Micron MTSD032AHC6MS-1WT, MTSD064AHC6MS-1WT, MTSD128AHC6MS-1WT, MTSD256AHC6MS-1WT User Manual

Micron Confidential and Proprietary

Industrial microSDHC and microSDXC Card

Features

Industrial microSDHC and microSDXC
Card

MTSD032AHC6MS-1WT, MTSD064AHC6MS-1WT, MTSD128AHC6MS-1WT,
MTSD256AHC6MS-1WT

Features

• Micron® 3D TLC NAND Flash

• Form factor: 8-pad microSD memory card (11mm ×
15mm)

• Density1: 32GB, 64GB, 128GB, 256GB

• SD Physical Layer Specification version 5.10
compliant
– microSD Card Specification version 4.20
– SD memory card file system specification
– SD memory card security specification
– Content protection for recordable media (CPRM)
– Secure digital music initiative (SDMI)-compliant
– Password protection of cards
– Supports secure digital interface (SD) and serial

peripheral interface (SPI)

• Mean time to failure (MTTF): 2 million hours (tar­geting)

• Endurance: Total bytes written (TBW)
– 32GB: up to 22TB
– 64GB: up to 45TB
– 128GB: up to 90TB
– 256GB: up to 180TB

• Surveillance recording capability
– 32GB: 24/7 recording @2 Mb/s for 3 years
– 64GB: 24/7 recording @4 Mb/s for 3 years
– 128GB: 24/7 recording @8 Mb/s for 3 years
– 256GB: 24/7 recording @16 Mb/s for 3 years

• Health monitoring: Available

• Performance
– Refer to Performance and Capacity (page 6)

for read and write speed

• Bus speed mode (theoretical transfer rate @x4 bits)
– Default: 3.3V signaling up to 12.5 MB/s @25 MHz
– High-speed: 3.3V signaling up to 25 MB/s @50

MHz

– SDR12: UHS-I 1.8V signaling up to 12.5 MB/s

@25 MHz

– SDR25: UHS-I 1.8V signaling up to 25 MB/s @50

MHz

– SDR50: UHS-I 1.8V signaling up to 50 MB/s @100

MHz

2

3

4

– SDR104: UHS-I 1.8V signaling up to 104 MB/s

@208 MHz

– DDR50: UHS-I 1.8V signaling up to 50 MB/s @50

MHz (sampled on both clock edges)

• Integrated power-on reset, oscillator, voltage regula­tion, and voltage detection circuits

• Built-in features for defect and error management
– Strong error correction code implemented
– Global wear leveling
– Bad block management
– Refresh mechanism for UECC prevention
– Sudden power-off (SPO) protection

• Operating voltage: 2.7–3.6V

• Temperature
– Operating: –25°C to +85°C
– Storage: –40°C to +85°C

• Standards compliance
– RoHS
– FCC
– CE
– BSMI
– KC RRA
– W.E.E.E.
– VCCI
– IC

• Halogen-free

Notes:

1. Actual usable capacity may vary. 1GB equals
1 billion bytes.

2. SD Specifications, Part 1, Physical Layer
Specification, version 5.10.

3. SD Specifications, Part 1, microSD Card
Specification, version 4.20.

4. Contact Micron factory for details.

CCM005-816717818-10492
Industrial_microSD_Card_32GB-256GB_AH.pdf - Rev. D 05/18 EN

Products and specifications discussed herein are subject to change by Micron without notice.

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Micron Technology, Inc. reserves the right to change products or specifications without notice.

© 2018 Micron Technology, Inc. All rights reserved.

Micron Technology

Product Family

SD = Secure digital

Density

032 = 32GB
064 = 64GB
128 = 128GB
256 = 256GB

NAND Component

AH = TLC 256Gb, x8, 3.3V (3D)

Controller Revision

C6 = Revision C6

Production Status

Blank = Production
ES = Engineering samples

Custom Designator

Blank = Standard

Operating Temperature Range

WT = –25°C to +85°C
IT = –40°C to +85°C

Special Features

1 = First genaration

Packaging

RG = Full size SD
MS = microSD

MT SD 128 AH C6 MS-1 WT XX ES

Micron Confidential and Proprietary

Industrial microSDHC and microSDXC Card

Features

Part Number Ordering Information

Micron microSD memory cards are available in different configurations and densities. Verify valid part numbers
by using Micron’s part catalog search at www.micron.com. To compare features and specifications by device type,
visit www.micron.com/products. Contact the factory for cards not found.

Figure 1: Marketing Part Number Chart

Note:

1. Not all combinations are necessarily available. For a list of available devices or for further information on
any aspect of these products, please contact your nearest Micron sales office.

Table 1: Ordering Information

Part Number Capacity

MTSD032AHC6MS-1WT 32GB

MTSD064AHC6MS-1WT 64GB

MTSD128AHC6MS-1WT 128GB

MTSD256AHC6MS-1WT 256GB

CCM005-816717818-10492
Industrial_microSD_Card_32GB-256GB_AH.pdf - Rev. D 05/18 EN

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Micron Confidential and Proprietary

Industrial microSDHC and microSDXC Card

Important Notes and Warnings

Important Notes and Warnings

Micron Technology, Inc. ("Micron") reserves the right to make changes to information published in this document,
including without limitation specifications and product descriptions. This document supersedes and replaces all
information supplied prior to the publication hereof. You may not rely on any information set forth in this docu­ment if you obtain the product described herein from any unauthorized distributor or other source not authorized
by Micron.

Automotive Applications. Products are not designed or intended for use in automotive applications unless specifi­cally designated by Micron as automotive-grade by their respective data sheets. Distributor and customer/distrib­utor shall assume the sole risk and liability for and shall indemnify and hold Micron harmless against all claims,
costs, damages, and expenses and reasonable attorneys' fees arising out of, directly or indirectly, any claim of
product liability, personal injury, death, or property damage resulting directly or indirectly from any use of non­automotive-grade products in automotive applications. Customer/distributor shall ensure that the terms and con­ditions of sale between customer/distributor and any customer of distributor/customer (1) state that Micron
products are not designed or intended for use in automotive applications unless specifically designated by Micron
as automotive-grade by their respective data sheets and (2) require such customer of distributor/customer to in­demnify and hold Micron harmless against all claims, costs, damages, and expenses and reasonable attorneys'
fees arising out of, directly or indirectly, any claim of product liability, personal injury, death, or property damage
resulting from any use of non-automotive-grade products in automotive applications.

Critical Applications. Products are not authorized for use in applications in which failure of the Micron compo­nent could result, directly or indirectly in death, personal injury, or severe property or environmental damage
("Critical Applications"). Customer must protect against death, personal injury, and severe property and environ­mental damage by incorporating safety design measures into customer's applications to ensure that failure of the
Micron component will not result in such harms. Should customer or distributor purchase, use, or sell any Micron
component for any critical application, customer and distributor shall indemnify and hold harmless Micron and
its subsidiaries, subcontractors, and affiliates and the directors, officers, and employees of each against all claims,
costs, damages, and expenses and reasonable attorneys' fees arising out of, directly or indirectly, any claim of
product liability, personal injury, or death arising in any way out of such critical application, whether or not Mi­cron or its subsidiaries, subcontractors, or affiliates were negligent in the design, manufacture, or warning of the
Micron product.

Customer Responsibility. Customers are responsible for the design, manufacture, and operation of their systems,
applications, and products using Micron products. ALL SEMICONDUCTOR PRODUCTS HAVE INHERENT FAIL­URE RATES AND LIMITED USEFUL LIVES. IT IS THE CUSTOMER'S SOLE RESPONSIBILITY TO DETERMINE
WHETHER THE MICRON PRODUCT IS SUITABLE AND FIT FOR THE CUSTOMER'S SYSTEM, APPLICATION, OR
PRODUCT. Customers must ensure that adequate design, manufacturing, and operating safeguards are included
in customer's applications and products to eliminate the risk that personal injury, death, or severe property or en­vironmental damages will result from failure of any semiconductor component.

Limited Warranty. In no event shall Micron be liable for any indirect, incidental, punitive, special or consequential
damages (including without limitation lost profits, lost savings, business interruption, costs related to the removal
or replacement of any products or rework charges) whether or not such damages are based on tort, warranty,
breach of contract or other legal theory, unless explicitly stated in a written agreement executed by Micron's duly
authorized representative.

CCM005-816717818-10492
Industrial_microSD_Card_32GB-256GB_AH.pdf - Rev. D 05/18 EN

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Micron Technology, Inc. reserves the right to change products or specifications without notice.

© 2018 Micron Technology, Inc. All rights reserved.

General Description

The microSD card is an advanced Micron® 3D NAND Flash memory technology based
removable storage device specifically designed to meet the performance, capacity, and
quality required for industrial devices or systems. In addition to mass storage-specific
Flash memory, the microSD card includes an on-board intelligent controller which
manages interface protocols, security algorithms for content protection, data storage
and retrieval, as well as error correction code (ECC) algorithms, defect handling, sudden
power-off safeguard and wear leveling.

The microSD card includes one or more NAND Flash memory components and a mi­croSD card controller. The density of a card depends on the number of die within the
package and the density of each die.

Figure 2: Functional Block Diagram

Micron Confidential and Proprietary

Industrial microSDHC and microSDXC Card

General Description

SD protocol

CPU

Data buffer

Note:

Media

manager

1. Not drawn to scale.

NAND Flash interface

Micron

NAND Flash

Micron

NAND Flash

(optional)

CCM005-816717818-10492
Industrial_microSD_Card_32GB-256GB_AH.pdf - Rev. D 05/18 EN

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© 2018 Micron Technology, Inc. All rights reserved.

1 2 3

4 5 6 7

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Micron Confidential and Proprietary

Industrial microSDHC and microSDXC Card

Pad Assignment and Descriptions

Figure 3: microSD Card Pad Assignment (Bottom View)

Table 2: MicroSD Contact Pad Description

Pad Assignment and Descriptions

Pad #

1 DAT2

Symbol Type1Description Symbol Type1Description

2

I/O/PP Data line [Bit 2] RSV – Reserved

2 CD/DAT32I/O/PP3Card detect/data line [Bit 3] CS I

SD Mode SPI Mode

3

Chip select (active low)

3 CMD PP Command/response DI I Data in

4 V

DD

S Supply voltage V

DD

S Supply voltage

5 CLK I Clock SCLK I Clock

6 V

SS

S Supply voltage ground V

SS

S Supply voltage ground

7 DAT0 I/O/PP Data line [Bit 0] DO O/PP Data out

8 DAT1

2

I/O/PP Data line [Bit 1] RSV – Reserved

Notes:

1. S: power supply; I: input; O: output using push-pull drivers; PP: I/O using push-pull driv­ers.

2. The extended DAT lines (DAT1-DAT3) are input on power-up. They start to operate as
DAT lines after SET_BUS_WIDTH (ACMD6) command. The host shall keep its own DAT1­DAT3 lines in input mode, as well, while they are not used.

3. After power-up, pad 2 is configured as an input with an internal 50kΩ pull-up (for card
detection and SPI mode selection). The pull-up should be disconnected prior to regular
data transfer by issuing the SET_CLR_CARD_DETECT (ACMD42) command.

CCM005-816717818-10492
Industrial_microSD_Card_32GB-256GB_AH.pdf - Rev. D 05/18 EN

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Micron Confidential and Proprietary

Performance and Capacity

Performance

Using a striping method across multiple NAND Flash devices the card read and write
performance is optimized.

The Industrial microSD cards also use performance features of the underlying NAND
Flash to increase speed in streaming applications. By sending larger packets of sequen­tial data, the Industrial microSD card can better utilize NAND Flash features to enhance
performance.

Table 3: Measured Performance (25°C, VDD = 3.3V)

Industrial microSDHC and microSDXC Card

Performance and Capacity

Density

1

Sequential Read

2

Sequential Write

2

32GB 90 MB/s 25 MB/s

64GB 90 MB/s 45 MB/s

128GB 90 MB/s 45 MB/s

256GB 90 MB/s 45 MB/s

Notes:

1. 1GB = 1 billion bytes.

2. Measurements are based on a 100MB file size in UHS-I mode and depend on the host
configuration used to run the test.

Capacity

When quoting device capacity, Micron uses the formatted capacity, not the raw number
of bytes available.

Table 4: Bytes Available After Factory Formatting (FAT32 for SDHC card and exFAT for SDXC card)

Density

1

Usable Bytes

2

Speed Class

3

32GB 29,884,416,000 Class10, U1 Class1 (A1)

64GB 59,760,443,392 Class10, U1 Class1 (A1)

128GB 124,688,269,312 Class10, U1 Class1 (A1)

256GB 249,376,538,624 Class10, U1 Class1 (A1)

Application Performance

3, 4

Class

Notes:

1. 1GB = 1 billion bytes.

2. Actual user usable capacity. When cloning disk partitions, the master disk should always

3. Class is determined by Testmetrix VTE4100 Compliance Test.

4. Enable users to run their smartphone apps from the installed memory card.

CCM005-816717818-10492
Industrial_microSD_Card_32GB-256GB_AH.pdf - Rev. D 05/18 EN

be formatted to no more than the minimum guaranteed usable bytes available for that
card capacity.

6

Micron Technology, Inc. reserves the right to change products or specifications without notice.

© 2018 Micron Technology, Inc. All rights reserved.