Microsemi Corporation CHFP6KE60A, CHFP6KE60, CHFP6KE43A, CHFP6KE43, CHFP6KE40A Datasheet
...
8700 E. Thomas Road
• Solderable standoff tabs .040X.040X.010
Scottsdale, AZ 85251
Tel: (480) 941-6300
Fax: (480) 947-1503
FLIP-CHIP TVS DIODES
CHFP6KE5.0
thru
CHFP6KE170CA
FEATURES
• Unidirectional and Bidirectional
• Fully glass passivated
• 600 watt (10/1000 µs)
• Eliminates wire bonding
• NON Inductive Insertion
• No voltage overshoot
MECHANICAL
•
Weight: 0.01 grams (approximate)
PACKAGING
• Waffle package 50 pices or wafer ring 70 pieces
BIDIRECTIONAL ALL DIMENSIONS NOMINAL
FLIP-CHIP DIMENSIONS PAD SIZE & CIRCUIT
Patented Flip-Chip Series
MAXIMUM RATINGS
• Max Junction Temperature: 1500C (with conformal coating)
• Storage Temperature: -55
• Flip-Chip Peak Pulse Power: 600 Watts (10/1000 µs)
• Maximum non-repetitive peak power 600 Watts (10/1000 µs)
• Total continuous power dissipation 2.5 W (with adequate heat
sink @ 75
• Turn-on time (theoretical) unidirectional 1X10
• Turn-on time (theoretical) bidirectional 1X10
0
C)
inches (mm)
0
C to +1500C
-12
-9
FLIP-CHIP DIMENSIONS PAD SIZE & CIRCUIT
MSC1596.PDF ISO 9001 CERTIFIED REV B 3/13/2000
UNIDIRECTIONAL ALL DIMENSIONS NOMINAL
inches (mm)
VBR above 30 V VBR 30V and below
CHFP6KE5.0 thru CHFP6KE170CA
PEAK PULSE POWER Vs PULSE TIME
– PEAK PULSE POWER – kW
pp
P
TP – PULSE TIME – SEC
PEAK PULSE
POWER DERATING
)
PP
) or Current (I
PP
In percent of 25° C rating
Peak Pulse Power (P
TEMPERATURE °C
ATTACHMENT AND CONFORMAL COATING
INSTRUCTIONS
FOR Flip-Chip COMPONENTS
The .010” thick tab standoffs minimize shorting during attachment; however, minimal
solder/conductive epoxy must be used and carefully controlled to prevent excess
attachment material from wicking up the side of the tab and shorting across the junction.
Maximum recommended solder temperatures are 212 C for IR reflow and 221 C for
vapor-phase reflow. For flip-chip protection, coating material is Stycast ™ 2651-40 lowviscosity epoxy manufactured by Emerson & Cuming. Follow instructions carefully for
preparation of the epoxy to prevent entrapment of air bubbles. Make sure that Flip-Chips
have been baked at 100 C for 15 minutes minimum to out-gas any adsorbed moisture
immediately prior to coating. Epoxy-coating material should be dispensed around the
edges of the chip with an appropriately sized syringe after which epoxy is de-aired to
remove bubbles entrapped beneath the chip. Cure epoxy as instructed by the supplier.
MSC1596.PDF ISO 9001 CERTIFIED REV B 3/13/2000
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