Datasheet PDSP16330, PDSP16330A, PDSP16330AAOAC, PDSP16330AC, PDSP16330ACOAC Datasheet (MITEL)

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PDSP16330/A/B
Pythagoras Processor
Supersedes version September 1996, DS3884 - 1.3 DS3884 - 2.1 November 1998
The PDSP16330 is a high speed digital CMOS IC that converts Cartesian data (Real and Imaginary) into Polar form (Magnitude and Phase), at rates up to 20MHz. Cartesian 16+16 bit 2's complement or Sign-Magnitude data is converted into 16 bit Phase format. The Magnitude output may be scaled in amplitude by powers of 2. The Phase output represents a full 2 x π field to eliminate phase ambiguities.
Polyimide is used as an inter-layer dielectric and as glassivation.
The PDSP16330 is offered in three speed grades: a basic 10MHz part (PDSP16330), a 20MHz version (PDSP16330A) and a 25MHz version (PDSP16330). A MIL­STD-883 version is also detailed in a separate datasheet.
Fig.1 Pin connections - bottom view (PGA)
AC84
1234567891011
L
K
J
H
G
F
E
D
C
B
A
PIN 1A INDEX MARK ON TOP SURFACE
FEATURES
25MHz Cartesian to Polar Conversion
16-Bit Cartesian Inputs
16-Bit Magnitude Output
12-Bit Phase Output
2’s Complement or Sign-Magnitude Input Formats
Three-state Outputs and Independent
Data Enables Simplify System Interfacing
Magnitude Scaling Facility with Overflow Flag
Less than 400 mW Power Dissipation at 10MHz
84-pin PGA or 100 pin QFP Package or 84 LCC
APPLICATIONS
Digital Signal Processing
Digital Radio
Radar Processing
Sonar Processing
Robotics
ORDERING INFORMATION Commercial (0°C to +70°C)
PDSP16330A CO AC (20MHZ - PGA Package) PDSP16330B CO AC (25MHZ - PGA Package)
Industrial (-40°C to +85°C)
PDSP16330A BO AC 20MHZ - PGA Package PDSP16330A/IG/GC1R 20MHZ - GC Package PDSP16330B BO AC 25MHZ - PGA Package
Military (-55°C to +125°C)
PDSP16330A AO AC 20MHZ - PGA Package PDSP16330/MC/GC1R 10MHz - GC Package
Mil 883C Screened
Fig.2 Pin connections - QFP Package
GC100
ASSOCIATED PPODUCTS
PDSP16112 16 X 12 Complex Multiplier PDSP16116 16 X 16 Complex Multiplier PDSP16318 Complex Accumulator PDSP16350 I/Q Splitter and NCO PDSP16510A Stand Alone FFT Processor
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PDSP16330/A/B
2
FUNCTIONAL DESCRIPTION
The PDSP16330 converts incoming Cartesian Data into the equivalent Polar Values. The device accepts new 16 + 16 bit complex data every cycle, and delivers a 16 bit + 12 bit Polar equivalent after 24 clock cycles.The input data can be in 2s’ Complement or Sign Magnitude format selected via the FORM input. The output is in a magnitude format for both the Magnitude output and the Phase. Phase data is zero for data with a zero Y input and positive X, and is 400 hex for zero X data and positive Y, is 800 hex for zero Y data and negative X, and is C00 hex for zero X and negative Y. The LSB weighting (bit 0) is 2 x π/4096 radians. The 16 bit Magnitude result may be scaled by shifting one, two, or three places in the more significant direction, effectively multiplying the Magnitude result by 2,4 or 8 respectively. Any of these shifts can under certain conditions cause an invalid result to be output from the device. Under these circumstances the OVR output will become active. The PDSP16330 has independent clock enables and three state output controls for all ports.
FORM
This input selects the format of the X and Y input data. A low level on FORM indlcates that the Input data is twos’ complement format (Note: input data 8000 hex is not valid in 2s’ complement mode). This input refers to the format of the current Input data and may be changed on a per cycle basis if desired. The level of FORM is latched at the same time as the data to which it refers.
S1-0
These inputs select the scaling factor to be applied to the Magnitude output. They are latched by the rising edge of CLK and determine the scaling of the output in the cycle after they are loaded into the device. The scale factor applied is determined by the table. Should the scaling factor applied cause an invalid Magnitude result to be output on the M Port, then the OVR Flag will become active for the period that the M Port output is invalid.
The output number range is from 0 to 2 when the scaling factor is set at x1.
S0
0 1 0 1
Scaling Factor
x1 x2 x4 x8
S1
0 0 1 1
Fig.2 Block diagram
+
SHIFT
16
32
30
15
16
16 16
9
9
12
2
OEM
S0
S1
FORM
CEX
SIGN
15
30
SIGN X SIGN Y
X > Y
OEP
P11:0OVRM15:0
X
2
MAGNITUDE MAGNITUDE
Y
2
X2 + Y
2
ROTATE
SIGN
Y/X
CEY
/4
ARCTAN
ROM
Y15:0X15:0
π
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PDSP16330/A/B
3
PIN DESCRIPTIONS
Symbol Pin Name and Description
CLK Clock: Common Clock to device Registers. Register contents change on the rising edge of clock.
Both pins must be connected. CEX Clock Enable: Clock Enable for X Port. The clock to the X port is enabled by a low level. CEY Clock Enable: Clock Enable for Y Port The clock to the Y port is enabled by a low level. X15-X0 X Data Input Data presented to this input is loaded into the device by the rising edge of CLK.
X15 is the MSB Y15-Y0 Y Data Input Data presented to this input is loaded into the device by the rising edge of CLK.
Y15 is the MSB M15-M0 M Data Output: Magnitude data generated by the device is output on this port. Data changes on
the rising edge of CLK, M15 is the MSB. The weighting of M15 is determined by the Scale factor
selected . P11-P0 P Data Output: Phase data generated by the device is output on this port. Data changes on the
rising edge of CLK, P11 is the MSB. The weighting of P11 is π radians. OEM Output Enable: Output Enable for M Port. The M Port is in a high impedance state when this input
is high. OEP Output Enable: Output Enable for P Port. The P Port is in a high impedance state when this input
is high. FORM Format Select This input selects the format of the Cartesian Data input on the X and Y ports.
This input is latched by the rising edge of CLK, and is applied at the same time as the data to
which it refers. A low !evel indicates that two’s complement data is applied, a high indicates
Sign-Magnitude S1-S0 Scaling Control: Control input for scaling of Magnitude Data. This input is latched by the rising
edge of CLK, and determines the scaling to be applied to the Magnitude result. The Scaling is
applied to the output data in the cycle following the cycle in which the control was latched. OVR Overflow: Overflow flag. This signal becomes active if the scaling currently selected causes an
invalid value to be presented to the Magnitude output. Vcc +5V supply. All Vcc pins must be connected.
GND 0V supply. All GND pins must be connected.
2's Complement
7FFF
. .
. 0001 0000
FFFF
.
.
. 8001
Sign Magnitude
7FFF
. . .
0001
. . .
FFF
0000 8000
INPUT DATA RANGE
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PDSP16330/A/B
4
* * * * * * * † * †
Sub-
group
1,2,3 1,2,3 1,2,3 1,2,3 1,2,3 1,2,3 1,2,3
1,2,3
ELECTRICAL CHARACTERISTICS
Test conditions (unless otherwise stated): T
amb
(Commercial) = 0°C to + 70°C, T
amb
(Industrial) = -40°C to + 85°C
V
cc
(Commercial) = 5.0V + 5%, Vcc (Industrial and Military) = 5.0V + 1%, GND = 0V
STATIC CHARACTERISTICS
Value
Characteristic Symbol Units Conditions
Min. Typ. Max.
Output high voltage V
OH
2.4 V IOH = 3.2mA
Output low voltage V
OL
0.6 V lOL=-3.2mA
Input high voltage (CMOS) V
IH
3.0 V Inputs CEX, CEY and CLK only
Input low voltage (CMOS) V
IL
1.0 V Inputs CEX, CEY and CLK only
Input high voltage (TTL) V
IH
2.2 V All other inputs
Input low voltage (TTL) V
IL
0.8 V All other inputs
Input leakage current (Note 1 ) I
IL
-10 + 120 µA GND < VIN<V
CC
Input capacitance C
IN
10 pF
Output leakage current l
oz
-50 + 50 µA GND <VIN < V
CC
Output SC current I
OS
-50 230 mA Vcc = Max
NOTES
1. All inputs except clock inputs have high value pull-down resistors
2. All parameters marked * are tested during production. Parameters marked † are guaranteed by design and characterisa­tion.
Pin No. AC
F3 G3 G1 G2 F1 H1 H2 J1 K1 J2 L1 K2 K3 L2 L3 K4 L4 J5 K5 L5 K6 J6 J7 L7 K7 L6 L8 K8
Function
M7 M6 M5 M4 M3 M2 M1 M0 S0 S1 GND Vcc FORM Y15 Y14 Y13 Y12 Y11 Y10 Y9 Y8 Y7 Y6 Y5 Y4 Y3 Y2 Y1
Pin No. AC
L9 L10 K9 L11 K10 J10 K11 J11 H10 H11 F10 G10 G11 G9 F9 F11 E11 E10 E9 D11 D10 C11 B11 C10 A11 B10 B9 A10
Function
YO
CEY
CLK Vcc GND GND GND GND GND GND GND
OEP
P0 P1 P2 P3 P4 P5 P6 P7 P8 P9 P10 P11 GND Vcc
CEX
X0
Pin No. AC
A9 B8 A8 B6 B7 A7 C7 C6 A6 A5 B5 C5 A4 B4 A3 A2 B3 A1 B2 C2 B1 C1 D2 D1 E3 E2 E1 F2
Function
X1 X2 X3 X4 X5 X6 X7 X8 X9 X10 X11 X12 X13 X14 X15 CLK OVR Vcc GND
OEM
M15 M14 M13 M12 M11 M10 M9 M8
PIN FUNCTION
GC
91 92 93 94 95 96 97 98 99 100 1 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22
GC
23 24 25 26 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 57 58
GC
59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 81 82 83 84 85 86 87 88 89 90
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PDSP16330/A/B
5
Max.
25
24
PDSP16330A
Min.
12
2
12
0
12
2
5 50 15 15 24
Max.
25
24 25 25 25 25
180
120
Characteristic
† Input data setup to clock rising edge † Input data Hold after clock rising edge † CEX, CEY Setup to clock rising edge † CEX, CEY Hold aher clock rising edge † FORM, S1:0 Setup to clock rising edge † FORM, S1:0 Hold after clock rising edge † Clock rising edge to valid data * Clock period † Clock high time † Clock low time † Latency † OEM, OEP low to data high data valid † OEM, OEP low to data low data valid † OEM, OEP high to data high impedance † OEM, OEP low to data high impedance † Vcc current (TTL input levels)
† Vcc current (CMOS input levels)
SWITCHING CHARACTERISTICS
NOTES
1. LSTTL is equivalent to IOH = 20µA, IOL = -0.4mA
2. Current is defined as negative into the device
3. CMOS input levels are defined as: VIH = VDD - 0.5V, VIL = +0.5V
4. All parameters marked * are tested during production. Parameters marked † are guaranteed by design and characterisation.
5. All timings are dependent on silicon speed. This speed is tested by measuring clock period. This guarantees all other timings by characterisation and design.
Value
PDSP16330
Min.
15
2
30
0
15
7 5
100
25 25 24
Max.
40
24 30 30 30 30
110
70
PDSP16330B
Min.
12
2
12
0
12
2
5 40 15 15 24 25 25 25 25
225
150
Units
ns ns ns ns ns ns ns ns ns ns
cycles
ns ns ns ns
mA
mA
Conditions
2 x LSTTL + 20pF
2 x LSTTL + 20pF 2 x LSTTL + 20pF 2 x LSTTL + 20pF
2 x LSTTL + 20pF VCC = Max Outputs unloaded Clock freq. = Max
VCC = Max Outputs unloaded Clock freq. = Max
ABSOLUTE MAXIMUM RATINGS
Supply voltage, V
cc
-0.5V to + 7.0V
Input voltage, V
IN
-0.5V to VCC + 0.5V
Output voltage, V
our
-0.5V to VCC + 0.5V Clamp diode current per pin, IK (see Note 2) ±18mA Static discharge voltage (HMB), V
STAT
500V
Storage temperature. T
stg
-65°C to + 150°C Ambient temperature with power applied T
amb
: Commercial 0°C to + 70°C Industrial -40°C to + 85°C Military -55 °C to + 125°C
Package power dissipation P
TOT
1200mW
Junction temperature 150°C
THERMAL CHARACTERISTICS
Package Type
θ
JC°C/W
θ
JA°C/W
AC 12 36 GC 12 35
NOTES
1. Exceeding these ratings may cause permanent damage. Functional operatlon under these conditions is not implied.
2. Maximum dissipation or 1 second should not be exceeded; only one output to be tested at any one time.
3. Exposure to Absoulte Maximum Ratings for extended periods may affect device reliability.
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PDSP16330/A/B
6
0.5V
0.5V
0.5V
0.5V
V
H
V
L
1.5V
1.5V
Delay from ouput low to output high impedance
Delay from ouput high impedance to Output low
Delay from ouput high to output high impedance
Delay from ouput high impedance to Output high
NOTES
1. V
H
- Voltage reached when output driven high
2. V
L
- Voltage reached when output driven low
Test Waveform - measurement level
DUT
100p
I
OH
1.5V
I
OL
Fig.3 Three state delay measurement load
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