Microsemi LX7302 User Manual

LX7302

User Guide

LX7302 Evaluation Board

Preliminary

November 2018

LX7302 Evaluation Board

Contents

1 Revision History ............................................................................................................................. 1

1.1 Revision 2.0 ........................................................................................................................................ 1

1.2 Revision 1.0 ........................................................................................................................................ 1

2 Product Description ....................................................................................................................... 2

3 Evaluation Board Operation .......................................................................................................... 3

4 PCB Layout Guidelines ................................................................................................................... 4

5 Test Considerations ..................................................................................................................... 10

6 Evaluation Board Test Data .......................................................................................................... 11

7 Evaluation Board Schematic ........................................................................................................ 18

8 Bill of Materials ............................................................................................................................ 19

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LX7302 Evaluation Board

1 Revision History

1.1 Revision 2.0

Revision 2.0 was published in November 2018. In Revision 1.1, was updated.Table 3 (see page 19)

1.2 Revision 1.0

Revision 1.0 was published in 2012. It was the first publication of this document.

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2 Product Description

The LX7302 is a single-phase, step-down, DC-DC controller IC designed to drive a high-side N-channel
MOSFET and a low-side N-channel synchronous rectifier. The controller includes the following features:

Inductor current sensing
Voltage droop control
Programmable VID control or external reference
Over-current protection
Over- and under-voltage protection
Power saving mode
Power OK indicator

The LX7302 device is housed in a 3 mm × 3 mm 20-pin plastic QFN package.

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3 Evaluation Board Operation

The LX7302 evaluation board contains a single LX7302 device and components necessary to provide four
output voltages at a maximum current of 30 A. Input voltages up to 25 V are supported. The input
supply source should be voltage-limited to 25 V maximum to protect the input capacitors, which are
rated at 25 V.

As configured, the evaluation board supports a user-programmable VID mode; however, the External
Reference mode is supported by changing four component values. See Test Considerations (see page 10

for further details.)

All input and output connections can be made using clip connections to on-board test points. In
addition, through-hole connections to accommodate 16 AWG wires are provided for high-output
current testing.

The following table describes the test point descriptions for the evaluation circuit. Please refer to this
table for evaluation board setup.

Table 1 • Evaluation Board I/O Connector and Test Point Reference

Reference Description

TP1 Switch node monitor point. Used to monitor switching output.

TP2 LX7302 UG pin monitor. Used to monitor upper FET gate signal.

TP3 LX7302 LG pin monitor. Used to monitor lower FET gate signal.

TP4 LX7302 POK pin monitor. Pulled up to VCC through a 10K resistor. Used to monitor Power OK indicator.

TP5 VOUT RTN. Connection for load return and monitor point for output voltage (–). Five 16 AWG through-hole

connections provided for high-current load return.

TP6 VOUT (+). Output positive connect to load, and monitor point for output voltage (+). Five 16 AWG through-hole

connections provided for high-current load return.

TP7 FCCM/PSM input. Control for LX7302 power saver mode. A voltage greater than 2.5 V on this pin places the

LX7302 in forced continuous conduction mode (FCCM) operation. A voltage less than 0.5 V on this pin places
the LX7302 in power saver mode (PSM) operation. See the LX7302 datasheet for details regarding these
functions.

TP8 Enable input. Enable control for the LX7302. A voltage greater than 2.5 V on this pin will disable the LX7302.

TP9 External reference input. A 0 V to 2.2 V input to this pin controls the output voltage when in external reference

mode. As configured, this mode is disabled, but it may be enabled by changing four components on the
evaluation board. See for further details.Test Considerations (see page 10)

TP14 LX7302 VCC input. Connect a 5 V ±10% source capable of 200 mA to this test point.

TP15 LX7302 VCC return. Connect the 5 V supply return to this test point.

TP16 5 V to 25 V input. Connect a 5 V to 25 V supply source capable of a 10 A current. The supply source current is

based on an as-configured maximum output voltage of 1.3 V; if higher output voltages are used, a supply of
higher current capability may be needed.

TP17 5 V to 20 V input return.

TP18 LX7302 VID 1 input. One of two VID control inputs. See the LX7302 datasheet for details.

TP19 LX7302 VID 0 input. One of two VID control inputs. See the LX7302 datasheet for details.

TP20 Evaluation board power ground. Used for measurement reference.

TP21 Evaluation board power ground. Used for measurement reference.

JB1 Droop control enable/disable. With JB1 installed, the LX7302 voltage droop function is disabled. Removing JB1

jumper enables the droop function. See the LX7302 datasheet for details.

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4 PCB Layout Guidelines

This section details the PCB layout guidelines for the LX7302 device and extensively references Figure 1

. It is necessary to give due consideration to the high-current paths when laying out the (see page 5)
PCB, particularly the following: the high switching current paths from the input filter capacitors (C12–
C14) to the upper MOSFET (Q1); Q1’s connection to the output inductor (L1); L1’s connection to the
output capacitors (C9–C11); the synchronous MOSFET (Q2 and Q3) connection to L1; C9–C11’s return
connection to Q2 and Q3; and C9–C11’s return connection to C12–C14. These critical current paths
should be on a single layer only and should not be established on multiple layers through vias.
Establishing these traces with their associated parts on the top layer is preferable, both electrically and
thermally.

The LX7302 uses the signal return (AGND) for differential sensing of the output, so it is critical that all
connections unique to AGND be isolated from the power ground connections, and that the common
ground connection point be established at the point of load only. If remote sensing is not used, establish
the common ground at C2.

An R-C network consisting of R13 and C1 is used for sensing the voltage drop across L1. Both R13 and C1
should be mounted close to L1, and their respective connections to L1 should be Kelvin-connected as
close to L1 as possible.

The signal developed across C1 should be routed back to the LX7302 IC using a differential pair.

The connections from the point of load to the LX7302’s FB and AGND pins should also be routed as a
differential pair.

Parasitic capacitance must be kept to a minimum on pins 4–7. Therefore, it is important that the RSx
programming resistors (R4–R7) be mounted as close to their respective pins as possible. It is not
recommended to use test point pads on pins 4–7.

Pins 4–8 are sensitive to noise coupling. It is recommended to not route traces carrying switching signals
near these pins or their associated resistors.

Place components R10, R11, R14, C2, C4, and C5 as close to the IC as possible.

It is recommended to use 2 oz. copper due to its increased electrical and thermal performance.

A diagram indicating critical trace widths is shown in . The EVB silkscreen, as well Figure 1 (see page 5)
as top and bottom layers, are shown in through . See Figure 2 (see page 5) Figure 6 (see page 9)

for a complete schematic of the EVB; see Evaluation Board Schematic (see page 18) Bill of Materials

for a complete list of materials used.(see page 19)

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Figure 1 • PCB Critical Traces

Figure 2 • Silkscreen Top

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Figure 3 • Top Layer

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Figure 4 • Ground Layer

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Figure 5 • Power Layer

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Figure 6 • Bottom Layer

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1.

2.

3.

4.

5 Test Considerations

The following is a guideline for testing the LX7302 IC:

The LX7302 evaluation board will provide up to 30 A of continuous load current. The board comes
with through-hole pads to accommodate 16 AWG wire for high-current testing. It is recommended
to use these pads when operating at load currents in excess of 5 A.
The evaluation board is configured to operate in programmable VID mode. External Reference Mode
can be supported by following these steps:

Remove R6.
Add an 80.6K, 0603 resistor to R15.
Add a 1nF, 0603 capacitor to C3.
Replace R5 with a 0 Ω resistor or wire jumper.

Configuring the External Reference Mode will disable the VID Mode (they cannot be configured at
the same time). See the LX7302 Datasheet for further information.
The LX7302 evaluation board is configured to provide the following voltages under VID control:

Table 2 • Evaluation Board VID Settings

VID 1 VID 2 VOUT

0 0 1.250

0 1 1.082

1 0 1.007

1 1 0.852

Note: Actual output voltages will be within ±1% of the values listed in Table 2.
The programmable output voltage settings can be adjusted by changing the values of R4–R7. See the
LX7302 Datasheet for further information regarding VID control.
The value of the RT resistor (R8) is set at 49.9K. It is recommended to leave this resistor at 49.9K for
proper operation.
The current limit is set at 35 A by R14. This limit will vary based on the temperature of the lower
MOSFETs. The current limit may be adjusted by changing the value of R14.

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6 Evaluation Board Test Data

This section features the evaluation board test data graphs for the LX7302.

Figure 7 • Load Regulation

Figure 8 • Line Regulation

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Figure 9 • Efficiency vs. Output Current

Figure 10 • Soft Start, 5 A Load

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Figure 11 • Start-Up Profile, 5 A Load

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Figure 12 • PSM Start-Up into 1 A Load

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Figure 13 • Soft Shutdown No Load

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Figure 14 • VID00 to VID11 Change; 0.2 Ω Load

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Figure 15 • VID11 to VID00 Change; 0.2 Ω Load

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7 Evaluation Board Schematic

The section shows the schematic of the LX7302 evaluation board.

Figure 16 • Evaluation Board Schematic

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8 Bill of Materials

The following table lists the bill of materials for the LX7302 device.

Table 3 • Bill of Materials

Item
Number

Quantity Part

Reference

Description Manufacturer Manufacturer Part

Number

1 1 C1 Capacitor, ceramic, 0.47 µF, 10 V, 10%,

0603 type SMD

Panasonic ECJ-1VB1A474K

2 1 C2 Capacitor, ceramic, 1.0 µF, 10 V, 10%,

0805 type SMD

Panasonic ECJ2YB1A105K

3 1 C4 Capacitor, ceramic, 1000 pF, 50 V,

10%, 0603 type SMD

Panasonic ECJ-1VB1H102K

4 1 C5 Capacitor, ceramic, 0.1 µF, 16 V, 10%,

0603 type SMD

Panasonic ECJ-1VB1C104K

5 5 C3,C6,C7,

C8, C11,
C15

Do not implement

6 1 C16 Capacitor, ceramic, 3.3 nF, 50 V, 10%,

0805 type SMD

Panasonic ECJ-2VB1H332K

7 1 C18 Capacitor, ceramic, 10 pF, 50 V, NPO,

0603 type SMD

Panasonic ECJ-1VC1H100D

8 2 C9, C10 Capacitor, 560 µF, 2.5 V, polymer

electrolytic, 13m Ω ESR, 6 mm ×

7.7 mm SMD

United
Chemi-Con

APXE2R5ARA561MF

9 3 C12, C13,

C14

Capacitor, 330 µF, 25 V, polymer
electrolytic, 5 A ripple,
Oscon 4.3 mm × 13.1 mm SMT

Sanyo 25SVPF330M

10 1 C17 Capacitor, ceramic, 10 nF, 50 V, 20%,

0805 type SMD

Panasonic ECJ2VB1H103K

11 1 JB1 Header, 2 position vertical 3M 929450-01-02-I

12 1 L1 Inductor, power, 560 nh, 36 A, 1.5 mΩ Susumu PCMC135T-R56MF

13 1 Q1 Transistor, FET, BSC057N03LS N

channel FET, 30 V, 71 A, 5.7 mΩ,
PG-TDSON-8

Infineon BSC057N03MS

14 2 Q2, Q3 Transistor, FET, BSC030N03LS N

channel FET, 30 V, 100 A, 3 mΩ,
PG-TDSON-8

Infineon BSC030N03LS

15 2 Q4, Q5 Transistor, FET, 2N7002 general

purpose N-channel Mosfet SOT 23

Fairchild 2N7002

16 1 R1 Resistor, 43 kΩ, 1/10 W, 5% 0603 type

SMD

Panasonic ERJ3GSYJ433

17 2 R2, R3 Resistor, 10 kΩ, 1/10 W, 5% 0603 type

SMD

Panasonic ERJ3GSYJ103

18 1 R4 Resistor, 34.0 kΩ, 1/16 W, 1% 0603

type SMD

Panasonic ERJ3EKF3402

19 1 R5 Resistor, 40.2 kΩ, 1/16 W, 1% 0603

type SMD

Panasonic ERJ3EKF4022

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Item
Number

Quantity Part

Reference

Description Manufacturer Manufacturer Part

Number

20 1 R6 Resistor, 43.2 kΩ, 1/16 W, 1% 0603

type SMD

Panasonic ERJ3EKF4322

21 1 R7 Resistor, 49.9 kΩ, 1/16 W, 1% 0603

type SMD

Panasonic ERJ3EKF4992

22 1 R8 Resistor, 49.9 kΩ, 1/16 W, 1% 0603

type SMD

Panasonic ERJ3EKF4992

23 1 R9 Resistor, 1 MΩ, 1/10 W, 1% 0603 type

SMD

Panasonic ERJ3EKF1004

24 2 R10, R11 Resistor, 4.7 kΩ, 1/10 W, 5% 0603

type SMD

Panasonic ERJ3GSYJ472

25 1 R12 Resistor, 10 Ω, 1/10 W, 5% 0603 type

SMD

Panasonic ERJ3GSYJ100

26 1 R13 Resistor, 1.0 kΩ, 1/10 W, 5% 0603

type SMD

Panasonic ERJ3GSYJ102

27 1 R14 Resistor, 5.11 kΩ, 1/10 W, 1% 0603

type SMD

Panasonic ERJ3EKF5111

28 2 R16, R17 Resistor, 100 kΩ, 1/10 W, 5% 0603

type SMD

Panasonic ERJ3GSYJ104

29 4 R19, R20,

R21, R22

Resistor, 0 Ω, 5%, 0603 type SMD Panasonic ERJ3GEY0R00V

30 4 R18a - R18d RES 8.2 Ω, 1/8 W, 5%, 0805 SMD Panasonic ERJ-6GEYJ8R2V

31 1 R15 Do not implement

32 17 TP1, TP2,

TP3, TP4,
TP5, TP6,
TP7, TP8,
TP9, TP14,
TP15, TP16,
TP17, TP18,
TP19, TP20,
TP21

Terminal, miniature-style test point,
SMT PCB mount

Keystone 5016

33 1 U1 IC, LX7302 step-down DC-DC

controller, 3 mm × 3 mm
20-pin QFN

Microsemi LX7302

1 PCB Printed circuit board Microsemi SGE3247 X3

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