Microsemi Corporation LX5212CPWP, LX5212CN, LX5212CDP Datasheet
LIN DOC #:
LX5212
9-LINE LOW CAPACITANCE, µPOWER SCSI TERMINATOR
5212
THE INFINITE POWER OF INNOVATION
DESCRIPTION
The LX5212 is a nine-line active terminator
for the SCSI parallel bus. This SCSI standard
recommends active termination at both ends
of the SCSI bus.
During disconnect mode, the LX5212 requires a meager 500nA of supply current
while offering only 2.5pF of output capacitance. To enter this low-power mode, the
disconnect pin can be left open (floating)
or driven high, thereby disconnecting the
terminating resistors and placing the internal
low dropout regulator into low-power
mode. In disconnect mode, each termination line presents a high impedance to the
SCSI bus with the overall effect being to
preserve high signal integrity and yield
subsequent reliable, error-free communications.
During normal operation, the LX5212
IMPORTANT: For the most current data, consult LinFinity's web site: http://www.linfinity.com.
consumes only 600µA of current, which is
the lowest enabled supply current of any
terminator available on the market today.
Linfinity's proprietary BiCMOS low dropout
regulator architecture enables this unique
and very efficient operating characteristic.
The LX5212 also offers a precisely
trimmed channel output current specified to
a 5% tolerance. The maximum value of the
output current is trimmed as closely as
possible to the SCSI standard maximum
specification to give the highest possible
noise margin for fast SCSI operation. And
the LX5212 sinks up to 30mA of current,
making it compatible with today's fast active
negation drivers.
The LX5212 is a superior, pin-for-pin
replacement for a variety of industry products, such as the UC5614.
PRODUCT HIGHLIGHT
P RODUCTION DATA SHEET
KEY FEATURES
■ 2.5pF OUTPUT CAPACITANCE DURING
DISCONNECT
■ 500nA SUPPLY CURRENT IN DISCONNECT
MODE
■ 600µA SUPPLY CURRENT DURING NORMAL
OPERATION
■ 30mA SINK CURRENT FOR ACTIVE
NEGATION
■ LOGIC COMMAND DISCONNECTS ALL
TERMINATION LINES
■ CURRENT LIMIT AND THERMAL PROTECTION
■ COMPATIBLE WITH SCSI 1, 2, 3, AND FAST
20 STANDARDS
■ HOT SWAP COMPATIBLE
■ CONSULT FACTORY FOR APPLICATION TEST
REPORT: 5212TR
■ EVALUATION BOARD AVAILABLE
RECEIVING WAVEFORM - 20MHZ
Receiver
LX5212 LX5212
PACKAGE ORDER INFORMATION
TA (°C)
0 to 70 LX5212CN LX5212CPWP LX5212CDP
Plastic DIP
N
16-pin
Note: All surface-mount packages are available in Tape & Reel.
Append the letter "T" to part number. (i.e. LX5212CDPT)
1 Meter, AWG 28
LX5268 LX5268
Plastic TSSOP
PWP
24-pin, Power
DRIVING WAVEFORM - 20MHZ
Driver
Discussion On Applying
SCSI, Request Linfinity
Application Note:
"Understanding The
Single-Ended SCSI Bus"
Plastic SOIC
DP
16-pin, Power
NOTE:
For An In-Depth
Copyright © 1997
Rev. 1.8 11/97
L INFINITY MICROELECTRONICS INC.
11861 WESTERN AVENUE, GARDEN GROVE, CA. 92841, 714-898-8121, FAX: 714-893-2570
1
LX5212
PRODUCT DATABOOK 1996/1997
9-LINE LOW CAPACITANCE, µPOWER SCSI TERMINATOR
RODUCTION DATA SHEET
P
ABSOLUTE MAXIMUM RATINGS (Note 1)
TermPwr Voltage .................................................................................................+7V
Signal Line Voltage ................................................................................... 0V to +7V
Regulator Output Current ................................................................................... 0.4A
Operating Junction Temperature
Plastic (N, PWP, DP Packages).................................................................... 150°C
Storage Temperature Range .............................................................. -65°C to 150°C
Lead Temperature (Soldering, 10 seconds) .................................................... 300°C
Note 1. Exceeding these ratings could cause damage to the device. All voltages are with
respect to Ground. Currents are positive into, negative out of the specified
terminal.
THERMAL DATA
N PACKAGE:
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
θθ
θ
θθ
JA
65°C/W
PWP PACKAGE:
THERMAL RESISTANCE-JUNCTION TO LEADS,
θθ
θ
θθ
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
JL
θθ
θ
θθ
JA
27°C/W
100°C/W
DP PACKAGE:
D
θθ
θ
θθ
JL
x θ
θθ
θ
θθ
JA
).
JA
THERMAL RESISTANCE-JUNCTION TO LEADS,
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
Junction Temperature Calculation: T
numbers are guidelines for the thermal performance of the device/pc-board
The θ
JA
system. All of the above assume no ambient airflow.
= TA + (P
J
20°C/W
50°C/W
POWER UP / POWER DOWN FUNCTION TABLE
Disconnect Outputs
L Enabled 600µA
H HI Z 0.5µA
Open HI Z 0.5µA
Quiescent
Current
PACKAGE PIN OUTS
DISCONNECT
N.C.
GND
HEATSINK/GND
HEATSINK/GND
HEATSINK/GND
HEATSINK/GND
DISCONNECT
HEATSINK/GND
DISCONNECT
T7
1 16
T8
215
T9
314
N.C.
413
GND
512
611
T1
710
T2
89
N PACKAGE
(Top View)
T7
1 24
T8
223
T9
322
421
520
619
718
817
916
10 15
11 14
T1
12 13
T2
PWP PACKAGE
(Top View)
T7
T8
215
T9
314
T1
T2
413
512
611
710
89
GND
DP PACKAGE
(Top View)
16
T6
T5
REG OUT
N.C.
N.C.
V
TERM
T4
T3
T6
T5
REG OUT
N.C.
HEATSINK/GND
HEATSINK/GND
HEATSINK/GND
HEATSINK/GND
N.C.
V
TERM
T4
T3
T6
T5
REG OUT
HEATSINK/GND
HEATSINK/GND
V
TERM
T4
T3
2
Copyright © 1997
Rev. 1.8 11/97
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