Microsemi Corporation MM196 Datasheet
6 MOSFET Multi-Chip Module
PRELIMINARY SPECIFICATION
The MM196 is a Multi-Chip Module, MCM, incorporating 6 independent
DESCRIPTION
MOSFET die into a convenient BGA package. This device is also available
as discrete individual packaged Powermite3, see Microsemi data sheet
UPF1N100. This device is also available as bare die, see Microsemi data
sheet MSAFA1N100D. The MM196 allows users to externally connect the
MOSFETs via a motherboard or next assembly substrate into any
configuration desired. Custom variations of this product incorporating other
Microsemi protection die and/or passive components are available by
contacting the factory.
IMPORTANT:
For the most current data, consult
MICROSEMI
’s website:
http://www.microsemi.com
INDIVIDUAL COMPONENT
INDIVIDUAL COMPONENT SPECIFICATIONS
INDIVIDUAL COMPONENTINDIVIDUAL COMPONENT
Components
Q1 – Q6
Manufacturer
Microsemi Santa Ana MSAFA1N100D
SPECIFICATIONS
SPECIFICATIONS SPECIFICATIONS
Part Number
Characteristics
Note: Refer to individual data sheets for component performance.
If there are conflicting requirements, this document takes precedence.
Maximum Ratings @ 25ºC
Maximum Ratings @ 25ºC
Maximum Ratings @ 25ºC Maximum Ratings @ 25ºC
(UNLESS OTHERWISE SPECIFIED)
Parameter S y m b o l Min Max Unit
Peak Repetitive Drain
to Source Voltage
Operating Temperature
Range
V
DSS
T
op
1000 V
10 55 º C
Maximum Ratings @ 25ºC
Maximum Ratings @ 25ºC
Maximum Ratings @ 25ºC Maximum Ratings @ 25ºC
(UNLESS OTHERWISE SPECIFIED)
Description
Drain-Source On-State
Resistance,
Drain-Source On-State
Resistance,
R
DS(ON)1
R
DS(ON)2
Conditions TYP Max Unit
V
GS
I
D
V
I
D
T
= 10 Vdc
= 1 mAdc
= 7 Vdc
GS
= 5…150
mAdc
= 37ºC
C
,
12.5 13.5 ohm
,
12.5 ohm
Configuration and Dimensions
MM196
KEY FEATURES
KEY FEATURES
KEY FEATURES KEY FEATURES
!"
Miniature size, Multi-Chip
Module, MCM
!"
Convenient mounting, Ball Grid
Array, BGA
!"
Sn63/Pb37 solder bumps
(Alternate attach methods
available)
!"
Maximum switch voltage 1000V
APPLICATIONS/BENEFIT
APPLICATIONS/BENEFITSSSS
APPLICATIONS/BENEFITAPPLICATIONS/BENEFIT
!"
Three phase switching
!"
AC-DC converters
!"
Applications utilizing multiple
MOSFET die in multiple or array
configurations
Top View
0.38” typical
Microsemi
Schematic
MM196
0.35”
typical
0.050”
max
WWW.
Microsemi
.
COM
M
M
M
M
1
1
9
9
6
6
Copyright 2000
MSC1589.PDF ,2000-09-20
Microsemi
Santa Ana Division
2830 S. Fairview Street, CA. 92704, 714-979-8220, Fax: 714-557-5989
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