Micron MT9P031 User Manual

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MT9P031: 1/2.5-Inch 5-Mp Digital Image Sensor

MT9P031 Image Sensor

Product Brief

Micron’s MT9P031 is a 1/2.5-inch CMOS digital image sensor with an active-pixel array of 2592H x 1944V. It incorporates

sophisticated camera functions such as windowing, binning, column and row skip mode, and snapshot mode. It is programmable through a simple two-wire serial interface. The MT9P031 produces extraordinarily clear, sharp digital pictures, and its ability to capture both continuous video and single frames makes it the perfect choice for a wide range of consumer and commercial security applications, including high resolution network cameras; pan,

Preliminary

‡

tilt, and zoom cameras; and hybrid video/still cameras.

Applications

• High-resolution network cameras

• Wide field of view cameras

• High-definition surveillance camera

• Dome cameras with electronic pan, tilt, and zoom

• Hybrid video cameras with high resolution stills

• Detailed feature extraction for smart cameras

Features

•Micron® DigitalClarity® imaging technology

•High frame rate

• Superior low-light performance

• Low dark current

• Global reset release, which starts the exposure of all rows simultaneously

• Bulb exposure mode, for arbitrary exposure times

• Snapshot mode to take frames on demand

• Horizontal and vertical mirror image

• Column and row skip modes to reduce image size without reducing field of view

• Column and row binning modes to improve image quality when resizing

• Simple two-wire serial interface

• Subframe windowed readout

• Programmable contro ls: gain, frame rate, frame size, exposure

• Automatic black level calibration

• On-chip PLL

Key Parameters

Optical format 1/2.5-inch (4:3) Active imager size 5.70mm(H) x 4.28mm(V)

7.13mm diagonal Active pixels 2592H x 1944V Pixel size 2.2µm x 2.2µm Color filter array RGB Bayer pattern Shutter type Global reset release (GRR),

snapshot only; electronic

rolling shutter (ERS) Maximum data rate/ master clock

Full resolution Programmable up to 14 fps VGA (with binning) Programmable up to 53 fps 720P (1280 X 720, skipping mode) ADC resolution 12-bit, on-chip Responsivity 1.4 V/lux-sec (550nm) Pixel dynamic range 70.1dB (full resolution),

SNR

MAX

Supply voltage

Power consumption 381mW at 14 fps full

Operating temp. –30°C to +70°C Packaging 48-pin iLCC, die Output gain 10 e-/LSB Read noise 2.6 e-RMS at 16X Dark current 25 e-/pix/s at 55C

I/O 1.7V Digital 1.7V Analog 2.6V

96 Mp/s at 96 MHz (2.8V I/O)

48 Mp/s at 48MHz (1.8V I/O)

Frame Rate

Programmable up to 60 fps

76dB (2 x 2 binning)

38.1dB (full resolution),

44dB (2 x 2 binning)

−3.1V

−1.9V (1.8V nominal)

−3.1V (2.8V nominal)

resolution

‡Products and specifications discussed herein are for evaluation and reference purposes only and are subject to change by

Micron without notice. Products are only warranted by Micron to meet Micron’s production data sheet specifications.

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Ordering Information

Table 1: Available Part Numbers

Part Number Description

MT9P031I12STC ES 48-Pin iLCC 7 deg MT9P031I12STD ES Demo kit MT9P031I12STH ES Demo kit headboard

General Description

The MT9P031 sensor can be operated in its default mode or programmed for frame size, exposure, gain setting, and other parameters. The default mode outputs a full-resolution image at 14 frames per second (fps).

An on-chip analog-to-digital converter (ADC) provides 12 bits per pixel. FRAME_VALID and LINE_VALID signals ar e output on dedicated pins, as is a pixel clock that is synchronous with valid data.

The 5-megapixel CMOS i`mage sensor features DigitalClarity—Micron’s breakthrough low-noise CMOS imaging technology that achieves CCD image quality (based on signalto-noise ratio and low-light sensitivity) while maintaining the inherent size, cost, and integration advantages of CMOS.

MT9P031: 1/2.5-Inch 5-Mp Digital Image Sensor

Ordering Information

Figure 1: MT9P031 Quantum Efficiency versus Wavelength

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Figure 2: Chief Ray Angle

CRA Des ign

0 10 20 30 40 50 60 70 80 90 100 110

Image Height (%)

CRA (deg)

MT9P031: 1/2.5-Inch 5-Mp Digital Image Sensor

General Description

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Functional Overview

Pixel Array

2,752H x 2,004V

SCLK S

DATA

ADDR

PIXCLK D

OUT

[11:0] LINE_VALID FRAME_VALID

STROBE

Serial

Interface

Analog Signal Chain Data Path

TRIGGER

EXTCLK

RESET#

STANDBY#

OE#

Array Control

Output

The MT9P031 is a progressive-scan sensor that generates a stream of pixel data at a constant frame rate. It uses an on-chip, phase-locked loop (PLL) to generate all in ternal clocks from a single master input clock running between 6 MHz and 27 MHz. The maximum pixel rate is 96 megapixels per second, corresponding to a clock rate of 96 MHz. Figure3 illustrates a block diagram of the sensor.

Figure 3: MT9P031 Block Diagram

MT9P031: 1/2.5-Inch 5-Mp Digital Image Sensor

Functional Overview

The sensor is programmed via the two-wire serial bus, which communicates with the array control, analog signal chain, and digital signal chain. The core of the sensor is a 5megapixel active-pixel array. The timing and control circuitry sequences through the rows of the array, resetting and then reading each row in turn. In the time interval between resetting a row and reading that row, the pixels in the row integrate incident light. The exposure is controlled by varying the time interval between reset and readout. Once a row has been read, the data from the columns are sequenced through an analog signal chain (providing offset correction and gain) and then through an ADC. The output from the ADC is a 12-bit value for each pixel in the array. The ADC output passes through a digital processing signal chain (which provides further data path corrections and applies digital gain). The pixel data are output at a rate of up to 96 Mp/s, in addition to frame and line synchronization signals.

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Figure 4: Typical Configuration (connection)

OUT

[11:0]

PIXCLK

FRAME_VALID

LINE_VALID

STROBE

ADDR

RESET#

STANDBY#

SCLK S

DATA

TRIGGER

GND

TEST

1.5KΩ

VDDQ

2,3

1µF

10K

RSVD

GND

PLL

VAAPIX

2,3

OE#

To Controller

From

Controller

Master

Clock

EXTCLK

MT9P031: 1/2.5-Inch 5-Mp Digital Image Sensor

Functional Overview

Notes: 1. Resistor value 1.5KΩ is recommended but may be greater for slower two-wire speed.

2. All power supplies should be adequately decoupled.

3. All D

GND pins must be tied together, as must all AGND pins, all VDDQ pins, and all VDD pins.

Figure 5: 48-Pin iLCC 10x10mm Package Pinout Diagram (top view)

DATA

RSVD

SCLK

FRAME_VALID

LINE_VALID

STROBE

VDDQ

STANDBY#

TRIGGER

RESET#

GND

ADDR

OE#

19 20 21 22

TEST

GND

TEST

VAAPIX VAAPIX

123456 48 47 46 45

24 25

GND

TEST

PLL

VDDD

26 27

GND

GNDDOUT

OUT

D D

OUT

D D

OUT

D D

OUT

PIXCLK EXTCLK

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MT9P031: 1/2.5-Inch 5-Mp Digital Image Sensor

Table 2: Pin Descriptions

Name LLCC Pin Type Description

RESET# 16 Input

EXTCLK 31 Input

SCLK 4 Input

OE# 17 Input

STANDBY# 14 Input

TRIGGER 15 Input

ADDR 13 Input

DATA 5 I/O

PIXCLK 32 Output

OUT[11:0] 33 to 45 Output

FRAME_VALID 7 Output

LINE_VALID 8 Output

STROBE 9 Output

DD 12, 7 Supply

DDQ11, 39Supply

GND 10, 26, 46 Supply

AA 23, 24 Supply

VAAPIX 1, 48 Supply

GND 2, 22 Supply

DDPLL 25 Supply

TEST 3, 20, 21 –

RSVD 6 –

NC 18, 19, 27, 28, 29,

–

When LOW, the MT9P031 asynchronously resets. When driven HIGH, it resumes normal operation with all configuration registers set to factory defaults.

External input clock. Serial clock: Pull to V When HIGH, the PIXCLK, D

DDQ with a 1.5KΩ resistor.

OUT, FRAME_VALID, LINE_VALID, and STROBE

outputs enter a High-Z. When driven LOW, normal operation resumes. Standby: When LOW, the chip enters a low-power standby mode. It

resumes normal operation when the pin is driven HIGH. Snapshot trigger: Used to trigger one frame of output in snapshot

modes and to indicate the end of exposure in bulb exposure modes . Serial address: When HIGH, the MT9P031 responds to device ID (BA)H.

When LOW, it responds to serial device ID (90)H.

Serial data: Pull to VDDQ with a 1.5KΩ resistor. Pixel clock: The D

OUT, FRAME_VALID, LINE_VALID, and STROBE

outputs should be captured on the falling edge of this signal. Pixel data: Pixel data is 12-bit. MSB (D

each pixel, to be captured on the falling edge of PIXCLK. Frame valid: Driven HIGH during active pixels and horizontal blanking

of each frame and LOW during vertical blanking. Line valid: Driven HIGH with active pixels of each line and LOW during

blanking periods. Snapshot strobe: Driven HIGH when all pixels are exposing in

snapshot modes.

Digital supply voltage: Nominally 1.8V. IO supply voltage: Nominally 1.8V or 2.8V.

Digital ground.

Analog supply voltage: Nominally 2.8V. Pixel supply voltage: Nominally 2.8V, connected externally to V

Analog ground. PLL supply voltage: Nominally 2.8V, connected externally to VAA. Tie to A Tie to D

GND for normal device operation (factory use only). GND for normal device operation (factory use only).

No connect.

Functional Overview

OUT11) through LSB (DOUT0) of

AA.

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Default Readout Order

Lens

Pixel (0,0)

Row

Readout

Order

Column Readout Order

Scene

Sensor (rear view)

By convention, the sensor core pixel array is shown with pixel (0,0) in the top right corner (see Figure6). This reflects the actual layout of the array on the die . B y default data is first read out of the sensor at pixel (16,54).

When the sensor is imaging, the active surface of the se nsor faces the sce ne, as shown in Figure6. When the image is read out of the sensor, it is read one row at a time, with the rows and columns sequenced, as shown in Figure7.

Figure 6: Imaging a Scene

MT9P031: 1/2.5-Inch 5-Mp Digital Image Sensor

Functional Overview

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MT9P031: 1/2.5-Inch 5-Mp Digital Image Sensor

0,0 P0,1 P0,2

.....................................P

0,n-1 P0,n

1,0 P1,1 P1,2

.....................................P

1,n-1 P1,n

00 00 00 .................. 00 00 00

m-1,0 Pm-1,1

.....................................P

m-1,n-1 Pm-1,n

m,0 Pm,1

.....................................P

m,n-1 Pm,n

00 00 00 .................. 00 00 00

00 00 00 ..................................... 00 00 00

VALID IMAGE

HORIZONTAL

BLANKING

VERTICAL BLANKING

VERTICAL/HORIZONTAL

BLANKING

Output Data Format (default mode)

The MT9P031 image data is read out in a progressive scan. Valid image data is surrounded by horizontal blanking and vertical blanking, as shown in Figure 7. LINE_VALID is HIGH in the shaded region of the figure.

Figure 7: Spatial Illustration of Image Readout

Functional Overview

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Readout Modes

Subsampling

Skipping

Binning

MT9P031: 1/2.5-Inch 5-Mp Digital Image Sensor

Functional Overview

By default, the resolution of the output image is the full width and height of the FOV as defined above . The output resolution can be reduced by two methods: skipping and binning.

Row and column skip modes use sub sampling to reduce the output resolution without reducing field-of-view. The MT9P031 also has row and column binning modes, which can reduce the impact of aliasing introduced by the use of skip modes. This is achieved by the averaging of two or three adjacent rows and columns (adjacent same-color pixels). Both 2X and 4X binning modes are supported. Rows and columns can be binned independently.

Skipping reduces resolution by using only selected pixels from the FOV in the output image. In skip mode, entire rows and columns of pixels are not sampled, resulting in a lower-resolution output image. A skip 2X mode skips one Bayer pair of pixels for every pair output. Skip 3X skips two pairs for each one pair output. Rows and columns are always read out in pairs.

Binning reduces re solution b y combining adjacent, same-color im ager pixels to produce one output pixel. All of the pixels in the FOV contribute to the output image in bin mode. This can result in a more pleasing output image with reduced subsampling artifacts. It also improves low-light performance. For columns, the combination step can be either an averaging or summing operation. Depending on lighting conditions, one or the other may be desirable. In low-light conditions, summing produces a gain roughly equivalent to the column bin factor.

Only certain combinations of binning and skipping are allowed.

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MT9P031: 1/2.5-Inch 5-Mp Digital Image Sensor

DC Electrical Characteristics

Table 3: DC Electrical Characteristics

Symbol Definition Conditions Min Typ Max Units

DD Core digital voltage

DDQ I/O digital voltage

AA Analog voltage

V VAAPIX Pixel supply voltage

DDPLL PLL supply voltage

IH Input high voltage VDDQ = 2.8V

DDQ = 1.8V

Input low voltage VDDQ = 2.8V

VDDQ = 1.8V

IN Input leakage current No pull-up resistor; VIN = VDDQ or

DGND

OH Output high voltage At specified IOH

OL Output low voltage At specified IOL

OH Output high current At specified VOH = VDDQ-400mv at

DDQ

1.7V V

Output low current At specified VOL = 400mv at 1.7V

VDDQ

OZ Tri-state output leakage current VIN=VDDQ or GND DD1 Digital operating current Parallel mode 96 MHz full frame

nominal voltage, PLL enabled

DDQ1 I/O digital operating current Parallel mode 96 MHz full frame

nominal voltage, PLL enabled

AA1 Analog operating current Parallel mode 96 MHz full frame

nominal voltage, PLL enabled

AAPIX1 Pixel supply current Parallel mode 96 MHz full frame

nominal voltage, PLL enabled

DDPLL1 PLL supply current Parallel mode 96 MHz full frame

nominal voltage, PLL enabled

DD2 Digital operating current Parallel mode 96 MHz 4X binning

nominal voltage, PLL enabled

DDQ2 I/O digital operating current Parallel mode 96 MHz 4X binning

nominal voltage, PLL enabled

AA2 Analog operating current Parallel mode 96 MHz 4X binning

nominal voltage, PLL enabled

AAPIX2 Pixel supply current Parallel mode 96 MHz 4X binning

nominal voltage, PLL Enabled

DDPLL2 PLL supply current Parallel mode 96 MHz 4X binning

nominal voltage, PLL enabled

STBY1 Hard standby current PLL

EXTCLK enabled

enabled

STBY2 Hard standby current PLL

EXTCLK disabled

disabled

STBY3 Soft standby current PLL enabled EXTCLK enabled (PLL enabled)

STBY4 Soft standby current PLL

EXTCLK enabled (PLL disabled)

disabled

1.7 1.8 1.9 V

1.7 1.8/2.8 3.1 V

2.6 2.8 3.1 V

2.6 2.8 3.1 V 2

1.3

–0.3 –0.3

–3.3

2.3

–+0.8

+0.5

–<10 – µA

1.3 – 1.82 V

0.16 – 0.35 V

8.9 – 22.3 mA

2.6 – 5.1 mA

–– 2µA –28 35mA

–38.650 mA

–72 95mA

–2.4 6 mA

–5 6mA

–15 35mA

–6.450mA

–69 95mA

–3.4 6 mA

–5 6mA

–<500 – µA

–<50 – µA

–<500 – µA –<500 – µA

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Table 4: Power Consumption

Mode Full Resolution (14 fps) 4X Binning Units

Streaming 381 262 mW

Table 5: Absolute Maximum Ratings

Symbol Definition Min Max Units

DD_MAX Core digital voltage

DDQ_MAX I/O digital voltage

AA_MAX Analog voltage

AAPIX_MAX Pixel supply voltage

DDPLL_MAX PLL supply voltage

IN_MAX Input voltage

DD_MAX Digital operating current

DDQ_MAX I/O digital operating current

AA_MAX Analog operating current

AAPIX_MAX Pixel supply current

DDPLL_MAX PLL supply current

2, 3

ST Storage temperature

Operating temperature

MT9P031: 1/2.5-Inch 5-Mp Digital Image Sensor

DC Electrical Characteristics

–0.3 1.9 V –0.3 3.1 V –0.3 3.1 V –0.3 3.1 V –0.3 3.1 V –0.3 V

–35mA –100mA –95mA –6mA

–6mA –30 70 °C –40 125 °C

DDQ + 0.3 V

Notes: 1. Stresses greater than those listed may cause permanent damage to the device. This is a

stress rating only, and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability.

2. In order to keep dark current and shot noise artifacts from impacting image quality, care should be taken to keep T

OP at a minimum.

3. Measure at junction.

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Package Dimensions

4.50

10.000 ±0.075

3.85

7.70

3.85

0.70 TYP

7.70

48 1

1.40

47X 0.80

48X 0.40

4.50

10.000 ±0.075

7.57

1.455

5.702 CTR

7.02

4.277 CTR

1.45

LEAD FINISH: GOLD PLATING,

0.50 MICRONS MINIMUM THICKNESS

4.20

5.000 ±0.075

OPTICAL CENTER

OPTICAL AREA

MAXIMUM ROTATION OF OPTICAL AREA RELATIVE TO PACKAGE EDGES B AND C : 1º MAXIMUM TILT OF OPTICAL AREA RELATIVE TO SEATING PLANE A : 25 MICRONS RELATIVE TO TOP OF COVER GLASS D : 50 MICRONS

5.000 ±0.075

OPTICAL CENTER

FIRST CLEAR PIXEL

SEATING

PLANE

MOLD COMPOUND: EPOXY NOVOLAC

IMAGE SENSOR DIE

LID MATERIAL: BOROSILICATE GLASS 0.40 THICKNESS

1.250 ±0.125

0.725 ±0.075

0.525 ±0.050

0.125

(FOR REFERENCE ONLY)

SUBSTRATE MATERIAL: PLASTIC LAMINATE

Figure 8: 48-Pin iLCC Package Outline

MT9P031: 1/2.5-Inch 5-Mp Digital Image Sensor

Package Dimensions

Notes: 1. All dimensions are in millimeters.

8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: 208-368-3900

prodmktg@micron.com www.micron.com Customer Comment Line: 800-932-4992

Micron, the M logo, and the Micron logo are trademarks of Micron Technology, Inc.

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All other trademarks are the property of their respective owners.