Microsemi 1N3821, 1N3830A User Manual

This well established zener diode series for the 1N3821 thru 1N3830A JEDEC registration in the glass hermetic sealed DO-13 package provides a low voltage selection for 3.3 to 7.5 volts. It is also well suited for high­reliability applications where it is available in JAN, JANTX, and JANTXV military qualifications. Higher voltages are also available in the 1N3016 thru 1N3051 series (6.8 V to 200 V) in the same package (see separate data sheet). Microsemi also offers numerous other Zener diode products for a variety of other packages including surface mount.
SCOTTSDALE DIVISION
DESCRIPTION
1N3821 thru 1N3830A
1 Watt Metal Case Zener Diodes
APPEARANCE
WWW.
Microsemi
. COM
IMPORTANT: For the most current data, consult
MICROSEMI’s
website: http://www.microsemi.com
Zener Voltage Range: 3.3 V to 7.5 V
Hermetically sealed DO-13 metal package
Internally solder-bonded construction.
Also available in JAN, JANTX, JANTXV
qualifications per MIL-PRF19500/115 by adding the JAN, JANTX, or JANTXV prefixes to part numbers for desired level of screening, e.g. JANTX1N3821, JANTXV1N3051A, etc.
Surface mount also available with 1N3821UR-1 thru 1N30330AUR-1 series on separate data sheet
FEATURES
Regulates voltage over a broad operating current
Low voltage selection from 3.3 to 7.5 V
Tight voltage tolerances available
Low reverse (leakage) currents
Nonsensitive to ESD
Hermetically sealed metal package
Inherently radiation hard as described in Microsemi
APPLICATIONS / BENEFITS
and temperature range
MicroNote 050
Operating Junction and Storage Temperatures:
-65
THERMAL RESISTANCE: 50 at 0.375 inches (10 mm) from body or 110 junction to ambient when leads are mounted on FR4 PC board with 4 mm2 copper pads (1 oz) and track width 1 mm, length 25 mm
DC Power Dissipation (10 mm) from body or 1.0 Watts at T mounted on FR4 PC board as described for thermal resistance above (also see Fig 1)
Forward Voltage @ 200 mA: 1.5 Volts.
Solder Temperatures: 260
MAXIMUM RATINGS
C to +175oC
*: 1 Watt at T
C/W* junction to lead
C for 10 s (maximum)
o
C/W
< +125oC 3/8”
< +65oC when
MECHANICAL AND PACKAGING
CASE: DO-13 (DO-202AA), welded, hermetically sealed metal and glass
FINISH: All external surfaces are Tin-Lead (Pb/Sn) plated and solderable per MIL-STD-750 method 2026
POLARITY: Cathode connected case.
WEIGHT: 1.4 grams.
Tape & Reel option: Standard per EIA-296 (add
“TR” suffix to part number)
See package dimensions on last page
* For further mounting reference, thermal resistance from junction to metal case may be reduced to < 20
when mounting DO-13 metal case directly on heat sink.
DO-13
(DO-202AA)
o
C/W
1N3821 – 1N3830A
Copyright  2003 11-06-2003 REV A
Microsemi
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
Page 1
SCOTTSDALE DIVISION
1N3821 thru 1N3830A
1 Watt Metal Case Zener Diodes
*ELECTRICAL CHARACTERISTICS @ 25oC
JEDEC
TYPE
NUMBER
1N3821 1N3821A 1N3822 1N3822A 1N3823 1N3823A 1N3824 1N3824A 1N3825 1N3825A 1N3826 1N3826A 1N3827 1N3827A 1N3828 1N3828A 1N3829 1N3829A 1N3830 1N3830A
*JEDEC Registered Data.
NOTES: 1. The JEDEC type numbers shown with suffix A have a standard tolerance of +/-5% on the nominal zener voltage. V with device in thermal equilibrium in 25 consult factory.
2. The zener impedance is derived when a 60 cycle ac current having an rms value equal to 10% of the dc zener current (I superimposed on I eliminate unstable units. See MicroNote 202 for variation in dynamic impedance with different zener currents.
3. Allowance has been made for the increase in
NOMINAL
ZENER
VOLTAGE
@ IZT
V
Z
(Note 1)
Volts mA OHMS OHMS mA µA Volts %/
3.3
3.3
3.6
3.6
3.9
3.9
4.3
4.3
4.7
4.7
5.1
5.1
5.6
5.6
6.2
6.2
6.8
6.8
7.5
7.5
thermal equilibrium at the power dissipation of 1 watt.
ZENER
TEST
CURRENT
I
76 76 69 69 64 64 58 58 53 53 49 49 45 45 41 41 37 37 34 34
or IZK. Zener impedance is measured at 2 points to ensure a sharp knee on the breakdown curve and to
ZT
MAXIMUM ZENER IMPEDANCE
ZT
@ IZT ZZK @ I
Z
ZT
10 10 10 10
9 9 9 9 8 8 7 7 5 5 2 2
1.5
1.5
1.5
1.5
o
(Note 2)
= 1mA
ZK
400 400 400 400 400 400 400 400 500 500 550 550 600 600 700 700 500 500 250 250
C still air and mounted in test clips, ¾” from unit body. if tighter tolerance on VZ is required,
V
due to ZZ and for the increase in junction temperature as the unit approaches
Z
MAXIMUM
ZENER
CURRENT
I
ZM
(Note 3)
276 276 252 252 238 238 213 213 194 194 178 178 162 162 146 146 133 133 121 121
MAXIMUM REVERSE LEAKAGE CURRENT
@ VR
I
R
100 100 100 100
50 50 10 10 10 10 10 10 10 10 10 10 10 10 10 10
1 1 1 1 1 1 1 1 1 1 1 1 2 2 3 3 3 3 3 3
GRAPHS
TYPICAL
TEMP. COEFF.
OF ZENER
VOLTAGE
α
VZ
o
C
-.066
-.066
-.058
-.058
-.046
-.046
-.033
-.033
-.015
-.015 +/-.010 +/-.010
+.030 +.030 +.049 +.049 +.053 +.053 +.057 +.057
measured
Z
or IZK) is
ZT
WWW.
Microsemi
. COM
TL
TA
Rated Power Dissipation (W)
1N3821 – 1N3830A
TL – Lead Temperature (oC) 3/8” from body
or TA on FR4 PC Board
Temperature Coeff. vs. Zener Voltage
FIGURE 2
FIGURE 1 Power Derating
Copyright  2003 11-06-2003 REV A
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
Microsemi
Scottsdale Division
Page 2
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