Mitsubishi Electric Corporation Semiconductor Group FS3UM-10 Datasheet

MITSUBISHI Nch POWER MOSFET
FS3UM-10
HIGH-SPEED SWITCHING USE
FS3UM-10
¡VDSS ................................................................................ 500V
¡r
DS (ON) (MAX) .................................................................4.4
¡I
D ............................................................................................ 3A
OUTLINE DRAWING Dimensions in mm
4.5
1.3
0.5 2.6
4.5MAX.
16
3.8MAX.
12.5MIN.
q
10.5MAX.
3.2
2.54 2.54
qwe
wr
e
r
7.0
φ 3.6
1.0
0.8
q GATE w DRAIN e SOURCE r DRAIN
TO-220
APPLICATION
SMPS, DC-DC Converter, battery charger, power supply of printer, copier, HDD, FDD, TV, VCR, per­sonal computer etc.
MAXIMUM RATINGS (Tc = 25°C)
Symbol VDSS VGSS ID IDM PD Tch Tstg
Drain-source voltage Gate-source voltage Drain current Drain current (Pulsed) Maximum power dissipation Channel temperature Storage temperature Weight
Parameter Conditions Ratings Unit
VGS = 0V VDS = 0V
Typical value
500 ±30
60 –55 ~ +150 –55 ~ +150
2.0
V V A A
W
°C °C
Feb.1999
ELECTRICAL CHARACTERISTICS (Tch = 25°C)
Symbol UnitParameter Test conditions
V
(BR) DSS
V
(BR) GSS
IGSS IDSS VGS (th) rDS (ON) VDS (ON) yfs Ciss Coss Crss td (on) tr td (off) tf VSD Rth (ch-c)
Drain-source breakdown voltage Gate-source breakdown voltage Gate-source leakage current Drain-source leakage current Gate-source threshold voltage Drain-source on-state resistance Drain-source on-state voltage Forward transfer admittance Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time Source-drain voltage Thermal resistance
ID = 1mA, VGS = 0V IG = ±100µA, VDS = 0V VGS = ±25V , VDS = 0V VDS = 500V, VGS = 0V ID = 1mA, VDS = 10V ID = 1A, VGS = 10V ID = 1A, VGS = 10V ID = 1A, VDS = 10V
VDS = 25V, VGS = 0V, f = 1MHz
VDD = 200V, ID = 1A, VGS = 10V, RGEN = RGS = 50
IS = 1A, VGS = 0V Channel to case
MITSUBISHI Nch POWER MOSFET
FS3UM-10
HIGH-SPEED SWITCHING USE
Limits
Min. Typ. Max.
500 ±30
— —
1.0 — — — — — — — — —
— — — —
3.4
3.4
1.5
300
35
1.5 —
— —
±10
4.4
4.4 — — — — — — — —
2.0
2.08
V V
µA
mA
V
V
S pF pF pF
ns ns ns ns
V
°C/W
PERFORMANCE CURVES
POWER DISSIPATION DERATING CURVE
100
80
60
40
20
POWER DISSIPATION PD (W)
CASE TEMPERATURE T
OUTPUT CHARACTERISTICS
10
PD = 60W
(TYPICAL)
C (°C)
TC = 25°C Pulse Test
VGS = 20V 10V 8V
MAXIMUM SAFE OPERATING AREA
1
10
0
10
–1
10
DRAIN CURRENT ID (A)
200150100500
TC = 25°C
Single Pulse
–2
10
23 5710123 5710223 571032
DRAIN-SOURCE VOLTAGE V
tw=10µs
100µs
1ms
10ms DC
DS (V)
OUTPUT CHARACTERISTICS
(TYPICAL)
TC = 25°C Pulse Test
VGS = 20V 10V 8V
PD = 60W
6V
DRAIN CURRENT ID (A)
0 1020304050
DRAIN-SOURCE VOLTAGE VDS (V)
6V
5V
DRAIN CURRENT ID (A)
0 4 8 12 16 20
DRAIN-SOURCE VOLTAGE VDS (V)
5V
Feb.1999
MITSUBISHI Nch POWER MOSFET
FS3UM-10
HIGH-SPEED SWITCHING USE
ON-STATE VOLTAGE VS.
GATE-SOURCE VOLTAGE
(TYPICAL)
40
32
(V)
24
DS (ON)
16
VOLTAGE V
DRAIN-SOURCE ON-STATE
0 4 8 12 16 20
GATE-SOURCE VOLTAGE V
TRANSFER CHARACTERISTICS
(TYPICAL)
10
TC = 25°C
DS
= 50V
V
(A)
D
Pulse Test
DRAIN CURRENT I
TC = 25°C Pulse Test
ID = 4A
3A
2A
1A
GS
(V)
ON-STATE RESISTANCE VS.
DRAIN CURRENT
(TYPICAL)
10
TC = 25°C Pulse Test
()
DS (ON)
RESISTANCE r
DRAIN-SOURCE ON-STATE
–2
5710–123 5710023 5710
2310
DRAIN CURRENT I
FORWARD TRANSFER ADMITTANCE
VS.DRAIN CURRENT
(TYPICAL)
1
10
VDS = 10V
Pulse Test
(S)
fs
0
10
ADMITTANCE y
FORWARD TRANSFER
TC = 25°C
75°C
125°C
VGS = 10V
D
(A)
20V
1
0 4 8 12 16 20
GATE-SOURCE VOLTAGE V
DRAIN-SOURCE VOLTAGE
2
10
CAPACITANCE
1
10
Ciss, Coss, Crss (pF)
Tch = 25°C
f = 1MHz
GS
= 0V
V
23 5710
DRAIN-SOURCE VOLTAGE V
CAPACITANCE VS.
(TYPICAL)
0
23 5710
1
23 571022
GS
Coss
Crss
DS
(V)
Ciss
(V)
–1
10
10–123 5710
DRAIN CURRENT I
SWITCHING CHARACTERISTICS
(TYPICAL)
t
f
2
10
t
d(off)
t
10
d(on)
1
t
r
SWITCHING TIME (ns)
–1
23 5710
10
DRAIN CURRENT ID (A)
0
23 5710
D
(A)
Tch = 25°C
DD
= 200V
V VGS = 10V
GEN
= R
R
GS
0
23 5710
1
= 50
1
Feb.1999
MITSUBISHI Nch POWER MOSFET
FS3UM-10
HIGH-SPEED SWITCHING USE
GATE-SOURCE VOLTAGE
VS.GATE CHARGE
(TYPICAL)
20
16
Tch = 25°C ID = 3A
VDS = 100V
(V)
GS
200V
12
400V
8
4
GATE-SOURCE VOLTAGE V
0
0 4 8 12 16 20
g
GATE CHARGE Q
(nC)
ON-STATE RESISTANCE VS.
CHANNEL TEMPERATURE
(t°C)
(25°C)
DS (ON)
DS (ON)
10
1
7 5
VGS = 10V ID = 1/2I Pulse Test
(TYPICAL)
D
3 2
0
10
7 5
3 2
–1
10
–50
DRAIN-SOURCE ON-STATE RESISTANCE r
DRAIN-SOURCE ON-STATE RESISTANCE r
CHANNEL TEMPERATURE Tch (°C)
0 50 100 150
SOURCE-DRAIN DIODE
FORWARD CHARACTERISTICS
(TYPICAL)
10
TC = 125°C
8
(A)
S
6
4
2
SOURCE CURRENT I
0
0 0.8 1.6 2.4 3.2 4.0
SOURCE-DRAIN VOLTAGE V
THRESHOLD VOLTAGE VS.
CHANNEL TEMPERATURE
(TYPICAL)
5.0 VDS = 10V
ID = 1mA
4.0
(V)
3.0
GS (th)
2.0
VOLTAGE V
1.0
GATE-SOURCE THRESHOLD
0
–50 0 50 100 150
CHANNEL TEMPERATURE Tch (°C)
75°C
VGS = 0V Pulse Test
25°C
SD
(V)
BREAKDOWN VOLTAGE VS.
(t°C)
(25°C)
CHANNEL TEMPERATURE
(TYPICAL)
1.4
BR (DSS)
BR (DSS)
VGS = 0V ID = 1mA
1.2
1.0
0.8
0.6
0.4 –50 0 50 100 150
DRAIN-SOURCE BREAKDOWN VOLTAGE V
CHANNEL TEMPERATURE Tch (°C)
DRAIN-SOURCE BREAKDOWN VOLTAGE V
TRANSIENT THERMAL IMPEDANCE
(°C/W)
1
10
7
(ch–c)
5
th
3
D=1
2
0.5
0
10
0.2
7 5
3
10
10
2
–1
7 5
3 2
–2
10
–4
23 57
0.05
0.02
0.01
Single Pulse
10
TRANSIENT THERMAL IMPEDANCE Z
CHARACTERISTICS
0.1
–3
–2
23 57 23 57 23 57
10
10
–1
PULSE WIDTH t
P
10023 57
w
(s)
DM
tw
D=
T
tw
T
10123 57
2
10
Feb.1999
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