MITSUBISHI M63826P, M63826FP, M63826GP Technical data

MITSUBISHI SEMICONDUCTOR <TRANSISTOR ARRAY>
M63826P/FP/GP
7-UNIT 500mA DARLINGTON TRANSISTOR-ARRAY WITH CLAMP DIODE
DESCRIPTION
M63826P, M63826FP and M63826GP are seven-circuit Darlington transistor arrays with clamping diodes. The cir­cuits are made of NPN transistors. Both the semi-conductor integrated circuits perform high-current driving with ex­tremely low input-current supply. Production lineup has been newly expanded with the addi­tion of 225mil (GP) package. M63826P and M63826FP have the same pin connection as M54526P and M54526FP. (Compatible with M54526P and M54526FP) More over, the features of M63826P and M63826FP are equal or superior to those of M54526P and M54526FP.
FEATURES
Three package configurations (P, FP and GP)
Pin connection Compatible with M54526P and M54526FP
High breakdown voltage (BVCEO 50V)
High-current driving (IC(max) = 500mA)
With clamping diodes
Driving available with PMOS IC output of 8-18V
Wide operating temperature range (Ta = –40 to +85 °C)
APPLICATION
Drives of relays and printers, digit drives of indication ele­ments (LEDs and lamps), and MOS-bipolar logic IC inter­faces
FUNCTION
The M63826P, M63826FP and M63826GP each have seven circuits consisting of NPN Darlington transistors. These ICs have resistance of 10.5k between input transistor bases and input pins. A spike-killer clamping diode is provided be­tween each output pin (collector) and COM pin (pin 9). The output transistor emitters are all connected to the GND pin (pin 8). The collector current is 500mA maximum. Collector­emitter supply voltage is 50V maximum.The M63826FP and M63826GP is enclosed in molded small flat package, en­abling space-saving design.
PIN CONFIGURATION
1
IN1 IN2
2
IN3
3
IN4 IN5 IN6 IN7 GND
4 5 6
7 8
16
O1
15
O2
14
O3
13
O4
12
O5
11
O6
10
O7
9
COM COMMON
16P4(P) 16P2N-A(FP) 16P2S-A(GP)Package type
CIRCUIT DIAGRAM
INPUT
The diode, indicated with the dotted line, is parasitic, and cannot be used.
10.5k
7.2k
3k
The seven circuits share the COM and GND
COM OUTPUT
GND
Unit :
ABSOLUTE MAXIMUM RATINGS (Unless otherwise noted, Ta = –40 ~ +85°C)
VCEO IC VI IF VR Pd Topr Tstg
Collector-emitter voltage Collector current Input voltage Clamping diode forward current Clamping diode reverse voltage Power dissipation Operating temperature Storage temperature
Output, H Current per circuit output, L
Ta = 25°C, when mounted on board
RatingsSymbol Parameter Conditions Unit
–0.5 ~ +50
500
–0.5 ~ +30
500
50
1.47(P)/1.00(FP)/0.80(GP) –40 ~ +85
–55 ~ +125
V
mA
V
mA
V
W
°C °C
Jan. 2000
MITSUBISHI SEMICONDUCTOR <TRANSISTOR ARRAY>
7-UNIT 500mA DARLINGTON TRANSISTOR-ARRAY WITH CLAMP DIODE
RECOMMENDED OPERATING CONDITIONS (Unless otherwise noted, Ta = –40 ~ +85°C)
Symbol Unit
Parameter
min typ max
VO Output voltage
Duty Cycle P : no more than 8% FP : no more than 5% GP : no more than 4%
Duty Cycle P : no more than 30% FP : no more than 20% GP : no more than 15%
IC
VIH VIL
Collector current (Current per 1 cir­cuit when 7 circuits are coming on si­multaneously)
“H” input voltage “L” input voltage
ELECTRICAL CHARACTERISTICS (Unless otherwise noted, Ta = 25°C)
Symbol UnitParameter Test conditions
V
(BR) CEO
CE(sat)
V
II VF IR hFE
Collector-emitter breakdown voltage
Collector-emitter saturation voltage
Input current Clamping diode forward volltage Clamping diode reverse current DC amplification factor
I
CEO = 100µA I = 500µA, IC = 350mA
I
I = 350µA, IC = 200mA
I
I = 250µA, IC = 100mA
I
I = 10V
V
F = 350mA
I
R = 50V
V
CE = 4V, IC = 350mA
V
Limits
0
0
50
400
V
mA
0
5 0
— —
200
25
0.5
V V
M63826P/FP/GP
Limits
min typ max
50 — — — — — —
1000
1.2
1.0
0.9
0.9
1.4
2500
1.6
1.3
1.1
1.4
2.0
100
V
V
mA
V µA —
SWITCHING CHARACTERISTICS (Unless otherwise noted, Ta = 25°C)
Symbol UnitParameter Test conditions
ton toff
Turn-on time Turn-off time
CL = 15pF (note 1)
TIMING DIAGRAMNOTE 1 TEST CIRCUIT
OPEN
Vo
R
L
OUTPUT
L
C
INPUT
Measured device
PG
50
(1)Pulse generator (PG) characteristics : PRR=1kHz,
tw = 10µs, tr = 6ns, tf = 6ns, Zo = 50
P
= 8V
P-P
V (2)Input-output conditions : RL = 25, Vo = 10V (3)Electrostatic capacity C
at connections and input capacitance at probes
L
includes floating capacitance
INPUT
OUTPUT
Limits
min typ max
— —
ton toff
15
350
50%50%
— —
ns ns
50%50%
Jan. 2000
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