SG120
11/91 Rev 1.4 6/97 LINFINITY Microelectronics Inc.
Copyright 1997 11861 Western Avenue
∞ ∞
∞ ∞
∞ Garden Grove, CA 92841
2 (714) 898-8121
∞∞
∞∞
∞ FAX: (714) 893-2570
ABSOLUTE MAXIMUM RATINGS (Note 1)
NEGATIVE REGULATOR
-65°C to 150°C
300°C
Operating Junction Temperature
Hermetic (K, R, IG - Packages) ...................................
Storage Temperature Range ...........................
Lead Temperature (Soldering, 10 Seconds) .................
FIGURE 1.
MAXIMUM AVERAGE POWER DISSIPATION
FIGURE 2.
QUIESCENT CURRENT VS. LOAD
FIGURE 3.
TEMPERATURE COEFFICIENT
Device Input Voltage Differential
Output Voltage Input Voltage (Output shorted to ground)
-5V -35V 35V
-5.2V -35V 35V
-8V -35V 35V
-12V -35V 35V
-15V -40V 35V
-18V -40V 35V
-20V -40V 35V
150°C
Note 1. Values beyond which damage may occur.
Operating Junction Temperature Range:
SG120 ...........................................................
RECOMMENDED OPERATING CONDITIONS (Note 2)
CHARACTERISTIC CURVES
-55°C to 150°C
Note 2. Range over which the device is functional.
THERMAL DATA
K Package:
Thermal Resistance-
Junction to Case, θ
JC
................. 3.0°C/W
Thermal Resistance-
Junction to Ambient, θ
JA
............... 35°C/W
R Package:
Thermal Resistance-Junction to Case, θJC................. 5.0°C/W
Thermal Resistance-Junction to Ambient, θJA.............. 40°C/W
T Package:
Thermal Resistance-Junction to Case, θJC.................. 15°C/W
Thermal Resistance-Junction to Ambient, θJA............ 120°C/W
IG Package:
Thermal Resistance-Junction to Case, θJC................. 3.5°C/W
Thermal Resistance-Junction to Ambient, θJA.............. 42°C/W
L Package:
Thermal Resistance-Junction to Case, θJC.................. 35°C/W
Thermal Resistance-Junction to Ambient, θJA............ 120°C/W
Note A. Junction Temperature Calculation: TJ = TA + (PD x θJA).
Note B. The above numbers for θ
JC
are maximums for the limiting thermal
resistance of the package in a standard mounting configuration.
The θJA numbers are meant to be guidelines for the thermal
performance of the device/pc-board system. All of the above
assume no ambient airflow.