Table 10 · JP1 Serial Header Pin Assignments ............................................................................... 23
Table 11 · JP5 Serial Header Pin Assignments ............................................................................... 23
Table 12 · Discrete Component Options for Clocks ........................................................................ 23
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ZLE30267 Hardware Guide
Supported Devices
The ZLE30267 evaluation board supports the following Microsemi timing and synchronization devices:
ZL30260 to ZL30267 and ZL40250 to ZL40253.
Related Documents
ZLE30267 Evaluation Board Rev B Schematic
ZLE30267 Evaluation Board Rev B Bill of Materials
Datasheets for the ZL30267 and the other part numbers listed in the Supported Devices section
Hardware Overview
The ZLE30267 Evaluation Board is a test and demonstration platform with support for the full feature sets of
the family of timing ICs.
Hardware Feature Summary
A top side image of the board is shown in Figure 1.
Throughout this document, the abbreviation “DUT” is used to refer to “Device UnderTest”, meaning the
Microsemi timing IC on the board.
The ZLE30267 board includes the following major components and hardware features:
Major Components
Timing IC (DUT)
Low noise linear regulators
USB Interface for optional connection to PC with GUI software
External EEPROM for timing device configuration storage (ZL30260, ZL30262, ZL30264, ZL30266,
ZL40250, ZL40252)
SMA connectors for access to all DUT clocks
Serial bus switch
Hardware Features
Single 5VDC external power interface with connector for AC/DC wall adapter
Fully configurable DUT power options
DUT reset switch
Standalone (DIP switch) operation or GUI Interface
USB interface with USB-B connector for PC GUI connection
Pin headers with direct access to board’s SPI/I2C bus. Off-board DUT, EEPROM, or SPI master device
can interface with on-board devices.
Status LEDs
Oscillator options: on board or pluggable TCXOs, XOs or XTALs
SMA connectors on all input and output clocks
Jumper-configurable input clocks
Additional discrete component configuration options for advanced users
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ZLE30267 Hardware Guide
Power and ground jacks
5V adapter
jack
DUT
USB jack
SPI/I2C
Connectors
Local oscillator selection
LEDs
USB
interface
IC
Reset
button
Device part # and
Info about on-board XOs
VDD
Control
VDD Control
barcode
Output Clocks
Input Clocks
6 December 2015
Figure 1 · Board Floor Plan
Page 7
Power Supply
The board is normally powered via connector J5 using the provided AC-wall-plug 5VDC power supply. Red
LED D1 illuminates to indicate that the board is powered. Advanced power options for lab experimentation
are also provisioned on the board.
USB Interface
The Windows®-based ZLE30267 GUI software communicates with the board via USB connector JDR1.
Hardware Configuration
Top Level Configurations
The ZLE30267 Evaluation Board supports several operational modes of DUTs, including
SPI/I2C slave (with or without internal EEPROM)
SPI master with external EEPROM
To provide flexibility to users, the board supports a multiplicity of configurations, some of which require
software supervision via the USB link, some of which allow the board to operate as a standalone unit, and
others which provide external device access points to the board’s serial bus by means of pin headers.
Top level configuration defines the following aspects of board set up:
A connection between a serial bus master device and serial bus slave device. The serial bus
master may be the USB interface controller (U8), DUT (U17), or an external controller connected
into a pin header (JP1 or JP5) on the board. The serial bus slave device may be the DUT, onboard EEPROM (U10), or an external EEPROM or DUT on a separate board, connected to a pin
header (JP1 or JP5).
Control of serial bus switch, which may be either via DIP switches or the USB interface controller
Control of DUT GPIO pins by means of DIP switches
The following block diagram shows a simplified topology of the hardware elements relating to high-level
board configuration. Annotations identify significant board components associated with objects in the image.
At the core of the board’s design is a serial bus switch. The switch allows point-to-point serial bus
connections to be made between the USB interface, DUT, and on board EEPROM, with additional options
for connecting user devices to a pin header. Hardware settings on the board may be configured by DIP
switches, or, in set-ups in which the board is under software control, the software controls some DIP switch
settings, and monitors others.
ZLE30267 Hardware Guide
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ZLE30267 Hardware Guide
Each of the possible configurations is portrayed in the following series of Figures 3 through 9. The active
serial bus and hardware control elements of the configuration are depicted by heavy lines. Active blocks are
also identified with bold text. Two of the switches on SW1 are shown in green to differentiate them from
GPIO controls. These represent settings for signals IF1 and IF0, which act through the SPI bus and are
used in DUT configuration on reset.
In Configuration 1, the USB interface is SPI master with the DUT as bus slave.
Figure 2 · Configuration Topology with Annotations
8 December 2015
Figure 3 · Board Configuration 1
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ZLE30267 Hardware Guide
In Configurations 2 and 3, the USB device is SPI master. The USB master can interface with an on-board
EEPROM as in Configuration 2, or an “external SPI device” as in Configuration 3. The external SPI device
could be either an EEPROM or a DUT mounted on another board. The physical form the external device
takes would typically be an independently powered board connected by cable interface to JP1 or JP5. In
configurations in which an external device is connected to the board, voltage level compatibility should be
checked prior to proceeding with connections.
Figure 4 · Board Configuration 2
Figure 5 · Board Configuration 3
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ZLE30267 Hardware Guide
In Configurations 4 and 5, The DUT is set up as a SPI master with external EEPROM. The difference
between the two configurations is that in Configuration 4 the on-board EEPROM is referenced and in
Configuration 5, a header-connected external EEPROM is referenced. Note that these configurations apply
only to DUTs which do not have internal EEPROMs.
Figure 6 · Board Configuration 4
Figure 7 · Board Configuration 5
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ZLE30267 Hardware Guide
Configurations 6 and 7 depict scenarios in which an external serial bus master device is connected to the
DUT. One Figure shows the topology for the two configurations because they are differentiated only by
switch settings. Configuration 6 is SPI serial bus mode, whereas Configuration 7 is an I2C serial bus.
Figure 8 · Board Configurations 6 and 7
Finally, Configuration 8 depicts an external device interfacing with the on-board EEPROM over the serial
bus.
December 2015 11
Figure 9 · Board Configuration 8
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ZLE30267 Hardware Guide
Board
Config.
Number
Serial
Bus
Master
Serial
Bus Slave
Description
Switch and Jumper Settings
USB Controller IO
Pin Settings
1
USB
(SPI)
DUT
GUI/PC is master of SPI bus,
and controls serial bus
configuration settings. DIP
switch settings control DUT
GPIOs. DUT loads
configuration from internal ROM
or EEPROM (devicedependent).
Switch and Jumper Configurations, Detailed Listing
Each of the possible board configurations illustrated above is implemented as a collection of settings. The
settings are comprised of jumper assignments, DIP switch settings, and/or software-controlled bit port logic
(1=high, 0=low). This section provides a comprehensive listing of all the board settings for each
configuration. It is important to note that for configurations in which the DUT is an active element, settings
must be applied prior to and held during the DUT reset cycle so that the DUT starts up in a state which is
synchronized with the board.
Table 1 lists the configurations and their associated settings. References to the configuration topology
diagrams in the preceding section are shown in column 1. A summary listing of the Jumpers and switches
referenced in Table 1 can be found in Table 3.
The reader is referred to applicable device datasheets for further information about DUT reset and
configuration. Some signals, typically GPIOs, may change once DUT has initialized. Note: at this time not all
configurations are fully supported by software.
Table 1 · Serial Bus DIP Switch and Jumper Configurations
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ZLE30267 Hardware Guide
Board
Config.
Number
Serial
Bus
Master
Serial
Bus Slave
Description
Switch and Jumper Settings
USB Controller IO
Pin Settings
3
USB
(SPI)
JP1 or
JP5
GUI/PC controls external
EEPROM connected at header,
or external DUT via SPI cable,
and serial bus configuration.
If DUT is running, GPIO DIPs
should be left as configured.
JP9 = on
JP6: all open
SW1.IF0 = 1
SW1.IF1 = 1
SW1.PUPD_ENB = 0
The following sections provide detailed listings of the various evaluation board user interface components.
Power Supply
The board provides several options for evaluating device performance with respect to power supply
configuration. DUT power configuration is highly customizable. A thorough understanding of the DUT and
board operation should be developed prior to customizing power settings on the board. Table 2 summarizes
the power supply related hardware connectors and their functions.
Sets oscillator voltage (shunt pins 1-2=3.3V, shunt pins 2-3=
2.5V, open = 1.8V)
Silkscreen
Reference
Device/ Function
Basic Setting
Schematic
Sheet
Description
JDR1 (USB)
USB connector
Connected to PC
2
Connects board to host computer
JP9 (PWREN#)
2 pin header
Shunt installed
2
Enables USB interface controls on board
JP2
2 pin header
Shunt installed
2
Serial bus voltage translator reference voltage
S2 (DUT
RESET)
Reset pushbutton
Inactive
2
Sends a reset signal to DUT.
JP1
10 pin header
Unconnected
3
Can be used to connect an external SPI or I2C master to
DUT or EEPROM on board
JP6
8 pin header
Shunts on pins 1-2,
3-4, 5-6, 7-8
3
Connects EEPROM to switched SPI bus
JP3
3 pin header
Shunt on pins 1-2
3
Configure JP1 as SPI SCLK or I2C SCL
JP4
3 pin header
Shunt on pins 1-2
3
Configure JP1 as SPI SI or I2C SDA
JP5
8 pin header
No shunts
3
Probe/test serial header for EEPROM or DUT
JP7
10 pin header
No shunts
3
Test/ pull down header for DUT GPIO pins
SW2
4 DIP switch
Depends on
Configuration
3
SPI bus switch hardware configuration (may be overdriven
by USB controller)
SW1
8 DIP switch
Depends on
Configuration
3
DUT hardware configuration pin and GPIO hardware
configuration switches. GPIO switches may be overdriven
by USB controller (not currently supported by GUI)
TP35, TP36,
TP38, TP40
Testpoints
N/A 3 Test points for probing SPI bus at DUT
J15
SMA Connector
3 DUT AC0_GPIO0 connection point
JP12
2 pin header
Shunt installed
3
Connect DUT AC0_GPIO0 to LEDs/local controller port
J16
SMA Connector
3 DUT AC1_GPIO1 connection point
JP13
2 pin header
Shunt installed
3
Connect DUT AC1_GPIO1 to LEDs/local controller port
J11
SMA Connector
3 DUT AC2_GPIO2 connection point
JP11
2 pin header
Shunt installed
3
Connect DUT AC2_GPIO2 to LEDs/local controller port
Reset, SPI Bus and GPIO Settings
The board has a number of DUT variants and configurations, some of which support GUI/PC software and
some of which are standalone operation. Table 3 lists the hardware interfaces which are related to SPI bus,
resets, and DUT configuration. This table provides a physical description and summary of the configurable
hardware components referenced in Table 1.
Table 3 · Reset, SPI bus and PC Interface Hardware Configuration
16 December 2015
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ZLE30267 Hardware Guide
Silkscreen
Reference
Device/ Function
Basic Setting
Schematic
Sheet
Description
J20
SMA Connector
3 DUT TEST_GPIO3 connection point
JP20
2 pin header
Shunt installed
3
Connect DUT TEST_GPIO3 to LEDs/local controller port
Silkscreen
Reference
Device/ Function
Basic Setting
Schematic
Sheet
Description
JP69
6 pin header
Shunt pins 5-6
7
2-pin shunt installed connects OSC power (see JP70) to one
of three oscillators (pins 1-2= JP67 header for daughter card;
pins 3-4 = Y2; pins 5-6= Y3)
JP67
10-pin receptacle for
oscillator daughter
board
7 Microsemi custom daughter board installs here.
JP64
10 pin header
Shunt pins 1-3
7
XA pin clock patch header. Shunt settings are as follows:
pins 1-2: JP67 to J31 (monitor JP67)
pins 1-3: JP67 to DUT XA pin
pins 3-5: Y2 to DUT XA pin
pins 5-7: Y2 to J31 (monitor Y2)
pins 4-6: Y3 to DUT XA pin
pins 6-8: Y3 toJ31 (monitor Y3)
pins 2-4: J31 to DUT XA pin (external clock in)
J31
SMA connector
7
Access point for monitoring an oscillator on board, or providing
DUT XA pin clock from an external clock source
JP66
2 pin header
Open
7
Open selects AC coupled clock connection to J31; shunt
selects DC coupling to J31
JP72
6 pin header
Shunt pins 3-4
7
Header for mounting optional XTAL or oscillator device.
Located on bottom side of board. Shunt on pins 3-4 patches
oscillator signal from patch header JP64 to DUT XA pin
Clock Source
Jumper Settings
Y2 on-board 3.2mm x 2.5mm single-ended oscillator site
The board provides several options for driving the timing device’s XA input pin from an on-board oscillator,
crystal, or an external source. Table 4 summarizes the oscillator related hardware jumpers and connectors
and functionality. Table 5 summarizes board jumper settings required to set up each clock source.
Table 4 · XA Pin Oscillator Configurable Hardware
Table 5 · DUT XA Pin Source Selection Jumper Settings
The various combinations of GPIO[2,1,0] and IF[1,0] mode bits which apply during DUT reset are
summarized in Table 6. As described in the timing device datasheets, these five bits determine the operating
mode of the DUT with respect to its serial bus interface and configuration data fill selection. Serial bus
steering must be coordinated with mode bits as described in Table1.
Table 6 · DUT Reset: Mode Bit Settings
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ZLE30267 Hardware Guide
DUT Type
DUT Mode
Settings (DIP controlled)
Settings (GUI Controlled, on reset)
Internal EEPROM
I2C Slave
I2C address: [SW1.IF1,SW1.IF0 ] = [0,0] or
[0,1] or [1,0]
Notes
For all DUT modes, TEST_GPIO3 = 0 whether by DIP control or GUI control.
See Table 1 for further details on configuration modes.
Input Clocks
The board’s IC1 and IC2 clock inputs can be configured to accept either a differential or single-ended signal
using jumpers. When configured as a differential input, IC1 or IC2 can be configured as either AC-coupled
or DC-coupled. IC3 is a single-ended input by definition, and can be configured to be either AC-coupled or
DC-coupled. Table 7 summarizes the input clock related hardware connectors and functionality. Table 8
shows how to configure the ICx jumpers for either a differential or single-ended input.
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ZLE30267 Hardware Guide
Silkscreen
Reference
Device/ Function
Basic Setting
Schematic
Sheet
Description
J27 (IC1P)
J28 (IC1N)
SMA connectors
Differential clock input
7
IC1 differential or single-ended input. Various
configurations are created using JP54, JP55,
JP44, JP45
JP54, JP55
3-pin headers
Shunt pins 2-3
7
JP54 applies to IC1P. JP55 applies to IC1N.
Settings:
Open = AC coupled input
Shunt pins 1-2 = AC-couple DUT pin to GND
(unused)
Shunt pins 2-3 = DC-coupled signal
JP44, JP45
JP44: shunt (default) terminates IC1P/N as 100
ohms differential. Remove for single ended
operation.
JP45: normally open. Shunt to terminate IC1P as
50 ohms to GND (and optionally IC1N if JP44 is
installed)
J24 (IC2P)
J23 (IC2N)
SMA connectors
Differential clock input
7
IC2 differential or single-ended input. Various
configurations are created using JP36, JP35,
JP39, JP40
JP36, JP35
3-pin headers
Open
7
JP36 applies to IC2P. JP35 applies to IC2N.
Settings:
Open = AC coupled input
Shunt pins 1-2 = AC-couple DUT pin to GND
(unused)
Shunt pins 2-3 = DC-coupled signal
JP39, JP40
2-pin headers
Shunt JP30
7
JP39: shunt (default) terminates IC2P/N as 100
ohms differential. Remove for single ended
operation.
JP40: normally open. Shunt to terminate IC2P as
50 ohms to GND (and optionally IC2N if JP39 is
installed)
J19 (IC3)
SMA connector
AC coupled clock input
7
Single ended clock input with configuration
options
JP31
2-pin header
Shunt pins 1-2
7
Header open connects DUT IC3 pin to J31 SMA
jack as AC coupled
Shunt connects DUT IC3 pin to J31 SMA as DC
coupled
Input Clock
Mode
Coupling
Jumper Settings
IC1
Differential
AC (100 ohms
differential load)
JP54 = open
JP55 = open
JP45 = open
JP44 = installed
The board supports evaluation of all device output clocks using SMA connectors. Table 8 summarizes the
output clock hardware connectors. To limit parasitic circuit loads, there are no jumper options on output
clocks. Configurations can be modified only by means of discrete component substitutions.
December 2015 21
Note that OC3 and OC8 have on-board balun circuitry. See schematic sheet 6 for details.
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ZLE30267 Hardware Guide
Silkscreen
Reference
Device/ Function
Basic Setting
Schematic
Sheet
Description
J32(OC1P)
J35 (OC1N)
OC1 Output
Differential
6
Output clocks, referenced to VDDOA
J34 (OC2P)
J37 (OC2N)
OC2 Output
Differential
6
Output clocks, referenced to VDDOA
J33 (OC3P)
J36 (OC3N)
OC3 Output
Differential,
balun *
6
Output clocks, referenced to VDDOB
J30 (OC4P)
J29 (OC4N)
OC4 Output
Differential
6
Output clocks, referenced to VDDOC
J26 (OC5P)
J25 (OC5N)
OC5 Output
Differential
6
Output clocks, referenced to VDDOC
J22 (OC6P)
J21 (OC6N)
OC6 Output
Differential
6
Output clocks, referenced to VDDOD
J18 (OC7P)
J17 (OC7N)
OC7 Output
Differential
6
Output clocks, referenced to VDDOD
J12 (OC8P)
J8 (OC8N)
OC8 Output
Differential,
balun *
6
Output clocks, referenced to VDDOE
J13 (OC9P)
J9 (OC9N)
OC9 Output
HCSL
6
Output clocks, referenced to VDDOF
J14 (OC10P)
J10 (OC10N)
OC10 Output
2xCMOS
6
Output clocks, referenced to VDDOF
* OC3 and OC8 have a discrete component option to wire in a balun. The default configuration is balun wired in. A
single ended clock appears only on the “P” connector of the pair with this option.
All output clocks include a 100 ohm differential resistor across the P and N pins and should be configured to run in
LVDS mode unless discrete components values are adapted to other output formats.
Table 9 · Output Clock Hardware Configuration
GPIO Header and Status LEDs
The device’s bi-directional GPIO pins are accessible on the 10-pin header JP7. The header pins are labeled
for easy identification. The present states of GPIO0, GPIO1, GPIO2, and GPIO3 are indicated by LEDs D9,
D8, D7 and D6, respectively. LEDs D2 through D5 are not defined and may be used by the GUI/PC
software application as needed.
Connecting Off-Board Devices
Two pin headers provide direct access to the ZLE30267 switched serial bus. JP1 and JP5 connect in to the
serial bus signals on the board. JP1 is a 10-pin shrouded and keyed header which is compatible with the
Aardvark brand USB to SPI/I2C adapter interface cable. JP5 is a more generic 8-pin open body header.
Various configurations supported by headers JP1 and JP5 are listed in Table 1.
Possible uses for the headers include the following:
Load DUT from and/or program EEPROMs in a separate socketed board
Connect the GUI to a DUT in a customer’s board via cabled SPI bus connection
Interface a controller in a customer’s board with the ZLE30267 board DUT to assist software
development and debugging.
Table 10 and Table 11 list all of the pin assignments of JP1 and JP5.
22 December 2015
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ZLE30267 Hardware Guide
Signal
Pin Number
Pin Number
Signal
SCL 1 2
GND
SDA 3 4
N.C.
MISO
5 6 N.C.
SCLK
7 8 MOSI
CSB
9
10
GND
Notes: SCL and SDA pins require changes to shunts on
headers JP3 and JP4 to connect on board.
Signal
Pin Number
Pin Number
Signal
CSN
1 2 GND
MISO
3 4 GND
MOSI
5 6 GND
SCLK
7
8
GND
Clock Net
Components
Basic Setting
Schematic
Sheet
Description/ Alternate Values
IC3
R108, R109
R108=0, R109= not
installed
7
R values can be used to create a voltage
divider, receiver bias, or end termination
OC1P
R138, R132,
R183
LVDS and
programmable
differential modes:
R138= 0 ohms, R132=
not installed, R183 =
100 ohms
6
CMOS mode: install a series termination resistor
as R138 if required; remove R183
HCSL mode: install a series termination resistor
R138 if required; remove R183
OC1N
R139, R133
LVDS and
programmable
differential modes:
R139= 0 ohms, R133=
not installed
6
CMOS mode: : install a series termination
resistor as R139 if required
HCSL mode: install a series termination resistor
R139 if required
Table 10 · JP1 Serial Header Pin Assignments
Table 11 · JP5 Serial Header Pin Assignments
Discrete Component Options for Input and Output Clocks
This section identifies components on clock circuits that an advanced user would most likely consider
modifying. A sampling of settings is summarized in Table 12 below.
Table 12 · Discrete Component Options for Clocks
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ZLE30267 Hardware Guide
Clock Net
Components
Basic Setting
Schematic
Sheet
Description/ Alternate Values
OC3P
R128, R134,
C14, C15, R146,
R185
LVDS and
programmable
differential modes,
differential to single
ended with on-board
balun.
R134=0
R128=dni
C15=100nF
C14=dni
R146=0
6
AC coupled differential outputs (bypass balun):
C15= dni, R146=dni , C14 = 100nF, plus basic
settings for R128, R134, R185
DC coupled differential outputs (bypass balun):
C15= dni, R146=dni , C14 = 0 ohms, plus basic
settings for R128, R134, R185
HCSL: change R134 to a termination resistor
value if required
OC3N
R129, R135,
C16, C17
LVDS and
programmable
differential modes,
differential to single
ended with on-board
balun.
R135=0
R129=dni
C16=100nF
C17=dni
6
AC coupled differential outputs (bypass balun):
C16= dni, C17 = 100nF, plus basic settings for
R129, R135
DC coupled differential outputs (bypass balun):
C16= dni, C17 = 0 ohms, plus basic settings for
R129, R135
HCSL: change R135 to a termination resistor
value if required
Notes
Settings for OC1 can be used as a template for OC2, OC4, OC5, OC6, OC7, OC9, and OC10. Please refer to ZLE30267
schematic.
Settings for OC3 can be used as a template for OC8.
OC9 is factory-configured for HCSL with R191 not populated and R90=0 and R91=0.
OC10 is factory-configured for 2xCMOS with R192 not populated and R92=30 and R93=30.
Oscillator / Crystal Daughter Card
Daughter Card Overview
The ZLE30267 evaluation board provides an on-board, low-jitter oscillator which can be used as the
reference clock for evaluating device features and output clock jitter performance. Applications requiring a
more detailed evaluation with a specific reference source can take advantage of the ZLE30267 oscillator /
crystal daughter card. This plug-in card provides an easy method to evaluate alternate oscillator and crystal
options without the need to re-work the ZLE30267 evaluation board.
The schematic for the ZLE30267 oscillator / crystal daughter card is shown in Figure 10. The card contains
two circuits, one circuit on each side of connector JP1. The left side circuit is the oscillator circuit. This
circuit can be used to evaluate 7mm x 5mm and 3mm x 2.5 mm surface mount oscillators. The oscillator is
24 December 2015
powered through connector JP1 by a power supply located on the ZLE30267 evaluation board. This supply
can be configured to a voltage of 3.3V, 2.5V or 1.8V using evaluation board jumper JP70. The right side
circuit is the crystal resonator circuit. This circuit can be used to evaluate 3.2mm x 2.5mm and 2.5mm x
2mm surface mount crystal resonators.
The assembly drawing for the ZLE30267 oscillator / crystal daughter card is shown in Figure 11. The
physical layout of the card layout is similar to the schematic with connector JP1 located in the center of the
board, all oscillator circuit components located on the left side of JP1, and all crystal resonator circuit
components located on the right side of JP1. When an XO or crystal daughter card assembly is built, only
one of these two circuits is populated.
The ZLE30267 oscillator / crystal daughter is provided with components JP1, C2, and R2 pre-installed. An
oscillator daughter card assembly is built by installing two additional components. The first component is the
oscillator to be evaluated which is installed at site Y1 or Y3 based on its package size. The second
component is resistor R3 which is the series source termination resistor for the oscillator output clock signal.
The value of R3 is chosen such the total impedance of the oscillator output driver and R3 is 50 Ω. An
example of an oscillator daughter card assembly is shown in Figure12. The installed components are
indicated in red.
The ZLE30267 oscillator / crystal daughter is provided with components JP1, C2, and R2 pre-installed. The
crystal oscillator circuit does not use components C2 and R2. These components have no impact on the
circuit performance and can remain installed. A crystal daughter card assembly is built by installing
components R1, R5, and Y2. Resistors R1 and R5 are each a fixed value of 0 Ω. Crystal Y2 is chosen
based on the specifications detailed in the device data sheet. An example of a crystal resonator daughter
card assembly is shown in Figure 13. The installed components are indicated in red.
The ZLE30267 oscillator / crystal daughter card is installed on the ZLE30267 evaluation board 3x2 pin
header JP72 located on the bottom side of the board. Prior to installation, the jumper installed on JP72 pins
3-4 must be removed. The remaining ZLE30267 evaluation board configuration for using the daughter card
is:
JP70 = shunt installed on pin 1-2 for 3.3V supply oscillator or crystal; shunt on pins 2-3 for 2.5V
An example of a ZLE30267 oscillator / crystal daughter card installed on header JP72 is shown in Figure 14.
When the daughter card is not installed, a jumper must be installed on JP72 pins 3-4.
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any liability whatsoever arising out of the application or use of any product or circuit. The products sold
hereunder and any other products sold by Microsemi have been subject to limited testing and should
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specifications are believed to be reliable but are not verified, and Buyer must conduct and complete all
performance and other testing of the products, alone and together with, or installed in, any endproducts. Buyer shall not rely on any data and performance specifications or parameters provided by
Microsemi. It is the Buyer’s responsibility to independently determine suitability of any products and to
test and verify the same. The information provided by Microsemi hereunder is provided “as is, where is”
and with all faults, and the entire risk associated with such information is entirely with the Buyer.
Microsemi does not grant, explicitly or implicitly, to any party any patent rights, licenses, or any other IP
rights, whether with regard to such information itself or anything described by such information.
Information provided in this document is proprietary to Microsemi, and Microsemi reserves the right to
make any changes to the information in this document or to any products and services at any time
without notice.
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