Constantly increasing demand for bandwidth, and the geographical spread of data
networks, have increased the deployment of fiber optics at all application levels.
Today's network infrastructures require open systems based on fiber optics that can be
installed easily and adapted flexibly to changing requirements.
The MICROSENS Access & xWDM Platform offers a wide range of access and
multiplexing modules for LAN and WAN applications as well as for the interfacing of
telecommunications and industrial networks.
The modular Access & xWDM Platform from MICROSENS is based on universal
communication modules for installation in various chassis types and the installation
into 19” racks. One power supply supplies all modules via the backplane with power.
For higher safety requirements it is possible to work with a second redundant power
supply.
A large number of modules are available for the passive and active conversion and
transport of all kind of protocols. The different modules can be combined together in
one chassis. The product range includes e.g. multimode / single mode converter,
Wavelength converter, fiber / copper long haul converter, bridges and switches, 3R
signal regeneration, redundant converter, Gigabit Extender, transparent WDM
converter, copper / fiber converter with WDM fiber interface and CWDM/DWDM
transponders and multiplexers.
Depending on the requirement in terms of bandwidth and optical parameter it is
possible to select the optimal solution for today’s and tomorrows demands. All modules
can be changed during operation (hot swap).
3HU Chassis (MS416001M) with two power supplies for redundancy (MS416004M):
1HU Chassis (MS416006M / MS416007M) with integrated power supplies:
168 TE (1x84 TE front and 1x84 TE back) with 3 HU modules
Technical Specifications
Type Modular Access & xWDM System for 19“ rack installation
Dimensions MS416001M (3 HU)
450 x 130 x 250 mm (w x h x d)
84 TE with 3 HU modules
MS416010M (4 HU)
450 x 174 x 400 mm (w x h x d)
MS416006M / MS416007M (1 HU)
450 x 43 x 285 mm (w x h x d)
3x 6 TE with 1 HU
Power Supply Power Supply Module 230 V/ 50 Hz,
also for redundancy, optional with 48 V DC und 24 V DC
(not for MS416006/MS416007, integrated there)
Operating temp. 0°C to 55°C
Storage temp. -20°C to 80°C
Rel. humidity 5% to 80% non condensing
Combinations
The 19” chassis (MS416001M) can take with one power supply (MS416004M) inserted
up to 12 modules. The power supply can be also be inserted redundant (2x
MS416004M), in that case there are 10 slots available for modules. For the power
redundancy it is also possible to combine 230 V AC and 24/48 V DC power supplies
together.
In the extended version (MS416010M, 4 HU) there are 14 slots on the front and 14 slots
on the back side available (total 28 slots). For the airflow it is necessary in insert min
two fan units (3 slot wide). So in combination with two power supplies and one
management modules it is possible to insert up to 17 modules. This 4 HU chassis is
optimised for the air flow and has larger insertion depth.
Furthermore there are smaller chassis for up to 3 modules available (MS416006M). this
chassis has a fixed integrated power supply and can be also delivered with a second
redundant power supply (MS416007M).
Additional there are deskt6op chassis with one and two slots available. Here the power
supply can be done either with an integrated or an external power supply. An optional
wall mount bracket is also available.
MS417041-24 Desktop chassis for modules, 2 modules
24 V DC
1x 12 V DC
1x 24 V DC
1x 48 V DC
1x 230 V AC
1x 12 V DC
1x 24 V DC
MS417041-48 Desktop chassis for modules, 2 modules
1x 48 V DC
48 V DC
MS417051M Desktop chassis for modules, 2 modules
1x 230 V AC
integrated power supply 100-230 V AC, 1,25 A
MS417001M-WH Wall mounting kit for desktop chassis
MICROSENS reserves the right to make any changes without further notice to any product to i mprove reliability, function or design. MICROSENS does not assume any
liability arising out of the application or use of any product. (PK/SH2811)