Mitsubishi Electric Corporation Semiconductor Group FS2AS-14A Datasheet

MITSUBISHI Nch POWER MOSFET
FS2AS-14A
HIGH-SPEED SWITCHING USE
FS2AS-14A
¡VDSS ................................................................................700V
¡r
DS (ON) (MAX) ..............................................................9.75
¡I
D ............................................................................................2A
OUTLINE DRAWING Dimensions in mm
0.9MAX.
2.3
q
4
2.3
1
6.5
5.0 ± 0.2
1.0MAX.
2
wr
e
1.0
2.3
3
10MAX.
5.5 ± 0.2
2.3MIN. 1.5 ± 0.2
q GATE w DRAIN e SOURCE r DRAIN
0.5 ± 0.1
0.5 ± 0.2
0.8
MP-3
APPLICATION
SMPS, DC-DC Converter, battery charger, power supply of printer, copier, HDD, FDD, TV, VCR, per­sonal computer etc.
MAXIMUM RATINGS (Tc = 25°C)
Parameter ConditionsSymbol Ratings Unit VDSS VGSS ID IDM PD Tch Tstg
Drain-source voltage Gate-source voltage Drain current Drain current (Pulsed) Maximum power dissipation Channel temperature Storage temperature Weight
VGS = 0V VDS = 0V
Typical value
700 ±30
55 –55 ~ +150 –55 ~ +150
0.26
V V A A
W
°C °C
Feb.1999
ELECTRICAL CHARACTERISTICS (Tch = 25°C)
Symbol UnitParameter Test conditions
V
(BR) DSS
V
(BR) GSS
IGSS IDSS VGS (th) rDS (ON) VDS (ON) yfs Ciss Coss Crss td (on) tr td (off) tf VSD Rth (ch-c)
Drain-source breakdown voltage Gate-source breakdown voltage Gate-source leakage current Drain-source leakage current Gate-source threshold voltage Drain-source on-state resistance Drain-source on-state voltage Forward transfer admittance Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time Source-drain voltage Thermal resistance
ID = 1mA, VGS = 0V IGS = ±100µA, VDS = 0V VGS = ±25V , VDS = 0V VDS = 700V, VGS = 0V ID = 1mA, VDS = 10V ID = 1A, VGS = 10V ID = 1A, VGS = 10V ID = 1A, VDS = 10V
VDS = 25V, VGS = 0V, f = 1MHz
VDD = 200V, ID = 1A, VGS = 10V, RGEN = RGS = 50
IS = 1A, VGS = 0V Channel to case
MITSUBISHI Nch POWER MOSFET
FS2AS-14A
HIGH-SPEED SWITCHING USE
Limits
Min. Typ. Max.
700 ±30
— —
0.72 — — — — — — — — —
— — — —
7.47
7.47
1.2
270
30
1.0 —
— —
±10
9.75
9.75 — — — — — — — —
1.5
2.27
V V
µA
mA
V
V
S pF pF pF
ns ns ns ns
V
°C/W
PERFORMANCE CURVES
POWER DISSIPATION DERATING CURVE
100
(W)
80
D
60
40
20
POWER DISSIPATION P
0 20050 100 150
CASE TEMPERATURE T
OUTPUT CHARACTERISTICS
(A)
D
(TYPICAL)
C
(°C)
TC = 25°C Pulse Test
VGS = 20V
10V
MAXIMUM SAFE OPERATING AREA
1
10
(A)
D
0
10
–1
10
DRAIN CURRENT I
–2
10
10
TC = 25°C Single Pulse
0
210
1
357 2 10
357 2 10
DRAIN-SOURCE VOLTAGE V
OUTPUT CHARACTERISTICS
(TYPICAL)
2.0
(A)
D
1.6
TC = 25°C Pulse Test
VGS = 20V
1.2
2
DC
10V
tw = 10ms
357
DS
(V)
5V
100ms
1ms
10ms 100ms
3
DRAIN CURRENT I
0 1020304050
PD = 55W
DRAIN-SOURCE VOLTAGE VDS (V)
5V
4V
0.8
0.4
DRAIN CURRENT I
0 4 8 12 16 20
DRAIN-SOURCE VOLTAGE VDS (V)
4.5V
4V
Feb.1999
MITSUBISHI Nch POWER MOSFET
FS2AS-14A
HIGH-SPEED SWITCHING USE
ON-STATE VOLTAGE VS.
GATE-SOURCE VOLTAGE
(TYPICAL)
50
40
30
20
VOLTAGE VDS (ON) (V)
10
DRAIN-SOURCE ON-STATE
0 4 8 12 16 20
GATE-SOURCE VOLTAGE V
TRANSFER CHARACTERISTICS
(TYPICAL)
DRAIN CURRENT ID (A)
TC = 25°C Pulse Test
ID = 3A
2A
1A
GS (V)
TC = 25°C
DS = 50V
V Pulse Test
ON-STATE RESISTANCE VS.
DRAIN CURRENT
(TYPICAL)
20
16
VGS = 10V
12
DS (ON) ()
RESISTANCE r
DRAIN-SOURCE ON-STATE
–1
10
210
0
357 2 10
DRAIN CURRENT I
FORWARD TRANSFER ADMITTANCE
VS.DRAIN CURRENT
(TYPICAL)
1
10
fs (S)
0
10
125°C
ADMITTANCE y
FORWARD TRANSFER
TC = 25°C Pulse Test
20V
1
357 2 10
TC = 25°C
75°C
357
D (A)
VDS = 10V Pulse Test
2
0 4 8 12 16 20
GATE-SOURCE VOLTAGE V
DRAIN-SOURCE VOLTAGE
3
10
2
10
1
10
CAPACITANCE
Ciss, Coss, Crss (pF)
Tch = 25°C
f = 1MH
VGS = 0V
0
10
210
357 2 10
DRAIN-SOURCE VOLTAGE V
CAPACITANCE VS.
(TYPICAL)
Z
0
1
357 2 10
GS (V)
Ciss
Coss
Crss
2
357 2
DS (V)
–1
10
–1
10
23 57 10
DRAIN CURRENT I
SWITCHING CHARACTERISTICS
(TYPICAL)
3
10
2
10
1
10
SWITCHING TIME (ns)
0
10
–1
10
23457 10
DRAIN CURRENT ID (A)
0
10
23 57
Tch = 25°C
DD = 200V
V
GS = 10V
V
GEN = RGS = 50
R
td(off)
tr
td(on)
0
10
23457
1
D (A)
tf
1
Feb.1999
MITSUBISHI Nch POWER MOSFET
FS2AS-14A
HIGH-SPEED SWITCHING USE
GATE-SOURCE VOLTAGE
VS.GATE CHARGE
(TYPICAL)
20
Tch = 25°C
D
= 2A
I
(V)
GS
16
VDS = 250V
12
400V
600V
GATE-SOURCE VOLTAGE V
0 4 8 12 16 20
GATE CHARGE Q
g
(nC)
ON-STATE RESISTANCE VS.
CHANNEL TEMPERATURE
(t°C)
(25°C)
DS (ON)
DS (ON)
10
1
(TYPICAL)
VGS = 10V
D
= 1/2I
I Pulse Test
0
10
–1
10
–50 0 50 100 150
DRAIN-SOURCE ON-STATE RESISTANCE r
DRAIN-SOURCE ON-STATE RESISTANCE r
CHANNEL TEMPERATURE Tch (°C)
SOURCE-DRAIN DIODE
FORWARD CHARACTERISTICS
(TYPICAL)
(A)
S
10
VGS = 0V Pulse Test
SOURCE CURRENT I
0 0.8 1.6 2.4 3.2 4.0
SOURCE-DRAIN VOLTAGE V
TC = 125°C 75°C 25°C
SD
(V)
THRESHOLD VOLTAGE VS.
CHANNEL TEMPERATURE
(TYPICAL)
5.0
D
VDS = 10V
D
= 1mA
I
4.0
(V)
3.0
GS (th)
2.0
VOLTAGE V
1.0
GATE-SOURCE THRESHOLD
–50 0 50 100 150
CHANNEL TEMPERATURE Tch (°C)
BREAKDOWN VOLTAGE VS.
(t°C)
(25°C)
(BR) DSS
(BR) DSS
1.4
CHANNEL TEMPERATURE
(TYPICAL)
VGS = 0V
D
= 1mA
I
1.2
1.0
0.8
0.6
0.4 –50 0 50 100 150
DRAIN-SOURCE BREAKDOWN VOLTAGE V
CHANNEL TEMPERATURE Tch (°C)
DRAIN-SOURCE BREAKDOWN VOLTAGE V
TRANSIENT THERMAL IMPEDANCE
(°C/W)
1
10
(ch–c)
th
D = 1.0
0.5
0
10
0.2
0.1
10
10
–1
–2
10
–4
23 57
0.05
0.02
0.01 Single Pulse
10
TRANSIENT THERMAL IMPEDANCE Z
CHARACTERISTICS
–3
–2
23 57 23 57 23 57
10
10
–1
PULSE WIDTH t
10023 57
w
(s)
10123 57
2
10
Feb.1999
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