Microsemi Corporation SG55327L-883B, SG55327F, SG55327F-883B, SG55327J, SG55327J-883B Datasheet
SG55327/SG75327
4/90 Rev 1.2 7/96 LINFINITY Microelectronics Inc.
Copyright 1994 11861 Western Avenue
∞ ∞
∞ ∞
∞ Garden Grove, CA 92841
1 (714) 898-8121
∞∞
∞∞
∞ FAX: (714) 893-2570
QUAD SOURCE MEMORY DRIVER
FEATURES
••
••
• Quad source memory drivers
••
••
• 600mA output current capability
••
••
• V
CC2
drive voltage variable to 24V
••
••
• Output capable of swinging between V
CC2
and
ground
••
••
• High-repetition-rate driver compatible with high–
speed magnetic memories
••
••
• Inputs compatible with TTL decoders
••
••
• Minimum time skew between strobe and output–
current rise
••
••
• Pulse-transformer coupling eliminated
••
••
• Drive-line lengths reduced
HIGH RELIABILITY FEATURES - SG55327
♦♦
♦♦
♦ Available to MIL-STD-883
♦♦
♦♦
♦ Scheduled for MIL-M-38510 QPL listing
♦♦
♦♦
♦ LMI level “S” processing available
DESCRIPTION
The SG55327/SG75327 is a monolithic quad source driver
designed to meet the high current and fast switching speed
requirements of magnetic memory systems. Each driver is
independently controlled and capable of sinking up to 600mA.
Paired with the SG55326 Quad Sink Driver, the SG55327/
SG75327 provides the current drive necessary for many sink/
source applications.
The SG55327/SG75327 has also been used in many non-memory
applications: for example, as the driver for a clock circuit, relay,
lamp, or small motor, or any application where a 600mA source
driver is needed.
The SG55327 is characterized for use over the full military
operating ambient temperature range of -55°C to 125°C while the
SG75327 is characterized from 0°C to 70°C.
These devices are available in 16-pin ceramic DIP, 16-pin plastic
DIP and 16-pin flatpack.
BLOCK DIAGRAM
SG55327/SG75327
4/90 Rev 1.2 7/96 LINFINITY Microelectronics Inc.
Copyright 1994 11861 Western Avenue
∞ ∞
∞ ∞
∞ Garden Grove, CA 92841
2 (714) 898-8121
∞∞
∞∞
∞ FAX: (714) 893-2570
ABSOLUTE MAXIMUM RATINGS (Note1)
Supply Voltage (V
CC1
) (Note 2) ............................................
Supply Voltage (V
CC2
) .........................................................
Input Voltage (any address or strobe input) ......................
Output Collector Voltage ....................................................
7.0V
25V
5.5V
25V
750mA
150°C
150°C
-65°C to 150°C
300°C
Output Collector Current .............................................
Operating Junction Temperature (T
C
)
Hermetic (J, F-Packages) .........................................
Plastic (N-Package) ..................................................
Storage Temperature Range ..........................
Lead Temperature (Soldering, 10 seconds) ..................
Note 1. Values beyond which damage may occur.
Note 2. Voltage values are with respect to network ground terminal.
THERMAL DATA
J Package:
Thermal Resistance-
Junction to Case, θ
JC
.................. 30°C/W
Thermal Resistance-
Junction to Ambient, θ
JA
............... 80°C/W
N Package:
Thermal Resistance-
Junction to Case, θ
JC
.................. 40°C/W
Thermal Resistance-
Junction to Ambient, θ
JA
.............. 65°C/W
F Package:
Thermal Resistance-
Junction to Case, θ
JC
................... 70°C/W
Thermal Resistance-
Junction to Ambient, θ
JA
............ 115°C/W
Note 3. Range over which the device is functional.
Output Collector Current .................................................
Operating Ambient Temperature Range:
SG55327 .......................................................
SG75327 .............................................................
4.5V to 5.5V
4.5V to 24V
24V
600mA
-55°C to 125°C
0°C to 70°C
Supply Voltage (V
CC1
) ............................................
Supply Voltage (V
CC2
) .............................................
Output Collector Voltage ....................................................
RECOMMENDED OPERATING CONDITIONS (Note 3)
ELECTRICAL CHARACTERISTICS
(Unless otherwise specified, these specifications apply over the operating ambient temperatures for SG55327 with -55°C ≤ TA ≤ 125°C, and SG75327
with 0°C ≤ TA ≤ 70°C. Low duty cycle pulse testing techniques are used which maintains junction and case temperatures equal to the ambient
temperature.)
2
V
CC1
= 4.5V, I
IN
= -10mA, TA = 25°C
V
CC1
= 4.5V, V
COL
= 24V
V
CC1
= 4.5V, V
COL
= 24V, TA = 25°C
V
CC1
= 4.5V, V
OUT
= 0V, I
SOURCE
= –600mA
T
A
= 25°C
V
IN
= 5.5V
V
IN
= 2.4V
V
IN
= 0.4V
Test ConditionsParameter Units
Min. Typ.
Static Section
High-Level Input Voltage (VIH)
Low-Level Input Voltage (V
IL
)
Input Clamp Voltage (V
IK
)
Collectors Terminal Off-State
Current (I
OFF
)
Saturation Voltage (V
SAT
) (Note 4)
Input Current (IIN)
Address
Strobe
High-Level Input Current (I
IH
)
Address
Strobe
Low-Level Input Current (I
IL
)
Address
Strobe
Min. Typ.
SG75327SG55327
Max.Max.
-1.0
0.43
-1.0
-4.0
0.8
-1.7
500
150
0.90
0.70
1
4
40
160
-1.6
-6.4
2
-1.0
0.43
-1.0
-4.0
0.8
-1.7
200
200
0.90
0.75
1
4
40
160
-1.6
-6.4
V
V
V
µA
µA
V
V
mA
mA
µA
µA
mA
mA
Note A. Junction Temperature Calculation: TJ = TA + (PD x θJA).
Note B. The above numbers for θJC are maximums for the limiting thermal
resistance of the package in a standard mounting configuration.
The θJA numbers are meant to be guidelines for the thermal
performance of the device/pc-board system. All of the above
assume no ambient airflow.
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