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Helios Dual Pentium II
User Manual
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Micronics Helios Dual Pentium II User Manual

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Helios
Dual Pentium II
System Board Manual
Document Number: 06-00329-01, Rev. 2A
April 1998
45365 Northport Loop West, Fremont, CA. 94538-6417
2
Copyright Notices
Copyright 1998 Micronics Computers, Inc. The information con- tained in the Helios PCI/ISA/AGP Dual Pentium II system board manual has been carefully checked and is believed to be accurate. Micronics assumes no responsibility for any inaccuracies that may be contained in this document. Micronics makes no commitments to update or to keep the information in this manual at a current level when changes are made to the product.
Micronics reserves the right to make improvements to this document and/or product at any time and without notice. All Rights Reserved. No part of this document may be photocopied, reproduced, trans­lated, or reduced to any medium or machine form without prior, written consent from Micronics.
Portions of the Manual
Portions of this manual were copied (with permission) from Phoenix Technologies, Ltd. All rights reserved.
Trademarks
IBM is a registered trademark of International Business Machines. Microsoft and Windows are registered trademarks of Microsoft Cor­poration. Intel, PCI and AGP are registered trademarks of Intel Corporation. All other product names mentioned herein are used for identification purposes only and may be the trademarks of their respective companies.
1
Table of Contents
Introduction 5 Features 6 Software Compatibility 7 Before You Begin 8
Chapter 1 - Quick Installation 9
Installing the Helios 9
Chapter 2 - Configuring the Helios 11
Static Electricity 11 Environment Considerations 11 Helios System Board 12 Helios Back Panel Connections 12 Jumper and Connector Settings 13
Chapter 3 - Installing the Helios 19
Introduction 19 System Memory Support 19 Installing the Helios 20
Tools Required 20 Equipment Required 20
System Memory 21
Adding Memory 21 Memory Configurations 22 Installing DIMMs 25
Removing DIMMs 25 CPU Installation 26
Installing the CPU Retention Mechanism 26
Installing a CPU 28 CPU Installation Overview 30 CPU Installation (Box version) 31
Installing a PCI Peripheral Card 32 Installing an ISA Peripheral Card 33 Installing an AGP Peripheral Card 34 Installing a CD-ROM Drive 35 Helios Sound Option 36
Chapter 4 - The BIOS Setup Utility 39
Configuration 39 Initial Bootup 39 Setup 39 Running the Setup Procedure 40 Info Screen 41 Setting the CPU Speed 41 Setting the Main Screen 43
Setting the Advanced Screen 47 Setting the Chipset Screen 50 Setting the Features Screen 51
DMI Event Logging Submenu 53 Power Management Submenu 54 Security Submenu 56
Exit Screen 58
Chapter 5 - Installing Device Drivers 59
About Device Drivers 59 Installing the Sound Drivers 59
Chapter 6 - Special Features 61
Intel’s 440BX AGPset 61 Accelerated Graphics Port (AGP) 61 SDRAM (Synchronous DRAM) 62 LM79 (Hardware Management) 62 Ultra DMA/33 IDE 63 Universal Serial Bus (USB) 63
2
Appendix A - Technical Information 65
Specifications 65 Environmental Specifications 67 Temperature Range 67 Relative Humidity 67 Battery Disposal 68 Support and Information Services 69 Technical Support 69
Appendix B - Post Messages 71
Appendix C - Beep and POST Codes 73
Appendix D - Updating the System BIOS 77
Appendix E - Warranties and Notices 79
Limited Warranty 79 Non-Warranty Service 80 FCC Statement 81
Glossary 82
Index 86
3
4
List of Figures
Figure 1.1: Power-Up Screen 10 Figure 2.1: Helios System Board 12 Figure 2.2: Helios Back Panel Connections 12 Figure 3.1: Installing a 168-Pin DIMM 25 Figure 3.2: Installing a CPU 28 Figure 3.3: Installing a CPU (Boxed version) 31 Figure 3.4: Installing a PCI Card 32 Figure 3.5: Installing an ISA Peripheral Card 33 Figure 3.6: Installing an AGP Peripheral Card 34 Figure 3.7: Connecting External Sound Devices 36 Figure 4.1: Power-Up Screen 40 Figure 4.2: Info Screen 41 Figure 4.3: CMOS Main Screen 43 Figure 4.4: IDE Device Submenu 45 Figure 4.5: Advanced Screen 47 Figure 4.6: Chipset Screen 50 Figure 4.7: Features Screen 51 Figure 4.8: DMI Event Logging Submenu 53 Figure 4.9: Power Management Submenu 54 Figure 4.10: Security Submenu 56 Figure 4.11: Exit Screen 58
List of Tables
Table 2.1: BIOS Configuration Setting 13 Table 2.2: Clear CMOS Settings 13 Table 2.3: Soft Power On/Off Setting 14 Table 2.4: Onboard Sound Selection 14 Table 2.5: Secondary USB Port Selection 14 Table 2.6: Flash BIOS Setting 14 Table 2.7: Case and Peripheral Connections 15 Table 3.1: Memory Configurations 22 Table A.1: Support and Information Services 70
Introduction
Thank you for choosing the Helios system board. The Helios is an advanced dual processor solution for high­performance workstation and application servers.
Helios is specifically designed to create powerful, depend­able servers and workstations. Based on the highly acclaimed Intel 440BX AGPset, Helios supports the next generation of the Pentium II, which offers flexibility and the highest level of performance. It features support for 100MHz Front Side Bus speeds and accepts PCI, ISA and AGP expansion cards to embrace a wide variety of network enhancements.
Rich with features, Helios provides Ultra DMA/33 IDE hard drive protocol (up to 33MBytes/sec transfer rate), PC100 SDRAM memory support, optional LM79 micro­processor system hardware management support and optional ESS Maestro-2™ PCI audio. Maestro-2 is a high­performance 500-MIPS equivalent PCI audio processor, using the high-bandwidth PCI bus and an AC’97 codec to deliver advanced PC audio features. Helios is the ideal choice for excellent performance and sustained network reliability.
Micronics builds all products to exacting standards, using the highest quality components available. We are proud to provide this system board and believe you will be pleased with your purchase.
5
Introduction
6
Features
The Helios includes the following features: ▲ Dual Intel Slot 1
for:
Intel Pentium II processors - 233/266/300/333MHz (66MHz FSB) Intel Pentium II processors - 350/400MHz (100MHz FSB)
▲ Integrated Voltage Regulator Modules ▲ Jumperless CPU configuration via BIOS ▲ Intel 440BX AGPset
Intel PIIX 4e National PC87309 Enhanced Super I/O chip
▲ One 16-bit ISA slot
Five 32-bit PCI slots (One is a shared PCI/ISA slot) One AGP slot
▲ Bus Speed - 66 and 100MHz ▲ Four 3.3V unbuffered 64/72-bit 168-pin DIMM sockets
Maximum memory - 1GB for SDRAM (PC100 supported) ECC support via chipset
▲ ESS Maestro-2™ PCI Audio (optional) ▲ LM79 Microprocessor System Hardware Management (optional)
LM75 CPU temperature sensors
▲ Ultra DMA/33 IDE protocol support ▲ ATX form factor
Introduction
7
Software Compatibility
The Helios system board has been thoroughly tested for compatibil­ity with a variety of operating systems and environments, including:
▲ Microsoft -
DOS 6.2x Windows 95 Windows NT 3.5x Windows NT 4.0
▲ IBM -
OS/2 Warp 3.0 OS/2 Warp 4.0
▲ SCO -
UNIXWare 2.1.1 Open Server 5.02 UNIX 3.2.4.2
▲ Novell -
NetWare 3.12 NetWare 4.11
Introduction
8
Before You Begin
This manual will familiarize you with the features, installation and use of your Helios. There are several symbols and conven­tions used throughout this manual to help draw your attention to a feature or to focus on important information:
When you see the Magnifying Glass, it refers to something you should take a closer look at before proceeding further.
When you see the Exclamation Mark, it gives important information on avoiding damage.
Common Names
AGP Accelerated Graphics Port DIMM Dual Inline Memory Module DMI Desktop Management Interface DRAM Dynamic Random Access Memory ECC Error Checking and Correction FSB Front Side Bus IDE Integrated Drive Electronics PCI Peripheral Component Interconnect SDRAM Synchronous DRAM USB Universal Serial Bus VRM Voltage Regulator Module
Introduction
Chapter 1: Quick Installation
9
1
Chapter
Quick Installation
We know that many experienced people prefer to read as little of the documentation as possible. If this sounds like you, here’s the short form to get up and running quickly.
Installing the Helios
1. Make backup copies of your installation and configu­ration diskettes.
2. Ground yourself to prevent damaging static dis­charge by using an anti-static wrist or ankle strap, or touch a safely grounded metal object.
3. Remove the Helios from its packaging.
4. Configure the system board’s jumper settings, if neces­sary (refer to Jumper Settings in Chapter 2).
5. Install the CPU and the system memory. Be sure to attach the Retention Mechanism as described in Chapter 3.
6. Install the system board in the chassis and make all necessary case connections.
7. Install any ISA, PCI and/or AGP add-on peripherals (refer to Chapter 2 for the location of the slots).
8. Connect any optional devices.
9. Configure the CPU speed. The CPU speed is selected through the BIOS. First you must close jumper W12 (refer to Jumper and Connector Settings in Chapter
2).
10. Turn on your system. When the system is powered up it will go into Setup automatically.
11. The first selection on the Main screen will be CPU Speed. Select the correct speed.
STATIC!
Before handling the Helios, be properly grounded by using a special wrist or ankle strap, or touch a safely grounded object.
10
Figure 1.1: Power-Up Screen
Chapter 1: Quick Installation
12. From the Main Menu screen, set the time and date. Adjust the BIOS settings to match your configuration. If installing an IDE drive, select the IDE device you wish to configure. Press ENTER with Type selected and the BIOS will automatically configure the drive for you (refer to Chapter 4).
13. Make any desired setting configurations in the other menus (refer to Chapter 4). When finished, press F10 (Save and Exit) to save your settings.
14. You will see a message indicating that the CPU speed setting has been saved.
15. Power down your system and remove the jumper off W12 (save the jumper by placing it back on one pin only). The CPU speed selection will no longer appear in Setup.
16. After you have installed your operating system, you can install the sound device drivers (optional). Refer to Chapter 5.
Configuring the Helios
Although the Helios system board is packaged in materials that are designed to protect it from physical damage and static electricity, it is important to use care while unpack­ing the board and setting it up.
Static Electricity
The Helios is shipped from the factory in an anti-static bag. To reduce the possibility of damage from static discharge, it is important to neutralize any static charges your body may have accumulated before handling the board.
The best way to do this is to ground yourself using a special anti-static wrist or ankle strap. If you do not have an anti-static strap available, touch both of your hands to a safely grounded object, such as the power supply or chassis of a computer that is connected to the power socket. After you have grounded yourself, ground the Helios board via one of the solder pads that surround its mounting holes. When you remove the Helios from its packaging, place it on top of the anti-static bag, and carefully inspect the board for damage which might have occurred during shipment.
Environment Considerations
Make sure the finished computer system is in an area with good ventilation. The system should not be in direct sunlight, near heaters, or exposed to moisture, dust, or dirt.
11
Chapter 2: Configuring the Helios
2
Chapter
Helios System Board
Back Panel Connections
Chapter 2: Configuring the Helios
12
Figure 2-1: Helios System Board Diagram
Figure 2-2: Helios Bac k Panel
Chapter 2: Configuring the Helios
13
Jumper Settings
This section provides jumper settings for the Helios system board that may or may not need to be changed. Other configurations can be changed through the BIOS Setup, such as the CPU speed. NOTE: For details on how
to configure the CPU speed, see “Setting the CPU Speed” in Chapter 4.
Table 2-1 lists the settings for the BIOS Configuration Setup. To select the CPU speed in the BIOS, you must close jumper W12. (Refer to Chapter 4 for details on setting the CPU speed).
Table 2-2 lists the settings to clear the CMOS. With your computer's power off, close pins 2-3, wait ten seconds and place the jumper back on pins 1-2. (The jumper must be placed back on pins 1-2 for the system to function properly.) NOTE: This will reset all BIOS default settings. Any
changes you have made will be lost.
Table 2-2: Clear CMOS Settings
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T ab le 2-1: BIOS Configuration Setting
Chapter 2: Configuring the Helios
Table 2-3 lists the setting for the system power-on setting. When set for Normal operation the power supply is turned On/Off using a momentary push-button switch connected to J28.
Table 2-4 lists the settings to enable or disable the optional onboard sound.
Table 2-5 lists the settings to route the Secondary USB port to the AGP connector (J1) or to the USB connector (J12). NOTE: Jumpers W5, W6 and W7 must be set to the same position.
Table 2-6 lists the setting to reprogram the BIOS. To flash the BIOS, you must place a jumper on W4 in position 1-2 as shown in the table. (Refer to Appendix E for details on reprogramming the system BIOS).
14
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Chapter 2: Configuring the Helios
15
Table 2-7 lists the connectors and their functions.
T ab le 2-7: Connector Settings and Functions
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*NOTE: If your system board comes with onboard audio, PCI slot location J20 becomes a non-bus-mastering slot, regardless of whether the onboard audio is enabled or disabled. Bus-mastering PCI cards (i.e., most LAN cards and SCSI host adapters) will not work when inserted into slot J20. They can, however, be used in slots J16-J19. Non-bus-mastering devices, like most graphics cards, can be plugged into slots J16-J20.
If your system board comes without onboard audio, all PCI slots (including J20) will support bus-mastering and non-bus-mastering devices.
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Chapter 2: Configuring the Helios
16
T ab le 2-7b: Connector Settings and Functions
Chapter 2: Configuring the Helios
17
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Chapter 2: Configuring the Helios
18
Chapter 3: Installing the Helios
3
Chapter
Installing the Helios
Introduction
This chapter explains how to install the Helios system board, memory, CPU and peripherals.
WARNING: Before installing or removing any peripherals or components, make sure you have a clear work space and that you adhere to all anti-static precautions described in Chapter 1. Micronics recommends that only experienced tech­nicians install and configure the system board.
Damage which occurs to the board while adding or removing peripherals or components may void the warranty. If prob­lems arise while installing peripherals, contact the computer dealer where you purchased the peripheral or Micronics’ Technical Support Department.
System Memory Support
The flexibility of the Helios is augmented by its support for standard SDRAM (66MHz) and PC100 SDRAM (100MHz) memory. The Helios supports ECC (with 72-bit DIMMs) via the chipset.
SDRAM speed and synchronous operation have enabled the breakthrough in memory-systems design needed to meet the demands of fast high-performance processors. SDRAM improves bandwidth to main memory because all address, data and control signals are synchronized with the system clock. With all operations synchronized, system wait states are reduced, thus providing increased performance over conventional DRAM.
The new PC100 SDRAM memory has the same technol­ogy as standard SDRAM, but is faster due to its ability to support the new Intel BX chipset and system boards that support the 100MHz Front Side Bus speeds.
19
Installing the Helios
Installation of the Helios system board depends on the type of case you use. Helios is designed for the ATX form factor and must be installed in an ATX chassis. Install the system board into the chassis using the tools and equipment re­quired and make all necessary case connections.
NOTE: If you are unfamiliar with installing a system board, Micronics highly recommends that you read the computer user’s manual or contact your dealer’s technical support department.
Tools Required
Micronics recommends using the following tools to install the Helios:
❏ Small Phillips screwdriver ❏ Tweezers or a pair of needle-nose pliers ❏ Tray (to hold loose screws)
Equipment Required
Micronics recommends using the following equipment with the Helios for a typical configuration:
❏ ATX chassis with standard hardware. ❏ A high-quality ATX power supply capable of providing
continuous power within a 3 volt range. A power filter may be used with a noisy AC power source.
❏ PS/2 mouse and compatible keyboard. ❏ Eight ohm speaker. ❏ Standard ribbon cables for internal connections. ❏ Standard power cord (grounded).
Chapter 3: Installing the Helios
20
Chapter 3: Installing the Helios
21
System Memory
System memory is necessary to operate the Helios system board. The Helios has four 3.3V unbuffered 64/72-bit, 168-pin DIMM sockets for a maximum of one Gigabyte of memory. Support is provided for standard SDRAM (66MHz) and PC100 SDRAM (100MHz). This section list the rules for adding memory to the Helios, gives examples of common memory configurations and show how to physically install the memory.
Adding Memory
The following is a list of rules to follow when installing DIMMs. If you follow these rules, your upgrade should be trouble-free:
❏ Use 8ns or faster PC100 SDRAM DIMMs when using
a 100MHz bus speed processor.
❏ Use 10ns or faster SDRAM DIMMs when using a
66MHz bus speed processor. NOTE: PC100 memory is backwards compatible to run at the 66MHz bus speed.
❏ Use only PC100MHz DIMM modules for the 100MHz
Front Side Bus speeds (350 and 400). Due to the strict timing issues involved when operating at 100MHz, your system will not boot if non-compliant PC100 DIMM modules are used.
For long term reliability, Micronics recommends using DIMMs with gold-plated contacts. The use of tin-plated contacts may conflict with the gold alloy on the DIMM socket.
one
bank
168-Pin DIMM
Chapter 3: Installing the Helios
22
Memory Configurations
DIMM memory configuration is auto-banking and there­fore does not need to be installed in any particular order. The following table lists the most common memory configurations.
Memory Bank 1 Bank 2 Bank 3 Bank 4
8MB 1Mx64 16MB 2Mx64 16MB 1Mx64 1Mx64 24MB 2Mx64 1Mx64 24MB 1Mx64 1Mx64 1Mx64 32MB 2Mx64 2Mx64 32MB 4Mx64 32MB 1Mx64 1Mx64 1Mx64 1Mx64 40MB 2Mx64 2Mx64 1Mx64 40MB 2Mx64 1Mx64 1Mx64 1Mx64 40MB 4Mx64 1Mx64 48MB 2Mx64 2Mx64 2Mx64 48MB 2Mx64 2Mx64 1Mx64 1Mx64 48MB 4Mx64 1Mx64 1Mx64 56MB 4Mx64 2Mx64 1Mx64 56MB 4Mx64 1Mx64 1Mx64 1Mx64 64MB 2Mx64 2Mx64 2Mx64 2Mx64
T ab le 3-1: Memory Configurations
Chapter 3: Installing the Helios
23
Memory Bank 1 Bank 2 Bank 3 Bank 4
64MB 4Mx64 4Mx64 64MB 8Mx64 80MB 4Mx64 2Mx64 2Mx64 2Mx64 80MB 4Mx64 4Mx64 1Mx64 1Mx64 80MB 8Mx64 2Mx64 80MB 8Mx64 1Mx64 1Mx64 96MB 4Mx64 4Mx64 2Mx64 2Mx64 96MB 4Mx64 4Mx64 4Mx64
96MB 8Mx64 2Mx64 1Mx64 1Mx64 112MB 4Mx64 4Mx64 4Mx64 2Mx64 112MB 8Mx64 4Mx64 2Mx64 112MB 8Mx64 4Mx64 1Mx64 1Mx64 128MB 16Mx64 128MB 4Mx64 4Mx64 4Mx64 4Mx64 128MB 8Mx64 4Mx64 4Mx64 128MB 8Mx64 8Mx64 160MB 16Mx64 2Mx64 1Mx64 1Mx64 160MB 8Mx64 4Mx64 4Mx64 4Mx64 160MB 16Mx64 4Mx64
T ab le 3-1a: Memory Configurations
Chapter 3: Installing the Helios
24
T ab le 3-1b: Memory Configurations
Memory Bank 1 Bank 2 Bank 3 Bank 4
192MB 16Mx64 4Mx64 4Mx64 192MB 8Mx64 8Mx64 4Mx64 4Mx64 192MB 8Mx64 8Mx64 8Mx64 224MB 16Mx64 8Mx64 2Mx64 2Mx64 224MB 16Mx64 8Mx64 4Mx64 256MB 16Mx64 16Mx64 256MB 16Mx64 8Mx64 4Mx64 4Mx64 256MB 16Mx64 8Mx64 8Mx64 256MB 8Mx64 8Mx64 8Mx64 8Mx64 288MB 16Mx64 16Mx64 4Mx64 320MB 16Mx64 8Mx64 8Mx64 8Mx64 384MB 16Mx64 16Mx64 16Mx64 384MB 16Mx64 16Mx64 8Mx64 8Mx64 448MB 16Mx64 16Mx64 16Mx64 8Mx64 512MB 16Mx64 16Mx64 16Mx64 16Mx64
1GB 32Mx64 32Mx64 32Mx64 32Mx64
Chapter 3: Installing the Helios
25
Installing DIMMs
DIMM modules may be added one bank at a time. To install the DIMMs, locate the memory banks on the system board and perform the following steps:
1. Hold the DIMM so that the notched edge is aligned with the notch on the DIMM socket (Figure 3-1).
2. Insert the DIMM at a 90 degree angle.
3. Gently push the DIMM straight down until it locks into place (past the release tabs).
Figure 3-1: Installing a 168-Pin DIMM
Removing DIMMs
To remove DIMMs, follow the steps below:
1. With both thumbs (or fingers), press the release tabs away from the socket.
2. With the DIMM free from the release tabs, lift the module up and place in an anti-static bag or package.
Chapter 3: Installing the Helios
26
Support Bridge with Studs
Retention Base
CPU Installation
The Helios is designed to support single or dual Pentium II processors. The Pentium II processor comes installed in a Single Edge Contact (SEC) cartridge that connects into "Slot 1" on the system board.
A Retention Mechanism is supplied to anchor the proces­sor to the system board. Attach the Retention Mechanism before inserting the processor.
Installing the CPU Retention Mechanism
Before you begin, verify that your Retention Mechanism Kit contains the following items:
❏ Retention Base (black plastic module) ❏ Support Bridges with Studs (plastic
mounts)
Follow the steps below to install the kit:
1. Locate the four Retention Base holes (near each end of the Slot 1 socket). Insert the two Support Bridges with studs (plastic mounts) from the bottom side of the Helios toward the component side until they snap into place.
(Orient the loops toward the outer edges of the system board)
Chapter 3: Installing the Helios
27
2. Place the Retention Base over the Slot 1 connector and insert it down into the Support Bridges with studs. Note the “Keyed” location of both Slot 1 and the Retention Base.
3. Using a screwdriver, tighten all four sides of the Retention Base.
Retention Base
Keyed
Installing a CPU
If you are installing a single CPU, the Primary CPU slot (U1) must be used. You must also install a terminator card in the Secondary slot.
If you are installing
two CPU’s, we
recommend that you follow the guidelines below:
✍
Use CPU’s of the same family type
✍
Use CPU’s of the same revision stepping (i.e., A0, A1, B0)
✍
Use CPU’s of the same FSB frequency (i.e., 66MHz vs. 100MHz)
✍
Use CPU’s of the same L2 cache size (i.e., 256KB vs. 512KB)
✍
Use CPU’s of the same L2 cache type (i.e., ECC vs. non­ECC)
✍
Use CPU’s of the same L2 cacheable address range (i.e., 512MB vs. 4GB)
NOTE: If the two processors differ in any of the above catego­ries, the system may still appear to run correctly, but consistent behavior cannot be guaranteed.
Follow the steps below to install the Pentium II processor:
1. Locate the Slot 1 connector (refer to Figure 2-1).
2. If you are installing the boxed version of the Pentium II processor, follow the instructions in the section “CPU Installation (Boxed version).”
3. If you are installing the optional Heat Sink Support, continue to step 4; if not, go to step 5.
Chapter 3: Installing the Helios
28
Terminator
Card
Secondary Slot
4. The Heatsink components consist of a top bar, base and two pins. Gently insert the Heatsink base into the holes next to the Slot 1 socket. Push down until the base snaps into place.
5. Gently insert the processor cartridge down into the Retention Module, making sure the connector on the processor cartridge and the Slot 1 connector are aligned (refer to the keyed location on the previous page).
6. Push the processor cartridge down until it snaps into place.
7. Lock the processor cartridge into place by pushing outward on the tabs located on both sides of the processor cartridge. The processor cartridge is locked when the tabs snap into the holes on the side of the Retention Mechanism.
8. After the processor cartridge is locked into place, connect the Heatsink’s top bar to the base.
9. Lock the base into place by inserting a pin down into the base on both sides.
10. Make sure the CPU speed selection is set correctly.
NOTE: Leave the system case off until you have configured the CPU speed (refer to Chapter 4 - Setting the CPU Speed).
Chapter 3: Installing the Helios
29
Top Bar
Pin
Base
Pin
Chapter 3: Installing the Helios
30
CPU Installation
Overview
1. Mount the Retention Mechanism for the CPU.
2. Mount the (optional) heatsink support base onto the system board.
3. Slide the CPU into the Retention Mecha­nism.
4. Lock the CPU into the Retention mechanism using the tabs.
5. Slide in the Heat Sink Top Bar, then insert the pins to lock it in place.
CPU Installation Overview
Figure 3-2: Installing a CPU
5
1
2
3
4
Chapter 3: Installing the Helios
31
1
2
3
4
3
Install to system board
Figure 3-3: Installing a CPU (Boxed version)
CPU Installation (Boxed version)
A boxed version of the CPU is offered through Intel. This packaging uses an active cooling fan. The mounting hardware is described below. For detailed instructions, please refer to the documentation that is supplied with your CPU.
NOTE: Make sure the speed selection jumpers are set correctly (refer to Chapter 2 - Jumper Settings).
Chapter 3: Installing the Helios
32
Installing a PCI Peripheral Card
Micronics PCI slots accommodate all PCI peripherals that meet the PCI 2.1 specifications. Follow the steps below to install a PCI card:
1. Turn the computer system off and remove its cover.
2. Choose an unused PCI slot and remove the slot cover.
3. Insert the card with the bottom edge level to the slot.
Never insert the card at an angle.
4. Carefully push the card straight down, making sure the card is fully inserted.
5. Replace the screw which holds the card in place.
6. Replace the computer cover.
7. Refer to the PCI card’s documentation additional instructions regarding installation and software driv­ers.
Figure 3-4: Installing a PCI Card
Chapter 3: Installing the Helios
33
Installing an ISA Peripheral Card
Micronics ISA slots accommodate all standard ISA pe­ripherals. Follow the steps below to install an ISA card:
1. Turn the computer system off and remove its cover.
2. Choose an unused ISA slot and remove the slot cover.
3. Insert the card with the bottom edge level to the slot.
Never insert the card at an angle.
4. Carefully push the card straight down, making sure the card is inserted fully.
5. Replace the screw that holds the card in place.
6. Replace the computer cover.
7. Refer to the ISA card’s documentation for additional instructions regarding installation and software driv­ers.
Figure 3-5: Installing an ISA P eripheral Card
Installing an AGP Peripheral Card
Micronics AGP slot can accommodate all AGP peripher­als that meet the Intel AGP bus specifications. Follow the steps below to install an AGP card:
1. Turn the computer system off and remove its cover.
2. Locate the AGP slot (J1) and remove the slot cover.
3. Insert the card with the bottom edge level to the slot.
Never insert the card at an angle.
4. Carefully push the card straight down, making sure the card is fully inserted.
5. Replace the screw which holds the card in place.
6. Replace the computer cover.
7. Refer to the AGP card’s documentation for additional instructions regarding installation and soft­ware drivers.
Chapter 3: Installing the Helios
34
Figure 3-6: Installing an A GP Peripheral Card
Installing a CD-ROM Drive
The instructions below will help you with a CD-ROM drive installation, but also refer to the documentation that accompa­nied your CD-ROM drive.
Before starting the setup and installation, make sure your computer is off and the power cord is disconnected from the wall outlet. Your CD-ROM drive kit should contain the following items for a successful installation:
❏ CD-ROM Drive with installation hardware ❏ Interface Cable ❏ CD Audio Cable
1. Connect the ribbon cable as described in the CD­ROM’s documentation, making sure the red stripe on the cable is aligned with pin 1 of the connectors.
2. Connect the audio cable to the CD-ROM drive's audio connector.
3. Connect the other end of the audio cable to the MPC­2 compatible CD-ROM audio connector on the Helios system board (see Figures 2.1 and 2.2).
4. Connect the power supply cable to the CD-ROM drive's power connector.
5. Install the CD-ROM device drivers. CD-ROM drives require device drivers to access the drive and are generally provided by the manufacturer of the CD­ROM drive. Usually one device driver is added to the CONFIG.SYS file and one to the AUTOEXEC.BAT file.
6. If you are using the CD-ROM drive in an MS-DOS environment, the utility MSCDEX.EXE must also be added to the AUTOEXEC.BAT file. Consult your DOS manual for more information.
Chapter 3: Installing the Helios
35
Helios Sound Option
You can connect external sound devices to your Helios system board to take advantage of the optional sound support (refer to Figure 2.2). The sound option includes 16-bit stereo sound and a game and MIDI port. See Chapter 5 for information on installing sound device drivers.
Connecting Sound Devices
Figure 3-6: Connecting External Sound Devices
Chapter 3: Installing the Helios
36
Game Port
You can use the Game Port connector to connect an IBM PC compatible joystick or MIDI instrument.
Line Out
The Line Out jack allows you to connect the audio output of the audio controller to your home stereo, VCR, or amplified speakers.
Line In
You may connect an external mono or stereo audio source to the audio controller, such as a tape player or radio. Use the appropriate converter cable to interface to your external equipment.
MIC In
The MIC In jack will accommodate a mono 600 ohm microphone.
Chapter 3: Installing the Helios
37
Chapter 3: Installing the Helios
38
39
The BIOS Setup Utility
Configuration
After the Helios system board and all hardware is installed, the system is ready for configuration. Before turning on the computer, make sure all cables are correctly connected and all jumpers are correctly set.
We recommend that you keep the computer cover off the first time you boot the system. This makes it faster and easier to correct any difficulties that might arise.
Initial Boot Up
Power up the Helios. If the system does not properly boot, check all your cables and peripherals for bad connections. You may also get beep codes or error messages. If this occurs, consult Appendix B for a guide to possible solu­tions.
After the system properly boots, it is ready to be config­ured. The following information explains the proper proce­dures for BIOS configuration.
Setup
The Setup program is used to configure the computer’s BIOS (Basic Input/Output System). The computer’s BIOS is responsible for configuring the system board, CPU and providing hardware information to the operating system. In order for the computer to run properly, run the Setup procedure after first installing the system board and when­ever you make a hardware change to the system.
Chapter 4: The BIOS Setup Utility
4
Chapter
40
When the system is turned on, it performs a memory test, and a BIOS identification and system information screen is displayed on your monitor, as shown in Figure 4-1.
Figure 4-1: P ower-Up Screen
When “Press <F2> to enter Setup” appears at the bottom of the screen, press the <F2> key to start the Setup program. Note that the Setup program can only be acti­vated during the boot sequence.
Running the Setup Procedure
The Helios system board has six primary configuration screens: Info, Main, Advanced, Chipset, Features and Exit. To toggle between the screens, press the right arrow <→> and the left arrow < ←> keys.
Chapter 4: The BIOS Setup Utility
Chapter 4: The BIOS Setup Utility
41
Info Screen
The Info screen lists your system configuration information. This information is determined by your system configura­tion and cannot be manually changed.
Figure 4-2: Info Screen
Setting the CPU Speed
These instructions will assist you when installing a new CPU or changing the CPU speed. If you have not done so already, power down your system and remove the cover. Follow the steps below:
1. After you have removed the cover, place the jumper on W12 (refer to the following table).
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2. Turn on your system. When the system is powered up it will go into Setup automatically.
3. The first selection on the Main screen will be CPU Speed. Select the correct speed and press F10 (Save and Exit) to save your setting.
4. You will see a message indicating that the CPU speed setting has been saved.
5. Power down your system and remove the jumper off W12 (save the jumper by placing it back on one pin only). The CPU speed selection will no longer appear in Setup.
NOTES:
•
No speed configuration is required when adding a second processor with the same speed as the original processor.
•
If you forget to remove the configuration jumper after you save and exit, the process will simply repeat.
Chapter 4: The BIOS Setup Utility
42
Setting the Main Screen
The CMOS Main screen is used to set the time and date, to set the floppy drive types, to configure IDE hard disks and other categories. This chapter explains how to config­ure each of these categories. To move between the catego­ries, use the up and down arrow <↑/↓> keys.
Figure 4-3: CMOS Main Screen
System Time and Date
To set the Time, use the <-> key to decrease the number and the <+> key to increase the number. To move the prompt forward, use the <Tab> key; to move the prompt backward, use the <Shift-Tab> key. To set the Date, use the up and down arrows<↑/↓> to highlight the System Date and follow the same procedure used to set the Time.
Chapter 4: The BIOS Setup Utility
43
Chapter 4: The BIOS Setup Utility
44
Diskette A or B
To configure a floppy drive added to or removed from your computer, use the up and down arrow keys <↑/↓> to select the desired drive. Use the <+/-> keys to change the setting until it matches the floppy drive you installed. The BIOS supports 2.88MB, 1.44MB, 1.2MB, 720KB, and 360KB floppy drives.
Primary and Secondary IDE Devices
If you are setting up a SCSI hard disk, select None in the IDE Device parameters (see your SCSI card manual for more details). To install an IDE device, select the device to configure and press ENTER. An IDE Device submenu will appear (see Figure 4-4).
Large Disk Access Mode
If you are using a DOS operating system (MS-DOS, Novell DOS or PC-DOS), set to DOS (default). If you are using anything else, set to OTHER.
MPS Version
This selection allows you to select the 1.1 or 1.4 (default) Intel Multiprocessor specification.
Chapter 4: The BIOS Setup Utility
45
Type
This category selects the drive type installed in the system. The options are Auto (default), User and None. If Autotype Fixed Disk does not find your drive’s parameters, fill this information in manually under the User category. This information may be in the manual which came with your system. If not, contact your dealer or the hard drive manu­facturer to fill in this category. If you are using a SCSI hard drive, select None and refer to the documentation which came with the SCSI adapter.
Multiple-Sector Transfers
This category determines the number of sectors per block for multiple sector transfers. The options are Auto (de­fault), Disabled, 2 Sectors, 4 Sectors, 6 Sectors, 8 Sectors and 16 Sectors.
Figure 4-4: IDE Device Submenu
Chapter 4: The BIOS Setup Utility
LBA Mode Control
Enabling this selection causes LBA (Logical Block Ad­dressing) to be used in place of Cylinders, Heads and Sectors. LBA Mode Control support drives larger than 500MB. The default setting is Enabled.
32-Bit I/O
This category allows you to enable the 32-bit I/O function of the PCI IDE controller. Select Disabled if your drive will not run at this speed. The default setting is Disabled.
Transfer Mode
This category sets the transfer speeds for IDE devices. The Fast PIO 1, Fast PIO 2, Fast PIO 3 and Fast PIO 4 (default) options are for higher speed devices.
Smart Monitoring
This feature will monitor your hard drive and report any problems detected. The default setting cannot be changed.
46
Chapter 4: The BIOS Setup Utility
47
Setting the Advanced Screen
The Advanced screen is used to configure the system devices. To move to the Advanced screen, use the left and right arrow keys <←/→> keys until you see the screen below.
Figure 4-5: Advanced Screen
Plug & Play O/S
This selection allows your system to work with a Plug and Play operating system such as Windows 95. The default setting is No. NOTE: This selection should be set to No when using Windows 3.1 or Windows NT.
Reset Configuration Data
Select Yes to reset Extended System Configuration Data (ESCD) when you exit Setup. This selection allows the PnP BIOS to re-detect your PCI and ISA PnP devices and reallocate resources to them. The default setting is No.
Chapter 4: The BIOS Setup Utility
48
PCI Configuration
Use this selection for additional setup menus to configure IRQ’s for legacy ISA devices.
PS/2 Mouse
When disabled, this selection prevents the PS/2 mouse from functioning and frees up IRQ12. Selecting Autodetect (default) allows the operating system to determine whether to enable or disable the mouse.
Legacy USB Support
Use this selection to provide BIOS support for USB devices to function in alternative operating systems. Your USB device must still have and load its own drivers for that particular operating system. Select Enabled when using DOS and Windows 95 operating systems. Select Disabled (default) when using Windows NT, OS/2 and Unix operat­ing systems.
Integrated Ports
Use this selection for additional setup menus to configure peripheral devices. Press <Enter> and a submenu ap­pears.
Integrated PCI IDE
Enables or disables the integrated PCI IDE adapter. The IDE controller may be set for Primary, Both (default) or Disabled.
Integrated LM79
Enable or disable the integrated LM79 microprocessor system hardware monitor. The LM79 can be used to moni­tor temperatures, power supply voltages and fan speeds.
Integrated Sound
Enables or disables the integrated sound interface. The default setting is Enabled.
Keyboard Detection
Setting this to Enabled (default) activates the keyboard detection upon boot. When disabled, it allows the system to boot without a keyboard attached.
Chapter 4: The BIOS Setup Utility
49
Chapter 4: The BIOS Setup Utility
50
Setting the Chipset Screen
The Chipset screen allows you to program the Intel 440BX AGP chipset features. To access the Chipset setup screen, highlight this option on the main menu screen and press <Enter>.
Figure 4-6: Chipset Setup Screen
Graphics Aperture
Select the size of the Graphics Aperture for the AGP video device. The aperture is a portion of the PCI memory address range dedicated for graphics memory address space.
DRAM Type
The DRAM type can be set for Non-Parity (default), Parity or ECC. Selecting ECC will detect the parity error and allow the system to correct the error, if ECC memory is in place on the system.
Chapter 4: The BIOS Setup Utility
51
Setting the Features Screen
The Features Screen allows you to configure the boot configuration, power management functions and the se­curity of the system. To move to the Features Screen, use the left and right arrow <←/→> keys until it appears.
Figure 4-7: Features Setup Screen
QuickBoot
This selection allows the system to skip certain tests while booting. This will decrease the time needed to boot up the system.
QuietBoot
When disabled, this selection displays the system diagnos­tics screen during boot up. When enabled, the system logo screen displays in place of the system diagnostics screen.
Chapter 4: The BIOS Setup Utility
52
Multiboot
Use this selection for additional setup menus to configure your boot devices. Press <Enter> and a submenu appears.
DMI Event Logging
Use this selection for additional setup menus to control the DMI (Desktop Management Interface) Event Logging func­tions of the system. This feature allows you to view and modify DMI Event logs. To enable the DMI Event Logging feature, press <Enter> and a submenu appears (see Figure 4-8).
Power Management
Use this selection for additional setup menus to control the power management functions of the system. To enable the power management feature, press <Enter> and a submenu appears (see Figure 4-9).
Security
Use this selection for additional setup menus to control the security functions of the system. To enable the security feature, press <Enter> and a submenu appears (see Figure 4-10).
Chapter 4: The BIOS Setup Utility
53
Figure 4-8: DMI Event Logging Submenu
Event Logging
When Enabled (default), this selection allows logging of DMI (Desktop Management Interface) events.
ECC Event Logging
When Enabled (default), this selection allows logging of ECC (Error Checking and Correction) events.
View DMI Event Log
Press <Enter> here to view contents of the DMI event log.
Mark Events As Read
After you have viewed the contents of the DMI event log, press <Enter> here to mark all DMI events as read.
Clear All DMI Event Logs
Selecting Yes will clear the DMI event log after the system reboots. The default setting is No.
Power Savings
This selection allows you to change the system power management settings. Maximum Power Savings conserves the greatest amount of system power. Maximum Perfor­mance conserves power but allows greatest system perfor­mance. To alter these settings, choose Customize (de­fault). To turn off power management, choose Disabled.
Standby Timeout
The Standby Timeout selection sets the amount of time that elapses for the system to enter Standby Mode. Standby Mode turns off various devices in the system, including the display screen, until you start using the system again. The options are Off (default), 1 min., 2 min., 4 min., 6 min., 8 min., 12 min. or 16 min.
Suspend Timeout
The Suspend Timeout selection sets the amount of time that elapses for the system to enter Suspend Mode. The
Chapter 4: The BIOS Setup Utility
54
Figure 4-9: P ower Management Submenu
options are Off (default), 5 min., 10 min., 15 min., 20 min., 30 min., 40 min. or 60 min. Before making changes, “Cus­tomized” must be selected in the Power Management Mode selection.
Resume On Time
When this feature is turned On, the system counts down to zero and awakes from Standby or Suspend mode. Before making changes, “Customized” must be selected in the Power Management Mode category. The default setting is Off.
Chapter 4: The BIOS Setup Utility
55
56
Figure 4-10: Security Submenu
Set Supervisor Password
This selection controls access to the Setup utility. Press the ENTER key to enter the Supervisor Password submenu. Type the password and press the ENTER key. Retype the password and press the ENTER key again. Write down the password somewhere safe so it will not be forgotten. The password may be disabled by setting the new password to nothing (pressing the ENTER key without first typing a password).
WARNING: If you forget the Supervisor Password, it cannot be disabled without discharging the CMOS.
Set User Password
This selection controls access to the Setup utility. Follow the same procedure used to set the Supervisor Password.
NOTE: After a password is entered, it is saved immediately. All other changes may still be discarded (see Exit Screen).
Chapter 4: The BIOS Setup Utility
Chapter 4: The BIOS Setup Utility
Password on Boot
When enabled, the system requires a password upon power up. Either the Supervisor or User Password may be entered. The default setting is Disabled.
Fixed Disk Boot Sector
This selection allows the boot sector of the fixed disk to be write protected. The default setting is Normal. When set for Write Protected, it serves as a form of virus protection. If the passwords are enabled, this option may only be changed by the Supervisor.
57
Chapter 4: The BIOS Setup Utility
58
Exit Screen
After you complete configuring the BIOS, select the Exit screen. To move to the Exit Screen, use the left and right arrow <←/→> keys until it appears. To move between the categories, use the up and down arrow keys <↑/↓>.
Figure 4-11: Exit Screen
Choose “Save Changes and Exit” and reboot the com­puter.
Chapter 5: Installing Device Drivers
59
5
Chapter
Installing Device Drivers
This chapter explains how to install the software device drivers and utilities necessary to utilize the optional sound support. Other drivers and utilities are available through our online services.
About Device Drivers
Device drivers are necessary for the computer system to communicate with devices such as CD-ROM drives, sound controllers, graphics adapters or devices that are not na­tively supported by the system BIOS. Once started, device drivers remain active in the background of the computer system. Usually a device driver is added to the CONFIG.SYS file, the AUTOEXEC.BAT file or both.
Installing the Sound Drivers
Once you have connected your external sound devices, you can install the sound drivers. NOTE: If you are installing a CD-ROM drive, it is recommended you install it before setting up the sound devices. See Installing a CD-ROM Drive in Chapter 3.
1. Follow the instructions in Chapter 3 on connecting external sound devices.
2. If you previously installed another sound card, remove it and all associated files from your AUTOEXEC.BAT and CONFIG.SYS files. If you are using Windows 3.1x, you must also remove all associated files from the WIN.INI and SYSTEM.INI files. (For more informa­tion, please contact the sound driver manufacturer.)
3. Start your computer system.
4. Insert the sound driver disk into your floppy drive.
Chapter 5: Installing Device Drivers
60
5. If you are using Windows 95, refer to the Windows 95 user’s manual for instructions on how to install sound drivers.
6. If you are using Windows NT, refer to the Windows NT user’s manual for instructions on how to install sound drivers.
7. Once the software is copied, the install program auto­matically updates the system files.
Chapter 6: Special Features
61
6
Chapter
Special Features
The Helios achieves high reliability, performance and scalability with numerous features.
Intel’s 440BX AGPset
In the competitive world of system board chipsets, Intel’s new 440BX places at the top with its support for the
100MHz Front Side Bus (FSB) tech­nology. The 440BX is the infrastructure behind the 100MHz FSB technology. Along with PC100 memory and Intel’s new versions of the Pentium II processor family, the 440BX AGPset adds a new
data highway that should post a substan­tial increase in bus and memory access. The flexibility of the 440BX allows for support of the first generation Pentium II processors at 66MHz FSB speeds.
Accelerated Graphics Port (AGP)
With the introduction of the Pentium II and the 440LX AGPset, graphics took the next step onto the AGP free­way. The AGP bus is faster than the current 33MHz PCI bus. It pro­vides a direct connection between the graphics subsystem and system memory. AGP, with dual 528MB/s data path, sur­passes PCI’s 132MB bottleneck.
Chapter 6: Special Features
62
SDRAM (Synchronous DRAM)
SDRAM is memory that can synchronize itself with the computer’s clock. This synchronization reduces time delays and allows for fast consecutive read and write capability. SDRAM can add as much as 10% to the overall system performance.
Intel’s release of the 440BX AGPset allows SDRAM to operate up to a new standard at 100MHz. At these speeds, a new standard of SDRAM or PC100 SDRAM is required. PC100 MHz memory is backwards compatible to run at 66MHz, however, a non PC100 SDRAM may not be used on a 100MHz FSB system.
LM79 (Hardware Management)
A highly integrated Data Acquisition system for hardware monitoring of servers, Personal Computers, or
virtually any microproces­sor based system. In a PC, the LM79 can be used to monitor power supply volt­ages, temperatures, and fan speeds. It provides the hardware support for remote management
software, (i.e., Intel’s LANDesk) to keep maintenance costs to a minimum while providing real time remote management.
Ultra DMA/33 IDE
A hard drive interface protocol that increases the burst data transfer rate to 33MBytes per second. Prior to this protocol, Mode-4 protocol has been the fastest at 16.6MB per second. This new protocol is supported by Intel’s 440LX and 440BX AGPsets.
Universal Serial Bus (USB)
The simple and flexible way to connect devices to your desktop or notebook PC. USB allows virtually unlimited PC
expansion with no more hassles over add-in cards, dip switches, jumper cables, software drivers, IRQ set-
tings, DMA chan­nels and I/O addresses. With USB, you can attach and detach peripherals without opening the computer or even shutting it down.
Chapter 6: Special Features
63
Chapter 6: Special Features
64
Appendix A: Technical Information
65
A
Appendix
Specifications
Part Number: 09-00329-xx
Processor: Dual Intel Slot 1 for:
Intel Pentium II processors -
233/266/300/333MHz (66MHz FSB).
Intel Pentium II processors -
350/400MHz (100MHz).
Integrated VRMs
CPU Clock: Support for 66 and 100MHz CPU bus
Chipset: Intel 440BX AGPset
Intel PIIX 4e National PC87309 Enhanced Super I/O chip
Form Factor: ATX form factor
Six layer board Stacked I/O connectors (Intel Venus I/O Shield compatible). 20-pin ATX power connector
Expansion: One 16-bit ISA slots
Five 32-bit PCI slots (One is a shared PCI/ISA slot) One AGP slot
BIOS: Phoenix 4.06 BIOS on 2MB Flash
Advanced Power Management 1.2 PCI auto configuration Auto detection of memory size Jumperless CPU configuration Auto detection and display of EDO and SDRAM memory. Auto detection of IDE hard disk types Soft Power Down Quick Boot Multiboot II DMI 2.0/SMI/ACPI
Appendix A: Technical Information
Keyboard/Mouse: PS/2 style keyboard and mouse
Memory Capacity: Four 3.3V unbuffered 64/72-bit DIMM sockets
(PC100 100MHz SDRAM memory supported). Maximum memory - 1GB SDRAM ECC supported via chipset when using 62/72-bit DIMMs.
Onboard Sound: ESS Maestro-2 PCI audio (optional) Sound Blaster compatible 16-bit stereo
Line In, Line Out, MIC and Game/MIDI ports 4-pin CD-ROM audio header (ATAPI) 4-pin CD-ROM modem/Telephony header (ATAPI). 4-pin Line In header (ATAPI) 4-pin Aux 2 (ATAPI) 4-pin Video Sound In header (ATAPI) Sound drivers
Hardware LM79 Microprocessor System Hardware Monitor Management: (optional).
Two LM75 CPU Temperature Sensors CPU Fan Speed Monitoring (3-pin header) Chassis Intrusion (2-pin header) Chassis Fan Speed Monitoring (3-pin header)
I/O Ports: Two high speed serial ports (16550 compatible)
One 25-pin Parallel Port (ECP and EPP) Two USB ports
Floppy Port: Supports 360K - 2.88MB formats
Auto detection of add-in floppy controllers
PCI IDE Ports: Ultra DMA/33 IDE
Two 40-pin IDE connectors (Primary and Secondary IDE). Multiple sector transfer support Auto detection of add-in IDE board Supports all ATAPI device
66
Appendix A: Technical Information
67
Environmental Specifications
The environment in which the Helios is located is critical. Micronics recommends the following environmental specifications:
Temperature Range
Operating: 50 to 104 degrees Fahrenheit (10 to 40 degrees Celsius).
Non -Operating: 50 to 140 degrees Fahrenheit (10 to 60 degrees Celsius).
Shipping: -22 to 140 degrees Fahrenheit (-30 to 60 degrees Celsius).
Relative Humidity
Operating: 20% to 80%. Non-Operating: 5% to 90%.
Appendix A: Technical Information
Battery Disposal
WARNING:
Please do not open battery, dispose of in fire, recharge, put in backwards or mix with used or other battery types. The battery may explode or leak and cause personal injury.
68
Appendix A: Technical Information
69
Support and Information Services
Micronics offers a variety of support and information ser­vices to help you get the most from your product. The following services are available:
▲ Technical Support ▲ Electronic Bulletin Board Service (BBS) ▲ Return Materials Authorization (RMA) ▲ Fax-On-Demand ▲ World Wide Web ▲ Customer Service
Refer to Table A-1 for details on these services.
Technical Support
If you need technical assistance, our Technical Support Engineers will be glad to help you. You can contact us via telephone, fax or BBS. Before calling Technical Support please have the following information ready:
❏ The model name, 09 part number and serial number of
your Micronics product, which is silk screened on the face of the Helios system board.
❏ Your computer information such as CPU type, operating
system, amount of installed memory and other peripher­als installed in your computer.
❏ Try to call from the location of your computer.
NOTE: For Return Material Authorization purposes, please keep a copy of your product receipt.
Appendix A: Technical Information
70
T ab le A-1: Support and Information Services
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Appendix B: POST Messages
71
Appendix
B
POST Messages
The following table lists the Power On Self Test (POST) messages, possible causes and solutions.
Message Possible Cause Solution
DISKETTE DRIVE A FAILURE
Drive A failed or is missing.
Check Setup and cable connections.
DISKETTE DRIVE B FAILURE
Drive B failed or is missing.
Check Setup and cable connections.
EXTENDED RAM FAILED AT OFFSET: nnnn
Extended memory not working or configured properly.
Replace defective memory.
FAILING BITS: nnnn
Memory failure in System, Extended, or Shadow memory.
Replace defective memory.
FIXED DISK X FAILURE (where X =0 or 1)
The hard disk is not configured or working properly.
Rerun SE TUP and check connections, or replace hard di sk.
FIXED DISK CONTROLLER FAILURE
The controller card h as failed.
Check configuration and connections, or replace controller card.
INCO RR E C T DR I V E A TYPE
Floppy drive A: not set correctly in Setup.
Run Setup.
INCO RR E C T DR I V E B TYPE
Floppy drive A: not set correctly in Setup.
Run Setup.
INVALID NVRAM MEDIA TYPE
NVRAM chip is bad. Requires repair of system
board.
KEYBOARD ERROR, or KEYBOARD CONTROLLER ERROR
The keyboard or keyboard controller failed.
Check connections. You may have to replace the keyboard or controller.
KEYBOARD ERROR nn
A key is jammed or was held do wn during boot .
Make sure the keys are not jammed or dirty.
KEYBOARD LOCKED
Keyswitch on the front of the case is locked.
Unlock the keyswitch.
Appendix B: POST Messages
72
Message Possible Cause Solution
MONITOR TYPE DOES NOT MATCH CMOS
Monitor type not correctly identified in Setup.
Run Setup and enter correct monitor type.
OPERATING SYSTEM NOT FOUND
Operating system cannot be located on Drive C: or Drive A:
Check Setup to see if Drive A: and C : are properly configured, or put a bootable disk in Drive A:
PARITY CHECK 1 nnnn
Parity error found in the system bus.
Check Setup. Board repair may be required.
PARITY CHECK 2 nnnn
Parity error found in the I/O bus.
Check Setup. Board repair may be required.
PREVIOU S BOOT INCOMPLETE ­DEFAULT CONFIGURATION USED
Previous POST did not complete successfully.
Run Setup, load default BIOS settings, make any necessary adjustments, and save the changes
REAL TIME CLOCK ERROR
Real-time clock failed BIOS test.
May require bat tery replacement or board repair.
SHADOW RAM FAILED AT OFFSET
Shadow RAM fa iled. May require repair of
system board.
SYSTEM BA TTERY IS DEAD
System battery died. Replace the system
battery and run Setup to reconfigure the system.
SYSTEM CAC HE ERROR - CACHE DISABLED
External (L2) cache failed BIOS test.
System will still run, but slower. Replace cache at convenien ce.
SYSTEM CM OS CHECKSUM BAD ­RUN SETUP
System CMOS has been corrupted or modified incorrectly .
Run Setup and reconfigure the system.
SYSTEM RAM FAILED AT OFFSET: nnnn
System RAM failed. Replac e defective RAM.
SYSTEM TIMER ERROR
Timer test failed. Requires repair of system
board.
Appendix C: Beep and POST Codes
73
Beep and POST Codes
Beep codes are a series of beeps sent through the speaker which indicate a problem during the Power On Self Test (POST). If text appears on the video screen, the Helios has completed POST; any other tone from the speaker indi­cates something other than a POST error. These tones are not described in the tables on the following pages.
The beep error codes are a series of beeps. The duration of the beep tones are constant, but the length of the pauses between the beeps varies. For example: a 1-3-3 beep code will sound like one beep, a pause; three beeps consecu­tively, another pause and then three more beeps.
One beep code is often misunderstood. If a video card is not installed or is failing, the system board will generate a long-short-long-short beep code. This is often inter­preted as a 1-2-1 beep code. But POST errors always vary in the length of the pause and not the duration of the beep tone.
Another way of identifying a POST error is to use a device called a POST card. This peripheral card is inserted into one of the ISA slots and has an LED (or LCD) read out showing the contents of port 80h.
The following tables list all beep codes and POST rou­tines.
Appendix
C
Appendix C: Beep and POST Codes
74
Code Beeps POST Routine Description
02 Verify Real Mode. 04 Get CPU type. 06 Initialize system hardware. 08 Initialize c hipset registers with initial POST v alues. 09 Get in POST Reg.
0A Initialize CPU registers. 0C Initialize cache initial POST values. OE Initialize I/O. OF Initialize the localbus IDE.
10 Initialize Power Manageme nt .
11 Load alternate reg isters wit h i nitial POS T va l ues.
12 Jump to UserPatch0.
14 Initialize k ey board controller.
16 2-2-3 BI OS ROM checksum.
18 825 4 timer initializ ation.
1A 8237 DMA co ntroller i nitiali z ation. 1C Rese t Programmable Interrupt Contro l ler.
20 3-1-1 Test DRAM refr es h .
22 3-1-3 Test 8742 Keyboard Controller.
24 Set ES segment register to 4 GB.
28 Autosize DRAM.
2A Clear 512K base RAM. 2C 3-4-1 Test 512 K base address li nes.
2E 3-4-3 Test 512 K base memory.
32 Test CPU bus-clock frequency.
34 Test CMOS RAM.
35 Initialize alt ernate chipset registers .
37 Reinitia liz e th e c hipset (MB only).
38 Shadow system BIOS ROM.
39 Reinitia liz e th e c ac he (MB only).
3A Autosize cache. 3C Configure advanc ed chipset re gi s ters. 3D Load alternate registers with CMOS valu es.
40 Set initial CPU speed.
42 Initialize int errupt vectors.
44 Initialize BIOS interrupts.
46 2-1-2-3 C heck ROM copyrig ht notice.
47 Initialize manager for PCI Option ROMs.
48 Chec k video configuratio n against CMOS.
49 Initialize PC I bus and devices.
Appendix C: Beep and POST Codes
Code Beeps POST Routine Description
4A Initialize all video adapters in system. 4C Shadow video BIOS ROM. 4E Display copyright notice. 50 Display CPU type and speed. 51 Initialize EISA board. 52 Test keyboard. 54 Set key click if enabled. 56 Enable keyboard. 58 2-2-3-1 Test for unexpected interrupts. 5A Display prompt “Press F2 to enter SETUP”. 5C Test RAM between 512 and 640k. 60 Test extended memory. 62 Test extended memory address lines. 64 Jump to UserPatc h1. 66 Configure advanced cache regi st er s. 68 Enable external and CPU caches. 6A Display external cache size. 6C Display shadow message. 6E Display non-disposable segments. 70 Display error messages. 72 Check for configuration errors. 74 Test real-time clock. 76 Check for keyboard err or s. 7C Set up hardware interr upt v ector s. 7E Test coprocessor if present. 80 Disable onboard I/O ports. 82 Detect and instal l external RS232 ports. 84 Detect and instal l external parallel ports. 86 Re-initialize on-board I/O ports. 88 Initialize BIOSData Area. 8A Initialize Extended BIOS Data Area. 8C Initialize floppy controller. 90 Initialize hard-disk controller. 91 Initialize localbus hard-disk controller. 92 Jump to UserPatc h2. 93 Build MPTABLE for multi-processor boards. 94 Disable A20 address line. 96 Clear huge ES segment register. 98 Search for option ROMs. 9A Shadow option ROMs.
75
Code Beeps POST Routine Description
9C Set up Power Management. 9E Enable hardware interrupts. A0 Set time of day. A2 Check k ey lock. A4 Initialize typematic rate. A8 Erase F2 prompt. AA Scan for F2 keystroke. AC Enter SETUP. AE Clear in-POST flag. B0 Check for errors. B2 POST done - prepare to boot operating system . B4 One beep. B6 Check password (optional). B8 Clear global descriptor table. BC Clear parity checkers. BE Clear screen (optional). BF Check virus and backup reminders. C0 Try to boot with INT 19. D0 Interrupt handler error. D2 Unknown interrupt error. D4 Pending Interrupt. D6 Initialize op tion ROM error. D8 Shutdown error. DA Extended Block Move.
DC Shutdow n 10 er ro r .
The following ar e for boot bl ock in Flas h ROM : E2 Initialize the chipset. E3 Initialize refresh counter. E4 Check for Forced Flash. E5 Check HW status of ROM. E6 BIOS ROM is OK. E7 Do a complete RAM test. E8 Do OEM initialization. E9 I nitialize interrupt controller. EA Read in the bootstrap code. EB Initialize all vectors. EC Boot the Flash program . ED Initialize the boot device. EE Boot code was read OK.
Appendix C: Beep and POST Codes
76
Appendix D: Updating the System BIOS
77
Updating the System BIOS
The Micronics system boards are designed so that the BIOS can be reprogrammed using a BIOS file. You can easily FLASH a BIOS by following the steps below:
1. After downloading the appropriate BIOS file from our BBS or Website, extract it to a bootable MS-DOS 6.X diskette.
2. Reboot your system with the MS-DOS 6.X diskette in the A: drive. To make sure a clean DOS environment is loaded, press the F5 key while “Starting MS-DOS” is displayed. After the system has rebooted, the cursor will appear at the A:> prompt.
3. Now you can run the FLASH utility from the bootable floppy disk. Refer to the README.TXT file included with the BIOS update for detailed instruc­tions.
4. After the update process has completed and the system reboots, verify that the new BIOS version appears onscreen. If you have problems during this process, or if you have questions about the procedure, please call Technical Support.
NOTE: If you prefer to send your system board in for the upgrade, the RMA department offers this service free of charge if your system board is under warranty.
D
Appendix
If you encounter any problems during this process, or if you have questions about the procedure, please call Technical Support.
Appendix D: Updating the System BIOS
78
Appendix E: Warranties and Notices
79
Limited Warranty
Except as described below, Micronics warrants the prod­ucts to be free from defects in material and workmanship in normal use for a period of one (1) year from date of purchase. Should any product fail to perform according to this warranty at any time during the warranty period, except as provided below, Micronics or its authorized service centers will, at Micronics’ option, repair or replace the product at no additional charge.
The warranty does not cover loss or damage which occurs in shipment or which is due to: (1) improper installation or maintenance, misuse, neglect or any cause other than ordinary commercial application, including without limi­tation, accidents or acts of God; (2) adjustment, repair, or modification by other than a Micronics authorized service center; (3) improper environment, excessive or inad­equate heating or air conditioning, or electrical power failures, surges or other irregularities; (4) any statement about the product other than those set forth in this warranty; or (5) nonconformity to models or samples shown to the purchaser. Any models or samples were for the sole purpose of suggesting the character of the product and are not intended to form the basis of the bargain.
A receipt or copy of the invoice with the date of purchase from a Micronics reseller is required before any warranty service can be rendered. Service can be obtained by calling Micronics for a Return Merchandise Authoriza­tion (RMA) Number.
The RMA Number should be prominently displayed on the outside of the shipping carton of the returned product. Returned product should be shipped prepaid or hand carried to Micronics. The purchaser assumes risk of loss or damage in transit, and unless otherwise agreed to in writing by Micronics, will pay inbound shipping charges.
The exclusive remedy of the purchaser under this warranty above will be repair or replace at Micronics’ option, but if for
E
Appendix
Appendix E: Warranties and Notices
80
any reason that remedy should fail of its essential purpose, the exclusive remedy of the purchaser shall then be actual damages up to amounts paid for the defective product by the purchaser. This limited warranty shall be deemed to “fail of its essential purpose” if, after repeated efforts, Micronics is unable to make the product operate as warranted. Micron­ics’ liability for damages to the purchaser for any cause whatsoever; regardless of the form of action and whether in contract or in tort, shall be limited to the purchase price in effect when the cause of action arose for the product that is the basis of the claim.
Micronics will not be liable for any lost profits or any indirect, special incidental or consequential damages in connection with the product, even if Micronics has been advised of the possibility of such damages.
Micronics makes no warranties or representations as to performance of products or as to service to distributor or to any person, except as set forth in Micronics; limited warranty accompanying delivery of product.
Micronics disclaims all other warranties whether oral, written, expressed, or implied, including without limita­tion, the warranties of design, merchantability, or fitness for a particular purpose, if applicable, or arising from a course of dealing, usage or trade practice.
Non-Warranty Service
After the one year warranty service is no longer in effect, repair service is still available for Micronics products. For more information, contact Micronics’ RMA department at (510) 661-3030. The RMA department is open between 8:30 A.M. and 4:45P.M. Pacific Standard Time.
Appendix E: Warranties and Notices
81
FCC Statement
This equipment has been tested and found to comply within the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reason­able protection against harmful interference in a residential installation. This equipment generates, uses and can radi­ate radio frequency energy and, if not used in accordance with the instructions, may cause harmful interference to radio communications. Interference to radio or television reception can be determined by turning the equipment off and on. You are encouraged to try to correct the interfer­ence by one or more of the following measures:
▲ Reorient the receiving antenna. ▲ Increase the separation between the equipment and
the receiver.
▲ Connect the equipment into an outlet on a circuit
different from that to which the receiver is con­nected.
▲ Consult your dealer or an experienced radio/TV
technician for help.
To meet FCC requirements, shielded cables are required.
NOTE: Changes or modifications not expressly approved by Micronics could void your authority to operate the equipment.
16550 UART - A high speed chip for controlling serial ports. Although un­necessary for a mouse, it is required for modems that are 14,400 baud or faster.
AGP - Accelerated Graphics Port. A faster bus than the current 33MHz PCI bus, which will connect the graphics controller to system memory through the chipset.
Asynchronous - Operations that do not require the clocks of communicat­ing devices to be coordinated. See Syn­chronous.
ATX - A system board size measuring approximately 12” x 9.6”.
Bidirectional Parallel Port - A type of parallel port that can send and receive information.
BIOS - An Acronym for Basic Input/ Output System. Configures the system board and provides hardware informa­tion to the operating system.
Bit - A contraction of Binary digit. The smallest unit of information in a binary number system. A bit repre­sents a choice between either zero or one.
Boot - To start up the computer and load the operating system software. See cold boot and warm boot.
Buffered DIMMs - The 168-pin buff­ered DIMM modules use buffer logic chips on their control lines to reduce loading on the system board. This buff­ering action increases the maximum
Glossary
Glossary
82
number of modules on the same system board. The buffered DIMMs come with standard DRAM chips for either 5V or
3.3V operation.
Bus - A group of electronic paths used to send data between parts of the sys­tem. On a system board, the bus con­nects the peripheral cards with the microprocessor via the expansion slots.
Bus Mastering - The ability of a peripheral card to control the bus with­out requiring intervention of the CPU.
Byte - A group of adjacent bits treated as a unit. Eight bits are typically con­sidered one byte. Also called a charac­ter.
Cache - A process where information is copied from the slower memory (DRAM) to the faster memory (SRAM). Information that is likely to be read or edited is stored in the cache providing significant performance in­creases.
Cache Hit - The percentage of request for data from memory that can be served from the cache.
Cache Miss - A memory access which cannot be supplied from cache.
Cold Boot - Starting the computer by turning on the power or pressing the RESET button. A cold boot makes the processor execute all of the diagnostics. See boot and warm boot.
CPU - An acronym for Central Pro­cessing Unit. A CPU performs arith­metic calculations, makes logical decisions, and directs the operation of the computer in conjunction with the operating system.
DIMM - An acronym for Dual Inline Memory Module. A small printed cir­cuit board containing memory chips.
Disk Drive - A hardware device which provides for the storage of data on dis­kettes or hard metal disks that have a magnetic coating. A disk drive func­tions by spinning at high speed while moving a device called the read/write head across the disk’s surface in order to read or write data in magnetic code.
DMI - An acronym for Desktop Man­agement Interface. DMI makes hard­ware inventory easier. It defines a for­mat of a management agent for desk­top systems. Its layered-model architec­ture allows a wide range of software and hardware components to pass informa­tion about themselves to an asset man­agement system.
DRAM - An acronym for Dynamic Random Access Memory. A type of memory chip that only keeps its memory if supplied with regular clock pulses and a chance to regularly refresh its data. It is slower and more cost ef­fective than SRAM. See SRAM.
ECC - An acronym for Error Check­ing and Correction. ECC is logic de­signed to correct memory errors. The number of errors that can be corrected depends upon the algorithms used, and the number of error correction bits (non-data bits) present.
ECP - An acronym for Expanded Capabilities Port. A standard set by Hewlett Packard and Microsoft Corpo­ration to expand the capabilities of the parallel port.
EDO Memory - An acronym for Ex­tended Data Out. A DRAM perfor­mance feature that permits multiple bit of data in a single row to be accessed quickly.
EPP - An acronym for Enhanced Par­allel Port. A standard which increases the capabilities of the parallel port.
EPROM - Acronym for Erasable Pro­grammable Read Only Memory. A type of ROM chip that can be pro­grammed with relatively simple tools that will retain its data until erased. It can only be erased by exposing the cir­cuitry in the chip to ultraviolet light. See also Flash ROM.
Flash ROM - A type of ROM chip that will retain its data until erased. It can be erased or reprogrammed by supply­ing it with +12V of voltage. See ROM and EPROM.
Gigabyte - A disk storage capacity mea­surement. Approximately one thou­sand megabytes or 1,073,741,824 bytes.
IDE - An acronym for Integrated Device Electronics. A standard for communicating between a hard drive and a computer.
Internal Cache - Cache which is built into the CPU. See Cache.
Glossary
83
ISA - An acronym for Industry Stan­dard Architecture. A well-established bus standard that originated with the IBM AT. See PCI and VESA Local Bus.
LM75 - The LM75 is a temperature sensor. The host can query the LM75 at any time to read the temperature. Its 3.0V to 5.5V supply voltage range, low supply current and I2C interface, make it ideal for a wide range of appli­cations.
LM79 - The LM79 is a highly inte­grated Data Acquisition system for hardware monitoring of servers, per­sonal computers or virtually any micro­processor based system. In a PC, the LM79 can be used to monitor tempera­tures, power supply voltages and fan speeds.
NS - An acronym for Nanosecond. One billionth of a second. Measure of the access time of RAM.
Parallel Port - A connection for a printer or similar peripheral. Generally, parallel ports are output only. See Bi­directional Parallel Port and ECP.
Parity - Logic that detects the presence of an error in memory. Generally, a single parity bit is used for each byte (8 bits) of data. The most commonly used forms of parity are even parity, odd par­ity and checksums.
PC100 SDRAM - Intel’s latest BX chipset and associated system boards increase the memory bus speed from 66 to 100 MHz. Completely new SDRAM DIMM modules are necessary to meet the enhanced speed requirement.
These are called PC100 modules. The PC100 specification defines very strin­gent design rules for these 100MHz modules. Only DIMM’s designed to meet this requirement will work cor­rectly in 100MHz system boards.
PCI - An acronym for Peripheral Com­ponent Interconnect. A high perfor­mance 32-bit or 64-bit bus developed by Intel Corporation. PCI is designed to be independent of the hard­ware architecture to ensure compatibil­ity with future computer systems. See
VESA Local Bus and ISA.
Pentium - A high performance 64-bit CISC processor designed and manufac­tured by Intel Corporation.
Pipeline - In DRAMs and SRAMs, a method for increasing the performance using multistage circuitry to stack or save data while new data is being ac­cessed.
Plug and Play - A standard developed to ensure easy installation of peripher­als. Theoretically, a newly installed card will automatically configure itself and work properly without requiring jumper configuration or device drivers.
POST - An acronym for Power On Self Test. A diagnostic program that is run whenever the system is cold booted.
RAM - An acronym for Random Access Memory. A type of memory that is used as the “working memory” of a computer system. See DRAM and SRAM.
Glossary
84
ROM - An acronym for Read Only Memory. A type of memory that retains its data without requiring power. Once written, it cannot be modified. See EPROM and Flash ROM.
SCSI - Small Computer System Inter­face. A bus interface standard that de­fines physical and electrical character­istics for hardware devices. SCSI pro­vides a standard interface that enables many different kinds of devices, such as disk drives and CD-ROM drives to interface with the host computer.
SDRAM - An acronym for Synchro­nous Dynamic Random Access Memory or Synchronous DRAM. A DRAM designed to deliver bursts of data at very high speed using automatic addressing, multiple page interleaving and a synchronous (or clocked) inter­face.
Serial Port - A communications port used to connect peripherals such as modems and mice.
Setup - A program that allows you to make changes to the system configura­tion.
SIMM - An acronym for Standard Inline Memory Module. A small printed circuit board containing memory chips.
Small Computer System Interface ­See SCSI.
Synchronous Cache - A type of cache that uses a clock signal to latch the in­puts and the data output. This struc­ture spreads the cache access across two
or three cycles while maintaining a bandwidth of one access per cycle. Improves performance by 5-10%.
Unbuffered DIMMs - The unbuffered DIMM modules do not use any buffer logic chips, thus achieving faster op­eration due to the elimination of the propagation delay of the logic buffer. This increase in speed comes at the cost of reducing the maximum number of modules on the same system board.
USB - Universal Serial Bus. The simple and flexible way to connect devices to your desktop or notebook PC. USB al­lows virtually unlimited PC expansion with no more hassles over add-in cards, dip switches, jumper cables, software drivers, IRQ settings, DMA channels and I/O addresses. With USB, you can attach and detach peripherals without opening the computer or even shutting it down.
VESA - An acronym for Video Elec­tronics and Standards Association.
VESA Local Bus (VL-Bus) - A high performance bus designed by VESA. A 32-bit version of the ISA bus which op­erates at the speed of the computer’s CPU. See PCI and ISA.
VRM - Voltage Regulator Module. Supplies CPU specific voltages for the Secondary CPU.
Write-Back Cache - Upon a cache hit, the cache is updated and the main memory is not affected. Upon a cache miss, only the main memory is updated.
Glossary
85
Index
B
Battery Disposal - 68 POST Messages - 71 BIOS
Configuration - 39 Setup - 39
Bulletin Board System (BBS) - 70
C
Configuring the Helios- 11 CPU
Box Version - 31 Installation - 28 Overview 30 Retention Mechanism - 26 Speed Configuration- 41
D
Diagram (Helios) - 12
E
Environmental Specifications - 67 Error Checking (ECC) - 19, 21
H
Help
Bulletin Board System (BBS) - 70 Telephone Numbers - 70 Troubleshooting - 71, 73
Index
86
I
Installation
AGP Peripheral Card - 34 CPU - 26 Installing the Helios - 19 ISA Peripheral Card - 33 PCI Peripheral Card - 32 Quick Installation - 9
J
Jumper and Connector Settings - 13
M
Helios System Board Diagram - 12 Memory
Configurations - 22 Installing - 25 Removing - 25 Supported - 19, 21
O
Online Services - 70
P
PC100 SDRAM Memory - 19, 21 POST Messages - 71
S
Specifications - 65 Synchronous DRAM Memory - 19, 21 System BIOS - 39, 77
Index
87
T
Technical Specifications - 65 Technical Support - 69 Troubleshooting - 71, 73
U
Updating the System BIOS - 77 Utility Programs
Advanced Screen - 47 BIOS Setup - 39 Chipset Screen - 50 Exit Screen - 58 Features Screen - 51 Info Screen - 41 Main Screen - 43
W
Warranties - 79 World Wide Web - 70
Index
88
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