MITEL SP5611 Datasheet

SP5611
1·3GHz Bidirectional I2C Bus Controlled Synthesiser
Advance Information
Supersedes February 1997 version, DS3758-4.1 DS3758 - 5.0 June 1998
The SP5611 is a single chip frequency synthesiser de­signed for TV tuning systems. Control data is entered in the standard I2C BUS format. The device contains 4 addressable bidirectional open collector ports, one of which is a 3-bit ADC. The information on these ports can be read via the I
2
C BUS. the device has 4 programmable addresses, programmed by applying a specific input voltage to the P3 address select input. This enables two or more synthesisers to be used in a system.
FEATURES
Complete 1·3GHz Single Chip System
High Sensitivity RF Inputs
Programmable via I
2
C BUS
Low Power Consumption (5V, 20mA)
Low Radiation
Phase Lock Detector
Varactor Drive Amp Disable
4 Bi-directional Controllable Outputs
5-Level ADC
Variable I
ESD Protection: 4kV, Mil-Std-883C, Method 3015
2
C BUS Address for Multi-tuner Applications
(1)
Switchable 4512/1024 Reference Divider
Pin and Function Compatible with SP5511S
(1) Normal ESD handling precautions should be observed.
(2) The SP5511S does not have a switchable reference
division ratio.
(2)
CHARGE PUMP
CRYSTAL Q1 CRYSTAL Q2
SDA
SCL
I/O PORT P7
*
I/O PORT P6
I/O PORT P5
† = Logic level I/O port
*
= 3-bit ADC input
Fig. 1 Pin connections – top view
APPLICATIONS
Satellite TV
Cable Tuning Systems
VCRs
THERMAL DATA
u
= 41°C/W
JC
u
= 111°C/W
JA
ORDERING INFORMATION
SP5611 KG/MPAS (Tubes) SP5611S KG/MPAD (Tape and reel)
1 2 3 4
SP5611
5 6 7 8
16
DRIVE OUTPUT
15
V
EE
14
RF INPUT
13
RF INPUT
12
V
CC
11
NC
10
P3 ADD SELECT PORT
9
I/O PORT P4
MP16
SP5611
ELECTRICAL CHARACTERISTICS
T
= 240°C to 185°C, V
AMB
These Characteristics are guaranteed by either production test or design. They apply within the specified ambient temperature and supply voltage ranges unless otherwise stated.
= 14·5V to 15·5V, reference frequency = 4MHz.
CC
Characteristic Pin
Supply current Prescaler input voltage
Prescaler input impedance Prescaler input capacitance
SDA, SCL
Input high voltage Input low voltage Input high current Input low current Leakage current
SDA
Output voltage
Charge pump current low Charge pump current high Charge pump output leakage current Charge pump drive output current Charge pump amplifier gain Recommended crystal series resistance Crystal oscillator drive level Crystal oscillator negative resistance External reference input frequency External reference input amplitude
Output Ports
P4-P7 sink current P4-P7 leakage current
Input Ports
P3 input current high P3 input current low P4, P5, P7 input voltage low P4, P5, P7 input voltage high P6 input current high P6 input current low
12
13,14
13,14
13, 14
4,5 4,5 4,5 4,5 4,5
4
1 1 1
16
2 2 2 2
9-6 9-6
10
10 9,8,6 9,8,6
7 7
Value
Min. Max.
12·5
Typ.
20
27
300
50
2
3 0
5·5 1·5
10
210
10
0·4
650
6170
65
500
6400
10
200
80
70
1000
2
8
200
750
10
10
1
20·5
0·8
2·7
110 210
Units
mA
mVrms
pF
V V
µA µA µA
V
µA µA
nA
µA
mV p-p
MHz
mVrms
mA
µA
mA mA
V V
µA µA
Conditions
V
= 4·5V to 5·5V (note 1)
CC
50MHz to 1·3GHz sinewave, see Fig. 5
Input voltage = V
CC
Input voltage = 0V When V
CC
= 0V
Sink current = 3mA
Byte 4, bit 2 = 0, pin 1 = 2V Byte 4, bit 2 = 1, pin 1 = 2V Byte 4, bit 4 = 1, pin 1 = 2V V pin 16 = 0·7V
Parallel resonant crystal (note 2)
AC coupled sinewave AC coupled sinewave
V
= 0·7V
OUT
V
= 13·2V
OUT
V pin 10 = V
CC
V pin 10 = 0V
See Table 3 for ADC levels
NOTES
1. Maximum power consumption is 150mW with V
2. Resistance specified is maximum under all conditions.
= 5·5V and all ports off.
CC
2
ABSOLUTE MAXIMUM RATINGS
All voltages are referred to VEE and pin 3 at 0V
Parameter
Pin
Value
SP5611
Units
Max.Min.
Conditions
Supply voltage
RF input voltage
Port voltage
Total port output current
Address select voltage
RF input DC offset
Charge pump DC offset
Drive output DC offset
Crystal oscillator DC offset
SDA, SCL input voltage
Storage temperature
Junction temperature
12
13,14
6-9
6-9
6-9
10
13-14
1
16
2
4,5
20·3
20·3
20·3
20·3
20·3
20·3
20·3
20·3
20·3
20·3
255
7
2·5
14
6
50
10·3
V
CC
10·3
V
CC
VCC10·3
10·3
V
CC
10·3
V
CC
VCC10·3
6
1150
1150
V
V p-p
V
V
mA
V
V
V
V
V
V
V
°C °C
Port in off state
Port in on state
RF IN
SCL
SDA
13
14
5
4
P3 ADD SELECT
PREAMP
TRANSCEIVER
ADDRESS
SELECT
10
PRESCALER
POWER ON DET
POR
I2C BUS
3-BIT
ADC
4
8
LEVEL
3 TTL
COMP
15-BIT
PROGRAMMABLE
DIVIDER
15-BIT LATCH DIVIDE RATIO
F
4-BIT LATCH
PORT INFO
F
PD
L
4
F
PHASE
COMP
COMP
F
LOCK
DET
CONTROL DATA
LATCHES
AND
CONTROL LOGIC
4
PORT OUTPUT
DRIVERS
9876
P4 P5 P6 P7
DIVIDER
4
512/1024
DN
CHARGE
PUMP
UP
CP TO OS
OSC
2
Q1
CRYSTAL
3
Q2
1
CHARGE PUMP
16
DRIVE/ VARICAP OUT
V
CC
15
V
EE
Fig. 2 Block diagram
3
SP5611
FUNCTIONAL DESCRIPTION
The SP5611 is programmed from an I2C Bus. Data and Clock are fed in on the SDA and SCL lines respectively, as defined by the I2C Bus format. The synthesiser can either accept new data (write mode) or send data (read mode). The LSB of the address byte (R/W) sets the device into write mode if it is low and read mode if it is high. The Tables in Fig. 3 illustrate the format of the data. The device can be pro­grammed to respond to several addresses, which enables the use of more than one synthesiser in an I Table 4 shows how the address is selected by applying a voltage to P3.
When the device receives a correct address byte, it pulls the SDA line low during the acknowledge period, and during following acknowledge periods after further data bytes are programmed. When the device is programmed into the read mode, the controller accepting the data must pull the SDA line low during all status byte acknowledge periods to read an­other status byte. If the controller fails to pull the SDA line low during this period, the device generates an internal STOP condition, which inhibits further reading.
WRITE Mode (Frequency Synthesis)
When the device is in write mode bytes 2 and 3 select the synthesised frequency, while bytes 4 and 5 control the output port states, charge pump, reference divider ratio and various test modes.
Once the correct address is received and acknowledged, the first bit of the next byte determines whether that byte is interpreted as byte 2 or 4; a logic 0 for frequency information and a logic 1 for control and output port information. When byte 2 is received the device always expects byte 3 next. Similarly, when byte 4 is received the device expects byte 5 next. Additional data bytes can be entered without the need to re-address the device until an I recognised. This allows a smooth frequency sweep for fine tuning or AFC purposes.
If the transmission of data is stopped mid-byte (for exam­ple, by another device on the bus) then the previously pro­grammed byte is maintained.
Frequency data from bytes 2 and 3 are stored in a 15-bit register and used to control the division ratio of the 15-bit programmable divider. This is preceded by a divide-by-8 prescaler and amplifier to give excellent sensitivity at the local oscillator input, see Fig. 5. The input impedance is shown in Fig. 7.
The programmed frequency can be calculated by multiply­ing the programmed division ratio by 8 times the comparison frequency F comparator, via a charge pump and varicap drive amplifier, adjusts the local oscillator control voltage until the output of the programmable divider is frequency and phased locked to the comparison frequency.
The reference frequency may be generated by an external source capacitively coupled into pin 2, or provided by an on­chip crystal controlled oscillator. The comparison frequency F
is derived from the reference frequency via the refer-
COMP
. When frequency data is entered, the phase
COMP
2
C Bus system.
2
C stop condition is
ence divider. The reference divider division ratio is switchable from 512 to 1024, and is controlled by bit 7 of byte 4 (TS0); a logic 1 to 512, a logic 0 for 1024. The SP5611 differs from the SP5511 in this respect, only 512 being available on the SP5511. Note that the comparison frequency is 7·8125kHz when a 4MHz reference is used, and divide by 512 is selected.
Bit 2 of byte 4 of the programming data (CP) controls the
current in the charge pump circuit, a logic 1 for ±170µA and a logic 0 for ±50µA, allowing compensation for the variable
tuning slope of the tuner and also to enable fast channel changes over the full band. When the device is frequency
locked, the charge pump current is internally set to ±50µA
regardless of CP.
Bit 4 of byte 4 (T0) disables the charge pump when it is set
to a logic 1.
Bit 8 of byte 4 (OS) switches the charge pump drive
amplifier’s output off when it is set to a logic 1.
Bit 3 of byte 4 (T1) enables various test modes when set high. These modes are selected by bits 5, 6 and 7 of byte 4 (TS2, and TS1, TS0) as detailed in Table 5. When T1 is set low, TS2 and TS1 are assigned a ‘don’t care’ condition, and TS0 selects the reference divider ratio as previously de­scribed.
Byte 5 programs the output ports P4 to P7; a logic 0 for a high impedance output and a logic 1 for low impedance (on).
READ Mode
When the device is in read mode the status byte read from the device on the SDA line takes the form shown in Table 2.
Bit 1 (POR) is the power-on reset indicator and is set to a logic 1 if the V
supply to the device has dropped below 3V
CC
(at 25˚C), for example, when the device is initially turned on. The POR is reset to 0 when the read sequence is terminated by a stop command. When POR is set high (at low V
CC
), the programmed information is lost and the output ports are all set to high impedance.
Bit 2 (FL) indicates whether the device is phase locked, a logic 1 is present if the device is locked, and a logic 0 if the device is unlocked.
Bits 3, 4 and 5 (I2, I1, I0) show the status of the I/O Ports P7, P5 and P4 respectively. A logic 0 indicates a low level and a logic 1 a high level. If the ports are to be used as inputs they should be programmed to a high impedance state (logic 1). These inputs will then respond to data complying with TTL type voltage levels.
Bits 6, 7 and 8 (A2, A1, A0) combine to give the output of the 5-level ADC. The ADC can be used to feed AFC informa­tion to the microprocessor from the IF section of the receiver, as illustrated in the typical application circuit.
APPLICATION
A typical application is shown in Fig. 4. All input/output interface circuits are shown in Fig. 6. The SP5611 is function and pin equivalent to the SP5511 device apart from the switchable reference divider, and has much lower power dissipation, im­proved RF sensitivity and better ESD performance.
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