Mitsubishi Electric Corporation Semiconductor Group FS30SM-6 Datasheet

MITSUBISHI Nch POWER MOSFET
FS30SM-6
HIGH-SPEED SWITCHING USE
FS30SM-6
¡VDSS ................................................................................ 300V
¡r
DS (ON) (MAX) .............................................................. 0.17
¡I
D ..........................................................................................30A
OUTLINE DRAWING Dimensions in mm
4.5
1.5
4.4
0.6 2.8
2
1.0
5.45
q
15.9MAX.
r
φ 3.2
qwe
5.45
4
wr
e
5.0
2
4
q GATE w DRAIN e SOURCE r DRAIN
20.0
19.5MIN.
TO-3P
APPLICATION
SMPS, DC-DC Converter, battery charger, power supply of printer, copier, HDD, FDD, TV, VCR, per­sonal computer etc.
MAXIMUM RATINGS (Tc = 25°C)
Symbol VDSS VGSS ID IDM PD Tch Tstg
Drain-source voltage Gate-source voltage Drain current Drain current (Pulsed) Maximum power dissipation Channel temperature Storage temperature Weight
Parameter Conditions Ratings Unit
VGS = 0V VDS = 0V
Typical value
300 ±30
250 –55 ~ +150 –55 ~ +150
4.8
V V A A
W
°C °C
g
Feb.1999
ELECTRICAL CHARACTERISTICS (Tch = 25°C)
Symbol UnitParameter Test conditions
V
(BR) DSS
V
(BR) GSS
IGSS IDSS VGS (th) rDS (ON) VDS (ON) yfs Ciss Coss Crss td (on) tr td (off) tf VSD Rth (ch-c)
Drain-source breakdown voltage Gate-source breakdown voltage Gate-source leakage current Drain-source leakage current Gate-source threshold voltage Drain-source on-state resistance Drain-source on-state voltage Forward transfer admittance Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time Source-drain voltage Thermal resistance
ID = 1mA, VGS = 0V IG = ±100µA, VDS = 0V VGS = ±25V , VDS = 0V VDS = 300V, VGS = 0V ID = 1mA, VDS = 10V ID = 15A, VGS = 10V ID = 15A, VGS = 10V ID = 15A, VDS = 10V
VDS = 25V, VGS = 0V, f = 1MHz
VDD = 150V, ID = 15A, VGS = 10V, RGEN = RGS = 50
IS = 15A, VGS = 0V Channel to case
MITSUBISHI Nch POWER MOSFET
FS30SM-6
HIGH-SPEED SWITCHING USE
Limits
Min. Typ. Max.
300 ±30
— —
2 — —
10.0 — — — — — — — — —
— — — —
3
0.13
1.95
15.0
2100
420
1.5 —
— —
±10
0.17
2.55 — — — — — — — —
2.0
0.50
V V
µA
mA
1
V
4
V
S pF pF pF
ns ns ns ns
V
°C/W
PERFORMANCE CURVES
POWER DISSIPATION DERATING CURVE
250
(W)
200
D
150
100
50
POWER DISSIPATION P
0
CASE TEMPERATURE T
OUTPUT CHARACTERISTICS
V
GS
50
40
(A)
D
30
= 20V
10V
7V
PD = 250W
(TYPICAL)
6V
C
(°C)
TC = 25°C Pulse Test
MAXIMUM SAFE OPERATING AREA
3 2
2
10
7
(A)
5
D
3 2
1
10
7 5
3 2
0
10
7 5
3
23 5710
TC = 25°C Single Pulse
1
23 5710223 5710
DRAIN CURRENT I
200150100500
DRAIN-SOURCE VOLTAGE V
tw=10µs
100µs
1ms
10ms
DC
DS
(V)
3
2
OUTPUT CHARACTERISTICS
10V
6V
(TYPICAL)
5.5V
PD = 250W
5V
(A)
D
VGS=20V
20
16
12
20
10
DRAIN CURRENT I
4V
0
0 1020304050
DRAIN-SOURCE VOLTAGE VDS (V)
5V
8
4
DRAIN CURRENT I
0
0 4 8 12 16 20
DRAIN-SOURCE VOLTAGE VDS (V)
4.5V
TC = 25°C Pulse Test
Feb.1999
MITSUBISHI Nch POWER MOSFET
FS30SM-6
HIGH-SPEED SWITCHING USE
ON-STATE VOLTAGE VS.
GATE-SOURCE VOLTAGE
(TYPICAL)
10
8
(V)
6
DS (ON)
4
VOLTAGE V
2
DRAIN-SOURCE ON-STATE
TC = 25°C Pulse Test
0
0 4 8 12 16 20
GATE-SOURCE VOLTAGE V
TRANSFER CHARACTERISTICS
(TYPICAL)
40
32
(A)
D
24
16
8
DRAIN CURRENT I
ID = 60A
45A
30A
15A
GS
(V)
TC = 25°C VDS = 50V Pulse Test
ON-STATE RESISTANCE VS.
DRAIN CURRENT
(TYPICAL)
0.20 TC = 25°C Pulse Test
0.16
()
0.12
DS (ON)
0.08
0.04
RESISTANCE r
DRAIN-SOURCE ON-STATE
0
–1
5710023 5710123 5710
2310
DRAIN CURRENT I
FORWARD TRANSFER ADMITTANCE
VS.DRAIN CURRENT
(TYPICAL)
2
10
V
DS
= 10V
7
Pulse Test
5
(S)
3
fs
2
1
10
7 5
3
ADMITTANCE y
FORWARD TRANSFER
2
V
125°C
GS
= 10V
D
(A)
TC = 25°C
75°C
20V
2
0
0 4 8 12 16 20
GATE-SOURCE VOLTAGE V
DRAIN-SOURCE VOLTAGE
5
3 2
3
10
7 5
3 2
2
10
CAPACITANCE
7 5
Ciss, Coss, Crss (pF)
3
Tch = 25°C
2
f = 1MHz
GS
= 0V
V
1
10
23 5710
DRAIN-SOURCE VOLTAGE V
CAPACITANCE VS.
(TYPICAL)
0
23 5710
1
23 5710
GS
Ciss
Coss
Crss
DS
(V)
2
(V)
23
0
10
10023 5710
DRAIN CURRENT I
SWITCHING CHARACTERISTICS
(TYPICAL)
3
10
7 5
t
3
d(off)
2
10
2
t
f
7 5
3
SWITCHING TIME (ns)
t
d(on)
t
r
2
1
10
0
23 5710
10
DRAIN CURRENT ID (A)
1
23 5710
D
Tch = 25°C VDD = 150V VGS = 10V
GEN
= R
R
1
23 5710
(A)
GS
= 50
2
2
Feb.1999
MITSUBISHI Nch POWER MOSFET
FS30SM-6
HIGH-SPEED SWITCHING USE
GATE-SOURCE VOLTAGE
VS.GATE CHARGE
(TYPICAL)
20
16
12
8
Tch = 25°C ID = 30A
VGS = 50V
100V
200V
(V)
GS
4
GATE-SOURCE VOLTAGE V
0
0 20406080100
GATE CHARGE Q
g
(nC)
ON-STATE RESISTANCE VS.
CHANNEL TEMPERATURE
(t°C)
(25°C)
DS (ON)
DS (ON)
10
1
7 5
VGS = 10V ID = 1/2I Pulse Test
(TYPICAL)
D
3 2
0
10
7 5
3 2
–1
10
–50
DRAIN-SOURCE ON-STATE RESISTANCE r
DRAIN-SOURCE ON-STATE RESISTANCE r
CHANNEL TEMPERATURE Tch (°C)
0 50 100 150
SOURCE-DRAIN DIODE
FORWARD CHARACTERISTICS
(TYPICAL)
50
TC=125°C
40
(A)
S
30
20
10
SOURCE CURRENT I
0
0 0.8 1.6 2.4 3.2 4.0
SOURCE-DRAIN VOLTAGE V
THRESHOLD VOLTAGE VS.
CHANNEL TEMPERATURE
(TYPICAL)
5.0 VDS = 10V
ID = 1mA
4.0
(V)
3.0
GS (th)
2.0
VOLTAGE V
1.0
GATE-SOURCE THRESHOLD
0
–50 0 50 100 150
CHANNEL TEMPERATURE Tch (°C)
25°C
75°C
VGS = 0V Pulse Test
SD
(V)
BREAKDOWN VOLTAGE VS.
(t°C)
(25°C)
CHANNEL TEMPERATURE
(TYPICAL)
1.4
(BR) DSS
(BR) DSS
VGS = 0V ID = 1mA
1.2
1.0
0.8
0.6
0.4 –50 0 50 100 150
DRAIN-SOURCE BREAKDOWN VOLTAGE V
CHANNEL TEMPERATURE Tch (°C)
DRAIN-SOURCE BREAKDOWN VOLTAGE V
TRANSIENT THERMAL IMPEDANCE
(°C/W)
1
10
7
(ch–c)
5
th
3 2
0
10
7
D=1
5
0.5
3 2
0.2
–1
10
0.1
7 5
3 2
–2
10
–4
23 57
10
10
TRANSIENT THERMAL IMPEDANCE Z
CHARACTERISTICS
0.05
0.02
0.01
Single Pulse
–3
–2
23 57 23 57 23 57
10
10
–1
PULSE WIDTH t
P
10023 57
w
(s)
DM
tw
D=
T
tw
T
10123 57
Feb.1999
10
2
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