Poor contact may cause malfunction.
● Do not install the control lines or communication cables together with the main circuit lines or power
cables. Keep a distance of 100mm or more between them. Failure to do so may result in malfunction
due to noise.
● Place the cables in a duct or clamp them. If not, dangling cables may swing or inadvertently be pulled,
resulting in malfunction or damage to modules or cables.
In addition, the weight of the cables may put stress on modules in an environment of strong vibrations
and shocks.
Do not clamp the extension cables with the jacket stripped. Doing so may change the characteristics
of the cables, resulting in malfunction.
● Check the interface type and correctly connect the cable. Incorrect wiring (connecting the cable to an
incorrect interface) may cause failure of the module and external device.
● Tighten the connector screws within the specified torque range. Undertightening can cause drop of
the screw, short circuit, fire, or malfunction. Overtightening can damage the screw and/or module,
resulting in drop, short circuit, fire, or malfunction.
● When disconnecting the cable from the module, do not pull the cable by the cable part. For the cable
with connector, hold the connector part of the cable. Pulling the cable connected to the module may
result in malfunction or damage to the module or cable.
● Prevent foreign matter such as dust or wire chips from entering the module. Such foreign matter can
cause a fire, failure, or malfunction.
● A protective film is attached to the top of the module to prevent foreign matter, such as wire chips,
from entering the module during wiring. Do not remove the film during wiring. Remove it for heat
dissipation before system operation.
● Programmable controllers must be installed in control panels. Connect the main power supply to the
power supply module in the control panel through a relay terminal block. Wiring and replacement of a
power supply module must be performed by qualified maintenance personnel with knowledge of
protection against electric shock. For wiring, refer to the MELSEC iQ-R Module Configuration Manual.
● For Ethernet cables to be used in the system, select the ones that meet the specifications in the user's
manual for the module used. If not, normal data transmission is not guaranteed.
● Do not apply the 24VDC power before connecting a sensor head. If the power is applied before wiring,
normal data transmission is not guaranteed.
6
[Startup and Maintenance Precautions]
WARNING
● Do not touch any terminal while power is on. Doing so will cause electric shock or malfunction.
● Correctly connect the battery connector. Do not charge, disassemble, heat, short-circuit, solder, or
throw the battery into the fire. Also, do not expose it to liquid or strong shock. Doing so will cause the
battery to produce heat, explode, ignite, or leak, resulting in injury and fire.
● Shut off the external power supply (all phases) used in the system before cleaning the module or
retightening the connector screws or module fixing screws. Failure to do so may result in electric
shock.
7
[Startup and Maintenance Precautions]
CAUTION
● When connecting an external device with a CPU module or intelligent function module to modify data
of a running programmable controller, configure an interlock circuit in the program to ensure that the
entire system will always operate safely. For other forms of control (such as program modification,
parameter change, forced output, or operating status change) of a running programmable controller,
read the relevant manuals carefully and ensure that the operation is safe before proceeding. Improper
operation may damage machines or cause accidents.
● Especially, when a remote programmable controller is controlled by an external device, immediate
action cannot be taken if a problem occurs in the programmable controller due to a communication
failure. To prevent this, configure an interlock circuit in the program, and determine corrective actions
to be taken between the external device and CPU module in case of a communication failure.
● Do not disassemble or modify the modules. Doing so may cause failure, malfunction, injury, or a fire.
● Use any radio communication device such as a cellular phone or PHS (Personal Handy-phone
System) more than 25cm away in all directions from the programmable controller. Failure to do so
may cause malfunction.
● Shut off the external power supply (all phases) used in the system before mounting or removing the
module. Failure to do so may cause the module to fail or malfunction.
● After the first use of the product, do not perform each of the following operations more than 50 times
(IEC 61131-2/JIS B 3502 compliant).
Exceeding the limit may cause malfunction.
• Mounting/removing the module to/from the base unit
• Inserting/removing the extended SRAM cassette or battery-less option cassette to/from the
CPU module
• Mounting/removing the terminal block to/from the module
● After the first use of the product, do not insert/remove the SD memory card to/from the CPU module
more than 500 times. Exceeding the limit may cause malfunction.
● Do not touch the metal terminals on the back side of the SD memory card. Doing so may cause
malfunction or failure of the module.
● Do not touch the integrated circuits on the circuit board of an extended SRAM cassette or a batteryless option cassette. Doing so may cause malfunction or failure of the module.
● Do not drop or apply shock to the battery to be installed in the module. Doing so may damage the
battery, causing the battery fluid to leak inside the battery. If the battery is dropped or any shock is
applied to it, dispose of it without using.
● Startup and maintenance of a control panel must be performed by qualified maintenance personnel
with knowledge of protection against electric shock. Lock the control panel so that only qualified
maintenance personnel can operate it.
● Before handling the module, touch a conducting object such as a grounded metal to discharge the
static electricity from the human body. Failure to do so may cause the module to fail or malfunction.
8
[Operating Precautions]
CAUTION
● When changing data and operating status, and modifying program of the running programmable
controller from an external device such as a personal computer connected to an intelligent function
module, read relevant manuals carefully and ensure the safety before operation. Incorrect change or
modification may cause system malfunction, damage to the machines, or accidents.
● Do not power off the programmable controller or reset the CPU module while the setting values in the
buffer memory are being written to the flash ROM in the module. Doing so will make the data in the
flash ROM and SD memory card undefined. The values need to be set in the buffer memory and
written to the flash ROM and SD memory card again. Doing so can cause malfunction or failure of the
module.
[Disposal Precautions]
CAUTION
● When disposing of this product, treat it as industrial waste.
● When disposing of batteries, separate them from other wastes according to the local regulations. For
details on battery regulations in EU member states, refer to the MELSEC iQ-R Module Configuration
Manual.
[Transportation Precautions]
CAUTION
● When transporting lithium batteries, follow the transportation regulations. For details on the regulated
models, refer to the MELSEC iQ-R Module Configuration Manual.
● The halogens (such as fluorine, chlorine, bromine, and iodine), which are contained in a fumigant
used for disinfection and pest control of wood packaging materials, may cause failure of the product.
Prevent the entry of fumigant residues into the product or consider other methods (such as heat
treatment) instead of fumigation. The disinfection and pest control measures must be applied to
unprocessed raw wood.
9
CONDITIONS OF USE FOR THE PRODUCT
(1) Mitsubishi programmable controller ("the PRODUCT") shall be used in conditions;
i) where any problem, fault or failure occurring in the PRODUCT, if any, shall not lead to any major or serious accident;
and
ii) where the backup and fail-safe function are systematically or automatically provided outside of the PRODUCT for the
case of any problem, fault or failure occurring in the PRODUCT.
(2) The PRODUCT has been designed and manufactured for the purpose of being used in general industries.
MITSUBISHI SHALL HAVE NO RESPONSIBILITY OR LIABILITY (INCLUDING, BUT NOT LIMITED TO ANY AND ALL
RESPONSIBILITY OR LIABILITY BASED ON CONTRACT, WARRANTY, TORT, PRODUCT LIABILITY) FOR ANY
INJURY OR DEATH TO PERSONS OR LOSS OR DAMAGE TO PROPERTY CAUSED BY the PRODUCT THAT ARE
OPERATED OR USED IN APPLICATION NOT INTENDED OR EXCLUDED BY INSTRUCTIONS, PRECAUTIONS, OR
WARNING CONTAINED IN MITSUBISHI'S USER, INSTRUCTION AND/OR SAFETY MANUALS, TECHNICAL
BULLETINS AND GUIDELINES FOR the PRODUCT.
("Prohibited Application")
Prohibited Applications include, but not limited to, the use of the PRODUCT in;
• Nuclear Power Plants and any other power plants operated by Power companies, and/or any other cases in which the
public could be affected if any problem or fault occurs in the PRODUCT.
• Railway companies or Public service purposes, and/or any other cases in which establishment of a special quality
assurance system is required by the Purchaser or End User.
• Aircraft or Aerospace, Medical applications, Train equipment, transport equipment such as Elevator and Escalator,
Incineration and Fuel devices, Vehicles, Manned transportation, Equipment for Recreation and Amusement, and
Safety devices, handling of Nuclear or Hazardous Materials or Chemicals, Mining and Drilling, and/or other
applications where there is a significant risk of injury to the public or property.
Notwithstanding the above restrictions, Mitsubishi may in its sole discretion, authorize use of the PRODUCT in one or
more of the Prohibited Applications, provided that the usage of the PRODUCT is limited only for the specific
applications agreed to by Mitsubishi and provided further that no special quality assurance or fail-safe, redundant or
other safety features which exceed the general specifications of the PRODUCTs are required. For details, please
contact the Mitsubishi representative in your region.
10
INTRODUCTION
Thank you for purchasing the Mitsubishi Electric MELSEC iQ-R series programmable controllers.
This manual describes the procedures, system configuration, and wiring of the relevant products listed below.
Before using this product, please read this manual and the relevant manuals carefully and develop familiarity with the
functions and performance of the MELSEC iQ-R series programmable controller to handle the product correctly.
When applying the program examples provided in this manual to an actual system, ensure the applicability and confirm that it
will not cause system control problems.
Please make sure that the end users read this manual.
Relevant product
R60MH112NA
COMPLIANCE WITH EMC AND LOW VOLTAGE DIRECTIVES
Method of ensuring compliance
To ensure that Mitsubishi programmable controllers maintain EMC and Low Voltage Directives when incorporated into other
machinery or equipment, certain measures may be necessary. Please refer to one of the following manuals.
• MELSEC iQ-R Module Configuration Manual
• Safety Guidelines (This manual is included with the base unit.)
The CE mark on the side of the programmable controller indicates compliance with EMC and Low Voltage Directives.
Additional measures
To ensure that this product maintains EMC and Low Voltage Directives, please refer to one of the following manuals.
• MELSEC iQ-R Module Configuration Manual
• Safety Guidelines (This manual is included with the base unit.)
11
MEMO
12
CONTENTS
SAFETY PRECAUTIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
CONDITIONS OF USE FOR THE PRODUCT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
INTRODUCTION. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
COMPLIANCE WITH EMC AND LOW VOLTAGE DIRECTIVES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
RELEVANT MANUALS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
TERMS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14
CHAPTER 1 PART NAMES 15
CHAPTER 2 SPECIFICATIONS 17
2.1 Performance Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17
CHAPTER 3 FUNCTION LIST 19
CHAPTER 4 PROCEDURES BEFORE OPERATION 21
4.1 Measuring an Object . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22
Procedures when measuring an object. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Procedures for initialization when the setting is failed. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24
Procedure for sensor head replacement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25
CHAPTER 5 SYSTEM CONFIGURATION 27
5.1 Configuration of Laser Displacement Sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
5.2 Supported Software Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
CHAPTER 6 INSTALLATION AND WIRING 29
6.1 Correct Usage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29
6.2 Wiring Method . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Connection method of external power supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32
Connecting sensor head to control module. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35
6.3 Wiring Product. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
CHAPTER 7 COMMUNICATION EXAMPLE 37
7.1 Communication Example Between Control Module and Sensor Head . . . . . . . . . . . . . . . . . . . . . . . . . . . .37
System configuration example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37
Parameter setting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Program example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
CONTENTS
APPENDICES 41
Appendix 1 External Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .41
Appendix 2 Export Regulations by Japanese Government . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
INDEX 44
REVISIONS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .46
WARRANTY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .47
TRADEMARKS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .48
13
RELEVANT MANUALS
Manual name [manual number] Description Available form
MELSEC iQ-R Laser Displacement Sensor Control
Module User's Manual (Startup)
[SH-082017ENG] (this manual)
MELSEC iQ-R Laser Displacement Sensor Control
Module User's Manual (Application)
[SH-082019ENG]
MELSEC iQ-R Laser Displacement Sensor Control
Module User's Manual (Sensor Head)
[SH-082023ENG]
Laser Displacement Sensor MH11 SettingTool
Version 2 Operating Manual
[SH-082021ENG]
This manual does not include detailed information on the following:
• General specifications
• Installation
• Applicable combinations of CPU modules and the other modules, and the number of mountable modules
For details, refer to the following.
MELSEC iQ-R Module Configuration Manual
Specifications, procedures before operation, system configuration, wiring, and
communication examples of the control module
Functions, parameter settings, troubleshooting, I/O signals, and buffer
memory of the control module
Precautions for using the sensor head, installation methods, specifications,
and maintenance and inspection
Operation methods, functions, and error messages of the setting tool
It also describes the use of the buffering function and the received light
intensity waveform display function, which are useful for an evaluation
analysis of the laser displacement sensor MH11 or optimum settings.
Print book
e-Manual
PDF
Print book
e-Manual
PDF
Print book
e-Manual
PDF
e-Manual
PDF
e-Manual refers to the Mitsubishi Electric FA electronic book manuals that can be browsed using a dedicated
tool.
e-Manual has the following features:
• Required information can be cross-searched in multiple manuals.
• Other manuals can be accessed from the links in the manual.
• The hardware specifications of each part can be found from the product figures.
• Pages that users often browse can be bookmarked.
• Sample programs can be copied to an engineering tool.
TERMS
Unless otherwise specified, this manual uses the following terms.
Term Description
Control module An abbreviation for the MELSEC iQ-R laser displacement sensor control module
CPU module A generic term for the MELSEC iQ-R series CPU modules
Device A device (X, Y, M, D, or others) in a CPU module
Engineering tool Another name for the software package for the MELSEC programmable controllers
Label A label that represents a device in a given character string
Module label A label that represents one of memory areas (I/O signals and buffer memory areas) specific to each module in a given
Sensor head An abbreviation for the laser displacement sensor MH11 sensor head
Setting tool An abbreviation for the laser displacement sensor MH11 SettingTool Version 2
character string.
For the module used, the engineering tool automatically generates this label, which can be used as a global label.
14
1 PART NAMES
(2)
(3)
(4)
(5)
(1)
+24V
24G
This chapter describes the part names of the control module.
No. Name Description
(1) RUN LED Indicates the operating status of the module.
ERR LED Indicates the error status of the module.
LASER A LED • On: Sensor head A laser emission
LASER B LED • On: Sensor head B laser emission
ALM1 LED • On: Alarm in OUT1 ( MELSEC iQ-R Laser Displacement Sensor Control Module User's Manual (Application))
ALM2 LED • On: Alarm in OUT2 ( MELSEC iQ-R Laser Displacement Sensor Control Module User's Manual (Application))
(2) Sensor head A connector The sensor head connected to this connector is recognized as sensor head A, to activate the control module.
(3) Sensor head B connector The sensor head connected to this connector is recognized as sensor head B, to activate the control module.
(4) External power supply
terminal block
(5) Production information
marking
• On: Normal operation
• Off: Module power supply interrupted
• On: Minor error ( MELSEC iQ-R Laser Displacement Sensor Control Module User's Manual (Application))
• Flashing: Moderate error ( MELSEC iQ-R Laser Displacement Sensor Control Module User's Manual
(Application))
• Off: Normal operation
• Off: Sensor head A laser stop
• Off: Sensor head B laser stop
• Flashing: Replacing sensor head ( Page 25 Procedure for sensor head replacement)
• Off: Normal operation
• Flashing: Replacing sensor head ( Page 25 Procedure for sensor head replacement)
• Off: Normal operation
A terminal block for connecting an external power supply cable to the control module
Shows the production information (16 digits) of the module.
1
The production information and firmware version can be checked by using the setting tool or engineering tool.
To check the firmware version by using the setting tool, check "Controller Ver" on the setting tool window.
For details, refer to the following.
Laser Displacement Sensor MH11 SettingTool Version 2 Operating Manual
MELSEC iQ-R Module Configuration Manual
1 PART NAMES
15
MEMO
16
1 PART NAMES
2 SPECIFICATIONS
2.1 Performance Specifications
This chapter describes the performance specifications of the control module.
Item Description
Sampling cycle 10s, 20s, 40s, 100s, 200s, 400s, 1ms, 2ms
Number of occupied I/O points 32 points
Buffer memory capacity 64k words
Number of connected sensor heads 2 maximum
Internal current consumption (5VDC) 0.14A maximum
External power supply 24VDC -15% to +20%, including ripple of 0.5V (p-p)
Maximum inrush current: 18A, 250s or less
Maximum current consumption: 0.5A
External dimensions Height 106mm (Base unit mounting side: 98mm)
Width 27.8mm
Depth 125mm
Weight 0.24kg
2
2 SPECIFICATIONS
2.1 Performance Specifications
17
MEMO
18
2 SPECIFICATIONS
2.1 Performance Specifications
3 FUNCTION LIST
This chapter describes the functions of the control module. For details on the functions, refer to the following.
MELSEC iQ-R Laser Displacement Sensor Control Module User's Manual (Application)
Sensing function
Function Description
Measurement function Measures an object.
Judgment output Judges the measurement value when the upper/lower limit values are set.
Head/laser control Switches the state of laser between emission and stop.
Zero set Sets the measurement value obtained when the zero set is turned on to the reference value of measurement (zero).
The setting of the reference value of measurement is disabled when the zero set is turned off.
Timing Holds the measurement value and the judgment output at a desired timing.
Reset Resets the measurement value.
Emitted light intensity search Searches the received light intensity of all measurement surfaces and sets the appropriate emitted light intensity
automatically.
Memory operation function
Function Description
Output setting copy Copies the OUT setting between memory areas.
Memory change Changes the destination memory for saving the settings.
Memory copy Copies the settings saved in a memory area to another memory area.
Initialization Initializes the settings in the memory area.
Save Saves the settings in all the memory areas.
3
Buffering function
Function Description
Self-stop Stops buffering operation automatically.
Buffering mode Sets the buffering mode.
Buffering type Selects the output data to be accumulated.
Buffering rate Loads data to be accumulated for a long time by being longer of the accumulation time interval.
Accumulation amount Sets the accumulation amount of data.
Trigger condition Sets the conditions of trigger generation.
Trigger delay Delays the timing of data accumulation after trigger generation.
Trigger point The data accumulation before trigger generation is displayed.
Sample trigger accumulation amount Sets the accumulation amount of data for each trigger generation.
Status readout Checks the status of accumulation operation.
Accumulation amount readout Reads the accumulation amount of data.
Trigger counter readout Reads out the number of generated triggers.
Intelligent function
Function Description
External power supply interruption
detection function
Received light intensity waveform
acquisition function
Detects an interruption of the external power supply.
Loads the received light intensity waveform to the buffer memory of the control module.
Recipe selecting function
Function Description
Default recipe Sets the parameters of the laser displacement sensor just by selecting the recipe (setting value of each function)
corresponding to the measurement object.
3 FUNCTION LIST
19
MEMO
20
3 FUNCTION LIST
4 PROCEDURES BEFORE OPERATION
This chapter describes the procedures before operation.
1. Mounting a module
Mount the control module in any desired configuration.
Page 27 Configuration of Laser Displacement Sensor
2. Wiring
Perform wiring of external devices to the control module.
Page 32 Wiring Method
3. Adding a module
Add the control module to a module configuration by using the engineering tool.
Page 37 Communication Example Between Control Module and Sensor Head
4. Configuring parameter settings
Configure the parameter settings of the control module by using the engineering tool.
MELSEC iQ-R Laser Displacement Sensor Control Module User's Manual (Application)
5. Measuring an object
Configure the settings for connecting of sensor heads and proper measurement of objects by using the setting tool, and
measure the objects.
Page 22 Measuring an Object
6. Programming
Create a program.
Page 37 Communication Example Between Control Module and Sensor Head
4
4 PROCEDURES BEFORE OPERATION
21
4.1 Measuring an Object
Procedures when measuring an object
This section describes the operating procedures when measuring an object using by the control module.
1. Turning on the external power supply
Turn on the external power supply.
Page 32 Connection method of external power supply
2. Power-on the programmable controller.
Power on the programmable controller and start up the control module.
If the external power supply is not supplied more than five seconds after the programmable controller is powered on, the
external power supply interruption error (error code: 3010H) occurs.
3. Check that the laser displacement sensor is start-up.
Check that the sensor head emits a laser beam and the laser radiation indicator is on.
Be careful of the following when checking the laser displacement sensor is start-up.
• When the sensor head is start-up (the laser radiation indicator (LASER ON) is on), laser emission starts regardless of
whether the state of CPU module is RUN or STOP.
• Be careful that not to point the laser beam to people's eyes when the sensor head is start-up.
• Allow at least 40 to 50 seconds after power-on to use a laser beam.
• Allow at least 30 minutes of warming up after emitted laser beam from a sensor head to ensure the performance of the
sensor head.
• If the RUN LED of the control module is not turn on, check that the programmable controller is turned on and the external
power supply is connected to the control module.
4. Starting up the setting tool.
Start the setting tool.
5. Set the default recipe.
Set the basic settings depending on a measurement object in the default recipe.
To select the measurement object in the default recipe can be set the following settings.
• Head setting
• OUT setting
• Common setting
Laser Displacement Sensor MH11 SettingTool Version 2 Operating Manual
6. Position adjustment of sensor head
Checking the connecting direction of a sensor head. Select the optimum direction according to the shape or moving direction
of the measurement object.
• Checking the installation
The installation for the specular reflection measurement is different from that for the diffuse reflection measurement.
• Checking the measurement center
The measurement range indicator (RANGE) turns on in yellow around the measurement center.
• Checking the measurement range
Move a measurement object to check the displacement of the object is within the measurement range.
The measurement range indicator (RANGE) blinks in yellow when the object is within the measurement range.
Check that the received light intensity waveform of the sensor head A and B on the received light intensity waveform window
of the setting tool.
MELSEC iQ-R Laser Displacement Sensor Control Module User's Manual (Sensor Head)
Laser Displacement Sensor MH11 SettingTool Version 2 Operating Manual
22
4 PROCEDURES BEFORE OPERATION
4.1 Measuring an Object
7. Measurement
When the measurement completes normally, the measurement value is displayed on the measurement value display window
of the setting tool.
If the measurement value is not displayed, refer to the troubleshooting by symptom.
( MELSEC iQ-R Laser Displacement Sensor Control Module User's Manual (Application))
Check the peak waveform of the received light intensity and the peak received light intensity on the received light intensity
window.
If an alarm occurs within the measurement range, the received light intensity status can be checked by checking the peak
received light intensity.
4
4 PROCEDURES BEFORE OPERATION
4.1 Measuring an Object
23
Procedures for initialization when the setting is failed
When the setting is failed, initialize the setting details.
For details, refer to the following.
MELSEC iQ-R Laser Displacement Sensor Control Module User's Manual (Application)
24
4 PROCEDURES BEFORE OPERATION
4.1 Measuring an Object
Procedure for sensor head replacement
This section describes the operating procedures for replacing the sensor head without the power-off of the programmable
controller.
When using a sensor head replacement request
By using 'Sensor head replace request' (Y1), the sensor head can be replaced without causing a module error.
The following describes the procedure for replacing the sensor head when using 'Sensor head replace request' (Y1).
1. Saving the parameters
Save the parameters by using the setting tool or a buffer memory command.
Otherwise, the parameters will be lost during operation.
After replacement, the module operates with the parameter saved last.
2. Issuing a sensor head replacement request
Turn on 'Sensor head replace request' (Y1) and check that 'Sensor head replace request receiving status' (X1) is turned on.
3. Turning off the external power supply
Turn off the external power supply.
4. Replacing the sensor head
Replace the sensor head.
5. Turning on the external power supply
Turn on the external power supply.
4
6. Checking that the sensor head is recognized
After 'Sensor head configuration complete' (X4) turns on, check 'Sensor head A READY' (X2) or 'Sensor head B READY'
(X3).
If 'Sensor head A READY' (X2) or 'Sensor head B READY' (X3) does not turn on despite the sensor head being connected, try
again from step 3.
For details on a sensor head recognition error, refer to the following.
MELSEC iQ-R Laser Displacement Sensor Control Module User's Manual (Application)
7. Clearing a sensor head replacement request
Turn off 'Sensor head replace request' (Y1) and check that 'Sensor head replace request receiving status' (X1) is turned off.
8. Position adjustment of sensor head
Check the connecting direction and measurement distance of sensor head.
Page 22 Procedures when measuring an object
9. Measurement
Check that the system operates normally.
If an error occurs, refer to the troubleshooting in the following manual.
MELSEC iQ-R Laser Displacement Sensor Control Module User's Manual (Application)
4 PROCEDURES BEFORE OPERATION
4.1 Measuring an Object
25
When not using a sensor head replacement request
Even if an error occurs temporarily after the sensor head is replaced, if there is no problem, the replacement procedure can
be made simple.
The following describes the procedure for replacing the sensor head when 'Sensor head replace request' (Y1) is not used.
1. Saving the parameters
Save the parameters by using the setting tool or a buffer memory command.
Otherwise, the parameters will be lost during operation.
After replacement, the module operates with the parameter saved last.
2. Turning off the external power supply
Turn off the external power supply.
Then, any of the errors shown below is cleared and an external power supply interruption error (error code: 3010H) occurs.
• Sensor head unconnected
• Connection head mismatch
• Automatic head adjustment error
• Circuit operation failure
• Head system error
• Head connection check error
3. Replacing the sensor head
Replace the sensor head.
4. Turning on the external power supply
Turn on the external power supply.
5. Checking that an external power supply interruption error is cleared
Check that the external power supply interruption error is cleared.
However, if the error causes are not eliminated in step 2, these errors occur again.
When these errors occur, perform the replacement procedure from step 2 again.
6. Position adjustment of sensor head
Check the connecting direction and measurement distance of sensor head.
Page 22 Procedures when measuring an object
7. Measurement
Check that the system operates normally.
If an error occurs, refer to the troubleshooting in the following manual.
MELSEC iQ-R Laser Displacement Sensor Control Module User's Manual (Application)
26
4 PROCEDURES BEFORE OPERATION
4.1 Measuring an Object
5 SYSTEM CONFIGURATION
(1) (2)
(3)(4)
(5)
5.1 Configuration of Laser Displacement Sensor
The following figure shows the system configuration of the control module.
(1) Engineering tool, setting tool
(2) Control module
(3) Sensor head A
(4) Sensor head B
(5) External power supply
5
For applicable combinations of CPU modules and the other modules and for the number of mountable
modules, refer to the following.
MELSEC iQ-R Module Configuration Manual
Precautions
• When connecting one sensor head to the control module, connect the sensor head to the SENSOR HEAD A connector.
When one sensor head is used and it is connected to the SENSOR HEAD B connector, measurement cannot be
performed.
• Be careful of the incorrect wiring when connecting each device. For the wiring, refer to the following.
Page 32 Wiring Method
5 SYSTEM CONFIGURATION
5.1 Configuration of Laser Displacement Sensor
27
5.2 Supported Software Package
The following table shows the software packages supported by the control module.
Software Version
GX Works3 (Engineering tool) Version 1.055H or later
Setting tool Version 2.001B or later
About setting tool
For details on the setting tool, please consult your local Mitsubishi representative.
■Operating environment and installation/uninstallation
For details on the operating environment and installation/uninstallation of the setting tool, refer to the following.
Laser Displacement Sensor MH11 SettingTool Version 2 Installation Instructions
■Software license agreement
For details on the software license agreement to use the setting tool, refer to the following.
Laser Displacement Sensor MH11 SettingTool Version 2 Operating Manual
■Operation method and function
For details on the operation method and function of the setting tool, refer to the following.
Laser Displacement Sensor MH11 SettingTool Version 2 Operating Manual
28
5 SYSTEM CONFIGURATION
5.2 Supported Software Package
6 INSTALLATION AND WIRING
6.1 Correct Usage
Regarding execution and use, be aware of the following.
Installation environment
Do not install the product in the following conditions.
• Where the ambient temperature, ambient humidity, or ambient illuminance of light receiving surface is beyond the range of
specifications ( Page 29 Usage environment)
• Where dew condensation occurs due to rapid temperature change
• In an atmosphere of corrosive gas or flammable gas
• Where the product is exposed to dust, iron powder, and salt
• In an atmosphere where the product is likely to be exposed to organic solvent such as benzene, thinner, or alcohol, or to
strong alkaline materials such as ammonia or sodium hydroxide
• Where heavy vibration or impact is applied
• Where direct sunlight is received
• Where water, oil or chemicals splashes
• Where load is applied to the product
6
Usage environment
For the usage environment, refer to the general specifications of the following.
MELSEC iQ-R Module Configuration Manual
For details on the sensor head, refer to the general specifications of the following.
MELSEC iQ-R Laser Displacement Sensor Control Module User's Manual (Sensor Head)
Protective structure
Although the sensor head is waterproof, the control module and connectors are not structurally dustproof, waterproof, or
corrosion-resistant. Therefore, measurement underwater or in the rain is not allowed. Be aware of the usage environment.
Warming up time
Allow at least 30 minutes of warming up after emitted laser beam from a sensor head to ensure the performance of the sensor
head.
6 INSTALLATION AND WIRING
6.1 Correct Usage
29
Measures to reduce noise
• Install the product as far away as possible from noise source such as high-voltage lines, high-voltage device, power lines,
power device, machines which generate a large starting and stopping surge, welding machines, and inverter motor.
• Install the product as far away as possible from a wireless device that has a transmitter, such as an amateur radio device.
• Do not run the sensor head cable along (bundled in parallel) with other wirings. Keep it at least 100mm away from other
wires. Run the cable so that it is separate from high voltage and power circuit lines. If it is necessary to run the cable in
parallel with them, shield the cable by running it through a grounded electrical conduit.
• Ground FG with a ground resistance of 100 ohms or less and avoid sharing the ground with other devices. This may
produce an opposite effect.
• Connect a noise filter to the external power supply. Use a noise filter with the damping characteristic, RSEN-2006
(manufactured by TDK-Lambda Corporation) or equivalent. For details on a noise filter, refer to the following.
MELSEC iQ-R Module Configuration Manual
Insulation resistance and withstand voltage
Do not perform insulation resistance and withstand voltage tests between an exposed metal part of the sensor head
connector and the entire sensor head. Doing so may cause failure.
Power supply
■External power supply of the control module
• For the external power supply voltage, use the system within the rated voltage range of 20.4 to 28.8VDC.
• For the external power supply, use the control module with the satisfied performance specifications. ( Page 17
Performance Specifications)
• When using a commercial switching regulator for the external power supply, be sure to ground the FG terminal to avoid the
influence of high frequency noise. Do not cascade the FG terminal between control modules.
• When using a transformer in the external power supply, be sure to use an insulated transformer. The product or the external
power supply may be damaged if an auto transformer is used.
• Use an insulated external power supply incorporating a protective circuit to protect it against abnormal voltages from the
power line.
• When using a power supply not incorporating a protective circuit, be sure to power on through a protective element such as
a fuse.
■Power supply sequence for the control module and the programmable controller
• Turn on the external power supply, and then turn on the programmable controller.
• If the external power supply is not supplied more than five seconds after the programmable controller is powered on, the
external power supply interruption error (error code: 3010H) occurs.
• Turn off the programmable controller first, then, turn off the external power supply. If the external power supply turns off
prior to the programmable controller, the control module may malfunction.
• Leave an interval for at least 10 seconds between turning off the programmable controller and turning on the power again.
Failure to do so may corrupt saved data.
• It takes about 40 to 50 seconds from power-on to operating state (startup completed), depending on the settings saved.
Because outputs are not determined during startup, do not use them. Doing so may cause malfunction of devices due to an
incorrect output.
• Do not turn off the power while saving the settings. In the worst case, the system of the control module is destroyed and fail
to restart.
• When a sensor head is start-up (the laser radiation indicator (LASER ON) is on), laser emission starts regardless of
whether the state of CPU module is RUN or STOP.
• Be careful that not to point the laser beam to people's eyes when the sensor head is start-up.
30
6 INSTALLATION AND WIRING
6.1 Correct Usage
Instantaneous power failure
(1) (2) (3)
Control
module
Equipment
Control
module
Equipment
Control
module
Equipment
Ground
resistance of
100Ω or less
Ground
resistance of
100Ω or less
If an instantaneous power failure occurs, the system operates continuously, or goes to stop operation or restart the system,
depending on the duration of power failure. Do not use the system in the environment where an instantaneous power failure
occurs.
Grounding
Ground the FG terminals when substantial noise effects are present.
While there is adequate noise resistance in a normal environment, use the grounding process for environments with
particularly loud noise.
■Grounding process
• Use a power cable of 1.5 or more, with a ground resistance of 100 or less.
• Keep the grounding point as close to the control module as possible, to shorten the ground wire distance.
• Provide independent grounding in any cases. Sharing the grounding with other devices may produce an opposite effect.
• The sensor head case and sensor head cable connector housing are electrically connected via the sensor head cable to
the FG terminal of the control module.
6
(1) Independent grounding
(2) Shared grounding
(3) Common grounding
Connecting
■Wire connections and connectors
• Turn off the power of the programmable controller and external power supply before connecting or disconnecting the
connectors and any other connections.
• When connecting or disconnecting the sensor head, be sure to hold the connector body of the sensor head cable and not to
apply extra force to the cable.
• Be careful not to touch the terminals of disconnected connectors or to let foreign objects get in disconnected connectors.
• Be careful not to apply force to around the connectors of sensor head cable and extension cable for sensor head. Do not
bend the cables near connectors of sensor head cable and extension cable for sensor head. Doing so causes
disconnection of the cables.
• Fit the connector of the sensor head cable to the plug-in side of the connector. ( Page 35 Connecting sensor head to
control module)
6 INSTALLATION AND WIRING
6.1 Correct Usage
31
6.2 Wiring Method
+24V
24G
FG
(4)
(5)
(6)
(1)
(2)
(3)
+24V
24G
Connection method of external power supply
The external power supply is used for operating a sensor head.
Wiring
• For connecting the external power supply of the control module, use the +24V terminal and the 24G terminal of the external
power supply terminal block, and supply 24VDC.
• To reduce the effects of noise, perform twist processing (stranded wire processing) for the power cable.
For the wiring of the external power supply, refer to the following connection diagram.
Terminal block
The terminal block can be removed from the control module. Use the terminal block and the tightening tool that satisfy the
following conditions:
• Terminal block
The terminal block socket is manufactured by Mitsubishi Electric. For details on the terminal block socket, please consult your
local representative.
• Tightening tool
Flathead screwdriver Tightening torque range
Blade width: 0.6mm 3.5mm 0.2 to 0.3Nm
Removal and installation of terminal block
■Removal
To remove a terminal block, loosen terminal block mounting screws using a flathead screwdriver, and pull out the terminal
block.
■Installation
To install the terminal block, insert a terminal block to a connector, and secure the terminal block by attaching a terminal block
mounting screws using a flathead screwdriver.
Insufficient fixing may cause drop, short-circuit, or malfunction of the module.
Signal name of terminal block
The following shows the signal names of the terminal block.
No. Signal name Function
(1) +24V 24VDC (input) for power supply
(2) 24G Ground for power supply
(3)
(4) +24V 24VDC (output) for power supply
(5) 24G Ground for power supply
(6)
(FG)
(FG)
Functional ground
Functional ground (use prohibited)
32
6 INSTALLATION AND WIRING
6.2 Wiring Method
Processing method of the cable terminal
(1)
Strip the cable sheath from the tip for the strip length.
Attach the bar solderless terminal to the stripped area.
(1) Strip length
A recommended strip length is 13mm.
Wiring to terminal block
■Connecting a cable
Fully insert a wire having a bar solderless terminal into a wire insertion opening, and push the wire in. After inserting the wire,
pull it lightly to check that it is securely clamped.
Incomplete connections may cause short circuit, fire, or malfunction.
■Disconnecting a cable
Push in the open/close button of the wire to be disconnected using a flathead screwdriver. Pull out the wire with the open/
close button pushed in.
6
6 INSTALLATION AND WIRING
6.2 Wiring Method
33
Transition wiring of external power supply
+24V
24G
+24V
24G
+24V
24G
(1)
DC24V
0V
FG
FG FG
When multiple control modules are installed, power can be supplied through the transition wiring.
To perform the transition wiring of the external power supply, connect the +24V terminal and 24G terminal of the power supply
source control module to the +24V terminal and 24G terminal of the power supply destination control module.
(1) External power supply
• Ground the FG terminals.
• Do not cascade the FG terminal between control modules.
• Ground the FG terminal for each control module.
• Leave the FG terminal on the right side open all the time.
The number of cascade-connectable control modules (n) depends on the external power supply capacity.
Cascade the number of control modules that satisfies the following conditions.
• The voltage at the external power supply terminal of the cascaded terminal module is 20.4VDC or higher.
• Output current of the external power supply current consumption of the module (0.5A) n modules
34
6 INSTALLATION AND WIRING
6.2 Wiring Method
Connecting sensor head to control module
Precautions
The following describes the procedure to connect a sensor head to the control module.
Pay attention to the direction of a sensor head cable connector and insert the cable to the control module until it clicks.
Pull the cable lightly and check that it has been connected securely.
• When connecting one sensor head to the control module, connect the sensor head to the SENSOR HEAD A connector.
The measurement cannot be performed when the controller is connected to the SENSOR HEAD B connector.
• Do not mount the sensor head to the control module while the external power supply is turned on. Doing so may cause
sensor head failure.
• For details on connecting cables with sensor head fixed, refer to the following.
MELSEC iQ-R Laser Displacement Sensor Control Module User's Manual (Sensor Head)
6
6 INSTALLATION AND WIRING
6.2 Wiring Method
35
6.3 Wiring Product
Precautions
This section describes the wiring products used for the control module.
Applicable wire
For the wire to be connected to the terminal block, use the following.
Size Conductor cross-section area Material Temperature rating
24 to 14 AWG (stranded wire) 0.25 to 2.0 Copper 75 or greater
Bar solderless terminal
Use bar solderless terminals that satisfy the following conditions:
Typ e Model name Applicable wire size Contact
Bar solderless terminal AI 0.25-10YE 0.25 PHOENIX CONTACT GmbH & Co. KG
AI 0.34-10TQ 0.34
AI 0.5-10WH 0.5
AI 0.75-10GY 0.75
AI 1-10RD 1.0
AI 1.5-10BK 1.5
AI 2.5-10BU 2.5
Bar solderless terminal
tool
Bar solderless terminal TE 0.5-10 0.5 NICHIFU Co.,Ltd.
Bar solderless terminal
tool
CRIMPFOX6
TE 0.75-10 0.75
TE 1.0-10 1.0
TE 1.5-10 1.5
TE 2.5-10 2.5
NH 79A
• Always turn off the power before proceeding with attachment or removal of wiring and the terminal block.
• Do not use wires with a soldered end. Poor contact or insertion/extraction failure to the spring clamp terminal block may
occur depending on the finished quality of the soldering.
• Do not use bar solderless terminals without insulation sleeve.
36
6 INSTALLATION AND WIRING
6.3 Wiring Product
7 COMMUNICATION EXAMPLE
(1)
(2)
7.1 Communication Example Between Control Module
and Sensor Head
This sections describes the communication example between the control module and the sensor head.
System configuration example
The communication example uses the following system configuration.
System configuration
7
(1) Programmable controller system
• Power supply module: R61P
• CPU module: R04CPU
• Control module: R60MH112NA
(2) Sensor head: MH11H05B0SNA
7 COMMUNICATION EXAMPLE
7.1 Communication Example Between Control Module and Sensor Head
37
Parameter setting
Set the parameters using the engineering tool and the setting tool.
Setting of engineering tool
■Setting of control module
Connect the engineering tool to the CPU module, and set the parameters.
1. Set the CPU module.
[Project] [New]
2. Click the [Setting Change] button and set "Use Module Label" to "Yes".
3. Click the [OK] button, then, the module label of the CPU module is added.
4. Set the control module.
[Navigation window] [Parameter] [Module Information] Right-click [Add New Module]
38
7 COMMUNICATION EXAMPLE
7.1 Communication Example Between Control Module and Sensor Head
5. Click the [OK] button and add the module label of the control module.
6. Set the parameters.
[Navigation window] [Parameter] [Module Information] [R60MH112NA]
7
7. Write the parameters to the CPU module, and reset or power off and on the CPU module.
[Online] [Write to PLC]
In this example, default values are used for parameters that are not shown above. For the parameters, refer to
the following.
MELSEC iQ-R Laser Displacement Sensor Control Module User's Manual (Application)
Program example
The following shows the program example of the measurement value acquisition processing.
Classification Label name Description Device
Module label R60MH112_1.bModuleREADY Module READY X0
R60MH112_1.b2StrobeSignal_OUT[1] Strobe signal OUT1 X16
R60MH112_1.b2AlarmSignal_OUT[1] Alarm signal OUT1 X18
R60MH112_1.d2MeasurementValue_OUT[1] Measurement value OUT1 U0\G16
Label to be
defined
Define the local labels as follows.
7 COMMUNICATION EXAMPLE
7.1 Communication Example Between Control Module and Sensor Head
39
(0) The value of the depth of a dent is measured when the count start (bCountStart) is turned off and on, then, its value is stored in data (Max_dent_depth).
(44) The number of the dents are counted and classified according to its values. (Number_of_dents_A: Dent (between 2m and 5m), Number_of_dents_B:
Dent (5m or more)
40
7 COMMUNICATION EXAMPLE
7.1 Communication Example Between Control Module and Sensor Head
APPENDICES
98
27.8125
110
106
Appendix 1 External Dimensions
This section describes the external dimensions of the control module.
(Unit: mm)
A
APPX
Appendix 1 External Dimensions
41
Appendix 2 Export Regulations by Japanese
Government
The products have specifications not subject to export regulations by the Foreign Exchange and Foreign Trade Law.
42
APPX
Appendix 2 Export Regulations by Japanese Government
MEMO
A
APPX
Appendix 2 Export Regulations by Japanese Government
43
INDEX
B
Buffering function . . . . . . . . . . . . . . . . . . . . . . . 19
C
Control module . . . . . . . . . . . . . . . . . . . . . . . . . 14
CPU module. . . . . . . . . . . . . . . . . . . . . . . . . . . 14
D
Device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
E
Engineering tool . . . . . . . . . . . . . . . . . . . . . . . . 14
I
Intelligent function. . . . . . . . . . . . . . . . . . . . . . . 19
L
Label . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
M
Memory operation function. . . . . . . . . . . . . . . . . 19
Module label. . . . . . . . . . . . . . . . . . . . . . . . . . . 14
R
Recipe selecting function . . . . . . . . . . . . . . . . . . 19
S
Sensing function . . . . . . . . . . . . . . . . . . . . . . . . 19
Sensor head. . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Setting tool. . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
44
MEMO
I
45
REVISIONS
*The manual number is given on the bottom left of the back cover.
Revision date *Manual number Description
June 2019 SH(NA)-082017ENG-A First edition
Japanese manual number: SH-082016-A
This manual confers no industrial property rights of any other kind, nor does it confer any patent licenses. Mitsubishi Electric Corporation cannot be held
responsible for any problems involving industrial property rights which may occur as a result of using the contents noted in this manual.
2019 MITSUBISHI ELECTRIC CORPORATION
46
WARRANTY
Please confirm the following product warranty details before using this product.
1. Gratis Warranty Term and Gratis Warranty Range
If any faults or defects (hereinafter "Failure") found to be the responsibility of Mitsubishi occurs during use of the product
within the gratis warranty term, the product shall be repaired at no cost via the sales representative or Mitsubishi Service
Company.
However, if repairs are required onsite at domestic or overseas location, expenses to send an engineer will be solely at
the customer's discretion. Mitsubishi shall not be held responsible for any re-commissioning, maintenance, or testing
on-site that involves replacement of the failed module.
[Gratis Warranty Term]
The gratis warranty term of the product shall be for one year after the date of purchase or delivery to a designated place.
Note that after manufacture and shipment from Mitsubishi, the maximum distribution period shall be six (6) months, and
the longest gratis warranty term after manufacturing shall be eighteen (18) months. The gratis warranty term of repair
parts shall not exceed the gratis warranty term before repairs.
[Gratis Warranty Range]
(1) The range shall be limited to normal use within the usage state, usage methods and usage environment, etc., which
follow the conditions and precautions, etc., given in the instruction manual, user's manual and caution labels on the
product.
(2) Even within the gratis warranty term, repairs shall be charged for in the following cases.
1. Failure occurring from inappropriate storage or handling, carelessness or negligence by the user. Failure caused
by the user's hardware or software design.
2. Failure caused by unapproved modifications, etc., to the product by the user.
3. When the Mitsubishi product is assembled into a user's device, Failure that could have been avoided if functions
or structures, judged as necessary in the legal safety measures the user's device is subject to or as necessary by
industry standards, had been provided.
4. Failure that could have been avoided if consumable parts (battery, backlight, fuse, etc.) designated in the
instruction manual had been correctly serviced or replaced.
5. Failure caused by external irresistible forces such as fires or abnormal voltages, and Failure caused by force
majeure such as earthquakes, lightning, wind and water damage.
6. Failure caused by reasons unpredictable by scientific technology standards at time of shipment from Mitsubishi.
7. Any other failure found not to be the responsibility of Mitsubishi or that admitted not to be so by the user.
2. Onerous repair term after discontinuation of production
(1) Mitsubishi shall accept onerous product repairs for seven (7) years after production of the product is discontinued.
Discontinuation of production shall be notified with Mitsubishi Technical Bulletins, etc.
(2) Product supply (including repair parts) is not available after production is discontinued.
3. Overseas service
Overseas, repairs shall be accepted by Mitsubishi's local overseas FA Center. Note that the repair conditions at each FA
Center may differ.
4. Exclusion of loss in opportunity and secondary loss from warranty liability
Regardless of the gratis warranty term, Mitsubishi shall not be liable for compensation to:
(1) Damages caused by any cause found not to be the responsibility of Mitsubishi.
(2) Loss in opportunity, lost profits incurred to the user by Failures of Mitsubishi products.
(3) Special damages and secondary damages whether foreseeable or not, compensation for accidents, and
compensation for damages to products other than Mitsubishi products.
(4) Replacement by the user, maintenance of on-site equipment, start-up test run and other tasks.
5. Changes in product specifications
The specifications given in the catalogs, manuals or technical documents are subject to change without prior notice.
47
TRADEMARKS
SH(NA)-082017ENG-A
The company names, system names and product names mentioned in this manual are either registered trademarks or
trademarks of their respective companies.
In some cases, trademark symbols such as '
' or '' are not specified in this manual.
48
SH(NA)-082017ENG-A(1906)MEE
Specifications subject to change without notice.
When exported from Japan, this manual does not require application to the
Ministry of Economy, Trade and Industry for service transaction permission.
HEAD OFFICE : TOKYO BUILDING, 2-7-3 MARUNOUCHI, CHIYODA-KU, TOKYO 100-8310, JAPAN
NAGOYA WORKS : 1-14 , YADA-MINAMI 5-CHOME , HIGASHI-KU, NAGOYA , JAPAN
MODEL: R60MH112-U-IN-E
MODEL CODE: 13JX91
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