Microsemi Corporation MMAD1108 Datasheet

FEATURES

CIRCUIT DIAGRAM

• 8 Diode Array

• SOIC 16 pin Surface Mount Package

• UL 94V-0 Flammability Classification

MECHANICAL

• Molded SOIC 16 Pin

• Weight: 0.128 grams (approximate)

• Marking: Logo, device number, date code

• Pin #1 defined by DOT on top of package

MAXIMUM RATINGS

• Operating Temperatures: -550C to +1500C

• Storage Temperature: -550C to +1500C

• Forward Surge Current: 2.0 Amps (8.3 mS)

• Minimum Breakdown Voltage V

• Working Peak Reverse Voltage V

• Continuous forward current IF: 40 mA

• Power dissipation (PD): 500 mW

• Derating factor: 4.0 mW/°C

(BR)

: 90V

RWM

: 75V

8700 E. Thomas Road
Scottsdale, AZ 85251
Tel: [phone]
Fax: [phone]

MMAD1108

Switching Diode Array

PACKAGING

• Tape & Reel EIA Standard 481

• 13 inch reel 2,500 pieces (OPTIONAL)

• Carrier tube 48 pcs per (STANDARD)

ELECTRICAL CHARACTERISTICS @ 250C Unless otherwise specified

V

(BR)

Part Number

MMAD1108 90 75 .200 20 .300 20 4.0 5.0 1.00 1.20

G

@100µA

V

MIN MAX MAX @ V

A

B P

D

V

RWM

V

J

C

I

R

+25ºC

µA

L

R

I

R

+150ºC

µA

MAX @ V

CAP

@0V

pF

MAX MAX MAX MAX

R

t

rr

(nS)

V

F

@If = 10mA

V

@If = 100mA

V

F

V

MSC0900.PDF ISO 9001 CERTIFIED REV H 7/05/2000