Microsemi Corporation SG109IG, SG109K, SG309K, SG309T Datasheet
SG109/SG309
4/90 Rev 1.1 2/94 LINFINITY Microelectronics Inc.
Copyright 1994 11861 Western Avenue
∞ ∞
∞ ∞
∞ Garden Grove, CA 92841
1 (714) 898-8121
∞∞
∞∞
∞ FAX: (714) 893-2570
FEATURES
••
••
• Fully compatible with TTL and DTL
••
••
• Output current in excess of 1A
••
••
• Internal thermal overload protection
••
••
• No additional external components
••
••
• Bandgap reference voltage
••
••
• Foldback current limiting
HIGH RELIABILITY FEATURES-SG109
♦♦
♦♦
♦ Available to MIL-STD-883
♦♦
♦♦
♦ MIL - M38510 / 10701BXA - JAN109T
♦♦
♦♦
♦ Radiation data available
♦♦
♦♦
♦ LMI level "S" processing available
5 -VOLT FIXED VOLTAGE REGULATORS
DESCRIPTION
The SG109/SG309 is a completely self-contained 5V regulator.
Designed to provide local regualtion at currents up to 1A for digital
logic cards, this device is available in the hermetic TO-3, TO-66, TO39 and hermetic and plastic TO-220.
A major feature of the SG109's design is its built-in protective
features which make it essentially blowout proof. These consist of
both current limiting to control the peak currents and thermal
shutdown to protect against excessive power dissipation. With the
only added component being a possible need for an input bypass
capacitor, this regulator becomes extremely easy to apply. Utilizing
an improved Bandgap reference design, problems have been
eliminated that are normally associated with the zener diode
references, such as drift in output voltage and large changes in the
line and load regulation.
SCHEMATIC
SG109/SG309
4/90 Rev 1.1 2/94 LINFINITY Microelectronics Inc.
Copyright 1994 11861 Western Avenue
∞ ∞
∞ ∞
∞ Garden Grove, CA 92841
2 (714) 898-8121
∞∞
∞∞
∞ FAX: (714) 893-2570
Input Voltage ........................................................................35V
Power Dissipation ...........................................Internally Limited
Storage Temperature Range .............................-65°C to 150°C
ABSOLUTE MAXIMUM RATINGS (Note 1)
Note 1. Exceeding these ratings could cause damage to the device.
K Package:
Thermal Resistance-
Junction to Case, θ
JC
................. 3.0°C/W
Thermal Resistance-
Junction to Ambient, θ
JA
.............. 35°C/W
R Package:
Thermal Resistance-
Junction to Case, θ
JC
................. 5.0°C/W
Thermal Resistance-
Junction to Ambient, θ
JA
.............. 40°C/W
IG Package:
Thermal Resistance-
Junction to Case, θ
JC
................. 3.5°C/W
Thermal Resistance-
Junction to Ambient, θ
JA
.............. 42°C/W
T Package:
Thermal Resistance-
Junction to Case, θ
JC
.................. 15°C/W
Thermal Resistance-
Junction to Ambient, θ
JA
............. 120°C/W
THERMAL DATA
Input Voltage Range ............................................... 7.0V to 25V
Note 2. Range over which the device is functional.
ELECTRICAL CHARACTERISTICS
(Unless otherwise specified, these specifications apply over the operating ambient temperatures for SG109 with -55°C ≤ TA ≤ 150°C, SG309 with
0°C ≤ T
A
≤ 125°C, and for VIN = 10V, I
OUT
= 500mA (K, R, and IG -Power Packages-) and I
OUT
= 100mA (T-package). Low duty cycle pulse testing techniques
are used which maintains junction and case temperatures equal to the ambient temperature.)
RECOMMENDED OPERATING CONDITIONS (Note 2)
Units
SG309SG109
Parameter Test Conditions
TA = 25°C
V
IN
= 7.1V to 25V, TA = 25°C
T
A
= 25°C
Power Pkgs: I
OUT
= 5mA to 1.5A
T-package: I
OUT
=5mA to 500mA
V
IN
= 7.4V to 25V
Power Pkgs: I
OUT
= 5mA to 1.0A,
P
≤ 20W
T-package: I
OUT
=5mA to 200mA, P ≤ 20W
V
IN
= 7.4V to 25V
With Line : V
IN
= 7.4V to 25V
With Load: Power Pkgs: I
OUT
= 5mA to 1.0A
T-package: I
OUT
=5mA to 200mA
f = 10Hz to 100KHz, T
A
= 25°C
T
A
= 25°C
Output Voltage
Line Regulation
Load Regulation
Total Output Voltage Tolerance
Quiescent Current
Quiescent Current Change
Output Noise Voltage
Long Term Stability
Ripple Rejection
4.7
4.6
4.6
50
5.05
4.0
15
15
5.0
5.0
40
10
5.3
50
100
50
5.4
5.4
10
0.5
0.8
0.8
4.8
4.75
4.75
50
5.05
4.0
15
15
5.00
5.00
40
20
5.2
50
100
50
5.25
5.25
10
0.5
0.8
0.8
V
mV
mV
mV
V
V
mA
mA
mA
mA
µV
mV
dB
Min.Max.Typ.Min. Typ. Max.
Operating Junction Temperature Range
SG109 ............................................................-55°C to 150°C
SG309 ............................................................... 0°C to 125°C
Operating Junction Temperature
Hermetic (K, R, T, IG-Packages).................................. 150°C
Lead Temperature (Soldering, 10 Seconds) ................ 300°C
Note A. Junction Temperature Calculation: TJ = TA + (PD x θJA).
Note B. The above numbers for
θJC are maximums for the limiting
thermal resistance of the package in a standard mounting configuration. The θ
JA
numbers are meant to be
guidelines for the thermal performance of the device/
pc-board system. All of the above assume no ambient
airflow.
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