• Endurance (total bytes written)
– 1.6TB: Up to 8.8PB
– 1.92TB: Up to 3.5PB
– 3.2TB: Up to 17.5PB
– 3.84TB: Up to 7.0PB
– 6.4TB: Up to 35.1PB
– 7.68TB: Up to 14.0PB
– 8.0TB: Up to 11.7PB
– 11.0TB: Up to 16.1PB
• 512 and 4096 byte sector sizes
• Power: <5W idle, 25W power limited, or unlimited
• Surprise insertion/surprise removal (SISR) and
hot-plug capable
• Power-backed cache
• Steady state performance
form factor)
– Sequential 128KB read: 2.85–3.15 GB/s
– Sequential 128KB write: 1.9–2.3 GB/s
– Random 4KB read: 700K–770K IOPS
– Random 4KB write: 130K–280K IOPS
• Latency to media performance, typical (QD = 1)
– READ: 92–150µs3, WRITE: 21µs
• Reliability
– MTTF: 2 million hours
– Field-upgradable firmware
– UBER: <1 sector per 1017 bits read
• SMBus for drive management
• End-to-end data path protection
• SMART command set support
• Cryptographic erase
• FlexPro (flexible over provisioning)
1
1
1, 2
(varies by capacity and
4
5
• Temperature
6
– 0°C to 80°C SMART temperature
– 0°C to 35°C ambient for U.2
– Temperature protection
The Micron 9200® NVMe SSD Series is Micron's flagship performance product line.
These products utilize a Gen3 PCIe interface, the innovative Non-Volatile Memory Express protocol and Micron's own high-speed NAND to provide high throughput and
IOPS, very low latency, and consistent quality of service. The 9200 product line has Micron's FlexPro™ firmware architecture which allows you to actively tune capacity to optimize drive performance and endurance and is available in high capacities up to 11
TBs. Reliability assurance measures include cyclic redundancy checks (CRC), end-toend data path protection, capacitor-backed power loss protection and Micron's extensive validation, quality and reliability testing. It features thermal monitoring and protection, SMART attributes for status polling and SMBus for out-of-band management.
The Micron 9200 has three endurance classes: the PRO for read-centric use at roughly 1
drive writes per day (DWPD); and the MAX for mixed-use workloads at about 3 DWPD;
and the ECO for less than 1 DWPD. The PRO version comes in 1.92TB, 3.84TB, and
7.68TB capacities, while the MAX is sized at 1.6TB, 3.2TB, 6.4TB, and the ECO in 8.0TB
and 11.0TB.
Logical Block Address Configuration
The number of logical block addresses (LBAs) reported by the device ensures sufficient
storage space for the specified capacity.
Micron 9200 NVMe SSDs
General Description
Table 1: LBA Count in Accordance with IDEMA LBA1-03
The mean time to failure (MTTF) for the device can be calculated based on the component reliability data using the methods referenced in the Telcordia SR-322 reliability
prediction procedures for electronic equipment and measured during reliability demonstration test.
Table 4: MTTF
Endurance
SSD endurance is dependent on many factors, including: usage conditions applied to
the drive, drive performance and capacity, formatted sector size, error correction codes
(ECCs) in use, internal NAND PROGRAM/ERASE cycles, write amplification factor,
wear-leveling efficiency of the drive, over-provisioning ratio, valid user data on the
drive, drive temperature, NAND process parameters, and data retention time.
Micron 9200 NVMe SSDs
Functional Description
CapacityMTTF (Operating Hours)
All2.0 million
The device is designed to operate under a wide variety of conditions, while delivering
the maximum performance possible and meeting enterprise market demands.
While actual endurance varies depending on conditions, the drive lifetime can be estimated based on capacity, assumed fixed-use models, ECC, and formatted sector size.
Lifetime estimates for the device are shown in the following tables in total bytes written.
Table 5: Total Bytes Written
ModelCapacity (TB)Total Bytes Written (PB)
9200 ECO
9200 PRO
9200 MAX
Note:
1. Values shown are based on system modeling.
8.011.7
11.016.1
1.923.5
3.847.0
7.6814.0
1.68.8
3.217.5
6.435.1
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Micron Technology, Inc. reserves the right to change products or specifications without notice.
Data retention refers to the capability of the SSD media (that is, NAND flash) to retain
programmed data. The three primary factors that affect data retention are:
• Power-on/power-off state: Data retention generally improves when the SSD is in use
(that is, not shelved in a power-off state).
• Temperature: Data retention decreases as the temperature increases.
• Number of PROGRAM/ERASE cycles on the media: When the SSD ships from the factory, it is typically able to retain user data for up to 5 years in a powered-off state.
Data retention is guaranteed for three months at 40ºC (MAX), which assumes worstcase power and media wear (the SSD remains in a powered-off state and has reached
end of life).
The device uses sophisticated wear-leveling algorithms to maximize endurance by distributing PROGRAM/ERASE cycles uniformly across all blocks in the array. Both static
and dynamic wear leveling are utilized to optimize the drive’s lifespan.
Both types of wear leveling aim to distribute “hot” data away from blocks that have experienced relatively heavy wear. Static wear leveling accomplishes this by moving data
that has not been modified for an extended period of time out of blocks that have seen
few PROGRAM/ERASE cycles and into more heavily worn blocks. This frees up fresher
blocks for new data while reducing expected wear on tired blocks. Dynamic wear leveling, by contrast, acts on in-flight data to ensure it is preferentially written to the leastworn free blocks rather than those closer to the end of their rated life. These techniques
are used together within the controller to optimally balance the wear profile of the
NAND array.
Firmware Update Capability
The SSD supports firmware updates as defined by the NVMe specification. When a
download operation completes, an ACTIVATE command must be issued.
Power Loss Subsystem and Rebuild
The SSD supports an unexpected power loss with a power-backed write cache. No user
data is lost during an unexpected power loss. When power is subsequently restored, the
SSD returns to a ready state within a maximum of 120 seconds.
Boot
The 9200 is not intended to be a bootable device. Boot functionality is not validated by
Micron, and any use in this manner is done at the user's own risk. Please visit Mi-
cron.com to find other SSD products that are recommended for boot.
SMBus Sideband Management
If the system management bus (SMBus) is configured to be enabled, the SSD uses the
SMBus interface for presenting product data, monitoring drive health, checking drive
status before power-up, and error posting.
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Micron Technology, Inc. reserves the right to change products or specifications without notice.
Stresses greater than those listed may cause permanent damage to the device. This is a
stress rating only, and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
reliability.
Table 9: Power Consumption
Micron 9200 NVMe SSDs
Electrical Characteristics
Specification
Active reads
(Maximum RMS)
Active writes
(Maximum RMS)
128K sequential reads
(Average RMS)
128K sequential writes
(Average RMS)
4K random reads
(Average RMS)
4K random writes
(Average RMS)
Mixed 70/30 read/write
(Average RMS)
Notes:
1. Average power consumption.
2. 25W power limiting by VU command.
Table 10: Operating Voltage
9200 ECO
(TB)
9200 PRO
(TB)
25
25
9200 MAX
(TB)
2
2
1921171919171919
2020182020182020
1717161617161617
2021182120182021
1920172018162017
Unit8.011.01.923.847.681.63.26.4
W
Electrical CharacteristicValue
12V power railOperating voltage12Vdc (±8%)
MAX/MIN rise time10–100ms
MAX/MIN fall time<5s
Inrush current (typical peak)3.0A
MAX average current (RMS)2.5A
3.3V
power railOperating voltage3.3V (–8% to 8%)
AUX
MAX/MIN rise time50ms/1ms
MAX/MIN fall time5s/1ms
MAX average current20mA
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Micron Technology, Inc. reserves the right to change products or specifications without notice.
Operating temperature (as indicated by the SMART temperature attribute)
Operating ambient temperatureAmbient: 0°C to 35°C;
Operating airflow450 LFM at 25°C ambient3, 4
Storage temperature–40°C to 85°C5
Humidity25% to 95% noncondensing
0°C to 85°C1
2
Case: 0°C to 70°C
Notes:
1. If SMART temperature exceeds 75°C (SMART composite), write performance will be
throttled.
2. Temperature of air impinging on the SSD.
3. Airflow must flow along the length of the drive parallel to and through any cooling
fins.
4. Airflow is measured upstream of the drive before any acceleration as the air goes
around the drive.
5. Contact Micron for additional information.
Table 12: Shock and Vibration
Shock and Vibration2.5" U.2
Shock (nonoperational)1500G at 0.5ms half-sine
Vibration (nonoperational)3.1 G
Note:
1. Shock and vibration ratings refer to the ability to withstand stress events only. Prolonged or repeated exposure to conditions listed or greater stresses may result in permanent damage to the device. Functional operation of the device under these conditions is not implied. See warranty for more information.
5–800Hz at 30 min/axis
RMS
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Micron Technology, Inc. reserves the right to change products or specifications without notice.
The SSD supports SMART/Health log information as defined in the NVMe specification
as well as extended health information. These logs persist through power cycles and reflect lifetime data.
Table 13: SMART/Health Information (Log Identifier 02h)
BytesNameDescription
0Critical warningIndicates critical warnings for the state of the controller. Each bit corre-
sponds to a critical warning type; multiple bits may be set. If a bit is
cleared to 0, the critical warning does not apply. Critical warnings may
result in an asynchronous event notification to the host.
• Bit 00: If set to 1, the available spare space has fallen below the
threshold.
• Bit 01: If set to 1, the temperature has exceeded a critical threshold.
• Bit 02: If set to 1, the device reliability has been degraded due to significant media-related errors or any internal error that degrades device reliability.
• Bit 03: If set to 1, the media has been placed in read-only mode.
• Bit 04: If set to 1, the volatile memory backup device has failed. This
field is only valid if the controller has a volatile memory backup solution.
• Bits 07:05 Reserved
2:1TemperatureContains the temperature of the overall device (controller and NVM in-
cluded) in units of Kelvin. If it exceeds the temperature threshold, an
asynchronous event may be issued to the host. For the 9100, the value
reported is the maximum temperature measured on either the board
or controller.
3Available spareContains a normalized percentage (0–100%) of the remaining available
spare capacity, beginning at 100% and decreasing.
4Available spare thresholdWhen the available spare falls below the threshold indicated in this
field, an asynchronous event may be issued to the host. The value is indicated as a normalized percentage (0–100%). Threshold is set to 5%.
5Percentage usedContains a vendor-specific estimate of the percentage of the device life
used based on the actual device usage and the manufacturer's prediction of device life.
A value of 100 indicates that the estimated endurance of the device
has been consumed, but may not indicate a device failure.
Refer to the JEDEC JESD218 standard for SSD device life and endurance
measurement techniques.
31:6ReservedReserved
47:32Data units readContains the number of 512-byte data units the host has read from the
controller; this value does not include metadata. This value is reported
in thousands (that is, a value of 1 corresponds to 1000 units of 512
bytes read) and is rounded up. When the LBA size is a value other than
512 bytes, the controller shall convert the amount of data read to 512byte units.
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Micron Technology, Inc. reserves the right to change products or specifications without notice.
Table 13: SMART/Health Information (Log Identifier 02h) (Continued)
BytesNameDescription
63:48Data units writtenContains the number of 512-byte data units the host has written to the
controller; this value does not include metadata. This value is reported
in thousands (that is, a value of 1 corresponds to 1000 units of 512
bytes written) and is rounded up. When the LBA size is a value other
than 512 bytes, the controller shall convert the amount of data written
to 512-byte units. For the NVM command set, logical blocks written as
part of write operations shall be included in this value. Write uncorrectable commands shall not impact this value.
79:64Host read commandsContains the number of read commands issued to the controller.
95:80Host write commandsContains the number of write commands issued to the controller. For
the NVM command set, this is the number of write commands.
111:96Controller busy timeContains the amount of time the controller is busy with I/O commands.
The controller is busy when there is a command outstanding to an I/O
queue (specifically, a command was issued via an I/O submission queue
tail doorbell write and the corresponding completion queue entry has
not been posted yet to the associated I/O completion queue.) This value is reported in minutes.
127:112Power cyclesContains the number of power cycles.
143:128Power on hoursContains the number of power-on hours. This does not include time
that the controller was powered and in a low-power state condition.
159:144Unsafe shutdownsContains the number of unsafe shutdowns. This count is incremented
when a shutdown notification (CC.SHN) is not received prior to loss of
power.
175:160Media errorsContains the number of occurrences where the controller detected an
unrecovered data integrity error. Errors such as uncorrectable ECC, CRC
checksum failure, or LBA tag mismatch are included in this field.
191:176Number of error info log entriesContains the number of error information log entries over the life of
the controller.
511:192ReservedReserved
Vendor Unique SMART
In addition to the standard SMART log, the 9200 provides the following details in a vendor unique log:
24:25EA - Thermal throttle statusRaw value indicates throttle status and total throttling time.
27:28Normalized value
29:35Current raw value
36:37E7 - TemperatureRaw value reports the maximum and minimum temperature in Kelvin
39:40Normalized value
41:47Current raw value
48:49E8 - Power consumptionRaw value reports the maximum and minimum average power con-
51:52Normalized value
53:59Current raw value
60:61AF - Power loss protectionNormalized value reports the power loss protection status. 100 indi-
63:64Normalized value
65:71Current raw value
Byte 0: If set to 1, throttling is active; if set to 0, throttling is not active
Bytes 1–4: Total throttling time in minutes since power on
Bytes 5: Reserved
over the lifetime of the device.
Byte 0–1: The maximum temperature sampled from the temperature
sensor
Bytes 2–3: The minimum temperature sampled from the temperature
sensor
Bytes 4–5: The current temperature sampled from the temperature sensor
sumption in watts.
Bytes 0–1: The maximum power consumption
Bytes 2–3: The minimum power consumption
Bytes 4–5: The average power consumption
cates protection was successful. 0 indicates protection failed. A power
loss failure indicator will persist until a Format NVM command is executed.
Get/Set Features
The following features can be configured or retrieved using NVMe SET FEATURES and
GET FEATURES commands:
• 02h – Power management (Commands are accepted but values are not returned. A
custom power governor feature is utilized for power management.)
• 04h – Temperature threshold
• 05h – Set error recovery
• 07h – Number of queues (Maximum supported is 128 for both submission and completion queues.)
• 08h – Interrupt coalescing
• 09h – Interrupt vector configuration
• 0Bh – Asynchronous event configuration
• D4h – Device initiated thermal
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Micron Technology, Inc. reserves the right to change products or specifications without notice.
The host interface connector conforms to the PCIe Electromechanical Specification.
A mechanical indent is used to separate the PCIe power pins from the differential signal
contacts. The pins are numbered below in ascending order from left to right. Side B refers to component side. Side A refers to the solder side.
U.2 Pin Assignments
The U.2 2.5" form factor follows the SFF-8639 specification and supports built-in latching.
Table 15: PCIe Interface Connector Pin Assignments (U.2 Form Factor)
PinNameDescriptionPinNameDescription
S1GNDGroundE7REFCLK0+PCIe REFCLK 0 p
S2DNCE8REFCLK0-PCIe REFCLK 0 p
S3DNCE9GNDGround
S4GNDGroundE10PETp0PCIe TX Lane 0 p
S5DNCE11PETn0PCIe TX Lane 0 n
S6DNCE12GNDGround
S7GNDGroundE13PERn0PCIe RX Lane 0 n
E1REFCLK1+DNCE14PERp0PCIe RX Lane 0 p
E2REFCLK1-DNCE15GNDGround
E33.3Vaux3.3V auxiliary powerE16RSVDReserved
E4PERST1#DNCS8GNDGround
E5PERST0#PCIe Fundamental ResetS9DNC
E6RSVDReservedS10DNC
P1DNCS11GNDGround
P2DNCS12DNC
P3DNCS13DNC
P4IfDet_NInterface detectS14GNDGround
P5GNDGroundS15RSVDReserved
P6GNDGroundS16GNDGround
P7DNCS17PETp1PCIe TX Lane 1 p
P8DNCS18PETn1PCIe TX Lane 1 n
P9DNCS19GNDGround
P10PRSNT_NPresence detectS20PERn1PCIe RX Lane 1 n
P11ActivityActivity signal from the driveS21PERp1PCIe RX Lane 1 p
P12Hot-PlugGroundS22GNDGround
P13+12V_pre12V powerS23PETp2PCIe TX Lane 2 p
P14+12V12V powerS24PETn2PCIe TX Lane 2 n
P15+12V12V powerS25GNDGround
S26PERn2PCIe RX Lane 2 n
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Micron Technology, Inc. reserves the right to change products or specifications without notice.
1. PRSNT_N is open and IfDet_N is grounded to indicate PCIe support.
2. DualPortEn_N pin should be left un-connected or un-driven by the system to enable single port operation with all 4 lanes. If this pin is asserted (driven low) by the system, the
SSD will function as PCIe x2 lane only.
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Micron Technology, Inc. reserves the right to change products or specifications without notice.
The device complies with the following specifications:
• CE (Europe): EN 55022 Class B, EN 55024, RoHS
• UL: UL-60950-1, 2nd Edition
• BSMI (Taiwan): Approval to CNS 13438 Class B
• RCM (Australia, New Zealand): AS/NZS CISPR22 Class B
• KCC RRL (Korea): Approval to KN32 Class B, KN 35
• W.E.E.E.: Compliance with EU WEEE directive 2012/19/EC. Additional obligations
may apply to customers who place these products in the markets where WEEE is enforced.
• TUV (Germany): Approval to IEC60950/EN60950
• V
(Japan): 2015-04 Class B, CISPR22
CCI
• IC (Canada): ICES-003 Class B, CISPR22 Class B
• This Class B digital apparatus complies with Canadian ICES-003.
• Cet appareil numérique de la classe B est conforme à la norme NMB-003 du Canada
This equipment has been tested and found to comply with the limits for a digital device,
pursuant to part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions,
may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does
cause harmful interference to radio or television reception, which can be determined by
turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
References
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• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and the receiver.
• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.
• PCI Express CEM Specification V2.0
• PCI Express Specification V3.0
• SFF-8639
• IDEMA Specification
• Telcordia SR-322 Procedures
• NVM Express Specification revision 1.2
20
Micron Technology, Inc. reserves the right to change products or specifications without notice.
• Updated Drive Performance table and Latency table in Performance
• Updated Power Consumption table
• Corrected PCIe header information
• Updated Drive Performance table, Latency table, and Quality of Service table in Performance section
• Updated Out of Band Management Details table in SMBus Sideband Management:
Added NVMe Management Interface 1.0
• Updated Power Consumption table in Electrical Characteristics: Changed Idle power
specification
• Updated Temperature and Airflow table in Environmental Conditions: Changed Operating ambient temperature specification and Operating airflow specification
• Updated Shock and Vibration table
Rev. C – 7/17
• Updated Part Number Chart
• Updated formatting
Rev. B – 1/17
• Updated figure 1
• Updated formatting
Rev. A – 10/16
• Initial release
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: 208-368-4000