Primary Side
Secondary Side
U39 U40 U41 U42 U43 U44 U45 U46 U47
U6
U16
U1
U2
U3
U5
U2
U7
U9
U8
U10
U11
U12
U13
U14
U15
U17
U18
U19
U20
U25
U26
U27
U29
U28
U34
U35
U36
U37
U38
U21
U22
U23
U24
U30
U31
U32
U33
64GB (x72, ECC, DR) 288-Pin DDR4 LRDIMM
DDR4 SDRAM LRDIMM
Addendum
MTA36ASF8G72LZ – 64GB
Features
Features
• DDR4 functionality and operations supported as
defined in the component data sheet
• Features and specifications supported in the Micron
DDR4 LRDIMM core data sheet
• 288-pin, command/address/control registered, data
buffered dual in-line, load reduced memory module
(LRDIMM)
• Fast data transfer rates: PC4-3200, PC4-2933
• 64GB (4 Gig x 72)
• Dual-rank
• 16 internal banks; 4 groups of 4 banks each
Table 1: Addressing
Figure 1: 288-Pin LRDIMM (MO-309, R/C-B2)
Options Marking
• Operating temperature
– Commercial (0°C ≤ T
• Package
– 288-pin DIMM (Green) Z
• Frequency/CAS latency
– 0.625ns @ CL = 22 (DDR4-3200) -3G2
– 0.682ns @ CL = 21 (DDR4-2933) -2G9
≤ 95°C) None
OPER
Parameter 64GB
Row address 256K A[17:0]
Column address 1K A[9:0]
Device bank group address 4 BG[1:0]
Device bank address per group 4 BA[1:0]
Device configuration 16Gb (4 Gig x 4), 16 banks
Module rank address 2 CS_n[1:0]
CCM005-341111752-10547
asf36c8gx72lz.pdf - Rev. B 4/2020 EN
Products and specifications discussed herein are subject to change by Micron without notice.
1
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2019 Micron Technology, Inc. All rights reserved.
64GB (x72, ECC, DR) 288-Pin DDR4 LRDIMM
Table 2: Part Numbers and Timing Parameters – 64GB Modules
Base device: MT40A4G4,1 16Gb DDR4 SDRAM
Part Number
2
Density Configuration
MTA36ASF8G72LZ-3G2__ 64GB 8 Gig x 72 25.6 GB/s 0.625ns/3200 MT/s 22-22-22
MTA36ASF8G72LZ-2G9__ 64GB 8 Gig x 72 23.47 GB/s 0.682ns/2933 MT/s 21-21-21
Module
Module
Bandwidth
Memory Clock/
Data Rate
Clock Cycles
(CL-nRCD-nRP)
Features
Notes:
1. The data sheet for the base device can be found on micron.com.
2. All part numbers end with a two-place code (not shown) that designates component and PCB revisions.
Consult factory for current revision codes. Example: MTA36ASF8G72LZ-3G2B1.
CCM005-341111752-10547
asf36c8gx72lz.pdf - Rev. B 4/2020 EN
2
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2019 Micron Technology, Inc. All rights reserved.
64GB (x72, ECC, DR) 288-Pin DDR4 LRDIMM
Important Notes and Warnings
Important Notes and Warnings
Micron Technology, Inc. ("Micron") reserves the right to make changes to information published in this document,
including without limitation specifications and product descriptions. This document supersedes and replaces all
information supplied prior to the publication hereof. You may not rely on any information set forth in this document if you obtain the product described herein from any unauthorized distributor or other source not authorized
by Micron.
Automotive Applications. Products are not designed or intended for use in automotive applications unless specifically designated by Micron as automotive-grade by their respective data sheets. Distributor and customer/distributor shall assume the sole risk and liability for and shall indemnify and hold Micron harmless against all claims,
costs, damages, and expenses and reasonable attorneys' fees arising out of, directly or indirectly, any claim of
product liability, personal injury, death, or property damage resulting directly or indirectly from any use of nonautomotive-grade products in automotive applications. Customer/distributor shall ensure that the terms and conditions of sale between customer/distributor and any customer of distributor/customer (1) state that Micron
products are not designed or intended for use in automotive applications unless specifically designated by Micron
as automotive-grade by their respective data sheets and (2) require such customer of distributor/customer to indemnify and hold Micron harmless against all claims, costs, damages, and expenses and reasonable attorneys'
fees arising out of, directly or indirectly, any claim of product liability, personal injury, death, or property damage
resulting from any use of non-automotive-grade products in automotive applications.
Critical Applications. Products are not authorized for use in applications in which failure of the Micron component could result, directly or indirectly in death, personal injury, or severe property or environmental damage
("Critical Applications"). Customer must protect against death, personal injury, and severe property and environmental damage by incorporating safety design measures into customer's applications to ensure that failure of the
Micron component will not result in such harms. Should customer or distributor purchase, use, or sell any Micron
component for any critical application, customer and distributor shall indemnify and hold harmless Micron and
its subsidiaries, subcontractors, and affiliates and the directors, officers, and employees of each against all claims,
costs, damages, and expenses and reasonable attorneys' fees arising out of, directly or indirectly, any claim of
product liability, personal injury, or death arising in any way out of such critical application, whether or not Micron or its subsidiaries, subcontractors, or affiliates were negligent in the design, manufacture, or warning of the
Micron product.
Customer Responsibility. Customers are responsible for the design, manufacture, and operation of their systems,
applications, and products using Micron products. ALL SEMICONDUCTOR PRODUCTS HAVE INHERENT FAILURE RATES AND LIMITED USEFUL LIVES. IT IS THE CUSTOMER'S SOLE RESPONSIBILITY TO DETERMINE
WHETHER THE MICRON PRODUCT IS SUITABLE AND FIT FOR THE CUSTOMER'S SYSTEM, APPLICATION, OR
PRODUCT. Customers must ensure that adequate design, manufacturing, and operating safeguards are included
in customer's applications and products to eliminate the risk that personal injury, death, or severe property or environmental damages will result from failure of any semiconductor component.
Limited Warranty. In no event shall Micron be liable for any indirect, incidental, punitive, special or consequential
damages (including without limitation lost profits, lost savings, business interruption, costs related to the removal
or replacement of any products or rework charges) whether or not such damages are based on tort, warranty,
breach of contract or other legal theory, unless explicitly stated in a written agreement executed by Micron's duly
authorized representative.
CCM005-341111752-10547
asf36c8gx72lz.pdf - Rev. B 4/2020 EN
3
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2019 Micron Technology, Inc. All rights reserved.
DQ Map
Table 3: Component-to-Module DQ Map, Front
64GB (x72, ECC, DR) 288-Pin DDR4 LRDIMM
DQ Map
Component
Reference
Number
U1 0 0 5 U2 0 10 23
U3 0 22 32 U4 0 31 188
U5 0 CB6 54 U7 0 34 104
U8 0 40 108 U9 0 50 126
U10 0 60 128 U11 0 7 155
U12 0 14 21 U13 0 17 172
U14 0 25 183 U15 0 CB0 49
U17 0 38 102 U18 0 46 113
U19 0 52 117 U20 0 58 137
Component
DQ Module DQ
1 2 12 1 8 16
2 1 150 2 11 168
3 3 157 3 9 161
1 21 170 1 29 181
2 23 177 2 30 43
3 20 25 3 28 36
1 CB5 192 1 32 97
2 CB7 199 2 35 249
3 CB4 47 3 33 242
1 42 115 1 48 119
2 41 253 2 51 271
3 43 260 3 49 264
1 62 135 1 5 148
2 61 273 2 6 10
3 63 280 3 4 3
1 12 14 1 19 179
2 15 166 2 16 27
3 13 159 3 18 34
1 27 190 1 CB3 201
2 24 38 2 CB1 194
3 26 45 3 CB2 56
1 36 95 1 44 106
2 39 247 2 47 258
3 37 240 3 45 251
1 54 124
2 53 262
3 55 269
Module Pin
Number
Component
Reference
Number
Component
DQ Module DQ
1 57 275
2 59 282
3 56 130
Module Pin
Number
CCM005-341111752-10547
asf36c8gx72lz.pdf - Rev. B 4/2020 EN
4
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2019 Micron Technology, Inc. All rights reserved.
Table 4: Component-to-Module DQ Map, Back
64GB (x72, ECC, DR) 288-Pin DDR4 LRDIMM
DQ Map
Component
Reference
Number
Component
DQ Module DQ
Module Pin
Number
Component
Reference
Number
Component
DQ Module DQ
U21 0 62 135 U22 0 48 119
1 60 128 1 50 126
2 63 280 2 49 264
3 61 273 3 51 271
U23 0 42 115 U24 0 32 97
1 40 108 1 34 104
2 43 260 2 33 242
3 41 253 3 35 249
U25 0 CB5 192 U26 0 29 181
1 CB6 54 1 31 188
2 CB4 47 2 28 36
3 CB7 199 3 30 43
U27 0 21 170 U28 0 8 16
1 22 32 1 10 23
2 20 25 2 9 161
3 23 177 3 11 168
U29 0 2 12 U30 0 57 275
1 0 5 1 58 137
2 3 157 2 56 130
3 1 150 3 59 282
U31 0 54 124 U32 0 44 106
1 52 117 1 46 113
2 55 269 2 45 251
3 53 262 3 47 258
U33 0 36 95 U34 0 CB3 201
1 38 102 1 CB0 49
2 37 240 2 CB2 56
3 39 247 3 CB1 194
U35 0 27 190 U36 0 19 179
1 25 183 1 17 172
2 26 45 2 18 34
3 24 38 3 16 27
U37 0 12 14 U38 0 5 148
1 14 21
2 13 159
3 15 166
1 7 155
2 4 3
3 6 10
Module Pin
Number
CCM005-341111752-10547
asf36c8gx72lz.pdf - Rev. B 4/2020 EN
5
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2019 Micron Technology, Inc. All rights reserved.
64GB (x72, ECC, DR) 288-Pin DDR4 LRDIMM
IDD Specifications
IDD Specifications
Table 5: DDR4 IDD Specifications and Conditions – 64GB (Die Revision E)
Values are for the MT40A4G4 DDR4 SDRAM only and are computed from values specified in the DDR4 (4 Gig x 4) component data sheet
Parameter Symbol 3200 Units
One bank ACTIVATE-PRECHARGE current I
One bank ACTIVATE-PRECHARGE, wordline boost, IPP current I
One bank ACTIVATE-READ-PRECHARGE current I
Precharge standby current I
Precharge standby ODT current I
Precharge power-down current I
Precharge quite standby current I
Active standby current I
Active standby IPP current I
Active power-down current I
Burst read current I
Burst write current I
Different logic rank burst refresh current (1x REF) I
Different logic rank burst refresh IPP current (1x REF) I
Self refresh current: Normal temperature range (0°C to 85°C) I
Self refresh current: Extended temperature range (0°C to 95°C) I
Self refresh current: Reduced temperature range (0°C to 45°C) I
Auto self refresh current (25°C) I
Auto self refresh current (45°C) I
Auto self refresh current (75°C) I
Auto self refresh current (95°C) I
DD6N (0–85°C)
DD6E (0–95°C)
DD6R (0–45°C)
DD6A (25°C)
DD6A (45°C)
DD6A (75°C)
DD6A (95°C)
Auto self refresh IPP current (0°C to 95°C) I
Bank interleave read current I
Bank interleave read IPP current I
Maximum power-down current I
DD0
PP0
DD1
DD2N
DD2NT
DD2P
DD2Q
DD3N
PP3N
DD3P
DD4R
DD4W
DD5R
PP5R
PP6X
DD7
PP7
DD8
1764 mA
90 mA
1962 mA
1800 mA
1746 mA
1548 mA
1692 mA
2160 mA
72 mA
1728 mA
3060 mA
2664 mA
1998 mA
108 mA
2052 mA
4068 mA
864 mA
648 mA
864 mA
1836 mA
4068 mA
216 mA
4806 mA
324 mA
1368 mA
CCM005-341111752-10547
asf36c8gx72lz.pdf - Rev. B 4/2020 EN
Note:
1. For all IDD values, one package rank in active IDD condition, all other package ranks in
I
DD2P
or I
PP3N
.
6
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2019 Micron Technology, Inc. All rights reserved.
64GB (x72, ECC, DR) 288-Pin DDR4 LRDIMM
IDD Specifications
Table 6: DDR4 IDD Specifications and Conditions – 64GB (Die Revision B)
Values are for the MT40A4G4 DDR4 SDRAM only and are computed from values specified in the DDR4 (4 Gig x 4) component data sheet
Parameter Symbol 3200 2933 Units
One bank ACTIVATE-PRECHARGE current I
One bank ACTIVATE-PRECHARGE, wordline boost, IPP current I
One bank ACTIVATE-READ-PRECHARGE current I
Precharge standby current I
Precharge standby ODT current I
Precharge power-down current I
Precharge quite standby current I
Active standby current I
Active standby IPP current I
Active power-down current I
Burst read current I
Burst write current I
Different logic rank burst refresh current (1x REF) I
Different logic rank burst refresh IPP current (1x REF) I
Self refresh current: Normal temperature range (0°C to 85°C) I
Self refresh current: Extended temperature range (0°C to 95°C) I
Self refresh current: Reduced temperature range (0°C to 45°C) I
Auto self refresh current (25°C) I
Auto self refresh current (45°C) I
Auto self refresh current (75°C) I
Auto self refresh current (95°C) I
DD6N (0–85°C)
DD6E (0–95°C)
DD6R (0–45°C)
DD6A (25°C)
DD6A (45°C)
DD6A (75°C)
DD6A (95°C)
Auto self refresh IPP current (0°C to 95°C) I
Bank interleave read current I
Bank interleave read IPP current I
Maximum power-down current I
DD0
PP0
DD1
DD2N
DD2NT
DD2P
DD2Q
DD3N
PP3N
DD3P
DD4R
DD4W
DD5R
PP5R
PP6X
DD7
PP7
DD8
1854 1836 mA
126 126 mA
2034 2016 mA
1872 1836 mA
1782 1764 mA
1548 1548 mA
1692 1692 mA
2808 2772 mA
108 108 mA
2484 2448 mA
3870 3726 mA
3726 3600 mA
2196 2178 mA
144 144 mA
2412 2412 mA
4356 4356 mA
1044 1044 mA
360 360 mA
1044 1044 mA
2196 2196 mA
4356 4356 mA
396 396 mA
5058 4932 mA
252 252 mA
1440 1440 mA
CCM005-341111752-10547
asf36c8gx72lz.pdf - Rev. B 4/2020 EN
Note:
1. For all IDD values, one package rank in active IDD condition, all other package ranks in
I
DD2P
or I
PP3N
.
7
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2019 Micron Technology, Inc. All rights reserved.
DQ0
DQ1
DQ2
DQ3
U1
DQ4
DQ5
DQ6
DQ7
DQS0_t
DQS0_c
DQS9_t
DQS9_c
DQS0_t
DQS0_c
DQS9_t
DQS9_c
DQ0
DQ1
DQ2
DQ3
DQ4
DQ5
DQ6
DQ7
U16
VREFCA
VSS
DDR4 SDRAM, Register
DDR4 SDRAM, Register,
Data Buffer
VDD
Control, command and
address termination
VDDSPD
SPD EEPROM/Temp Sensor,
Register
VTT
DDR4 SDRAM, Register,
Data Buffers
DDR4 SDRAM
VPP
Rank 0: U1–U5, U7–U15, U17–U20
Rank 1: U21–U38
CS_n[3:0]A/B, BA[1:0]A/B, BG[1:0]A/B,
ACT_nA/B, A[17, 13:0]A/B, RAS_n/A16A/B,
CAS_n/A15A/B, WE_n/A14A/B,
PAR-A/B, CKE[1:0]A/B, ODT[1:0]A/B
CK0[A:D]_t
CK0[A:D]_c
Command, control, address, and clock line terminations:
DDR4
SDRAM
VTT
DDR4
SDRAM
VDD
U6
A0
SPD EEPROM/
Temperature
sensor
A1 A2
SA0
SA1
SDA
SCL
EVT
EVENT_N
CS_n DQS_t DQS_c
SA2
DQ
DQ
DQ
DQ
U29
CS_n DQS_t DQS_c
ZQ
VSS
DQ
DQ
DQ
DQ
U11
CS_n DQS_t DQS_c
DQ
DQ
DQ
DQ
U38
CS_n DQS_t DQS_c
ZQ
VSS
U47
DQ
DQ
DQ
DQ
DQ8
DQ9
DQ10
DQ11
U2
DQ12
DQ13
DQ14
DQ15
DQS1_t
DQS1_c
DQS10_t
DQS10_c
DQS1_t
DQS1_c
DQS10_t
DQS10_c
DQ8
DQ9
DQ10
DQ11
DQ12
DQ13
DQ14
DQ15
CS_n DQS_t DQS_c
DQ
DQ
DQ
DQ
U28
CS_n DQS_t DQS_c
ZQ
VSS
DQ
DQ
DQ
DQ
U12
CS_n DQS_t DQS_c
DQ
DQ
DQ
DQ
U37
CS_n DQS_t DQS_c
ZQ
VSS
U46
DQ
DQ
DQ
DQ
DQ16
DQ17
DQ18
DQ19
U13
DQ20
DQ21
DQ22
DQ23
DQS2_t
DQS2_c
DQS11_t
DQS11_c
DQS2_t
DQS2_c
DQS11_t
DQS11_c
DQ16
DQ17
DQ18
DQ19
DQ20
DQ21
DQ22
DQ23
CS_n DQS_t DQS_c
DQ
DQ
DQ
DQ
U36
CS_n DQS_t DQS_c
ZQ
VSS
DQ
DQ
DQ
DQ
U3
CS_n DQS_t DQS_c
DQ
DQ
DQ
DQ
U27
CS_n DQS_t DQS_c
ZQ
VSS
U45
DQ
DQ
DQ
DQ
DQ24
DQ25
DQ26
DQ27
U14
DQ28
DQ29
DQ30
DQ31
DQS3_t
DQS3_c
DQS12_t
DQS12_c
DQS3_t
DQS3_c
DQS12_t
DQS12_c
DQ24
DQ25
DQ26
DQ27
DQ28
DQ29
DQ30
DQ31
CS_n DQS_t DQS_c
DQ
DQ
DQ
DQ
U35
CS_n DQS_t DQS_c
ZQ
VSS
DQ
DQ
DQ
DQ
U4
CS_n DQS_t DQS_c
DQ
DQ
DQ
DQ
U26
CS_n DQS_t DQS_c
ZQ
VSS
U44
DQ
DQ
DQ
DQ
CB0
CB1
CB2
CB3
U15
CB4
CB5
CB6
CB7
DQS8_t
DQS8_c
DQS17_t
DQS17_c
DQS8_t
DQS8_c
DQS17_t
DQS17_c
CB0
CB1
CB2
CB3
CB4
CB5
CB6
CB7
CS_n DQS_t DQS_c
DQ
DQ
DQ
DQ
U34
CS_n DQS_t DQS_c
ZQ
VSS
DQ
DQ
DQ
DQ
U5
CS_n DQS_t DQS_c
DQ
DQ
DQ
DQ
U25
CS_n DQS_t DQS_c
ZQ
VSS
U43
DQ
DQ
DQ
DQ
DQ32
DQ33
DQ34
DQ35
U7
DQ36
DQ37
DQ38
DQ39
DQS4_t
DQS4_c
DQS13_t
DQS13_c
DQS4_t
DQS4_c
DQS13_t
DQS13_c
DQ32
DQ33
DQ34
DQ35
DQ36
DQ37
DQ38
DQ39
CS_n DQS_t DQS_c
DQ
DQ
DQ
DQ
U24
CS_n DQS_t DQS_c
ZQ
VSS
DQ
DQ
DQ
DQ
U17
CS_n DQS_t DQS_c
DQ
DQ
DQ
DQ
U33
CS_n DQS_t DQS_c
ZQ
VSS
U42
DQ
DQ
DQ
DQ
DQ40
DQ41
DQ42
DQ43
U8
DQ44
DQ45
DQ46
DQ47
DQS5_t
DQS5_c
DQS14_t
DQS14_c
DQS5_t
DQS5_c
DQS14_t
DQS14_c
DQ40
DQ41
DQ41
DQ43
DQ44
DQ45
DQ46
DQ47
CS_n DQS_t DQS_c
DQ
DQ
DQ
DQ
U23
CS_n DQS_t DQS_c
ZQ
VSS
DQ
DQ
DQ
DQ
U18
CS_n DQS_t DQS_c
DQ
DQ
DQ
DQ
U32
CS_n DQS_t DQS_c
ZQ
VSS
U41
DQ
DQ
DQ
DQ
DQ48
DQ49
DQ50
DQ51
U9
DQ52
DQ53
DQ54
DQ55
DQS6_t
DQS6_c
DQS15_t
DQS15_c
DQS6_t
DQS6_c
DQS15_t
DQS15_c
DQ48
DQ49
DQ50
DQ51
DQ52
DQ53
DQ54
DQ55
CS_n DQS_t DQS_c
DQ
DQ
DQ
DQ
U22
CS_n DQS_t DQS_c
ZQ
VSS
DQ
DQ
DQ
DQ
U19
CS_n DQS_t DQS_c
DQ
DQ
DQ
DQ
U31
CS_n DQS_t DQS_c
ZQ
VSS
U40
DQ
DQ
DQ
DQ
DQ56
DQ57
DQ58
DQ59
U20
DQ60
DQ61
DQ62
DQ63
DQS7_t
DQS7_c
DQS16_t
DQS16_c
DQS7_t
DQS7_c
DQS16_t
DQS16_c
DQ56
DQ57
DQ58
DQ59
DQ60
DQ61
DQ62
DQ63
CS_n DQS_t DQS_c
DQ
DQ
DQ
DQ
U30
CS_n DQS_t DQS_c
ZQ
VSS
DQ
DQ
DQ
DQ
U10
CS_n DQS_t DQS_c
DQ
DQ
DQ
DQ
U21
CS_n DQS_t DQS_c
ZQ
VSS
U39
ZQ
VSS
ZQ
VSS
ZQ
VSS
ZQ
VSS
ZQ
ZQ
ZQ
VSS
ZQ
VSS
ZQ
VSS
ZQ
ZQ
VSS
ZQ
VSS
ZQ
VSS
ZQ
VSS
ZQ
VSS
ZQ
VSS
ZQ
VSS
ZQ
VSS
ZQCAL
VSS
ALERT_N
VDD
DQ
DQ
DQ
DQ
ZQCAL
VSS
ZQCAL
VSS
ZQCAL
VSS
ZQCAL
VSS
ZQCAL
VSS
ZQCAL
VSS
ZQCAL
VSS
ZQCAL
VSS
ALERT_N
VDD
ALERT_N
VDD
ALERT_N
VDD
ALERT_N
VDD
ALERT_N
VDD
ALERT_N
VDD
ALERT_N
VDD
ALERT_N
VDD
CS0A, CS0B
CS1A, CS1B
CS0A
CS0BCS1A CS1B
CS0
CS1
BA[1:0]
BG[1:0]
ACT_n
A[17,13:0]
RAS_n/A16
CAS_n/A15
WE_n/A14
CKE0
CKE1
ODT0
ODT1
PAR_IN
C[2:0]
ALERT_CONN_N
SA0
SA1
SA2
SCL
SDA
CS0A/B: Rank 0
CS1A/B: Rank 1
BA[1:0]A/B: DDR4 SDRAM
BG[1:0]A/B: DDR4 SDRAM
ACTA/B: DDR4 SDRAM
A[17,13:0]A/B: DDR4 SDRAM
RAS_n/A16A/B: DDR4 SDRAM
CAS_n/A15A/B: DDR4 SDRAM
WE_n/A14A/B: DDR4 SDRAM
CKE0A/B: Rank 0, Rank 2
CKE1A/B: Rank 1, Rank 3
ODT0A/B: Rank 0, Rank 2 tied to VSS
ODT1A/B: Rank 1, Rank 3 tied to VSS
PARA/B: DDR4 SDRAM
C[2:0]: DDR4 SDRAM
ALERT_N: DDR4 SDRAM
BCOM0: DATA BUFFERS
BCOM1: DATA BUFFERS
BCOM2: DATA BUFFERS
BCOM3: DATA BUFFERS
BODT: DATA BUFFERS
BCKE: DATA BUFFERS
R
E
G
I
S
T
E
R
–
P
L
L
–
B
U
F
F
E
R
C
O
N
T
R
O
L
CK0t
CK0c
CK0[A:D]_c
CK0[A:D]_t
CK1t
CK1c
CKDB_c
CKDB_t
DATA BUFFERS
(U39–U47)
ZQCAL
VSS
RESET_CONN_N
QRST_N: DDR4 SDRAM
DDR4 SDRAM
(U1–U5, U7–U15, U17–U38)
VREFCA_CONN
VREFCA: DDR4 SDRAM
BVREF: DATA BUFFERS
BVREF
Data Buffers
Data Buffers
Data Buffers
Functional Block Diagram
Figure 2: Functional Block Diagram
Note:
1. The ZQ ball on each DDR4 component is connected to an external 240Ω ±1% resistor
CCM005-341111752-10547
asf36c8gx72lz.pdf - Rev. B 4/2020 EN
64GB (x72, ECC, DR) 288-Pin DDR4 LRDIMM
Functional Block Diagram
that is tied to ground. It is used for the calibration of the component’s ODT and output
driver.
8
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2019 Micron Technology, Inc. All rights reserved.
64GB (x72, ECC, DR) 288-Pin DDR4 LRDIMM
Functional Block Diagram
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: 208-368-4000
www.micron.com/products/support Sales inquiries: 800-932-4992
Micron and the Micron logo are trademarks of Micron Technology, Inc.
All other trademarks are the property of their respective owners.
This data sheet contains minimum and maximum limits specified over the power supply and temperature range set forth herein.
Although considered final, these specifications are subject to change, as further product development and data characterization some-
times occur.
CCM005-341111752-10547
asf36c8gx72lz.pdf - Rev. B 4/2020 EN
9
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2019 Micron Technology, Inc. All rights reserved.
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