
User Guide
LX8204 12 V E-Fuse Evaluation Board

LX8204 12 V E-Fuse Evaluation Board
Contents
1 Revision History ............................................................................................................................ 1
1.1 Revision 1.0 ........................................................................................................................................ 1
2 Product Description ....................................................................................................................... 2
2.1 Applications ........................................................................................................................................ 2
2.2 Key Features ....................................................................................................................................... 2
3 Evaluation Board Schematic .......................................................................................................... 3
4 Recommended Operating Conditions ............................................................................................ 4
5 PCB Layout of Evaluation Board ..................................................................................................... 5
6 Bill of Materials .............................................................................................................................. 7
7 Test Procedure ............................................................................................................................... 8
8 Ordering Information ..................................................................................................................... 9
Microsemi Proprietary and Confidential. User Guide Revision 1.0

LX8204 12 V E-Fuse Evaluation Board
1 Revision History
The revision history describes the changes that were implemented in the document. The changes are
listed by revision, starting with the most current publication.
1.1 Revision 1.0
Revision 1.0 was published in August 2017. It was the first publication of this document.
Microsemi Proprietary and Confidential. User Guide Revision 1.0 1

LX8204 12 V E-Fuse Evaluation Board
2 Product Description
The LX8204 is a fast-acting E-Fuse switch designed to protect circuitry connected to its output (VOUT)
from transient input voltage surges on its input (VCC), and to protect VCC from overload current events
coming from the load on VOUT.
Voltage protection features include under-voltage lockout (UVLO), and over-voltage clamping. This
clamp limits VOUT voltage allowing continued circuit operation during an input over-voltage transient
condition, while UVLO ensures that VOUT remains off until VCC reaches its minimum operating
threshold. On the current side, the LX8204 protects the input from output short circuit and/or overcurrent condition with a 2 A–3.5 A current limit circuit. Additionally, the LX8204 protects the subsequent
systems from hot-swap condition.
Another protection feature is latching thermal shutdown of VOUT, with a fault flag output on the
combined EN/FAULT pin. Once thermal shutdown threshold is reached and the E-Fuse switch opens, the
tri-state EN/FAULT pin will be pulled to about 1.6 V, signaling to the system and potentially other
connected E-Fuse switches that a fault has occurred.
2.1 Applications
Hard-disk drive
Solid-state drive
Hot swap
PC cards
2.2 Key Features
Protected from hot-swap condition
50 mΩ(typical) RDSON internal E-Fuse FET protected from 24 V
Up to 24 V transient input range
<15 V output voltage clamp including dynamic transient
Continuous operation during VCC surge
2 A–3.5 A current limit at overloading
Over-temperature protection
13 ms and 1.4 ms/3.5 ms soft start rise time
Current limit during output soft start
UVLO detection
3 mm × 3 mm DFN available
Microsemi Proprietary and Confidential. User Guide Revision 1.0 2

LX8204 12 V E-Fuse Evaluation Board
3 Evaluation Board Schematic
The following illustration shows the evaluation board schematic.
Figure 1 • Evaluation Board Schematic
Microsemi Proprietary and Confidential. User Guide Revision 1.0 3

LX8204 12 V E-Fuse Evaluation Board
4 Recommended Operating Conditions
The following table lists the recommended operating conditions for the LX8204 evaluation board.
Table 1 • Recommended Operating Conditions
Description Symbol Min Max Unit
Input voltage VIN 10.8 18 V
Output current IOUT 0 3.5 A
Junction temperature TA –40 125 °C
Microsemi Proprietary and Confidential. User Guide Revision 1.0 4

LX8204 12 V E-Fuse Evaluation Board
5 PCB Layout of Evaluation Board
The LX8204 evaluation board is a four-layer board. The following illustrations depict each of the board's
four layers.
Figure 2 • Layer 1: Top Layer
Figure 3 • Layer 2: Ground Layer
Microsemi Proprietary and Confidential. User Guide Revision 1.0 5

LX8204 12 V E-Fuse Evaluation Board
Figure 4 • Layer 3: Third Layer
Figure 5 • Layer 4: Bottom Layer
Microsemi Proprietary and Confidential. User Guide Revision 1.0 6

LX8204 12 V E-Fuse Evaluation Board
6 Bill of Materials
The following table lists the bill of materials for the LX8204 evaluation board.
Table 2 • Bill of Materials
Item Part Type Part Description Reference Qty
1 Miscellaneous Components Microsemi IC—LX8204 U1 1
2 Miscellaneous Components Test point (J3) EN/FAULT 1
3 Miscellaneous Components Terminal VIN, VOUT, GND 3
4 Miscellaneous Components Jumper/2-pin J2 1
5 Miscellaneous Components 2N7002 Q5 1
6 Capacitors 1 µF/50 V/10%/0805/X5R C16 1
7 Capacitors 33 µF/25 V/10%/0805/X5R C8 1
8 Resistors 500 kΩ/1%/0805 R1 1
9 Resistors 100 kΩ/1%/0805 R9 1
Microsemi Proprietary and Confidential. User Guide Revision 1.0 7

LX8204 12 V E-Fuse Evaluation Board
1.
2.
3.
7 Test Procedure
The following lists the LX8204 evaluation board test point connections.
Table 3 • Test Point Connections
Name Description
VIN Device power input connector.
VOUT Device power output connector.
GND Ground pin for both input and output.
The following steps describe the test procedure.
Before connecting the power supply to the VIN and GND connector pins, set the power supply
voltage to 12 V.
Turn on the power supply. Use the oscilloscope to measure the soft start output voltage. The soft
start time should be 1.2 ms.
Start to increase the load current up to trigger thermal shutdown. Check the over-current level and
EN pin voltage. EN voltage should be around 1.7 V. Over current limit is around 3.5 A.
Microsemi Proprietary and Confidential. User Guide Revision 1.0 8

LX8204 12 V E-Fuse Evaluation Board
8 Ordering Information
The following table lists the ordering information for the LX8204 evaluation board.
Table 4 • Ordering Information
Part Order Number Description
LX8204-xyyILD DFN 3 mm × 3 mm 10L
LX8204 EVAL BOARD Evaluation PCB for LX8204
Note: “x” is the soft start time with RT= GND (1= 1.4 ms, 3= 3.5 ms). “yy” is the current limit
(20= 2 Amps, 25= 2.5 Amps, 30= 3 Amps, 35= 3.5 Amps).
Microsemi Proprietary and Confidential. User Guide Revision 1.0 9

LX8204 12 V E-Fuse Evaluation Board
Microsemi Corporate Headquarters
One Enterprise, Aliso Viejo,
CA 92656 USA
Within the USA: +1 (800) 713-4113
Outside the USA: +1 (949) 380-6100
Fax: +1 (949) 215-4996
Email: sales.support@microsemi.com
www.microsemi.com
© 2017 Microsemi Corporation. All rights reserved. Microsemi and the
Microsemi logo are trademarks of Microsemi Corporation. All other
trademarks and service marks are the property of their respective owners.
Microsemi makes no warranty, representation, or guarantee regarding the information contained herein or the suitability of its products and s ervices
for any particular purpose, nor does Microsemi assume a ny liability whatsoever arising out of the app lication or use of any product or circuit. The
products sold hereunder and an y other products sold by Microsemi have been s ubject to limited testing and should not be us ed in conjunction with
mission-critical equipment or applications. Any performance specifications are believed to be reliable but are not verified, and Buyer must condu ct and
complete all performance and other testing of the products, alone and together with, or installed in , any end-products. Buyer shall not rely on any data
and per formance specifications or para meters provided by Microsemi. It is the Buyer's responsibility to ind ependently determine suitability of any
products and to test and verify the same. The information provided by Microsemi hereunder is provided "as is, where is" and with all faults, and the
entire risk associated with such information is entirely with the Buyer. Microsemi does not grant, explicitly or implicitly, to any party any patent rights,
licenses, or any other IP rights, whether with regard to such information itself or anything described by such information. Information provided in this
document is proprietar y to Microsemi, and Micr osemi reserves the right to make any changes to the information in this document or to any products
and services at any time without notice.
Microsemi C orporation (Nasdaq: MSCC) offers a com prehensive portfoli o of semiconduct or and system solu tions for aerosp ace & defense,
communications, data center and industrial markets. Products include high-performance and radiation-ha rdened a nalog mi xed-signal integrated
circuits, FPGAs, So Cs and ASICs; power managemen t products; timing and synchr onization devices and precise time solutions, setting the world's
standard for time; voice processing devices; RF solutions; discrete components; enterprise storage and communication solutions; security technologies
and scalable anti-ta mper products; Ethernet solutions; Power-over-Ethernet ICs and midspans; as well as custom des ign capabilities and services.
Microsemi is headquartered in Aliso Viejo, California, and has approximately 4,800 employees globally. Learn more at www.microsemi.com.
MSCC-0102-UG-01006-1.0-0717
Microsemi Proprietary and Confidential. User Guide Revision 1.0 10