• Native command queuing support with 32-command slot support
• ATA-8 ACS2 command set compliant
• ATA security feature command set and password
login support
• Secure erase (data page) command set: fast and secure erase
• Sanitize device feature set support
• Self-monitoring, analysis, and reporting technology
(SMART) command set
• Windows 8 drive telemetry
• Adaptive thermal monitoring
• Power loss protection for data-at-rest
• Performance
– PCMark® Vantage (HDD test suite score): Up to
80,000
– Sequential 128KB READ: Up to 500 MB/s
– Sequential 128KB WRITE: Up to 400 MB/s
– Random 4KB READ: Up to 80,000 IOPS
– Random 4KB WRITE: Up to 80,000 IOPS
– READ/WRITE latency: 5ms/25ms (MAX)
1, 2
• Reliability
– MTTF: 1.2 million device hours
3
– Static and dynamic wear leveling
– Uncorrectable bit error rate (UBER): <1 sector
For example:
1 = 1st generation
2 = 2nd generation
2 AB HA
M500 2.5-Inch NAND Flash SSD
Features
Part Numbering Information
Micron’s M500 SSD is available in different configurations and densities. The chart below is a comprehensive list
of options for the M500 series devices; not all options listed can be combined to define an offered product. Visit
www.micron.com for a list of valid part numbers.
Figure 1: Part Number Chart
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2
Micron Technology, Inc. reserves the right to change products or specifications without notice.
Micron’s solid state drive (SSD) uses a single-chip controller with a SATA interface on
the system side and 8-channels of Micron NAND Flash internally. Packaged in an HDD
replacement enclosure, the SSD integrates easily in existing storage infrastructures.
The SSD is designed to use the SATA interface efficiently during both READs and
WRITEs while delivering bandwidth-focused performance. SSD technology enables enhanced boot times, faster application load times, reduced power consumption, and extended reliability.
The self-encypting drive (SED) features a FIPS-compliant, AES-256 encryption engine,
providing hardware-based, secure data encryption, with no loss of SSD performance.
This SED follows the TCG/Opal specification for trusted peripherals.
When TCG/Opal features are not enabled, the device can perform alternate data encryption by invoking the ATA security command-set encryption features, to provide fulldisk encryption (FDE) managed in the host system BIOS. TCG/Opal and FDE feature
sets cannot be enabled simultaneously.
The data encryption is always running; however, encryption keys are not managed and
the data is not secure until either TCG/Opal or FDE feature sets are enabled.
M500 2.5-Inch NAND Flash SSD
General Description
Figure 2: Functional Block Diagram
SATA
SSD
controller
DRAM
buffer
NAND
NAND
NAND
NAND
NAND
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Micron Technology, Inc. reserves the right to change products or specifications without notice.
The drive is set to report the number of logical block addresses (LBA) that will ensure
sufficient storage space for the specified capacity. Standard LBA settings, based on the
IDEMA standard (LBA1-02), are shown below.
The SATA signal segment interface cable has four conductors and three ground connections. As shown in Package Dimensions, the cable includes a 7-pin signal segment and a
15-pin power segment arranged in a single row with a 1.27mm (0.050in) pitch.
Figure 3: SSD Interface Connections
Table 3: SATA Signal Segment Pin Assignments
Signal NameTypeDescription
S1GNDGround
S2A
S3A#
S4GNDGround
S5B#
S6B
S7GNDGround
M500 2.5-Inch NAND Flash SSD
Interface Connectors
Differential signal pair A and A#
Differential signal pair B and B#
Table 4: 2.5-Inch SATA Power Segment Pin Assignments
Pin#Signal NameDescription
P1RETIREDNo connect
P2RETIREDNo connect
P3DEVSLPDevice sleep
P4GNDGround
P5GNDGround
P6GNDGround
P7V55V power, precharge
P8V55V power
P9V55V power
P10GNDGround
P11DASDevice activity signal
P12GNDGround
P13V12No connect
P14V12No connect
P15V12No connect
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Micron Technology, Inc. reserves the right to change products or specifications without notice.
Measured performance can vary for a number of reasons. The major factors affecting
drive performance are the capacity of the drive and the interface of the host. Additionally, overall system performance can affect the measured drive performance. When
comparing drives, it is recommended that all system variables are the same, and only
the drive being tested varies.
Performance numbers will vary depending on the host system configuration.
For SSDs designed for the client computing market, Micron specifies performance in
FOB ("fresh-out-of-box") state. Data throughput measured in "steady state" may be
lower than FOB state, depending on the nature of the data workload.
For a description of these performance states and of Micron's best practices for performance measurement, refer to micron.com/ssd.
Table 5: Drive Performance
Capacity120GB240GB480GB960GB
UnitInterface Speed6 Gb/s6 Gb/s6 Gb/s6 Gb/s
PCMark Vantage70,00080,00080,00080,000HDD score
Sequential read (128KB transfer)500500500500MB/s
Sequential write (128KB transfer)130250400400MB/s
Random read (4KB transfer)62,00072,00080,00080,000IOPS
Random write (4KB transfer)35,00060,00080,00080,000IOPS
READ latency (MAX)5555ms
WRITE latency (MAX)25252525ms
READ latency (TYP)160160160160µs
WRITE latency (TYP)40404040µs
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Notes:
1. Performance numbers are maximum values, except as noted.
2. Typical I/O performance numbers as measured using Iometer with a queue depth of 32
and write cache enabled. Fresh-out-of-box (FOB) state is assumed. For performance
measurement purposes, the SSD may be restored to FOB state using the secure erase
command.
3. Iometer measurements are performed on an 20GB span of logical block addresses
(LBAs).
4. 4KB transfers are used to measure READ/WRITE latency values with write cache enabled.
5. System variations will affect measured results. For comparison, PCMark scores are measured with the SSD as a secondary drive in a two-drive system. When measured as an OS
drive, system overhead can cause lower scores.
For a description of these performance states and of Micron's best practices for performance measurement, refer to Micron's technical marketing brief "Best Practices for
SSD Performance Measurement"
6
Micron Technology, Inc. reserves the right to change products or specifications without notice.
Micron’s SSDs incorporate advanced technology for defect and error management.
They use various combinations of hardware-based error correction algorithms and
firmware-based static and dynamic wear-leveling algorithms.
Over the life of the SSD, uncorrectable errors may occur. An uncorrectable error is defined as data that is reported as successfully programmed to the SSD but when it is read
out of the SSD, the data differs from what was programmed.
Table 6: Uncorrectable Bit Error Rate
Uncorrectable Bit Error RateOperation
<1 sector per 1015 bits readREAD
Mean Time To Failure
Mean time to failure (MTTF) for the SSD can be predicted based on the component reliability data using the methods referenced in the Telcordia SR-332 reliability prediction
procedures for electronic equipment.
Table 7: MTTF
M500 2.5-Inch NAND Flash SSD
Reliability
CapacityMTTF (Operating Hours)
120GB1.2 million
240GB1.2 million
480GB1.2 million
960GB1.2 million
Note:
1. The product achieves a mean time to failure (MTTF) of 1.2 million hours, based on population statistics not relevant to individual units.
1
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7
Micron Technology, Inc. reserves the right to change products or specifications without notice.
Endurance for the SSD can be predicted based on the usage conditions applied to the
device, the internal NAND component cycles, the write amplification factor, and the
wear-leveling efficiency of the drive. The tables below show the drive lifetime for each
SSD capacity by client computing and sequential input and based on predefined usage
conditions.
Table 8: Drive Lifetime – Client Computing
CapacityDrive Lifetime (Total Bytes Written)
120GB72TB
240GB72TB
480GB72TB
960GB72TB
Notes:
1. Total bytes written calculated with the drive 90% full.
2. SSD volatile write cache is enabled.
3. Access patterns used during reliability testing are 25% sequential and 75% random and
consist of the following: 50% are 4KiB; 40% are 64KiB; and 10% are 128KiB.
4. Host workload parameters, including write cache settings, IO alignment, transfer sizes,
randomness, and percent full, that are substantially different than the described notes,
may result in varied endurance results.
5. GB/day can be calculated by dividing the total bytes written value by (365 × number of
years). For example: 72TB/5 years/365 days = 40 GB/day for 5 years.
Table 9: Drive Lifetime – Sequential Input
CapacityDrive Lifetime (Total Bytes Written)
120GB125TB
240GB250TB
480GB500TB
960GB500TB
Notes:
1. Endurance of Client SSDs in some data center applications can be maximized by implementing workloads which are sequential when writing, with read-intensive access. Micron recommends no higher than 20% of input/output operations be writes.
2. SSD volatile write cache is enabled.
3. Micron recommends sequential writes in transfer sizes of 128KiB or integer multiples of
128KiB which are 4KiB-aligned. Contact Micron for details.
4. Host workload parameters, including write cache settings, IO alignment, transfer sizes,
randomness, and percent full, that are substantially different than the described notes,
may result in varied endurance results.
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Micron Technology, Inc. reserves the right to change products or specifications without notice.
Environmental conditions beyond those listed may cause permanent damage to the device. This is a stress rating only, and functional operation of the device at these or any
other conditions above those indicated in the operational sections of this specification
is not implied. Exposure to absolute maximum rating conditions for extended periods
may affect reliability.
Table 10: SATA Power Consumption
M500 2.5-Inch NAND Flash SSD
Electrical Characteristics
Device Sleep
Capacity
120GB<5801502100mW
240GB<5951503200mW
480GB<101001503600mW
960GB<201001503800mW
AverageIdle AverageActive Average
Notes:
1. Data taken at 25°C using a 6 Gb/s SATA interface.
2. Active average power measured while running MobileMark Productivity Suite.
3. DIPM (device-initiated power management) enabled. DIPM Slumber supported.
4. Active maximum power is measured using Iometer with 128KB sequential write transfers.
Active Maximum
(128KB transfer)Unit
Table 11: Maximum Ratings
Parameter/ConditionSymbolMinMaxUnit
Voltage inputV54.55.5V
Operating temperatureT
Non-operating temperature–4085°C
Rate of temperature change–20°C/hour
Relative humidity (non-condensing)595%
Notes:
1. Temperature is best measured by reading the SSD's on-board temperature sensor, which
is recorded in SMART attribute 194 (or 0xC2).
2. Power-off sequence: When the SSD is shut down, the ATA STANDBY IMMEDIATE (STBI)
command should be the last command sent by the host and acknowledged by the SSD.
Failure to follow this process might result in a longer than normal time-to-ready (TTR)
during the subsequent power-on sequence. TTR is the time from power-on to drive
ready to accept SATA commands.
S
070°C
Table 12: Shock and Vibration
Parameter/ConditionSpecification
Non-operating shock1500G/0.5ms
Non-operating vibration5–800Hz @ 3.13G
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Micron Technology, Inc. reserves the right to change products or specifications without notice.
The device features adaptive thermal monitoring. While most host computers exhibit
operating environments that keep an SSD running in the range of 40°C to 45°C, adaptive thermal monitoring enables the SSD device to operate in a wide variety of environments by helping to prevent the host computer from running at excessive temperatures.
Adaptive thermal monitoring reduces NAND operations by approximately 40% when
the SSD's internal measured temperature reaches 75°C. The SSD remains in this lowered performance state until the temperature returns to 65°C; the SSD then returns to
normal operating mode. These transition points might occur at points somewhat different from case or ambient temperature because of thermal effects that cause a difference
between temperature sensed at the PCB level and temperature at the specified operating environment.
Adaptive thermal monitoring does not change the current negotiated speed of the SATA
bus, nor require or cause any new commands to be issued on the SATA bus. Ratedthroughput performance is not guaranteed at any point above the maximum specified
operating temperature.
The thermal monitoring feature can be disabled using ATA SET FEATURE commands as
described below. The default setting is ENABLED.
Note: The SSD will return to the default setting after each power cycle or COMRESET
command. Arrangements should be made to re-issue the DISABLE command after each
power cycle or COMRESET.
M500 2.5-Inch NAND Flash SSD
Adaptive Thermal Monitoring
DISABLE THERMAL MONITORING Command
• Command set feature
• Sub-command enable SATA feature
• Specific feature hardware feature control
• LBA FFFFh
• IDFY word 78, bit 5 will be set to indicate SATA hardware feature control is active
Table 13: Disable Thermal Monitoring Command Set Register
Register
Feature Set
Feature10h
Sector count08h
Sector numberFFh
Cylinder lowFFh
Cylinder highxx
Drive headxx
CommandEFh
76543210
ENABLE THERMAL MONITORING Command
• Command set feature
• Sub-command disable SATA feature
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Micron Technology, Inc. reserves the right to change products or specifications without notice.
Alignment Granularity4096 BytesPage or Descriptor size <<Minimum AES LU size>>
Lowest Aligned LBA0–
OPAL SSC V2.00 Feature Descriptor
Base COM ID0x10000x1000-0xFFFF defined for COM ID management
Number of COM IDs1–
Range Crossing Behavior0If drive receives a READ or WRITE command that
spans multiple LBA ranges and the LBA ranges are
not locked, then:
1. Process the data transfer, if Range Crossing = 0
2. Terminate the command with “Other Invalid
Command Parameter” if Range Crossing = 1
Number of Locking SP Admin Authorities
Supported
Number of Locking SP User Authorities
Supported
Initial C_PIN_SID PIN Indicator0x000x00 = The initial C_PIN_SID PIN value is equal to
Behavior of C_PIN_SID PIN upon Ter Revert0x000x00 = The C_PIN_SID PIN value becomes the value
DataStore Table Feature
Maximum number of DataStore Tables9The maximum number of the DataStore tables that
Maximum total size of DataStore Tables90MBSpecifies the maximum total size in bytes of all of
DataStore Table Size Alignment10MB–
4As per OPAL 2.0, drive should support at least 4 ad-
min
9As per OPAL 2.0, drive should support at least 8
users
the C_PIN_MSID PIN value
0xFF = The initial C_PIN_SID PIN value is VU, and
MAY not be equal to the C_PIN_MSID PIN value
OPAL 2.0 (only)
Customer-specific SID – Configurable
of the C_PIN_MSID PIN column after successful invocation of revert on the admin SP’s object in the
SP table
0xFF = The C_PIN_SID PIN value changes to a VU
value after successful invocation of revert on the
admin SP’s object in the SP table and MAY not be
equal to the C_PIN_MSID PIN value OPAL 2.0 (only)
the TPer supports, including the DataStore table
defined in OPAL SSC 2.0
the DataStore tables that TPer supports, including
the DataStore table defined in OPAL SSC 2.0
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Micron Technology, Inc. reserves the right to change products or specifications without notice.
234(O)F0001hMinimum number of 512 byte units per DOWNLOAD MI-
23500FFhMaximum number of 512 byte units per DOWNLOAD MI-
2360000h 0000h
0000h 0000h
0000h 0000h
0000h
2434000hBit 14 = 1; Supports FDE security features
2440000h 0000h
0000h 0000h
0000h 0000h
0000h 0000h
0000h 0000h
0000h
255(M)FIntegrity word
15–8variesChecksum
7–0A5hSignature
Reserved for CE-ATA
CROCODE command for mode 3
CROCODE command for mode 3
Reserved
Reserved
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Note:
1. F = The content of the word is fixed and does not change.
V = The content of the word is variable and may change depending on the state of the
device or the commands executed by the device.
X = The content of the word may be fixed or variable.
R = The content of the word is reserved and will be zero.
30
Micron Technology, Inc. reserves the right to change products or specifications without notice.
• CE (Europe): EN55022, 2006 Class B and EN55024, 1998 + A1: 2001 + A2:2003
• FCC: CFR Title 47, Part 15, ICES-003, all Class B
• UL (US): approval to UL-60950-1, 2nd Edition, 2007-03-27, IEC 60950-1:2005, 2nd Edition
• BSMI (Taiwan): approval to CNS 13438
• C-TICK (Australia, New Zealand): approval to AS/NZS CISPR22
• KCC RRL (Korea): approval to KCC MU2-C30025, KCC MU2-C30018 Class B
• W.E.E.E.: Compliance with EU WEEE directive 2002/96/EC. Additional obligations
may apply to customers who place these products in the markets where WEEE is enforced.
• TUV (Germany): approval to IEC60950/EN60950
• V
CCI
• IC (Canada):
- This Class B digital apparatus complies with Canadian ICES-003.
- Cet appareil numérique de la classe B est conforme à la norme NMB-003 du Canada.
FCC Rules
This equipment has been tested and found to comply with the limits for a Class B digital
device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and
used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user
is encouraged to try to correct the interference by one or more of the following measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and the receiver.
• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.
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Micron Technology, Inc. reserves the right to change products or specifications without notice.
• Added note 2 and note 4 to Table 8: Drive Lifetime – Client Computing
• Added note 2 and note 4 to Table 9: Drive Lifetime – Sequential Input
• Removed the AW = 2.5-inch (5mm) drive form factor from the Part Number Chart
• Added a power cycle note to thermal monitoring
• Revised thermal monitoring.
• Changed endurance data and added an endurance footnote on cover page.
• Revised part number chart.
• Revised and divided the drive lifetime table into two tables, a client computing table
and a sequential input table, with new data for these table categories.
Rev. B– 2/13
• Status changed from Preliminary to Production.
• Updated Physical Configuration section.
• Updated Electrical Characteristics section.
Rev. A – 1/13
• Initial release.
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: 208-368-4000