Microsemi Corporation MMAD1109 Datasheet
FEATURES
0.050
0.016
0.41
1.27
F
CIRCUIT DIAGRAM
• 7 Diode Array
• SOIC 14 pin Surface Mount Package
• UL 94V-0 Flammability Classification
MECHANICAL
• Molded SOIC 14 Pin
• Weight: 0.127 grams (approximate)
• Marking: Logo, device number, date code
• Pin #1 defined by DOT on top of package
MAXIMUM RATINGS
• Operating Temperatures: -550C to +1500C
• Storage Temperature: -550C to +1500C
• Forward Surge Current: 2.0 Amps (8.3 mS)
• Minimum Breakdown Voltage V
• Working Peak Reverse Voltage V
• Continuous forward current IF: 400 mA
• Power dissipation (PD): 500 mW
• Derating factor: 4.0 mW/°C
(BR)
: 90V
RWM
: 75V
8700 E. Thomas Road
Scottsdale, AZ 85251
Tel: (480) 941-6300
Fax: (480) 947-1503
MMAD1109
Switching Diode Array
PACKAGING
• Tape & Reel EIA Standard 481
• 13 inch reel 2,500 pieces (OPTIONAL)
• Carrier tube 55 pcs per (STANDARD)
ELECTRICAL CHARACTERISTICS @ 250C Unless otherwise specified
Vbr @ Ibr
Part Number
= 100µA
V
MIN MAX @ Vr MAX @ Vr MAX MAX MAX MAX
MMAD1109 90 .200 20 .300 20 4.0 5.0 1.00 1.20
Ir
+25ºC
µA
Ir
+150ºC
µA
CAP @
B
C
D
G
J
K
L
0V
pF
INCHES MILLIMETERS
0.050 BSC 1.27 BSC
@If = 10mA
(nS)
MAXMINDIM MAXMIN
0.344 A 0.336 8.53 8.74
0.1580.150 3.81 4.01
0.0690.053 1.35 1.75
0.0210.011 0.28 0.53
0.0100.006 0.15 0.25
0.0100.004 0.10 0.20
0.2060.189 4.80 5.23
0.244P 0.228 5.79 6.19
trr
Vf
@If = 100mA
V
Vf
V
MSC0901.PDF ISO 9001 CERTIFIED REV G 7/05/2000
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