MicroSys miriac SBC-S32V234 User Manual

Creating Embedded Systems

miriac SBC-S32V234

User Manual
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© MicroSys Electronics GmbH 2018

1 General Notes

Copyright MicroSys Electronics GmbH, December 2018

All rights reserved. All rights in any information which appears in this document
belong to MicroSys Electronics GmbH or our licensors. You may copy the
information in this manual for your personal, non-commercial use.

Copyrighted products are not explicitly indicated in this manual. The absence of the
copyright (©) and trademark (TM or ®) symbols does not imply that a product is not
protected. Additionally, registered patents and trademarks are similarly not
expressly indicated in this manual.

1.1 Warranty

To the extent permissible by applicable law all information in this document is
provided without warranty of any kind, whether expressed or implied, including but
not limited to any implied warranty of satisfactory quality or fitness for a particular
purpose, or of non-infringement of any third party’s rights. We try to keep this
document accurate and up-to-date but we do not make any warranty or
representation about such matters. In particular we assume no liability or
responsibility for any errors or omissions in this document.

MicroSys Electronics GmbH neither gives any guarantee nor accepts any liability
whatsoever for consequential damages resulting from the use of this manual or its
associated product.

MicroSys Electronics GmbH further reserves the right to alter the layout and/or
design of the hardware without prior notification and accepts no liability for doing
so.

1.2 Links

We make no warranty about any other sites that are linked to or from this
document, whether we authorize such links or not.

1.3 Liability

To the extent permissible by applicable law, in no circumstance, including (but not
limited to) negligence, shall we be liable for your reliance on any information in this
document, nor shall we be liable for any direct, incidental, special, consequential,
indirect or punitive damages nor any loss of profit that result from the use of, or the
inability to use, this document or any material on any site linked to this document
even if we have been advised of the possibility of such damage. In no event shall
our liability to you for all damages, losses and causes of action whatsoever,
whether in contract, tort (including but not limited to negligence) or otherwise
exceed the amount, if any, paid by you to us for gaining access to this document.

MicroSys Electronics GmbH
Muehlweg 1
82054 Sauerlach
Germany

Phone: [phone]
Fax: [phone]

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1.4 Offer to Provide Source Code of Certain
Software

This product contains copyrighted software that is licensed under the General

Public License (“GPL”) and under the Lesser General Public License Version
(“LGPL”). The GPL and LGPL licensed code in this product is distributed without

any warranty. Copies of these licenses are included in this product.
You may obtain the complete corresponding source code (as defined in the GPL)

for the GPL Software, and/or the complete corresponding source code of the LGPL
Software (with the complete machine-readable “work that uses the Library”) for a
period of three years after our last shipment of the product including the GPL
Software and/or LGPL Software, which will be no earlier than December 1, 2010,
for the cost of reproduction and shipment, which is dependent on the preferred
carrier and the location where you want to have it shipped to, by sending a request
to:

MicroSys Electronics GmbH
Muehlweg 1
82054 Sauerlach
Germany

In your request please provide the product name and version for which you wish to
obtain the corresponding source code and your contact details so that we can
coordinate the terms and cost of shipment with you.

The source code will be distributed WITHOUT ANY WARRANTY and licensed
under the same license as the corresponding binary/object code.

This offer is valid to anyone in receipt of this information.
MicroSys Electronics GmbH is eager to duly provide complete source code as

required under various Free Open Source Software licenses. If, however you
encounter any problems in obtaining the full corresponding source code we would
be much obliged if you give us a notification to the email address
[e-mail], stating the product and describing the problem (please do NOT
send large attachments such as source code archives etc. to this email address)

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1.5 Symbols, Conventions and Abbreviations

1.5.1 Symbols

Throughout this document, the following symbols will be used:

Information marked with this symbol MUST be obeyed to
avoid the risk of severe injury, health danger, or major
destruction of the unit and its environment

Information marked with this symbol MUST be obeyed to
avoid the risk of possible injury, permanent damage or
malfunction of the unit.

Information marked with this symbol gives important hints
upon details of this manual, or in order to get the best use
out of the product and its features.

Table 1 Symbols

1.5.2 Conventions

Symbol

explanation

#

denotes a low active signal

←

denotes the signal flow in the shown direction

→

denotes the signal flow in the shown direction

↔

denotes the signal flow in both directions

→

denotes the signal flow in the shown direction with additional logic /
additional ICs in the signal path

I/O

denotes a bidirectional pin

Input

denotes an input pin

matched

denotes the according signal to be routed impedance controlled and
length matched

Output

denotes an output pin

Pin 1

refers to the numeric pin of a component package

Pin a1

refers to the array position of a pin within a component package

XXX-

denotes the negative signal of a differential pair

XXX+

denotes the positive signal of a differential pair

XXX

denotes an optional not mounted or fitted part

Table 2 Conventions

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2 Introduction

Thank you for choosing the MicroSys MPX-S32V234 module. This manual should
help you to get the best performance and details out all of its features.

2.1 Safety and Handling Precautions

ALWAYS use the correct type and polarity of the power
supply!

DO NOT exceed the rated maximum values for the power
supply! This may result in severe permanent damage to
the unit, as well as possible serious injury.

ALWAYS keep the unit dry, clean and free of foreign
objects. Otherwise, irreparable damage may occur.

Parts of the unit may become hot during operation. Take
care not to touch any parts of the circuitry during
operation to avoid burns, and operate the unit in a well­ventilated location. Provide an appropriate cooling
solution as required.

ALWAYS take care of ESD-safe handling!
Many pins on external connectors are directly connected

to the CPU or other ESD sensitive devices.
Make or break ANY connections ONLY while the unit is

switched OFF.
Otherwise, permanent damage to the unit may occur,

which is not covered by warranty.

There is no separate SHIELD connection.
All the metal sheaths of shielded connectors are

connected to GND.
Also, all mounting holes of the carrier board are

connected to GND.
The module’s mounting holes are not connected to GND
Take this into account when handling and mounting the

unit.

Table 3 Safety and Handling Precautions

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2.2 Short Description

The miriac MPX-S32V234 is a member of the MPX module family, based on NXP’s
S32V234 vision processing MPU

It targets the evaluation of the main interfaces of the S32V234 processor

2.3 Ordering Information

The MPX-S32V234 System-on-Module (SoM) is available in the following configu­rations:

Part No.

Title

Description

854901

miriac MPX-S32V234 SoM

NXP S32V234@1GHz CPU, 2GB
DDR3L, standard temp 0C to +70C

854902

miriac MPX-S32V234 SoM

same as 854901, but with extended
temp -40C to +70C

854903

miriac MPX-S32V234 SoM

same as 854901, except CPU contains
Cryptographic Service Engine

2.4 Board Preparation

■ Make sure the BMD switch, located on the MPX-S32V module, is set properly

in order to select the correct boot source.
For more details see chapter 4.2 Boot Mode Configuration

■ Make sure the GPU switch, located on the MPX-S32V234 module, is set

properly in order to select the correct GPU supply.
For more details see chapter 5.5 Switches

Figure 1: BMD Switch

Figure 2: GPU Switch

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2.5 Software

When ordering MPX-S32V234 SoMs they are delivered with a version of U-Boot in
the onboard eMMC which was used in the factory to test the module on MicroSys'
CRX-32V carrier.
Assuming you are intending to mount the module on your own carrier, then you will
need to modify U-Boot accordingly.

The SBC-S32V234 (which is the MPX-S32V234 module mounted on the CRX-32V
carrier) is supported by NXP's automotive Linux BSP for S32. You can download
the latest Linux BSP from:

https://source.codeaurora.org/external/autobsps32/auto_yocto_bsp/

This should serve as your starting point for modifying U-Boot and Linux.
NXP has a release cadence of once every 3 months. As of December 2018, the
current release is BSP 19.0

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3 Module Description

This section describes all parts of the MPX-S32V234 module.

3.1 Block Diagram MPX-S32V234 Module

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3.2 Feature Overview

Feature

Type

Description

CPU

NXP S32V234

Core Clock 1GHz
Quad-Cortex®-A53
Single-Cortex®-M4

SDRAM

Dual 32-bit DDR3L
interface

2 x up to 1GByte
up to 1066MT/s

Mass Storage

8-bit eMMC

16 GByte

PCI Express

via MXM Connector

Rev.2.0
5Gbps
Lane x1
RC/EP
100MHz Clock Source
I2C support

Removable Media

via MXM Connector

For microSD cards
4/8-bit support

Ethernet

via MXM Connector

RGMII

Grahics Output

via MXM Connector

Parallel 24-bit

Video Input

MIPI-CSI-A

4 Lanes + Clock

MIPI-CSI-B

4 Lanes + Clock

Serial Interfaces

via MXM Connector

UART0

via MXM Connector

UART1

CAN Interface

via MXM Connector

CAN0

via MXM Connector

CAN1

RTC

Time/Date

PCF85263A
external backup

Board Control

S9KEAZN64A

Voltage supervision
Reset logic
Boot configuration
Status LED

Switches

Sliding Swicthes

RCON/Serial Select
GPU Power ON/Off

Indicators

LEDs

MCU Status
Reset Status
User GPIO1
User GPIO2

Connectors

Module Connectors

ADC Channel 0-7

MCU Programming Port
314-pin MXM Conncetor

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3.3 Mechanical Dimensions

3.3.1 MPX-S32V234 Module

The following drawing shows the mechanical outline of the MPX-S32V234 module
that is plugged into the CRX-S32V carrier board.

This drawing is not to scale.

For 3D data files please contact MicroSys.

Figure 3 Mechanical Dimensions

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3.4 Module Top Side

3.5 Module Bottom Side

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3.7 System Environment

3.7.1 Temperature Ratings

The MPX-S32V234 contains parts with the following ambient, junction or case
temperature ratings. Due to these limits, the system function is only guaranteed, if
none of them are exceeded at any time. The MPX-S32V234 requires an adequate
heatsink.

Part

Tmin

Tmax

C-0402-NP0-Series

-55°C

125°C

C-0402-X5R-Series

-55°C

85°C

C-0402-X7R-Series

-55°C

125°C

C-0603-226-X5R-Z

-55°C

85°C

C-0603-X7R-Series

-55°C

125°C

C-0805-X7R-Series

-55°C

125°C

C-1206-X7R-Series

-55°C

125°C

C-EEEFK1H331AQ

-55°C

105°C

CML-744-227

-40°C

125°C

CML-744-233-670

-40°C

85°C

D-B320A-13-F

-55°C

150°C

D-BAS70

-65°C

150°C

D-BAT54S

-55°C

125°C

D-SD2114S040S5R0

-55°C

125°C

FB-742-792-XXX

-55°C

125°C

HEADER-2.54-180-M-1X2

-40°C

125°C

HEADER-2.54-180-SM-1X5

-40°C

163°C

IC-BTS462T

-40°C

150°C

IC-DSC1001CI2-027.0000

-40°C

85°C

IC-DSC557-0344FI1

-40°C

85°C

IC-FT232RQ

-40°C

85°C

IC-IR347xMTRPBF

-40°C

125°C

IC-KSZ9031RNXIA

-40°C

85°C

IC-MAX4886ETO

-40°C

85°C

IC-MC33662BLEF

-40°C

125°C

IC-MT41K256M16HA-107-IT

-40°C

95°C

IC-MTFC16GAKAENA-4M-IT

-40°C

85°C

IC-NCV8715SQ50T2G

-40°C

125°C

IC-PCA9517ADP

-40°C

85°C

IC-PCF85263ATL

-40°C

85°C

IC-PS32V234CMN0VUB

-40°C

125°C

IC-REF3030AIDBZ

-40°C

125°C

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Part

Tmin

Tmax

IC-S9KEAZN64AMLH

-40°C

85°C

IC-SN74LVC1G125DCK

-40°C

125°C

IC-SN74LVC244ARGYR

-40°C

125°C

IC-TPS22920LYZP

-40°C

85°C

IC-TPS51200DRC

-40°C

85°C

IC-TPS5433xDDAR

-40°C

150°C

IC-TPS70933DBV

-40°C

125°C

L-744-311-220

-55°C

125°C

L-744-383-56033

-40°C

85°C

L-744-383-57068

-40°C

85°C

LD-155124xx73200

-40°C

85°C

PCB-ADP-8065-01

-40°C

85°C

PCB-MPX-S32V234-02

-40°C

85°C

R-0402-Serie

-55°C

155°C

R-0603-Serie

-55°C

155°C

R-0805-Serie

-55°C

155°C

R-1206-Serie

-55°C

155°C

R-2010-Serie

-55°C

155°C

ST-WE-687-118-140-22

-25°C

85°C

SW-WE-450-404-015-514

-40°C

85°C

T-BSS138LT1

-55°C

150°C

T-FDT434P

-55°C

150°C

T-PDTA114YT

-55°C

150°C

T-PDTC123JT

-65°C

150°C

XT-FT13A-40.00000/8-20-20/48

-40°C

85°C

3.7.2 Power Dissipation

Component

max.Temperature

Power Dissipation

CPU

Tj125° C

7W

DDR

Tc95° C

1.5W

Core Regulator

Tj125° C

1.2W

DDR Regulator

Tj125° C

0.3W

(j=junction, c=case, a=ambient)

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3.8 Power Supply

3.8.1 Input Supply Rating

The MPX-S32V234 module runs from a single power supply with the following
ratings:

Input Voltage Operating Range:

12V DC +/-25%

Typical Current Consumption
( room temperature / U-Boot prompt):

0,40A @12V

The input of the MPX-S32V234 system is not protected against wrong polarity and
over-current

DO NOT exceed the rated maximum values for the power
supply! This may result in severe permanent damage to
the unit, as well as possible serious injury.

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3.8.2 Power-Up

During a power-up sequence, the MCU first checks the input voltage to be within
their necessary limits. After that, the POL (Point Of Load) regulators on the module
will be activated. Any regulators on the carrier board should track the correspond­ing voltages on pins B15 and B16 of the module connector. If all module voltages
are o.k. the reset sequence will be started. If there is no external reset request, e.g.
via RSTIN# from the reset key, the RESET# will be released after 100ms. A low
level on the RSTIN# line extends this time. During normal operation, a falling edge
at RSTIN# initiates a reset sequence for the whole system, which is at least 100ms
long. As long the reset line is low, the system will be held in the reset state. If the
signal is released, the CPU will fetch its power-up configuration and starts up with
its BIST and/or boot sequence. The RSTOUT# signal will directly follow the state of
the RESET# signal. As long the RSTOUT# is active all connected devices must be
held in a reset state in order not to block the power-up configuration settings.

+12V

PWEN

V(intern)

RSTIN#

RSTOUT#

PORST#

If the MCU detects any overvoltage, it will turn off all internal point of load regula­tors.

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3.9 Reset Structure

Signal Name

Function

Type

RSTIN#

System Global Reset Input

4K7 Pullup

RSTOUT#

System Global Reset Output

Totem Pole

PORST#

Power-On Reset for CPU

Totem Pole

RESET#

Reset for CPU

Open Drain

M0RST#

Reset for Memory Bank 0

Totem Pole

M1RST#

Reset for Memory Bank 1

Totem Pole

( # denotes an active low signal )

Table 3-3 Reset signal overview

Figure 3-3 Reset Structure

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4 System Core, Boot Configuration

4.1 Processor NXP S32V234

The S32V234 is a vision processing MPU with four ARM® Cortex®-A53 cores and
a single Cortex-M4 core. The four CPU cores run at a maximum clock speed of
1000MHz.

Figure 4-7 Processor Block diagram

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4.2 Boot Mode Configuration

The MPX-S32V234 module offers several different boot modes to choose from.
The settings can be done via the sliding switch BMD on the module and two
BOOT-SEL signals on the MXM connectorr according to the following table.
The switch BMD sets the BMODE[0] and BMODE[1] signals of the CPU to low,
while the two configuration resistors BMD0 and BMD1 are used to set a fixed low
value on these lines.
The BMD, BMD0 and BMD1 parts are located on the MPX-S32V234 module.

green denotes the default configuration

Note 1) BMD0 and BMD1 are soldered resistors (size 0402) and not intended to be

changed by user.

Shown positions set the corresponding BTMOD0/1 line to low. BTMOD0 controls
the CPU configuration port PC9, i.e. BOOTMOD(0), while BTMOD1 is connected to
the CPU configuration port PC10, i.e. BOOTMOD(1).

Boot Mode

BMD-Switch

BMD01)

BMD11)

Serial Download, virgin device

No function

installed

installed

Serial Download, virgin device

Position 0

removed

installed

Serial Download, prog. device

Position 1

removed

installed

RCON Boot, if no fuses

Position 0

installed

removed

Serial Download, prog. device

Position 1

installed

removed

RCON Boot, no fuses

Position 0

removed

removed

Serial Download, prog. device

Position 1

removed

removed

Figure 4: BMD Switch

Figure 6: Position BTM1=low

Figure 5: Position BTM0=low

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4.3 BOOT-SEL Signals

The two signals BOOT-SEL1 and BOOT-SEL2 located on the MXM connector
B130 and B131 allow the following default boot modes, when the BMD switch is set
to position RCON. If the BMD switch is set to serial download, these signals have
no function.

If the eMMC or the SDHC are to be used after previously having booted from the
other device, then BOOT-SEL1 must be set correctly and the “mmc rescan” com­mand must be executed from within U-Boot. The “mmc info” command will then
show the new active storage device.

BOOT-SEL1

BOOT-SEL2

Boot Device

high

high

Cortex A53 via SDHC-A

low

high

Cortex A53 via eMMC

high

low

Cortex M4 via SDHC-A

low

low

Cortex M4 via eMMC

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4.4 Power-Up Configuration

The S32V234 is configured during power-up by the state of 32 I/O signals, which
are controlled by the MCU. Within the MCU, the four most popular RCON boot
configurations are implemented and can be selected via the BOOT DIP switch
located on the carrier board.

These configurations are only valid, if the Boot Mode Configuration is set to RCON Boot!

Signal

RCON

Port

eSDHC Mode

eMMC Mode

FLXR-TENB

RCON[0]

PA[7] 0 0

FLXR-TXD

RCON[1]

PA[8] 0 0

FLXR-RXD

RCON[2]

PA[9] 0 0

UART0-RXD

RCON[3]

PA[11] 0 0

UART0-TXD

RCON[4]

PA[12] 0 1

UART1-RXD

RCON[5]

PA[13] 0 0

UART1-TXD

RCON[6]

PA[14] 0 1

I2C0-SDA

RCON[7]

PA[15] 1 1

I2C0-SCL

RCON[8]

PB[0] 0 0

I2C1-SDA

RCON[9]

PB[1] 0 0

I2C1-SCL

RCON[10]

PB[2] 0 0

I2C2-SDA

RCON[11]

PB[3] 0 1

SPI0-SCK

RCON[12]

PB[5] 0 0

SPI0-SOUT

RCON[13]

PB[6] 0 0

SPI0-SIN

RCON[14]

PB[7] 0 0

SPI0-CS0#

RCON[15]

PB[8] 0 1

SPI1-SCK

RCON[16]

PB[9] 0 1

SPI1-SOUT

RCON[17]

PB[10] 0 0

SPI1-SIN

RCON[18]

PB[11] 0 0

SPI1-CS0#

RCON[19]

PB[12] 0 0

SPI2-SCK

RCON[20]

PB[13] 0 0

SPI2-SOUT

RCON[21]

PB[14] 1 1

SPI2-SIN

RCON[22]

PB[15] 0 0

SPI2-CS0#

RCON[23]

PC[0] 0 0

SPI3-SCK

RCON[24]

PC[1] 0 0

SPI3-SOUT

RCON[25]

PC[2] 0 0

SPI3-SIN

RCON[26]

PC[3] 0 0

SPI3-CS0#

RCON[27]

PC[4] 0 0

FXT0-CH0

RCON[28]

PC[5] 0 0

FXT0-CH1

RCON[29]

PC[6] 0 0

FXT0-CH2

RCON[30]

PC[7] 0 0

FXT0-CH3

RCON[31]

PC[8] 1 1

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4.5 MCU Programming Port

The MCU, a Kinetis S9KEAZN64AMLH, controls the power-on and the reset
sequence. It monitors all module generated supply voltages and drives all
configuration lines of the S32V234 CPU. The controller can be either programmed
via a module connector or a connector on the carrier board, both named MCU. As
the module connector is very tiny and has a pitch of 0.6mm, the connector on the
carrier with its 1.5mm pitch is the preferred one.

MPX-S32V234 Connector MCU

Manufacturer:

JST

Type:

SM06B-XSRS-ETB

mates with:

06XSR-36S

The module connector is supplied by the direct MCU supply with 3.3V.

Figure 7: Module MCU Connector

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4.5.1 MCU Pinout

MCU

Board

S32V234

Function

Pin

Port

Dir

Signal

Signal

RCON

1

PTD1

Out

BCFG23

SPI2_CS0#

RCON[23]

Configuration

2

PTD0

Out

BCFG29

FXT0_CH1

RCON[29]

Configuration

3

PTH7

Out

BCFG22

SPI2_SIN

RCON[22]

Configuration

4

PTH6

Out

BCFG6

UART1_TXD

RCON[6]

Configuration

5

PTE7

Out

RSTOUT#

Modul Rest Output

6

PTH2 n.c.

not connected

7 In

+3V3

Supply

8 In

VREFH

+3.0V

9 In

VREFL

Reference Ground

10

GND

Reference Ground

11

PTB7

Out

FRSTI#

eMMC Reset

12

PTB6

Out

PWEN

PSU enable

13

GND

Reference Ground

14

PTH1

In

QSPI-SEL

GPIO[158]

FLASH/SDHC Mux

15

PTH0

IO

TRTC#

Time Stamp RTC

16

PTE6

In

IRTC#

Interrupt RTC

17

PTE5

Out

PORST#

EXT_POR#

PowerOnReset

18

PTB5

Out

RESET#

RESET# Reset

19

PTB4

In

FCCU-F0

FCCU_F0

Failure Check&Correction

20

PTC3

In

LD4

yellow Led

21

PTC2

In

+3V3

ADC Divider 3:4

22

PTD7

Out

NMI

NMI Interrupt

23

PTD6

Out

FCCU-F1

FCCU_F1

Failure Check&Correction

24

PTD5

OUT

BCFGE#

Configuration Enable

25

PTC1

In

+3.3V

ADC Divider 3:4

26

PTC0

In

+1.8V

ADC direct

27

PTF7

In

+1.35V

ADC direct

28

PTF6

In

+1.0V

ADC direct

29

PTF5

In

+VIN

ADC Divider 1:11

30

PTF4

Out

BCFG2

FLXR_RXD

RCON[2]

Configuration

31

PTB3

Out

BCFG0

FLXR_TENB

RCON[0]

Configuration

32

PTB2

Out

BCFG1

FLXR_TXD

RCON[1]

Configuration

33

PTB1

Out

BCFG3

UART0_RXD

RCON[3]

Configuration

34

PTB0

Out

BCFG4

UART0_TXD

RCON[4]

Configuration

35

PTF3

Out

BCFG7

I2C0_SDA

RCON[7]

Configuration

36

PTF2

Out

BCFG8

I2C0_SCL

RCON[8]

Configuration

37

PTA7

Out

BCFG9

I2C1_SDA

RCON[9]

Configuration

38

PTA6

Out

BCFG10

I2C1_SCL

RCON[10]

Configuration

39

PTE4

Out

BCFG14

SPI0_SIN

RCON[14]

Configuration

40

GND

Reference Ground

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MCU

Board

S32V234

Function

41 In

+3V3

Supply

42

PTF1

Out

BCFG15

SPI0_CS0#

RCON[15]

Configuration

43

PTF0

Out

BCFG12

SPI0_CLK

RCON[12]

Configuration

44

PTD4

Out

BCFG13

SPI0_SOUT

RCON[13]

Configuration

45

PTD3

Out

BCFG24

SPI3_CLK

RCON[24]

Configuration

46

PTD2

Out

BCFG5

UART1_RXD

RCON[5]

Configuration

47

PTA3

Out

BCFG25

SPI3_SOUT

RCON[25]

Configuration

48

PTA2

Out

BCFG18

SPI1_SIN

RCON[18]

Configuration

49

PTA1

Out

BCFG17

SPI1_SOUT

RCON[17]

Configuration

50

PTA0

Out

BCFG31

FXT0_CH3

RCON[31]

Configuration

51

PTC7

Out

BCFG26

SPI3_SIN

RCON[26]

Configuration

52

PTC6

Out

BCFG30

FXT0_CH2

RCON[30]

Configuration

53

PTE3

Out

BCFG11

I2C2_SDA

RCON[11]

Configuration

54

PTE2

Out

BCFG16

SPI1_CLK

RCON[16]

Configuration

55

PTG3

Out

BCFG19

SPI1_CS0#

RCON[19]

Configuration

56

PTG2

Out

BCFG21

SPI2_SOUT

RCON[21]

Configuration

57

PTG1

Out

BCFG28

FXT0_CH0

RCON[28]

Configuration

58

PTG0

Out

BCFG27

SPI3_CS0#

RCON[27]

Configuration

59

PTE1

Out

BCFG20

SPI2_CLK

RCON[20]

Configuration

60

PTE0

In

BOOT-SEL1

Boot Mode

61

PTC5

In

BOOT-SEL2

Boot Mode

62

PTC4

In

MCU-CLK

Programming Interface

63

PTA5

In

RSTIN#

Programming Interface

64

PTA4

IO

MCU-DIO

Programming Interface

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5 MPX Module

The MPX-S32V234 miriac module has a 314-pin MXM connector and must be
mounted with a heatsink. It can be fixed with M2.5 screws through four 2.7mm
holes in the PCB.

MPX-S32V234 MXM Connector

Manufacturer:

JAE

Type:

MM70-314-310-B1-1

mates with:

PCB Edge Connector

5.1 Mounting/Unmounting

The mounting or unmounting of the module should only be made in a static free
area with full ESD precautions, i.e. as a minimum, a grounded dissipative work
surface of sufficient size and a grounded skin contact wrist strap are necessary.
Make sure, that all parts, the carrier, the module and the heatsink are placed on the
same static free area to avoid any discharges between them during assembly.

To mount the MPX-S32V234 module, make sure that the carrier is disconnected
from any power or other IO interfaces. Both connector surfaces of the module must
be clean as well as the carrier connector should be checked for bent or dirty
contacts. Check the module and the carrier for foreign or loose parts, which do not
belong to the boards. The screws should have clean threads and be tightened with
a maximum torque of 30Ncm.

Insert or remove the MPX-S32V234 module always by an angle of about 25° as
shown in the following figure.

The thermal conduction between cooler and CPU must be performed via a thermal
pad. Make sure that this thermal pad has the correct thickness and is placed over
the CPU package before mounting the heatsink.

For the removal of the module, first unplug all connections to the system. Remove
the inner screws, then the outer ones. The thermal pad may cause the heatsink to
stick to the module, so take care when pulling them apart to avoid damaging any
part of the module. Lift the module to about 25°and remove it from the connector.
Store the parts on a static free area.

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5.2 DRAM

The module is fitted with two individual DDR3L memory blocks, each 32-bit wide
and with 1GByte capacity. The parts used are 4Gbit devices organized in 256M x
16 bits with 15 row, 10 column and 3 bank addresses. The refresh rate depends on
the operating temperature must be set according to the following table

Case Temperature

Refresh Cycle Time

Tc<85°C

7.8us

85°C<Tc<95°C

3.9us

95°C<Tc<105°C

1.95us

The DDR3L command bus is actively terminated and routed in a fly-by topology.
The following table shows all trace lengths, in case write leveling needs to be
adjusted. The layer stack, together with the FR4 material, causes a signal delay
time of 6.8ps/mm.

DRAM

Signal Group

Trace Length

Description

Bank0

Command

J1->J2

54.0mm

CPU->DRAM

Bank0

Command

J2->J3

13.1mm

DRAM->DRAM

Bank0

Byte 0

J1->J2

25.7mm

CPU->DRAM

Bank0

Byte 1

J1->J2

22.7mm

CPU->DRAM

Bank0

Byte 2

J1->J3

23.1mm

CPU->DRAM

Bank0

Byte 3

J1->J3

18.3mm

CPU->DRAM

Bank1

Command

J1->J4

54.5mm

CPU->DRAM

Bank1

Command

J4>J5

13.9mm

DRAM->DRAM

Bank1

Byte 0

J1->J4

25.3mm

CPU->DRAM

Bank1

Byte 1

J1->J4

22.9mm

CPU->DRAM

Bank1

Byte 2

J1->J5

19.0mm

CPU->DRAM

Bank1

Byte 3

J1->J5

17.2mm

CPU->DRAM

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5.3 eMMC

The local boot device of the MPX-S32V234 module is realized as an eMMC. The
MTFC16GAKAENA-4M-IT from Micron uses the 8-bit wide data bus, provided by
the µSDHC module of the S32V234. This interface is shared between the external
storage devices on the carrier board and the local eMMC. The selection can be
either made by the setting of a CPU GPIO pin or via the MCU. Per default, the
multiplexing is done through the MCU by the setting of the boot mode switch.

The reset input of the eMMC device is connected to port PTB7 of the MCU. In case
this port is not configured, the FRSTI# signal is tied to +3.3V by a pullup resistor.

5.4 LEDs

There are four LEDs onboard the MPX-S32V234 module. The user LEDs 1 and 2
can be controlled by two CPU GPIO pins, LED 3 indicates state of the reset line
and LED 4 is connected to the MCU port PTC3.

Led

Color

ON

OFF

Description

LD1

green

CPU-PG5=high

CPU-PG5=low

LDG1 installed / LDG3 not installed

LD2

green

CPU-PG6=high

CPU-PG6=low

LDG2 installed / LDG4 not installed

LD1

green

CPU-PB1=high

CPU-PB1=low

LDG3 installed / LDG1 not installed

LD2

green

CPU-PB2=high

CPU-PB2=low

LDG4 installed / LDG2 not installed

LD3

red

RESET#=low

RESET#=high

Reset state indicator

LD4

yellow

MCU-PTC3=high

MCU-PTC3=low

MCU status led

Figure 8: MPX-LEDs

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5.5 Switches

The GPU sliding switch on the MPX-S32V234 module is used to disconnect the
GPU power pins to reduce power consumption, in case the GPU is not used. The
other sliding switch BMD is used to select between RCON-controlled and serial
boot mode. Both switches are located at the PCB edge on the bottom of the MPX­S32V234 module.

Any handling of these switches must be done exclusively using
non-conductive tools to avoid short circuits between carrier
board and module.

Figure 9: GPU switch

Figure 12: BMD Switch

Figure 11: GPU Power On (default)

Figure 10: GPU Power Off

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5.6 Module Connector

A carrier board must provide an MXM connector.

Manufacturer:

JAE

Type:

MM70-314-310-B1-1-R300

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5.7 Module Connections

MPX-S32V234

IO

Pin

Signal

Voltage

B1

IIC1-SDA

3.3V

T1

GND

B2

GND

T2

CAN-FD0-TX

3.3V

B3

IIC1-SCL

3.3V

T3

CAN-FD0-RX

3.3V

B4

JTAG-TCK

3.3V

T4

GND

B5

JTAG-TDI

3.3V

T5

CAN-FD1-TX

3.3V

B6

JTAG-TRST#

3.3V

T6

CAN-FD1-RX

3.3V

B7

JTAG-TMS

3.3V

T7

GND

B8

GND

T8

CSI1-DT0+

1.0V

B9

JTAG-TDO

3.3V

T9

CSI1-DT0-

1.0V

B10

FLXR-TENB

3.3V

T10

GND

B11

FLXR-TENA

3.3V

T11

CSI1-DT1-

1.0V

B12

FLXR-TXD

3.3V

T12

CSI1-DT1+

1.0V

B13

FLXR-RXD

3.3V

T13

GND

B14

GND

T14

CSI1-DT2+

1.0V

B15

3.3V rail output

T15

CSI1-DT2-

1.0V

B16

1.8V rail output

T16

GND

B17

GND

T17

CSI1-DT3-

1.0V

B18

CSI0-CLK+

1.0V

T18

CSI1-DT3+

1.0V

B19

CSI0-CLK-

1.0V

T19

GND

B20

GND

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T20

CSI0-DT0+

1.0V

B21

CSI1-CLK+

1.0V

T21

CSI0-DT0-

1.0V

B22

CSI1-CLK-

1.0V

T22

GND

B23

GND

T23

CSI0-DT1-

1.0V

B24

CSI0-DT2+

1.0V

T24

CSI0-DT1+

1.0V

B25

CSI0-DT2-

1.0V

T25

GND

B26

CSI0-DT3-

1.0V

T26

VIU0-D17

3.3V/1.8V

B27

CSI0-DT3+

1.0V

T27

VIU0-D18

3.3V/1.8V

B28

GND

T28

GND

B29

VIU0-D08

3.3V/1.8V

T29

VIU0-D19

3.3V/1.8V

B30

VIU0-D09

3.3V/1.8V

T30

VIU0-D20

3.3V/1.8V

B31

GND

T31

GND

B32

VIU0-D10

3.3V/1.8V

T32

VIU0-D21

3.3V/1.8V

B33

VIU0-D11

3.3V/1.8V

T33

VIU0-D22

3.3V/1.8V

B34

VIU0-D12

3.3V/1.8V

T34

GND

B35

VIU0-D13

3.3V/1.8V

T35

VIU0-D23

3.3V/1.8V

B36

GND

T36

VIU0-PCLK

3.3V/1.8V

B37

VIU0-D14

3.3V/1.8V

T37

GND

B38

VIU0-D15

3.3V/1.8V

T38

VIU0-VSYNC

3.3V/1.8V

B39

VIU0-D16

3.3V/1.8V

T39

VIU0-HSYNC

3.3V/1.8V

B40

VIU1-D08

3.3V/1.8V

T40

GND

B41

GND

T41

DCU-B0

1.8V

B42

VIU1-D09

3.3V/1.8V

T42

DCU-B1

1.8V

B43

VIU1-D10

3.3V/1.8V

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T43

GND

B44

VIU1-D11

3.3V/1.8V

T44

DCU-B2

1.8V

B45

VIU1-D12

3.3V/1.8V

T45

DCU-B3

1.8V

B46

VIU1-D13

3.3V/1.8V

T46

GND

B47

VIU1-D14

3.3V/1.8V

T47

DCU-B4

1.8V

B48

VIU1-D15

3.3V/1.8V

T48

DCU-B5

1.8V

B49

VIU1-D16

3.3V/1.8V

T49

GND

B50

GND

T50

DCU-B6

1.8V

B51

VIU1-D17

3.3V/1.8V

T51

DCU-B7

1.8V

B52

VIU1-D18

3.3V/1.8V

T52

GND

B53

VIU1-D19

3.3V/1.8V

T53

DCU-DE

1.8V

B54

VIU1-D20

3.3V/1.8V

T54

DCU-PCLK

1.8V

B55

GND

T55

GND

B56

VIU1-D21

3.3V/1.8V

T56

DCU-HSYNC

1.8V

B57

VIU1-D22

3.3V/1.8V

T57

DCU-VSYNC

1.8V

B58

VIU1-D23

3.3V/1.8V

T58

GND

B59

VIU1-PCLK

3.3V/1.8V

T59

DCU-TAG

1.8V

B60

VIU1-HSYNC

3.3V/1.8V

T60

DCU-G0

1.8V

B61

VIU1-VSYNC

3.3V/1.8V

T61

GND

B62

DCU-R0

1.8V

T62

DCU-G1

1.8V

B63

DCU-R1

1.8V

T63

DCU-G2

1.8V

B64

DCU-R2

1.8V

T64

GND

B65

DCU-R3

1.8V

T65

DCU-G3

1.8V

B66

DCU-R4

1.8V

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T66

DCU-G4

1.8V

B67

DCU-R5

1.8V

T67

GND

B68

GND

T68

DCU-G5

1.8V

B69

DCU-R6

1.8V

T69

DCU-G6

1.8V

B70

DCU-R7

1.8V

T70

GND

B71

SDHC-D7

3.3V

T71

DCU-G7

1.8V

B72

SDHC-D6

3.3V

T72

B73

GND

T73

GND

B74

SDHC-D5

3.3V

T74

SDHC-D4

3.3V

B75

SDHC-CMD

3.3V

T75

SDHC-D3

3.3V

B76

GND

T76

GND

B77

SDHC-CLK

3.3V

T77

SDHC-D2

3.3V

B78

SDHC-WP

3.3V

T78

SDHC-D1

3.3V

B79

GND

T79

GND

B80

SDHC-RST

3.3V

T80

SDHC-D0

3.3V

B81

SDHC-VSEL

3.3V

T81

GND

B82

GND

T82

PCIE-TX-

1.0V

B83

UART1-TXD

1.8V

T83

PCIE-TX+

1.0V

B84

UART1-RXD

1.8V

T84

GND

B85

GND

T85

PCIE-RX-

1.0V

B86

UART0-TXD

3.3V

T86

PCIE-RX+

1.0V

B87

UART0-RXD

3.3V

T87

GND

B88

GND

T88

PCIE-CLK+

1.0V

B89

I2C2-SDA

1.8V

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T89

PCIE-CLK-

1.0V

B90

I2C2-SCL

1.8V

T90

GND

B91

SPI3-CS0#

1.8V

T91

LFAST-TX-

1.6V

B92

SPI3-SCK

1.8V

T92

LFAST-TX+

1.6V

B93

SPI3-SIN

1.8V

T93

GND

B94

SPI3-SOUT

1.8V

T94

LFAST-RX-

1.6V

B95

SPI0-CS0#

1.8V

T95

LFAST-RX+

1.6V

B96

SPI0-SCK

1.8V

T96

GND

B97

SPI0-SIN

1.8V

T97

EMI-MDC

1.8V

B98

SPI0-SOUT

1.8V

T98

EMI-MDIO

1.8V

B99

SPI1-SIN

1.8V

T99

GND

B100

SPI1-SOUT

1.8V

T100

EC-COL

1.8V

B101

GND

T101

EC-TXCK

1.8V

B102

SPI1-SCK

1.8V

T102

GND

B103

SPI1-CS0#

1.8V

T103

EC-TXD3

1.8V

B104

FXT0-CH0

1.8V

T104

EC-RXDV

1.8V

B105

FXT0-CH1

1.8V

T105

GND

B106

FXT0-CH2

1.8V

T106

EC-RXD1

1.8V

B107

GND

T107

EC-TXD2

1.8V

B108

FXT0-CH3

1.8V

T108

GND

B109

FXT1-CH0

1.8V

T109

EC-RXD0

1.8V

B110

FXT1-CH1

1.8V

T110

EC-CRS

1.8V

B111

SPI2-SOUT

1.8V

T111

GND

B112

GND

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T112

EC-RXER

1.8V

B113

SPI2-SCK

1.8V

T113

EC-TXER

1.8V

B114

SPI2-SIN

1.8V

T114

GND

B115

GND

T115

EC-RXD3

1.8V

B116

SPI2-CS0#

1.8V

T116

EC-TXEN

1.8V

B117

ENET-T0

1.8V

T117

GND

B118

ENET-T1

1.8V

T118

EC-RXD2

1.8V

B119

ENET-T2

3.3V

T119

EC-TXD0

1.8V

B120

TRACE-D00

1.8V

T120

GND

B121

TRACE-D02

1.8V

T121

EC-RXCK

1.8V

B122

TRACE-D04

1.8V

T122

EC-TXD1

1.8V

B123

TRACE-D06

1.8V

T123

GND

B124

GND

T124

TRACE-CLK

1.8V

B125

TRACE-D08

1.8V

T125

TRACE-D01

1.8V

B126

TRACE-D10

1.8V

T126

GND

B127

TRACE-D12

1.8V

T127

TRACE-D03

1.8V

B128

TRACE-D14

1.8V

T128

TRACE-D05

1.8V

B129

GND

T129

GND

B130

BOOT-SEL1

3.3V

T130

TRACE-D07

1.8V

B131

BOOT-SEL2

3.3V

T131

TRACE-D09

1.8V

B132

RSTIN#

3.3V

T132

GND

B133

VRTC

3.3V

T133

TRACE-D11

1.8V

B134

GND

T134

TRACE-D13

1.8V

B135

I2C0-SCL

3.3V

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T135

TRACE-D15

1.8V

B136

I2C0-SDA

3.3V

T136

RSTOUT#

3.3V

B137

MCU-DIO

3.3V

T137

GND

B138

MCU-CLK

3.3V

T138

GND

B139

GND

T139

GND

B140

GND

T140

GND

B141

GND

T141

GND

B142

GND

T142

GND

B143

GND

T143

GND

B144

GND

T144

GND

B145

GND

T145

GND

B146

GND

T146

+VIN

B147

GND

T147

+VIN

B148

+VIN

T148

+VIN

B149

+VIN

T149

+VIN

B150

+VIN

T150

+VIN

B151

+VIN

T151

+VIN

B152

+VIN

T152

+VIN

B153

+VIN

T153

+VIN

B154

+VIN

T154

+VIN

B155

+VIN

B156

+VIN

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6 JTAG Chain

6.1.1 JTAG Devices

The JTAG chain of the MPX-S32V234 only includes the S32V234 processor. The
JTAG port is directly connected to the MXM connector.

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7 ADC

7.1.1 ADC Channles

The ADC converter contained in the S32V234 processor has 8 multiplexed single­ended channels. They can be directly accessed via the 18-pin ZIF connector ADC
on the bottom side of the module.

There is no protection on any ADC line against
overvoltage or wrong polarity. Refer to the S32V234
datasheet for maximum ratings

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8 I²C Structure

The MPX-S32V234 operates three different I²C busses.
I²C Bus 0 and 1 are not used onboard the MPX-S32V234.
I²C Bus 2 controls all devices on the module.

8.1.1 Bus Map

I²C Bus 0:

Address

Reference

Device

Function

0x00-0x7F

---

---

External devices

Table 4 I²C0 bus map

I²C Bus 1:

Address

Reference

Device

Function

0x00-0x7F

---

---

External devices

Table 5 I²C1 bus map

I²C Bus 2:

Address

Reference

Device

Function

0x51

J25

PCF85263A

Real Time Clock

Table 6 I²C2 bus map

8.1.2 I²C Devices

8.1.2.1 RTC

The RTC PCF85263A provides year, month, day, weekday, hours, minutes,
seconds and 100th seconds. It can be protected against data loss by the backup
battery located on the CRX-S32V carrier.

It is accessible via I²C Bus 2 at the 7-bit address 0x51. It offers a time stamp input
and an interrupt output, which are both connected to the MCU.

8.1.2.2 RTC Backup Battery

The battery back can be accessed via the MXM connector on pin B133. It should
not exceed a maimum voltage of 3.3V. The battery type should have a nominal
voltage of 3.0V. The backup is necessary to keep time and date of the real-time
clock on the MPX-S32V234 module.

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9 Appendix

9.1 Acronyms

These acronyms are being used within the document; note that this list does not
claim to be complete or exhaustive:

ADAS ........................................................................Advanced Driver Assistance Systems

ARM ............................................................................................ Advanced RISC Machine

BaseT .................................................................... Ethernet over twisted pair technologies

BIST .......................................................................................................... Built In Self-Test

CAN-FD .................................................... Controller Area Network with Flexible Data rate

CEC ..................................................................................... Consumer Electronics Control

Cortex-M4 ...................................................................................... ARMv7E-M architecture

CPU ............................................................................................... Central Processing Unit

CR2032 ......................................................................................... IEC standard button cell

CSI ................................................................................................ Camera Serial Interface

DDC .................................................................................................. Display Data Channel

eMMC ...................................................................................... embedded Multimedia Card

ESD ................................................................................................ Electrostatic Discharge

FR4 ........................................................................................................... flame retardant 4

GND ........................................................................................................................ Ground

GPIO ................................................................................................... General Purpose IO

GPL ................................................................................................ General Public License

GPU .............................................................................................. Graphic Processing Unit

HDMI .......................................................................... High-Definition Multimedia Interface

I²C .................................................................................................... Inter-Integrated Circuit

JTAG .............................................................................................. Joint Test Action Group

Kinetis ............................................................................................ ARM® Cortex-M0+ core

LAN ...................................................................................................... Local Area Network

LED ..................................................................................................... Light Emitting Diode

LIN ............................................................................................ Local Interconnect Network

MCU ..................................................................................................... Microcontroller Unit

MIPI ........................................................................... Mobile Industry Processor Interface

MPX ............................................................................................... MicroSys miriac Module

MXM ........................................................................................ Mobile PCI-Express Module

POL ............................................................................................................. Point Of Load

PPTC ............................................................. Polymeric Positive Temperature Coefficient

RCON .................................................................................................. Reset Configuration

RJ45 ..................................................................................................... Registered Jack 45

RTC ........................................................................................................... Real Time Clock

SBC ................................................................................................ Single Board Computer

SOM ......................................................................................................System On Module

TFTP ...................................................................................... Trivial File Transfer Protocol

TVS ...................................................................................... Transient Voltage Suppressor

UART .......................................................... Universal Asynchronous Receiver Transmitter

U-Boot ...................................................................................... The Universal Boot Loader

USB ..................................................................................................... Universal Serial Bus

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10 History

Date

Version

Change Description

2018-12-07

1.0

Initial Release Version

Table 7 Document history