Micron MTFDHAL1T6TCU, MTFDHAL1T9TCT, MTFDHAL3T2TCU, MTFDHAL3T8TCT, MTFDHAL6T4TCU User Manual

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Micron 9200 NVMe SSDs

9200 NVMe SSDs

MTFDHAL1T6TCU, MTFDHAL1T9TCT, MTFDHAL3T2TCU, MTFDHAL3T8TCT, MTFDHAL6T4TCU, MTFDHAL7T6TCT, MTFDHAL8TATCW, MTFDHAL11TATCW

Features

Features
• Micron® 3D NAND Flash
• PCIe® Gen3: U.2 ×4
NVMe 1.2
• Capacity – 9200 ECO: 11.0TB, 8.0TB – 9200 PRO: 1.92TB, 3.84TB, 7.68TB – 9200 MAX: 1.6TB, 3.2TB, 6.4TB
• Endurance (total bytes written) – 1.6TB: Up to 8.8PB – 1.92TB: Up to 3.5PB – 3.2TB: Up to 17.5PB – 3.84TB: Up to 7.0PB – 6.4TB: Up to 35.1PB – 7.68TB: Up to 14.0PB – 8.0TB: Up to 11.7PB – 11.0TB: Up to 16.1PB
• 512 and 4096 byte sector sizes
• Power: <5W idle, 25W power limited, or unlimited
• Surprise insertion/surprise removal (SISR) and hot-plug capable
• Power-backed cache
• Steady state performance form factor) – Sequential 128KB read: 2.85–3.15 GB/s – Sequential 128KB write: 1.9–2.3 GB/s – Random 4KB read: 700K–770K IOPS – Random 4KB write: 130K–280K IOPS
• Latency to media performance, typical (QD = 1) – READ: 92–150µs3, WRITE: 21µs
• Reliability – MTTF: 2 million hours – Field-upgradable firmware – UBER: <1 sector per 1017 bits read
• SMBus for drive management
• End-to-end data path protection
• SMART command set support
• Cryptographic erase
• FlexPro (flexible over provisioning)
1
1
1, 2
(varies by capacity and
4
5
• Temperature
6
– 0°C to 80°C SMART temperature – 0°C to 35°C ambient for U.2 – Temperature protection
• Mechanical/electrical – U.2: 69.85 × 15.00 × 100.5mm, 12V (–6%/+8%)
• Shock – U.2: 1500g @ 0.5ms
• Vibration: 3.1 G
5–800Hz @ 30 min/axis
RMS

Controller Features

• NVMe controller – Number of queues: 128 SQ/CQ pairs – Weighted round robin with urgent arbitration
• Interrupt coalescing
• NVMe command set attributes – Completion queue entry size: 16 bytes – Submission queue entry size: 64 bytes
• 4KB Atomic operations
Notes:
1. User capacity: 1GB = 1 billion bytes; 1TB = 1 trillion bytes; 1PB = 1 peta bytes.
2. Steady state as defined by SNIA Solid State Storage Performance Test Specification En­terprise v1.1.
3. READ latency varies by capacity.
4. Based on population statistics that are not relevant to individual units and a T 60°C.
5. 4K sector size support only.
6. Operating temperature is the drive case temperature as measured by the SMART temperature. See air flow recommenda­tions.
CASE
of
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Products and specifications discussed herein are subject to change by Micron without notice.
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FD H 1T6 T
Micron Technology
Product Family
FD = Flash drive
Drive Interface
H = PCIe Gen3
Drive Form Factor
AL = 2.5-inch, 15mm
Device Capacity
1T6 = 1.6TB 1T9 = 1.92TB 3T2 = 3.2TB 3T8 = 3.84TB 6T4 = 6.4TB 7T6 = 7.68TB 8T0 = 8.0TB 11T0 = 11.0TB
NAND Flash Type
T = TLC
Flash Drive Product Family
CU = 9200 MAX
CT = 9200 PRO
CW = 9200 ECO
Production Status
Blank = Production ES = Engineering sample MS = Mechanical sample
Customer Designator
YY = Standard
Additional Features
AB = Standard
Extended Firmware Features
Z = Standard 8 = VPD/SMBUS on by default
Sector Size
1 = 512 Bytes
NAND Component
AR = 384Gb, TLC, x16, 1.8V (3D)
BOM Production
1 = First generation
AL CU 1 Z AB ESAR 1 YY
MT
Micron 9200 NVMe SSDs
Features

Native Drivers

• Microsoft Windows Server® 2016
• Red Hat® Enterprise Linux (RHEL) 6.5+
• CentOS® 6.5+
• SUSE® Linux Enterprise Server 11 SP4, 12+
• Ubuntu® 12.04.03+, 14.04+

Custom Drivers

• Microsoft Windows Server 2012 R2, Hyper-V (rec­ommended)
• RHEL 6.1-6.4
• CentOS 6.1-6.4
• SUSE Linux Enterprise Server 11 SP1-SP3
• VMware® 5.5, 6.0+

Part Numbering Information

The Micron® 9200 SSD is available in different configurations and capacities. Visit www.micron.com for a list of valid part numbers.
Figure 1: Part Number Chart
Warranty: Contact your Micron sales representative for further information regarding the product, including prod­uct warranties.
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General Description

The Micron 9200® NVMe SSD Series is Micron's flagship performance product line. These products utilize a Gen3 PCIe interface, the innovative Non-Volatile Memory Ex­press protocol and Micron's own high-speed NAND to provide high throughput and IOPS, very low latency, and consistent quality of service. The 9200 product line has Mi­cron's FlexPro firmware architecture which allows you to actively tune capacity to op­timize drive performance and endurance and is available in high capacities up to 11 TBs. Reliability assurance measures include cyclic redundancy checks (CRC), end-to­end data path protection, capacitor-backed power loss protection and Micron's exten­sive validation, quality and reliability testing. It features thermal monitoring and pro­tection, SMART attributes for status polling and SMBus for out-of-band management.
The Micron 9200 has three endurance classes: the PRO for read-centric use at roughly 1 drive writes per day (DWPD); and the MAX for mixed-use workloads at about 3 DWPD; and the ECO for less than 1 DWPD. The PRO version comes in 1.92TB, 3.84TB, and
7.68TB capacities, while the MAX is sized at 1.6TB, 3.2TB, 6.4TB, and the ECO in 8.0TB and 11.0TB.

Logical Block Address Configuration

The number of logical block addresses (LBAs) reported by the device ensures sufficient storage space for the specified capacity.
Micron 9200 NVMe SSDs
General Description
Table 1: LBA Count in Accordance with IDEMA LBA1-03
Capacity 512-Byte Sector LBA Count 4KB Sector LBA Count
1.6TB 3,125,627,568 390,703,446
1.92TB 3,750,748,848 468,843,606
3.2TB 6,251,233,968 781,404,246
3.84TB 7,501,476,528 937,684,566
6.4TB 12,502,446,768 1,562,805,846
7.68TB 15,002,931,888 1,875,366,486
8.0TB 15,628,053,168 1,953,506,646
11.0TB 21,488,565,168 2,686,070,646
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Performance

Table 2: Drive Performance
Micron 9200 NVMe SSDs
Performance
9200 ECO
(TB)
9200 PRO
(TB)
9200 MAX
(TB)
Specification
Sequential read
3.15 3.15 2.85 3.15 3.15 2.85 3.15 3.15 GB/s
(128KB I/O size)
Sequential write
2.3 2.25 1.9 2.3 2.3 1.9 2.3 2.3
(128KB I/O size)
Random read
740K 770K 700K 770K 750K 700K 770K 770K IOPS
(4KB I/O size)
Random write
135K 130K 185K 170K 160K 255K 280K 270K
(4KB I/O size)
Mixed 70/30 read/write
320K 330K 325K 355K 355K 370K 445K 450K
(4KB I/O size)
Notes:
1. Performance specifications shown are with power limiting off. See Electrical Characteris­tics section for more details.
2. The stated specifications are preliminary.
3. Performance is steady state as defined by SNIA Solid State Storage Performance Test Specification Enterprise v1.1.
4. Performance may vary up to 10% over life of drive.
Table 3: Latency
Specification Queue Depth = 1 Unit
READ latency (TYP) 1.6TB–3.84TB 92 µs
READ latency (TYP) 6.4TB–8TB 101
READ latency (TYP) 11TB 105
WRITE latency (TYP) all capacities 21
Unit8.0 11.0 1.92 3.84 7.68 1.6 3.2 6.4
Note:
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1. Quality of service is measured using random 4KB workloads, QD = 1 at steady state.
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Functional Description

Mean Time to Failure

The mean time to failure (MTTF) for the device can be calculated based on the compo­nent reliability data using the methods referenced in the Telcordia SR-322 reliability prediction procedures for electronic equipment and measured during reliability dem­onstration test.
Table 4: MTTF

Endurance

SSD endurance is dependent on many factors, including: usage conditions applied to the drive, drive performance and capacity, formatted sector size, error correction codes (ECCs) in use, internal NAND PROGRAM/ERASE cycles, write amplification factor, wear-leveling efficiency of the drive, over-provisioning ratio, valid user data on the drive, drive temperature, NAND process parameters, and data retention time.
Micron 9200 NVMe SSDs
Functional Description
Capacity MTTF (Operating Hours)
All 2.0 million
The device is designed to operate under a wide variety of conditions, while delivering the maximum performance possible and meeting enterprise market demands.
While actual endurance varies depending on conditions, the drive lifetime can be esti­mated based on capacity, assumed fixed-use models, ECC, and formatted sector size. Lifetime estimates for the device are shown in the following tables in total bytes written.
Table 5: Total Bytes Written
Model Capacity (TB) Total Bytes Written (PB)
9200 ECO
9200 PRO
9200 MAX
Note:
1. Values shown are based on system modeling.
8.0 11.7
11.0 16.1
1.92 3.5
3.84 7.0
7.68 14.0
1.6 8.8
3.2 17.5
6.4 35.1
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Data Retention

Wear Leveling

Micron 9200 NVMe SSDs
Functional Description
Data retention refers to the capability of the SSD media (that is, NAND flash) to retain programmed data. The three primary factors that affect data retention are:
• Power-on/power-off state: Data retention generally improves when the SSD is in use (that is, not shelved in a power-off state).
• Temperature: Data retention decreases as the temperature increases.
• Number of PROGRAM/ERASE cycles on the media: When the SSD ships from the fac­tory, it is typically able to retain user data for up to 5 years in a powered-off state.
Data retention is guaranteed for three months at 40ºC (MAX), which assumes worst­case power and media wear (the SSD remains in a powered-off state and has reached end of life).
The device uses sophisticated wear-leveling algorithms to maximize endurance by dis­tributing PROGRAM/ERASE cycles uniformly across all blocks in the array. Both static and dynamic wear leveling are utilized to optimize the drive’s lifespan.
Both types of wear leveling aim to distribute “hot” data away from blocks that have ex­perienced relatively heavy wear. Static wear leveling accomplishes this by moving data that has not been modified for an extended period of time out of blocks that have seen few PROGRAM/ERASE cycles and into more heavily worn blocks. This frees up fresher blocks for new data while reducing expected wear on tired blocks. Dynamic wear level­ing, by contrast, acts on in-flight data to ensure it is preferentially written to the least­worn free blocks rather than those closer to the end of their rated life. These techniques are used together within the controller to optimally balance the wear profile of the NAND array.

Firmware Update Capability

The SSD supports firmware updates as defined by the NVMe specification. When a download operation completes, an ACTIVATE command must be issued.

Power Loss Subsystem and Rebuild

The SSD supports an unexpected power loss with a power-backed write cache. No user data is lost during an unexpected power loss. When power is subsequently restored, the SSD returns to a ready state within a maximum of 120 seconds.

Boot

The 9200 is not intended to be a bootable device. Boot functionality is not validated by Micron, and any use in this manner is done at the user's own risk. Please visit Mi-
cron.com to find other SSD products that are recommended for boot.

SMBus Sideband Management

If the system management bus (SMBus) is configured to be enabled, the SSD uses the SMBus interface for presenting product data, monitoring drive health, checking drive status before power-up, and error posting.
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Micron 9200 NVMe SSDs
Functional Description
Protocol supported: Enterprise SSD Form Factor interface with its accompanying vital product data (VPD) definition.
Management data and vital product data may be accessed at fixed addresses with +3.3V at this fixed address when the drive is fully powered up.
Table 6: Out of Band Management Details
Out of Band Protocol SMBUS Address
Enterprise SSD Form Factor 0x53 0xA6 Vital product data (VPD)
NVMe Management Interface 1.0 0x6A 0xD4 Subsystem management data (SMD)
prior to powering up the drive completely. This data continues to be available
AUX
Alternate Address
(due to bit shift) Data
Notes:
1. SMBUS addresses will appear at an alternate address in certain tools due the inclusion of direction bit in the SMBUS spec.
2. Out of band management is disabled by default.
Table 7: Vital Product Data (VPD) Structure
Address #Bytes Function Value Byte Offset Description
0x53 (7bit)
3 Class code 02h 0 Device type and programming interface
08h 1
01h 2
2 ID 44h 3 PCI-SIG vendor ID (0x1344 is assigned to
13h 4
Micron)
20 Varies 5–24 Serial number
40 Varies 25–64 Model number
1 PCIe port0 capabilities 03h 65 Maximum link speed
1 04h/08h 66 Maximum link width (04h if U.2, 08h if
HHHL)
1 PCIe port1 capabilities 00h 67 Maximum link speed
1 00h 68 Maximum link width
1 Initial power requirements 08h 69 12V Power rail initial power requirement
(W)
2 Reserved 0 70–71
1 Maximum power require-
ments
24h 72 12V power rail maximum power require-
ment (W)
2 Reserved 0 73–74
2 Capability list pointer 4Dh 75 16b address offset pointers to start of ca-
00h 76
pability list, see Capability List Pointer ta­ble
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Micron 9200 NVMe SSDs
Functional Description
Table 8: Capability List Pointer
Address #Bytes Value Byte Offset R/W Description
0x004D 2 A5h 0 RO PCI-SIG vendor specific capability
00h 1
2 00h 2 RO Pointer to next capability
00h 3
2 44h 4 RO PCI-SIG vendor ID (0x1344 is assigned to
13h 5
2 0000h 6–7 RO Reserved
2 Varies 8 RO Temperature value (Celsius), little-endian
Varies 9 RO
Micron)
format. For example, byte[8:9] = 29h 00h indicates the temperature is 41°C
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Electrical Characteristics

Stresses greater than those listed may cause permanent damage to the device. This is a stress rating only, and functional operation of the device at these or any other condi­tions above those indicated in the operational sections of this specification is not im­plied. Exposure to absolute maximum rating conditions for extended periods may affect reliability.
Table 9: Power Consumption
Micron 9200 NVMe SSDs
Electrical Characteristics
Specification
Active reads (Maximum RMS)
Active writes (Maximum RMS)
128K sequential reads (Average RMS)
128K sequential writes (Average RMS)
4K random reads (Average RMS)
4K random writes (Average RMS)
Mixed 70/30 read/write (Average RMS)
Notes:
1. Average power consumption.
2. 25W power limiting by VU command.
Table 10: Operating Voltage
9200 ECO
(TB)
9200 PRO
(TB)
25
25
9200 MAX
(TB)
2
2
19 21 17 19 19 17 19 19
20 20 18 20 20 18 20 20
17 17 16 16 17 16 16 17
20 21 18 21 20 18 20 21
19 20 17 20 18 16 20 17
Unit8.0 11.0 1.92 3.84 7.68 1.6 3.2 6.4
W
Electrical Characteristic Value
12V power rail Operating voltage 12Vdc (±8%)
MAX/MIN rise time 10–100ms
MAX/MIN fall time <5s
Inrush current (typical peak) 3.0A
MAX average current (RMS) 2.5A
3.3V
power rail Operating voltage 3.3V (–8% to 8%)
AUX
MAX/MIN rise time 50ms/1ms
MAX/MIN fall time 5s/1ms
MAX average current 20mA
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Micron 9200 NVMe SSDs
Electrical Characteristics

Environmental Conditions

Table 11: Temperature and Airflow
Temperature and Airflow 2.5" U.2 Notes
Operating temperature (as indicated by the SMART temper­ature attribute)
Operating ambient temperature Ambient: 0°C to 35°C;
Operating airflow 450 LFM at 25°C ambient 3, 4
Storage temperature –40°C to 85°C 5
Humidity 25% to 95% noncondensing
0°C to 85°C 1
2
Case: 0°C to 70°C
Notes:
1. If SMART temperature exceeds 75°C (SMART composite), write performance will be throttled.
2. Temperature of air impinging on the SSD.
3. Airflow must flow along the length of the drive parallel to and through any cooling fins.
4. Airflow is measured upstream of the drive before any acceleration as the air goes around the drive.
5. Contact Micron for additional information.
Table 12: Shock and Vibration
Shock and Vibration 2.5" U.2
Shock (nonoperational) 1500G at 0.5ms half-sine
Vibration (nonoperational) 3.1 G
Note:
1. Shock and vibration ratings refer to the ability to withstand stress events only. Pro­longed or repeated exposure to conditions listed or greater stresses may result in per­manent damage to the device. Functional operation of the device under these condi­tions is not implied. See warranty for more information.
5–800Hz at 30 min/axis
RMS
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Supported Commands

NVMe Admin Command Set

The 9200 supports the following mandatory NVMe admin commands, as described in the NVMe 1.2 specification:
• Delete I/O submission queue
• Create I/O submission queue
• Get log page
• Delete I/O completion queue
• Create I/O completion queue
• Identify
• Abort
• Set features
• Get features
• Asynchronous event request
The following optional NVMe admin commands are also supported:
• Firmware activate
• Firmware image download
• Format NVM
• Security Send
• Security Receive
Micron 9200 NVMe SSDs
Supported Commands

NVMe I/O Command Set

The 9200 supports the following mandatory NVMe I/O commands, as described in the NVMe 1.2 specification:
• Write
• Read
• Flush
The following optional NVMe I/O commands are also supported:
• Dataset management
• Deallocate

Log Pages

The Get Log Page command can be used to retrieve the following logs:
• 01h - Error information
• 02h - SMART / health information
• 03h - Firmware slot information
• CAh - Vendor Unique SMART
• 05h - Command Effects Log
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Micron 9200 NVMe SSDs
Supported Commands

SMART and Health Information

The SSD supports SMART/Health log information as defined in the NVMe specification as well as extended health information. These logs persist through power cycles and re­flect lifetime data.
Table 13: SMART/Health Information (Log Identifier 02h)
Bytes Name Description
0 Critical warning Indicates critical warnings for the state of the controller. Each bit corre-
sponds to a critical warning type; multiple bits may be set. If a bit is cleared to 0, the critical warning does not apply. Critical warnings may result in an asynchronous event notification to the host.
• Bit 00: If set to 1, the available spare space has fallen below the threshold.
• Bit 01: If set to 1, the temperature has exceeded a critical threshold.
• Bit 02: If set to 1, the device reliability has been degraded due to sig­nificant media-related errors or any internal error that degrades de­vice reliability.
• Bit 03: If set to 1, the media has been placed in read-only mode.
• Bit 04: If set to 1, the volatile memory backup device has failed. This field is only valid if the controller has a volatile memory backup solu­tion.
• Bits 07:05 Reserved
2:1 Temperature Contains the temperature of the overall device (controller and NVM in-
cluded) in units of Kelvin. If it exceeds the temperature threshold, an asynchronous event may be issued to the host. For the 9100, the value reported is the maximum temperature measured on either the board or controller.
3 Available spare Contains a normalized percentage (0–100%) of the remaining available
spare capacity, beginning at 100% and decreasing.
4 Available spare threshold When the available spare falls below the threshold indicated in this
field, an asynchronous event may be issued to the host. The value is in­dicated as a normalized percentage (0–100%). Threshold is set to 5%.
5 Percentage used Contains a vendor-specific estimate of the percentage of the device life
used based on the actual device usage and the manufacturer's predic­tion of device life. A value of 100 indicates that the estimated endurance of the device has been consumed, but may not indicate a device failure. Refer to the JEDEC JESD218 standard for SSD device life and endurance measurement techniques.
31:6 Reserved Reserved
47:32 Data units read Contains the number of 512-byte data units the host has read from the
controller; this value does not include metadata. This value is reported in thousands (that is, a value of 1 corresponds to 1000 units of 512 bytes read) and is rounded up. When the LBA size is a value other than 512 bytes, the controller shall convert the amount of data read to 512­byte units.
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Micron 9200 NVMe SSDs
Supported Commands
Table 13: SMART/Health Information (Log Identifier 02h) (Continued)
Bytes Name Description
63:48 Data units written Contains the number of 512-byte data units the host has written to the
controller; this value does not include metadata. This value is reported in thousands (that is, a value of 1 corresponds to 1000 units of 512 bytes written) and is rounded up. When the LBA size is a value other than 512 bytes, the controller shall convert the amount of data written to 512-byte units. For the NVM command set, logical blocks written as part of write operations shall be included in this value. Write uncor­rectable commands shall not impact this value.
79:64 Host read commands Contains the number of read commands issued to the controller.
95:80 Host write commands Contains the number of write commands issued to the controller. For
the NVM command set, this is the number of write commands.
111:96 Controller busy time Contains the amount of time the controller is busy with I/O commands.
The controller is busy when there is a command outstanding to an I/O queue (specifically, a command was issued via an I/O submission queue tail doorbell write and the corresponding completion queue entry has not been posted yet to the associated I/O completion queue.) This val­ue is reported in minutes.
127:112 Power cycles Contains the number of power cycles.
143:128 Power on hours Contains the number of power-on hours. This does not include time
that the controller was powered and in a low-power state condition.
159:144 Unsafe shutdowns Contains the number of unsafe shutdowns. This count is incremented
when a shutdown notification (CC.SHN) is not received prior to loss of power.
175:160 Media errors Contains the number of occurrences where the controller detected an
unrecovered data integrity error. Errors such as uncorrectable ECC, CRC checksum failure, or LBA tag mismatch are included in this field.
191:176 Number of error info log entries Contains the number of error information log entries over the life of
the controller.
511:192 Reserved Reserved

Vendor Unique SMART

In addition to the standard SMART log, the 9200 provides the following details in a ven­dor unique log:
Table 14: Vendor Unique SMART Attributes (Log Identifier CAh)
Bytes Name Description
0:1 F9 - NAND_writes_1GiB Raw value reports the number of writes to NAND in 1 GiB increments.
3:4 Normalized value
5:11 Current raw value
12:13 FA - NAND_reads_1GiB Raw value reports the number of reads to NAND in 1 GiB increments.
15:16 Normalized value
17:23 Current raw value
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Micron 9200 NVMe SSDs
Supported Commands
Table 14: Vendor Unique SMART Attributes (Log Identifier CAh) (Continued)
Bytes Name Description
24:25 EA - Thermal throttle status Raw value indicates throttle status and total throttling time.
27:28 Normalized value
29:35 Current raw value
36:37 E7 - Temperature Raw value reports the maximum and minimum temperature in Kelvin
39:40 Normalized value
41:47 Current raw value
48:49 E8 - Power consumption Raw value reports the maximum and minimum average power con-
51:52 Normalized value
53:59 Current raw value
60:61 AF - Power loss protection Normalized value reports the power loss protection status. 100 indi-
63:64 Normalized value
65:71 Current raw value
Byte 0: If set to 1, throttling is active; if set to 0, throttling is not active Bytes 1–4: Total throttling time in minutes since power on Bytes 5: Reserved
over the lifetime of the device. Byte 0–1: The maximum temperature sampled from the temperature sensor Bytes 2–3: The minimum temperature sampled from the temperature sensor Bytes 4–5: The current temperature sampled from the temperature sen­sor
sumption in watts. Bytes 0–1: The maximum power consumption Bytes 2–3: The minimum power consumption Bytes 4–5: The average power consumption
cates protection was successful. 0 indicates protection failed. A power loss failure indicator will persist until a Format NVM command is execu­ted.

Get/Set Features

The following features can be configured or retrieved using NVMe SET FEATURES and GET FEATURES commands:
• 02h – Power management (Commands are accepted but values are not returned. A custom power governor feature is utilized for power management.)
• 04h – Temperature threshold
• 05h – Set error recovery
• 07h – Number of queues (Maximum supported is 128 for both submission and com­pletion queues.)
• 08h – Interrupt coalescing
• 09h – Interrupt vector configuration
• 0Bh – Asynchronous event configuration
• D4h – Device initiated thermal
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Micron 9200 NVMe SSDs

Interface Connectors

Interface Connectors
The host interface connector conforms to the PCIe Electromechanical Specification.
A mechanical indent is used to separate the PCIe power pins from the differential signal contacts. The pins are numbered below in ascending order from left to right. Side B re­fers to component side. Side A refers to the solder side.

U.2 Pin Assignments

The U.2 2.5" form factor follows the SFF-8639 specification and supports built-in latch­ing.
Table 15: PCIe Interface Connector Pin Assignments (U.2 Form Factor)
Pin Name Description Pin Name Description
S1 GND Ground E7 REFCLK0+ PCIe REFCLK 0 p
S2 DNC E8 REFCLK0- PCIe REFCLK 0 p
S3 DNC E9 GND Ground
S4 GND Ground E10 PETp0 PCIe TX Lane 0 p
S5 DNC E11 PETn0 PCIe TX Lane 0 n
S6 DNC E12 GND Ground
S7 GND Ground E13 PERn0 PCIe RX Lane 0 n
E1 REFCLK1+ DNC E14 PERp0 PCIe RX Lane 0 p
E2 REFCLK1- DNC E15 GND Ground
E3 3.3Vaux 3.3V auxiliary power E16 RSVD Reserved
E4 PERST1# DNC S8 GND Ground
E5 PERST0# PCIe Fundamental Reset S9 DNC
E6 RSVD Reserved S10 DNC
P1 DNC S11 GND Ground
P2 DNC S12 DNC
P3 DNC S13 DNC
P4 IfDet_N Interface detect S14 GND Ground
P5 GND Ground S15 RSVD Reserved
P6 GND Ground S16 GND Ground
P7 DNC S17 PETp1 PCIe TX Lane 1 p
P8 DNC S18 PETn1 PCIe TX Lane 1 n
P9 DNC S19 GND Ground
P10 PRSNT_N Presence detect S20 PERn1 PCIe RX Lane 1 n
P11 Activity Activity signal from the drive S21 PERp1 PCIe RX Lane 1 p
P12 Hot-Plug Ground S22 GND Ground
P13 +12V_pre 12V power S23 PETp2 PCIe TX Lane 2 p
P14 +12V 12V power S24 PETn2 PCIe TX Lane 2 n
P15 +12V 12V power S25 GND Ground
S26 PERn2 PCIe RX Lane 2 n
CCMTD-731836775-10493 9200_u2_nvme_pcie_ssd.pdf - Rev. E 10/17 EN
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Page 16
Micron 9200 NVMe SSDs
Interface Connectors
Table 15: PCIe Interface Connector Pin Assignments (U.2 Form Factor) (Continued)
Pin Name Description Pin Name Description
S27 PERp2 PCIe RX Lane 2 p
S28 GND Ground
E17 PETp3 PCIe TX Lane 3 p
E18 PETn3 PCIe TX Lane 3 n
E19 GND Ground
E20 PERn3 PCIe RX Lane 3 n
E21 PERp3 PCIe RX Lane 3 p
E22 GND Ground
E23 SMCLK SMBus clock
E24 SMDAT SMBus data
E25 DualPortEn_N Dual port enable
Notes:
1. PRSNT_N is open and IfDet_N is grounded to indicate PCIe support.
2. DualPortEn_N pin should be left un-connected or un-driven by the system to enable sin­gle port operation with all 4 lanes. If this pin is asserted (driven low) by the system, the SSD will function as PCIe x2 lane only.
CCMTD-731836775-10493 9200_u2_nvme_pcie_ssd.pdf - Rev. E 10/17 EN
16
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Page 17

PCIe Header

Byte
offset
31 0
Device ID = 5192h
Vendor ID = 1344h
00h
Status Command
04h
Class code = 010802h Revision ID = 0
08h
BIST Header type = 00h Master latency timer Cache line size
0Ch
Subsystem vendor ID = 1344h
2Ch
~
~
~
~
1.6TB U.2 SSID = 2D00h,
3.2TB U.2 SSID = 4A00h,
6.4TB U.2 SSID = 5A00h
Byte
offset
31 0
Device ID = 5191h
Vendor ID = 1344h
00h
Status Command
04h
Class code = 010802h Revision ID = 0
08h
BIST Header type = 00h Master latency timer Cache line size
0Ch
Subsystem vendor ID = 1344h
2Ch
~
~
~
~
1.92TB SSID = 2D00h
3.84TB SSID = 4A00h
7.68TB SSID = 5A00h
Figure 2: 9200 MAX PCIe Header
Micron 9200 NVMe SSDs
PCIe Header
Figure 3: 9200 PRO PCIe Header
CCMTD-731836775-10493 9200_u2_nvme_pcie_ssd.pdf - Rev. E 10/17 EN
17
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Page 18
Figure 4: 9200 ECO PCIe Header
Byte
offset
31 0
Device ID = 5190h
Vendor ID = 1344h
00h
Status Command
04h
Class code = 010802h Revision ID = 0
08h
BIST Header type = 00h Master latency timer Cache line size
0Ch
Subsystem vendor ID = 1344h
2Ch
~
~
~
~
8.0TB SSID = 5C00h,
11.0TB SSID = 5F00h
Micron 9200 NVMe SSDs
PCIe Header
CCMTD-731836775-10493 9200_u2_nvme_pcie_ssd.pdf - Rev. E 10/17 EN
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Page 19

Physical Configuration

69.85 ±0.25 61.72
14.80
+0
-0.5
Y X
A
A
See Detail B
Detail B
0.50
3.00
0.30
Detail C
See Detail C
Section A–A
M3 THD 4 PL MIN 2.5 full THD
6in-bl MAX torque
0.5
S
X Y Z
Z
90.60
14.00
100.20 MAX
14.00
M3 THD 4 PL MIN 3 full THD
6in-bl MAX torque
0.5
S
X Y Z
90.60
3.50 ±0.38
Micron's 9200 conforms to PCI Express CEM and SFF-8639 specifications.
Figure 5: U.2 (2.5") Nominal Dimensions
Micron 9200 NVMe SSDs
Physical Configuration
Note:
CCMTD-731836775-10493 9200_u2_nvme_pcie_ssd.pdf - Rev. E 10/17 EN
19
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1. Length does not include 0.3 connector protrusion.
© 2016 Micron Technology, Inc. All rights reserved.
Page 20

Compliance

FCC Rules

Micron 9200 NVMe SSDs
Compliance
The device complies with the following specifications:
• CE (Europe): EN 55022 Class B, EN 55024, RoHS
• UL: UL-60950-1, 2nd Edition
• BSMI (Taiwan): Approval to CNS 13438 Class B
• RCM (Australia, New Zealand): AS/NZS CISPR22 Class B
• KCC RRL (Korea): Approval to KN32 Class B, KN 35
• W.E.E.E.: Compliance with EU WEEE directive 2012/19/EC. Additional obligations may apply to customers who place these products in the markets where WEEE is en­forced.
• TUV (Germany): Approval to IEC60950/EN60950
• V
(Japan): 2015-04 Class B, CISPR22
CCI
• IC (Canada): ICES-003 Class B, CISPR22 Class B
• This Class B digital apparatus complies with Canadian ICES-003.
• Cet appareil numérique de la classe B est conforme à la norme NMB-003 du Canada
This equipment has been tested and found to comply with the limits for a digital device, pursuant to part 15 of the FCC Rules. Operation is subject to the following two condi­tions: (1) this device may not cause harmful interference, and (2) this device must ac­cept any interference received, including interference that may cause undesired opera­tion. These limits are designed to provide reasonable protection against harmful inter­ference in a residential installation. This equipment generates, uses, and can radiate ra­dio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guaran­tee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interfer­ence by one or more of the following measures:

References

CCMTD-731836775-10493 9200_u2_nvme_pcie_ssd.pdf - Rev. E 10/17 EN
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and the receiver.
• Connect the equipment into an outlet on a circuit different from that to which the re­ceiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.
• PCI Express CEM Specification V2.0
• PCI Express Specification V3.0
• SFF-8639
• IDEMA Specification
• Telcordia SR-322 Procedures
• NVM Express Specification revision 1.2
20
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Page 21
Micron 9200 NVMe SSDs

Appendix A

Appendix A

Identify Data Structures

Table 16: Identify Controller Data Structure
Identify
Controller
Data
Structure
Bytes DS
1
1:0 F 0x1344 M PCI vendor ID (VID) Contains the company vendor identifier that
3:2 F 0x1344 M PCI subsystem vendor ID
23:4 V varies M Serial number (SN) Contains the serial number for the NVM sub-
63:24 V varies M Model number (MN) Contains the model number for the NVM
71:64 V varies M Firmware revision (FR) Contains the currently active firmware revi-
72 F 0x1 M Recommended arbitration
75:73 F 0x75-0xA0-0x00 M IEEE OUI identifier (IEEE) Contains the organization unique identifier
76 X 0x0 O Controller multi-path I/O and
77 F 0x20 M Maximum data transfer size
79:78 F 0x1 M Controller ID (CNTLID) This field contains the controller ID of the
83:80 F 0x00010200 M Version (VER) This field indicates the version of the NVM
95:92 V 0x1 M Optional asynchronous events
239:96 Reserved
Default
Value M/O2Feature Name Description
is assigned by the PCI SIG.
Contains the company vendor identifier that
(SSVID)
is assigned by the PCI SIG for the subsystem.
system.
subsystem.
sion for the NVM subsystem.
This is the recommended arbitration burst
burst (RAB)
size.
(OUI) for the controller vendor.
This field specifies multi-path I/O and name­namespace sharing capabili­ties (CMIC)
space sharing capabilities of the controller
and NVM subsystem.
Supports MDTS of 128K. (MDTS)
controller whose status is reported in this da-
ta structure.
express specification 1.2 that the controller
implementation supports.
This field indicates the optional asynchro­supported (OAES)
nous events supported by the controller.
Notes:
CCMTD-731836775-10493 9200_u2_nvme_pcie_ssd.pdf - Rev. E 10/17 EN
1. DS = Data structure; F = Fixed; V = Variable; X = Both
2. M/O = Mandatory/Optional
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Page 22
Table 17: Identify Namespace Data Structure
Micron 9200 NVMe SSDs
Appendix A
Bytes DS
512 F 0x55 M Submission queue entry size
513 F 0x44 M Completion queue entry size
1
Value M/O2Feature Name Description
Required and maximum submission queue (SQES)
entry size is 32 bytes
Required and maximum submission queue (CQES)
entry size is 16 bytes
515:514 Reserved
519:516 F 0x1 M Number of namespaces (NN) Supports up to 32 namespaces
Default
521:520 F 0x14 M Optional NVM command sup-
port (ONCS)
523:522 F 0x0 M Fused operation support
Supports dataset management and write un-
correctable optional NVMe commands
Fused commands not supported (FUSES)
524 F 0x4 M Format NVM attributes (FNA) Secure/Crypto erase not supported
525 F 0x1 M Volatile write cache (VWC) Volatile write cache is present
527:526 F 0x0 M Atomic write unit normal
(AWUN)
529:528 F 0x0 M Atomic write unit power fail
(AWUPF)
Atomic write size for controller during nor-
mal equals to 4K bytes
Indicates the atomic write size for the con-
troller during a power fail condition equals
512 bytes
530 X 0x0 M NVM vendor specific com-
Not supported mand configuration (NVSCC)
531 Reserved
533:532 F 0x0 M Atomic compare and write
Not supported unit (ACWU)
535:534 Reserved
539:536 F 0x0 O SGL support (SGLS) Not supported
703:540 Reserved
I/O command set attributes
2047:704 Reserved
Notes:
CCMTD-731836775-10493 9200_u2_nvme_pcie_ssd.pdf - Rev. E 10/17 EN
1. DS = Data structure; F = Fixed; V = Variable; X = Both
2. M/O = Mandatory/Optional
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Page 23

Revision History

Rev. E – 10/17

Rev. D – 8/17

Micron 9200 NVMe SSDs
Revision History
• Removed HHHL through the data sheet
• Updated Drive Performance table and Latency table in Performance
• Updated Power Consumption table
• Corrected PCIe header information
• Updated Drive Performance table, Latency table, and Quality of Service table in Per­formance section
• Updated Out of Band Management Details table in SMBus Sideband Management: Added NVMe Management Interface 1.0
• Updated Power Consumption table in Electrical Characteristics: Changed Idle power specification
• Updated Temperature and Airflow table in Environmental Conditions: Changed Op­erating ambient temperature specification and Operating airflow specification
• Updated Shock and Vibration table

Rev. C – 7/17

• Updated Part Number Chart
• Updated formatting

Rev. B – 1/17

• Updated figure 1
• Updated formatting

Rev. A – 10/16

• Initial release
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www.micron.com/products/support Sales inquiries: 800-932-4992
Micron and the Micron logo are trademarks of Micron Technology, Inc.
All other trademarks are the property of their respective owners.
This data sheet contains minimum and maximum limits specified over the power supply and temperature range set forth herein.
Although considered final, these specifications are subject to change, as further product development and data characterization some-
times occur.
CCMTD-731836775-10493 9200_u2_nvme_pcie_ssd.pdf - Rev. E 10/17 EN
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