This well established zener diode series for the 1N3821 thru 1N3830A
JEDEC registration in the glass hermetic sealed DO-13 package provides a
low voltage selection for 3.3 to 7.5 volts. It is also well suited for highreliability applications where it is available in JAN, JANTX, and JANTXV
military qualifications. Higher voltages are also available in the 1N3016
thru 1N3051 series (6.8 V to 200 V) in the same package (see separate
data sheet). Microsemi also offers numerous other Zener diode products
for a variety of other packages including surface mount.
SCOTTSDALE DIVISION
DESCRIPTION
1N3821 thru 1N3830A
1 Watt Metal Case Zener Diodes
APPEARANCE
WWW.
Microsemi
. COM
IMPORTANT: For the most current data, consult
MICROSEMI’s
website: http://www.microsemi.com
• Zener Voltage Range: 3.3 V to 7.5 V
• Hermetically sealed DO-13 metal package
• Internally solder-bonded construction.
• Also available in JAN, JANTX, JANTXV
qualifications per MIL-PRF19500/115 by adding the
JAN, JANTX, or JANTXV prefixes to part numbers
for desired level of screening, e.g. JANTX1N3821,
JANTXV1N3051A, etc.
• Surface mount also available with 1N3821UR-1
thru 1N30330AUR-1 series on separate data sheet
FEATURES
• Regulates voltage over a broad operating current
• Low voltage selection from 3.3 to 7.5 V
• Tight voltage tolerances available
• Low reverse (leakage) currents
• Nonsensitive to ESD
• Hermetically sealed metal package
• Inherently radiation hard as described in Microsemi
APPLICATIONS / BENEFITS
and temperature range
MicroNote 050
• Operating Junction and Storage Temperatures:
-65
• THERMAL RESISTANCE: 50
at 0.375 inches (10 mm) from body or 110
junction to ambient when leads are mounted on FR4
PC board with 4 mm2 copper pads (1 oz) and track
width 1 mm, length 25 mm
• DC Power Dissipation
(10 mm) from body or 1.0 Watts at T
mounted on FR4 PC board as described for thermal
resistance above (also see Fig 1)
• Forward Voltage @ 200 mA: 1.5 Volts.
• Solder Temperatures: 260
MAXIMUM RATINGS
o
C to +175oC
*: 1 Watt at T
o
C/W* junction to lead
o
C for 10 s (maximum)
o
C/W
< +125oC 3/8”
L
< +65oC when
L
MECHANICAL AND PACKAGING
• CASE: DO-13 (DO-202AA), welded, hermetically
sealed metal and glass
• FINISH: All external surfaces are Tin-Lead (Pb/Sn)
plated and solderable per MIL-STD-750 method
2026
• POLARITY: Cathode connected case.
• WEIGHT: 1.4 grams.
• Tape & Reel option: Standard per EIA-296 (add
“TR” suffix to part number)
• See package dimensions on last page
* For further mounting reference, thermal resistance from junction to metal case may be reduced to < 20
when mounting DO-13 metal case directly on heat sink.
DO-13
(DO-202AA)
o
C/W
1N3821 – 1N3830A
Copyright 2003
11-06-2003 REV A
Microsemi
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
Page 1
SCOTTSDALE DIVISION
1N3821 thru 1N3830A
1 Watt Metal Case Zener Diodes
*ELECTRICAL CHARACTERISTICS @ 25oC
JEDEC
TYPE
NUMBER
1N3821
1N3821A
1N3822
1N3822A
1N3823
1N3823A
1N3824
1N3824A
1N3825
1N3825A
1N3826
1N3826A
1N3827
1N3827A
1N3828
1N3828A
1N3829
1N3829A
1N3830
1N3830A
*JEDEC Registered Data.
NOTES: 1. The JEDEC type numbers shown with suffix A have a standard tolerance of +/-5% on the nominal zener voltage. V
with device in thermal equilibrium in 25
consult factory.
2. The zener impedance is derived when a 60 cycle ac current having an rms value equal to 10% of the dc zener current (I
superimposed on I
eliminate unstable units. See MicroNote 202 for variation in dynamic impedance with different zener currents.
3. Allowance has been made for the increase in
NOMINAL
ZENER
VOLTAGE
@ IZT
V
Z
(Note 1)
Volts mA OHMS OHMS mA µA Volts %/
3.3
3.3
3.6
3.6
3.9
3.9
4.3
4.3
4.7
4.7
5.1
5.1
5.6
5.6
6.2
6.2
6.8
6.8
7.5
7.5
thermal equilibrium at the power dissipation of 1 watt.
ZENER
TEST
CURRENT
I
76
76
69
69
64
64
58
58
53
53
49
49
45
45
41
41
37
37
34
34
or IZK. Zener impedance is measured at 2 points to ensure a sharp knee on the breakdown curve and to
ZT
MAXIMUM ZENER IMPEDANCE
ZT
@ IZT ZZK @ I
Z
ZT
10
10
10
10
9
9
9
9
8
8
7
7
5
5
2
2
1.5
1.5
1.5
1.5
o
(Note 2)
= 1mA
ZK
400
400
400
400
400
400
400
400
500
500
550
550
600
600
700
700
500
500
250
250
C still air and mounted in test clips, ¾” from unit body. if tighter tolerance on VZ is required,
V
due to ZZ and for the increase in junction temperature as the unit approaches
Z
MAXIMUM
ZENER
CURRENT
I
ZM
(Note 3)
276
276
252
252
238
238
213
213
194
194
178
178
162
162
146
146
133
133
121
121
MAXIMUM
REVERSE
LEAKAGE
CURRENT
@ VR
I
R
100
100
100
100
50
50
10
10
10
10
10
10
10
10
10
10
10
10
10
10
1
1
1
1
1
1
1
1
1
1
1
1
2
2
3
3
3
3
3
3
GRAPHS
TYPICAL
TEMP. COEFF.
OF ZENER
VOLTAGE
α
VZ
o
C
-.066
-.066
-.058
-.058
-.046
-.046
-.033
-.033
-.015
-.015
+/-.010
+/-.010
+.030
+.030
+.049
+.049
+.053
+.053
+.057
+.057
measured
Z
or IZK) is
ZT
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Microsemi
. COM
TL
TA
Rated Power Dissipation (W)
1N3821 – 1N3830A
TL – Lead Temperature (oC) 3/8” from body
or TA on FR4 PC Board
Temperature Coeff. vs. Zener Voltage
FIGURE 2
FIGURE 1
Power Derating
Copyright 2003
11-06-2003 REV A
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
Microsemi
Scottsdale Division
Page 2