MITSUBISHI CM1200HG-66H User Guide

MITSUBISHI HVIGBT MODULES
CM1200HG-66H
3rd-Version HVIGBT (High Voltage Insulated Gate Bipolar Transistor) Modules
HIGH POWER SWITCHING USE
CM1200HG-66H
IC ................................................................ 1200A
V
CES ....................................................... 3300V
1-element in a Pack
AISiC Baseplate
APPLICATION
Traction drives, High Reliability Converters / Inverters, DC choppers
INSULA TED TYPE
OUTLINE DRAWING & CIRCUIT DIAGRAM Dimensions in mm
190
3 - M4 NUTS
screwing depth min. 7.7
±0.5
57
57
±0.25
6
5
14
±0.25
E
GC
±0.3
±0.5
61.2
59.2
12
4
3
±0.3
±0.5
61.2
±0.5
57
±0.25
5 - M8 NUTS
±0.1
17
2
±0.25
±0.3
44
124
1
±0.1
9
8 - φ 7 MOUNTING HOLES
screwing depth min. 16.5
+1.0
0
±0.15
48
5
±0.5
140
+1.0
(6)
C
C
G E
E
(5)
CIRCUIT DIAGRAM
18
±0.3
41
±0.5
(4)
C
E
(3)
22
±0.3
(2)
C
E
(1)
LABEL
0
38
±0.3
40.4
HVIGBT (High Voltage Insulated Gate Bipolar Transistor) Modules
Jul. 2005
MITSUBISHI HVIGBT MODULES
CM1200HG-66H
HIGH POWER SWITCHING USE
3rd-Version HVIGBT (High Voltage Insulated Gate Bipolar Transistor) Modules
MAXIMUM RATINGS
Symbol Item Conditions UnitRatings
V
CES
VGES IC ICM IE IEM PC Tj Top Tstg Viso
Qpd
tpsc
Collector-emitter voltage Gate-emitter voltage
Collector current
(Note 2)
Emitter current
(Note 2)
Maximum power dissipation
(Note 3)
Junction temperature Operating temperature Storage temperature Isolation voltage
Partial discharge
Maximum short circuit pulse width
VGE = 0V, Tj = 25°C V
CE = 0V, Tj = 25°C
T
C = 90°C
Pulse (Note 1)
Pulse (Note 1) T
C = 25°C, IGBT part
RMS, sinusoidal, f = 60Hz, t = 1min. V1 = 6900V
rms, V2 = 5100Vrms
f = 60Hz (acc. to IEC 1287) V
CC = 2200V, VCES 3300V, VGE = 15V
T
j = 125°C
12500 –40 ~ +150 –40 ~ +125 –40 ~ +125
10200
INSULATED TYPE
3300
±20
1200 2400 1200 2400
10
10
V V A A A A
W
°C °C °C
V
pC
µs
ELECTRICAL CHARACTERISTICS
Symbol
I
CES
V
GE(th)
IGES
VCE(sat)
Cies Coes Cres Qg
VEC
td(on) tr Eon td(off) tf Eoff trr Qrr Erec
Note 1. Pulse width and repetition rate should be such that junction temperature (Tj) does not exceed Topmax rating (125°C).
Collector cut-off current Gate-emitter threshold voltage Gate leakage current Collector-emitter saturation voltage Input capacitance Output capacitance Reverse transfer capacitance Total gate charge
(Note 2)
Emitter-collector voltage
Turn-on delay time Turn-on rise time Turn-on switching energy Turn-off delay time Turn-off fall time Turn-off switching energy
(Note 2)
Reverse recovery time
(Note 2)
Reverse recovery charge
(Note 2)
Reverse recovery energy
2. The symbols represent characteristics of the anti-parallel, emitter to collector free-wheel diode (FWDi).
3. Junction temperature (T
4. Pulse width and repetition rate should be such as to cause negligible temperature rise.
Item Conditions
V
CE = VCES, VGE = 0V, Tj = 25°C
I
C = 120mA, VCE = 10V, Tj = 25°C
GE = VGES, VCE = 0V, Tj = 25°C
V I
C = 1200A, VGE = 15V, Tj = 25°C (Note 4)
I
C = 1200A, VGE = 15V, Tj = 125°C (Note 4)
V
CE = 10V, f = 100kHz
V
GE = 0V, Tj = 25°C CC = 1650V, IC = 1200A, VGE = 15V, Tj = 25°C
V I
E = 1200A, VGE = 0V, Tj = 25°C (Note 4)
I
E = 1200A, VGE = 0V, Tj = 125°C (Note 4)
V
CC = 1650V, IC = 1200A, VGE = ±15V
R
G(on) = 1.6Ω, Tj = 125°C, Ls = 100nH
Inductive load V
CC = 1650V, IC = 1200A, VGE = ±15V
R
G(off) = 1.6Ω, Tj = 125°C, Ls = 100nH
Inductive load V
CC = 1650V, IC = 1200A, VGE = ±15V
R
G(on) = 1.6Ω, Tj = 125°C, Ls = 100nH
Inductive load
j) should not exceed Tjmax rating (150°C).
Min Typ Max
5.0
— — — — — — — — — — — — — — — — — —
Limits
6.0
3.30
3.60 180
18.0
5.4
8.6
2.80
2.70
— —
1.60
— —
1.55
800
0.90
15
7.0
0.5
4.20 — — — — —
3.60 —
1.60
1.00 —
2.50
1.00 —
1.40 — —
Unit
mA
V
µA
V
nF nF nF µC
V
µs µs
J/pulse
µs µs
J/pulse
µs µC
J/pulse
HVIGBT (High Voltage Insulated Gate Bipolar Transistor) Modules
Jul. 2005
3rd-Version HVIGBT (High Voltage Insulated Gate Bipolar Transistor) Modules
THERMAL CHARACTERISTICS
Symbol
Rth(j-c)Q Rth(j-c)R Rth(c-f)
Thermal resistance
Contact thermal resistance
MECHANICAL CHARACTERISTICS
Symbol
M
CTI d
a
ds LC-E(int) RC-E(int)
Mounting torque
Mass
Comparative tracking index Clearance distance in air Creepage distance along surface Internal inductance Internal lead resistance
Item Conditions
Junction to Case, IGBT part Junction to Case, FWDi part Case to Fin, λ
Item Conditions
M8 : Main terminals screw M6 : Mounting screw M4 : Auxiliary terminals screw
IGBT part T
C = 25°C
grease = 1W/m·K
MITSUBISHI HVIGBT MODULES
CM1200HG-66H
HIGH POWER SWITCHING USE
INSULATED TYPE
Limits
Min Typ Max
— — —
Min Typ Max
7.0
3.0
1.0
600
26.0
56.0
— —
— —
6.0
Limits
— — —
1.35
— — —
18
0.18
10.0
20.0
15.0
6.0
3.0
— — — — — —
Unit
K/kW K/kW K/kW
Unit
N·m
kg
mm mm
nH
m
HVIGBT (High Voltage Insulated Gate Bipolar Transistor) Modules
Jul. 2005
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