MICRON MT48LC32M8A2FB-75, MT48LC64M4A2TG-7E, MT48LC16M16A2FG-75 Datasheet

PRODUCTS AND SPECIFICATIONS DISCUSSED HEREIN ARE SUBJECT TO CHANGE BY MICRON WITHOUT NOTICE.

1

256Mb: x4, x8, x16

SDRAM

KEY TIMING PARAMETERS

SPEED CLOCK ACCESS TIME SETUP HOLD

GRADE FREQUENCY CL = 2* CL = 3* TIME TIME

-7E 143 MHz – 5.4ns 1.5ns 0.8ns

-75 133 MHz – 5.4ns 1.5ns 0.8ns

-7E 133 MHz 5.4ns – 1.5ns 0.8ns

-75 100 MHz 6ns – 1.5ns 0.8ns

64 Meg x 4 32 Meg x 8 16 Meg x 16

Configuration 16 Meg x 4 x 4 banks 8 Meg x 8 x 4 banks 4 Meg x 16 x 4 banks Refresh Count 8K 8K 8K Row Addressing 8K (A0–A12) 8K (A0–A12) 8K (A0–A12) Bank Addressing 4 (BA0, BA1) 4 (BA0, BA1) 4 (BA0, BA1) Column Addressing 2K (A0–A9, A11) 1K (A0–A9) 512 (A0–A8)

SYNCHRONOUS DRAM

MT48LC64M4A2 – 16 Meg x 4 x 4 banks MT48LC32M8A2 – 8 Meg x 8 x 4 banks MT48LC16M16A2 – 4 Meg x 16 x 4 banks

For the latest data sheet, please refer to the Micron Web site:

www.micron.com/dramds

PIN ASSIGNMENT (Top View)

54-Pin TSOP

FEATURES

• PC66-, PC100-, and PC133-compliant

• Fully synchronous; all signals registered on positive edge of system clock

• Internal pipelined operation; column address can be changed every clock cycle

• Internal banks for hiding row access/precharge

• Programmable burst lengths: 1, 2, 4, 8, or full page

• Auto Precharge, includes CONCURRENT AUTO PRECHARGE, and Auto Refresh Modes

• Self Refresh Mode

• 64ms, 8,192-cycle refresh

• LVTTL-compatible inputs and outputs

• Single +3.3V ±0.3V power supply

OPTIONS MARKING

• Configurations 64 Meg x 4 (16 Meg x 4 x 4 banks) 64M4 32 Meg x 8 ( 8 Meg x 8 x 4 banks) 32M8 16 Meg x 16 ( 4 Meg x 16 x 4 banks) 16M16

• WRITE Recovery (tWR)

t

WR = “2 CLK”

1

A2

• Package/Pinout 54-pin TSOP II OCPL2 (400 mil) TG 60-ball FBGA (8mm x 16mm) (x4, x8) FB

4, 5

54-ball FBGA (8mm x 14mm) (x16 only) FG

3

• Timing (Cycle Time)

7.5ns @ CL = 2 (PC133) -7E

7.5ns @ CL = 3 (PC133) -75

• Self Refresh Standard None Low power L

3

• Operating Temperature Commercial (0oC to +70oC) None Industrial (-40oC to +85oC) IT

3

NOTE: 1. Refer to Micron Technical Note TN-48-05.

2. Off-center parting line.

3. Consult Micron for availability.

4. Not available in x16 configuration.

5. Actual FBGA part marking shown on page 58.

Part Number Example:

MT48LC16M16A2TG-75

Note: The # symbol indicates signal is active LOW. A dash (–)

indicates x8 and x4 pin function is same as x16 pin function.

V

DD

DQ0

V

DD

Q

DQ1 DQ2

VssQ

DQ3 DQ4

V

DD

Q

DQ5 DQ6

VssQ

DQ7

V

DD

DQML

WE#

CAS# RAS#

CS#

BA0 BA1 A10

A0 A1 A2 A3

V

DD

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27

54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28

Vss

DQ15

VssQ

DQ14 DQ13

V

DD

Q

DQ12 DQ11

VssQ

DQ10 DQ9

V

DD

Q

DQ8

Vss NC DQMH CLK CKE

A12 A11 A9 A8 A7 A6 A5 A4

Vss

x8x16 x16x8 x4x4

-

DQ0

-

NC

DQ1

-

NC

DQ2

-

NC

DQ3

-

NC

-

NC

-

NC

-

NC

DQ0

-

NC NC

-

NC

DQ1

-

NC

-

NC

-

DQ7

-

NC

DQ6

-

NC

DQ5

-

NC

DQ4

-

NC

-

DQM

-

NC

-

NC

DQ3

-

NC NC

-

NC

DQ2

-

NC

-

DQM

-

*CL = CAS (READ) latency

2

256Mb: x4, x8, x16

SDRAM

60-BALL FBGA ASSIGNMENT

(Top View)

64 Meg x 4 SDRAM

8mm x 16mm “FB”

32 Meg x 8 SDRAM

8mm x 16mm “FB”

NOTE: FBGA pin Symbol, Type, and Descriptions are identical to the listing of the 54-pin TSOP table on page 9.

A

B

C

D

E

F

G

H

J

K

L

M

N

P

R

1

2

3

4

5

6

7

8

Depopulated Balls

NC

Vss

NC

VssQ

V

DD

Q

DQ3

NC

VssQ

V

DD

Q

DQ2

NC

Vss

NC

DQM

NC

CK

A12

CKE

A11

A9

A8

A7

A6

A5

A4

Vss

V

DD

NC

V

DD

Q

NC

DQ0

VssQ

NC

V

DD

Q

NC

DQ1

VssQ

NC

V

DD

NC

WE#

CAS#

RAS#

NC

CS#

BA1

BA0

A0

A10

A2

A1

V

DD

A3

A

B

C

D

E

F

G

H

J

K

L

M

N

P

R

1

2

3

4

5

6

7

8

Depopulated Balls

DQ7

Vss

NC

VssQ

V

DD

Q

DQ6

DQ5

NC

VssQ

V

DD

Q

DQ4

NC

Vss

NC

DQM

NC

CK

A12

CKE

A11

A9

A8

A7

A6

A5

A4

Vss

V

DD

DQ0

V

DD

Q

NC

DQ1

VssQ

NC

DQ2

V

DD

Q

NC

DQ3

VssQ

NC

V

DD

NC

WE#

CAS#

RAS#

NC

CS#

BA1

BA0

A0

A10

A2

A1

V

DD

A3

3

256Mb: x4, x8, x16

SDRAM

54-BALL FBGA ASSIGNMENT

(Top View)

16 Meg x 16 SDRAM

8mm x 14mm “FG”

A

B

C

D

E

F

G

H

J

1

2

3

4

5

6

7

89

Depopulated Balls

Vss

DQ15

DQ14

DQ13

DQ12

DQ11

DQ10

DQ9

DQ8

NC/SV

UDQM

CLK

A12

A11

A8

A7

Vss

A5

V

SS

Q

V

DD

Q

V

SS

Q

V

DD

Q

Vss

CKE

A9

A6

A4

V

DD

Q

VssQ

V

DD

Q

V

SS

Q

V

DD

CAS#

BA0

A0

A3

DQ0

V

DD

DQ2

DQ1

DQ4

DQ3

DQ6

DQ5

LDQM

DQ7

RAS#

WE#

BA1

CS#

A1

A10

A2

V

DD

4

256Mb: x4, x8, x16

SDRAM

GENERAL DESCRIPTION

The 256Mb SDRAM is a high-speed CMOS, dynamic random-access memory containing 268,435,456 bits. It is internally configured as a quadbank DRAM with a synchronous interface (all signals are registered on the positive edge of the clock signal, CLK). Each of the x4’s 67,108,864-bit banks is organized as 8,192 rows by 2,048 columns by 4 bits. Each of the x8’s 67,108,864-bit banks is organized as 8,192 rows by 1,024 columns by 8 bits. Each of the x16’s 67,108,864-bit banks is organized as 8,192 rows by 512 columns by 16 bits.

Read and write accesses to the SDRAM are burst oriented; accesses start at a selected location and continue for a programmed number of locations in a programmed sequence. Accesses begin with the registration of an ACTIVE command, which is then followed by a READ or WRITE command. The address bits registered coincident with the ACTIVE command are used

PART NUMBER ARCHITECTURE PACKAGE

MT48LC64M4A2TG 64 Meg x 4 54-pin TSOP II MT48LC64M4A2FB* 64 Meg x 4 60-ball FBGA MT48LC32M8A2TG 32 Meg x 8 54-pin TSOP II MT48LC32M8A2FB* 32 Meg x 8 60-ball FBGA MT48LC16M16A2TG 16 Meg x 16 54-pin TSOP II MT48LC16M16A2FG 16 Meg x 16 54-ball FBGA

*Actual FBGA part marking shown on page 58.

256 Mb SDRAM PART NUMBERS

to select the bank and row to be accessed (BA0, BA1 select the bank; A0–A12 select the row). The address bits registered coincident with the READ or WRITE command are used to select the starting column location for the burst access.

The SDRAM provides for programmable READ or WRITE burst lengths of 1, 2, 4, or 8 locations, or the full page, with a burst terminate option. An auto precharge function may be enabled to provide a self-timed row precharge that is initiated at the end of the burst sequence.

The 256Mb SDRAM uses an internal pipelined architecture to achieve high-speed operation. This architecture is compatible with the 2n rule of prefetch architectures, but it also allows the column address to be changed on every clock cycle to achieve a highspeed, fully random access. Precharging one bank while accessing one of the other three banks will hide the precharge cycles and provide seamless, highspeed, random-access operation.

The 256Mb SDRAM is designed to operate in 3.3V memory systems. An auto refresh mode is provided, along with a power-saving, power-down mode. All inputs and outputs are LVTTL-compatible.

SDRAMs offer substantial advances in DRAM operating performance, including the ability to synchronously burst data at a high data rate with automatic column-address generation, the ability to interleave between internal banks to hide precharge time and the capability to randomly change column addresses on each clock cycle during a burst access.

5

256Mb: x4, x8, x16

SDRAM

TABLE OF CONTENTS

Functional Block Diagram – 64 Meg x 4 .................... 6

Functional Block Diagram – 32 Meg x 8 .................... 7

Functional Block Diagram – 16 Meg x 16 .................. 8

Pin Descriptions .......................................................... 10

Ball Descriptions .......................................................... 10

Functional Description ............................................... 12

Initialization ........................................................... 12

Register Definition ................................................ 1 2

Mode Register ................................................... 12

Burst Length ................................................ 12

Burst Type ................................................... 13

CAS Latency ................................................ 14

Operating Mode .......................................... 14

Write Burst Mode ........................................ 14

Commands ................................................................... 15

Truth Table 1 (Commands and DQM Operation) .............. 15

Command Inhibit .................................................. 16

No Operation (NOP) .............................................. 16

Load mode register ................................................ 16

Active ....................................................................... 1 6

Read ....................................................................... 1 6

Write ....................................................................... 16

Precharge ................................................................ 1 6

Auto Precharge ....................................................... 16

Burst Terminate ..................................................... 17

Auto Refresh ........................................................... 17

Self Refresh ............................................................. 1 7

Operation ..................................................................... 18

Bank/Row Activation ............................................. 18

Reads ....................................................................... 19

Writes ....................................................................... 25

Precharge ................................................................ 2 7

Power-Down ........................................................... 2 7

Clock Suspend........................................................ 28

Burst Read/Single Write ....................................... 28

Concurrent Auto Precharge ................................. 29

Truth Table 2 (CKE) ...................................................... 31

Truth Table 3 (Current State, Same Bank) ........................ 32

Truth Table 4 (Current State, Different Bank) .................. 34

Absolute Maximum Ratings ....................................... 36

DC Electrical Characteristics

and Operating Conditions ....................................... 3 6

I

DD Specifications and Conditions ............................. 36

Capacitance.................................................................. 37

Electrical Characteristics

and Recommended AC Operating Conditions ....... 37

AC Electrical Characteristics (Timing Table) ......... 38

Timing Waveforms

Initialize and Load mode register ........................ 40

Power-Down Mode ................................................ 41

Clock Suspend Mode ............................................ 42

Auto Refresh Mode ................................................ 43

Self Refresh Mode .................................................. 44

Reads

Read – Without Auto Precharge ..................... 45

Read – With Auto Precharge ........................... 46

Single Read – Without Auto Precharge ......... 47

Single Read – With Auto Precharge ............... 48

Alternating Bank Read Accesses .................... 49

Read – Full-Page Burst .................................... 50

Read – DQM Operation ................................... 51

Writes

Write – Without Auto Precharge ..................... 5 2

Write – With Auto Precharge ........................... 53

Single Write - Without Auto Precharge ......... 54

Single Write - With Auto Precharge ................ 5 5

Alternating Bank Write Accesses ................... 56

Write – Full-Page Burst .................................... 57

Write – DQM Operation ................................... 58

6

256Mb: x4, x8, x16

SDRAM

FUNCTIONAL BLOCK DIAGRAM

64 Meg x 4 SDRAM

13

RAS#

CAS#

ROW-

ADDRESS

MUX

CLK

CS#

WE#

CKE

CONTROL

LOGIC

COLUMN-

ADDRESS

COUNTER/

LATCH

MODE REGISTER

11

COMMAND

DECODE

A0-A12,

BA0, BA1

DQM

13

ADDRESS

REGISTER

15

2048

(x4)

8192

I/O GATING

DQM MASK LOGIC

READ DATA LATCH

WRITE DRIVERS

COLUMN

DECODER

BANK0

MEMORY

ARRAY

(8,192 x 2,048 x 4)

BANK0

ROW-

ADDRESS

LATCH

&

DECODER

8192

SENSE AMPLIFIERS

BANK

CONTROL

LOGIC

DQ0DQ3

4

DATA INPUT

REGISTER

DATA

OUTPUT

REGISTER

4

12

BANK1

BANK2

BANK3

13

11

2

1 1

2

REFRESH

COUNTER

7

256Mb: x4, x8, x16

SDRAM

FUNCTIONAL BLOCK DIAGRAM

32 Meg x 8 SDRAM

13

RAS#

CAS#

ROW-

ADDRESS

MUX

CLK

CS#

WE#

CKE

CONTROL

LOGIC

COLUMN-

ADDRESS

COUNTER/

LATCH

MODE REGISTER

10

COMMAND

DECODE

A0-A12,

BA0, BA1

DQM

13

ADDRESS REGISTER

15

1024

(x8)

8192

I/O GATING

DQM MASK LOGIC

READ DATA LATCH

WRITE DRIVERS

COLUMN

DECODER

BANK0

MEMORY

ARRAY

(8,192 x 1,024 x 8)

BANK0

ROW-

ADDRESS

LATCH

&

DECODER

8192

SENSE AMPLIFIERS

BANK

CONTROL

LOGIC

DQ0DQ7

8

DATA INPUT

REGISTER

DATA

OUTPUT

REGISTER

8

12

BANK1

BANK2

BANK3

13

10

2

1 1

2

REFRESH

COUNTER

8

256Mb: x4, x8, x16

SDRAM

13

RAS#

CAS#

ROW-

ADDRESS

MUX

CLK

CS#

WE#

CKE

CONTROL

LOGIC

COLUMNADDRESS

COUNTER/

LATCH

MODE REGISTER

9

COMMAND

DECODE

A0-A12,

BA0, BA1

DQML, DQMH

13

ADDRESS REGISTER

15

512

(x16)

8192

I/O GATING

DQM MASK LOGIC

READ DATA LATCH

WRITE DRIVERS

COLUMN

DECODER

BANK0

MEMORY

ARRAY

(8,192 x 512 x 16)

BANK0

ROW-

ADDRESS

LATCH

&

DECODER

8192

SENSE AMPLIFIERS

BANK

CONTROL

LOGIC

DQ0DQ15

16

DATA INPUT

REGISTER

DATA

OUTPUT

REGISTER

16

12

BANK1

BANK2

BANK3

13

9

2

2 2

2

REFRESH

COUNTER

FUNCTIONAL BLOCK DIAGRAM

16 Meg x 16 SDRAM

9

256Mb: x4, x8, x16

SDRAM

PIN DESCRIPTIONS

54-PIN TSOP SYMBOL TYPE DESCRIPTION

38 CLK Input Clock: CLK is driven by the system clock. All SDRAM input signals are

sampled on the positive edge of CLK. CLK also increments the internal burst counter and controls the output registers.

37 CKE Input Clock Enable: CKE activates (HIGH) and deactivates (LOW) the CLK signal.

Deactivating the clock provides PRECHARGE POWER-DOWN and SELF REFRESH operation (all banks idle), ACTIVE POWER-DOWN (row active in any bank) or CLOCK SUSPEND operation (burst/access in progress). CKE is synchronous except after the device enters power-down and self refresh modes, where CKE becomes asynchronous until after exiting the same mode. The input buffers, including CLK, are disabled during power-down and self refresh modes, providing low standby power. CKE may be tied HIGH.

19 CS# Input Chip Select: CS# enables (registered LOW) and disables (registered HIGH)

the command decoder. All commands are masked when CS# is registered HIGH. CS# provides for external bank selection on systems with multiple banks. CS# is considered part of the command code.

16, 17, 18 WE#, CAS#, Input Command Inputs: WE#, CAS#, and RAS# (along with CS#) define the

RAS# command being entered.

39 x4, x8: DQM Input Input/Output Mask: DQM is an input mask signal for write accesses and

an output enable signal for read accesses. Input data is masked when

15, 39 x16: DQML, DQM is sampled HIGH during a WRITE cycle. The output buffers are

DQMU placed in a High-Z state (two-clock latency) when DQM is sampled

HIGH during a READ cycle. On the x4 and x8, DQML (Pin 15) is a NC and DQMH is DQM. On the x16, DQML corresponds to DQ0DQ7 and DQMH corresponds to DQ8-DQ15. DQML and DQMH are considered same state when referenced as DQM.

20, 21 BA0, BA1 Input Bank Address Inputs: BA0 and BA1 define to which bank the ACTIVE,

READ, WRITE or PRECHARGE command is being applied.

23-26, 29-34, 22, 35, 36 A0-A12 Input Address Inputs: A0-A12 are sampled during the ACTIVE command (row-

address A0-A12) and READ/WRITE command (column-address A0-A9, A11 [x4]; A0-A9 [x8]; A0-A8 [x16]; with A10 defining auto precharge) to select one location out of the memory array in the respective bank. A10 is sampled during a PRECHARGE command to determine if all banks are to be precharged (A10 [HIGH]) or bank selected by (A10 [LOW]). The address inputs also provide the op-code during a LOAD MODE REGISTER command.

2, 4, 5, 7, 8, 10, 11, 13, 42, DQ0-DQ15 x16: I/O Data Input/Output: Data bus for x16 (4, 7, 10, 13, 42, 45, 48, and 51

44, 45, 47, 48, 50, 51, 53 are NCs for x8; and 2, 4, 7, 8, 10, 13, 42, 45, 47, 48, 51, and 53 are NCs

for x4).

2, 5, 8, 11, 44, 47, 50, 53 DQ0-DQ7 x8: I/O Data Input/Output: Data bus for x8 (2, 8, 47, 53 are NCs for x4).

5, 11, 44, 50 DQ0-DQ3 x4: I/O Data Input/Output: Data bus for x4.

40 NC – No Connect: This pin should be left unconnected.

3, 9, 43, 49 VDDQ Supply DQ Power: Isolated DQ power to the die for improved noise immunity.

6, 12, 46, 52 VSSQ Supply DQ Ground: Isolated DQ ground to the die for improved noise immunity.

1, 14, 27 V

DD

Supply Power Supply: +3.3V ±0.3V.

28, 41, 54 V

SS

Supply Ground.

10

256Mb: x4, x8, x16

SDRAM

BALL DESCRIPTIONS

54-BALL FBGA SYMBOL TYPE DESCRIPTION

F2 CLK Input Clock: CLK is driven by the system clock. All SDRAM input signals are sampled

on the positive edge of CLK. CLK also increments the internal burst counter and controls the output registers.

F3 CKE Input Clock Enable: CKE activates (HIGH) and deactivates (LOW) the CLK signal.

Deactivating the clock provides PRECHARGE POWER-DOWN and SELF REFRESH operation (all banks idle), ACTIVE POWER-DOWN (row active in any bank) or CLOCK SUSPEND operation (burst/access in progress). CKE is synchronous except after the device enters power-down and self refresh modes, where CKE becomes asynchronous until after exiting the same mode. The input buffers, including CLK, are disabled during power-down and self refresh modes, providing low standby power. CKE may be tied HIGH.

G9 CS# Input Chip Select: CS# enables (registered LOW) and disables (registered HIGH) the

command decoder. All commands are masked when CS# is registered HIGH. CS# provides for external bank selection on systems with multiple banks. CS# is considered part of the command code.

F7, F8, F9 CAS#, RAS#, Input Command Inputs: CAS#, RAS#, and WE# (along with CS#) define the

WE# command being entered.

E8, F1 LDQM, Input Input/Output Mask: DQM is sampled HIGH and is an input mask signal for

UDQM write accesses and an output enable signal for read accesses. Input data is

masked during a WRITE cycle. The output buffers are placed in a High-Z state (two-clock latency) when during a READ cycle. LDQM corresponds to DQ0–DQ7, UDQM corresponds to DQ8–DQ15. LDQM and UDQM are considered same state when referenced as DQM.

G7, G8 BA0, BA1 Input Bank Address Input(s): BA0 and BA1 define to which bank the ACTIVE, READ,

WRITE or PRECHARGE command is being applied. These pins also provide the op-code during a LOAD MODE REGISTER command

H7, H8, J8, J7, J3, J2, A0–A12 Input Address Inputs: A0–A11 are sampled during the ACTIVE command (row-

H3, H2, H1, G1, G3, H9, G2, address A0–A11) and READ/WRITE command (column-address A0–A8; with A10

defining auto precharge) to select one location out of the memory array in the respective bank. A10 is sampled during a PRECHARGE command to determine if all banks are to be precharged (A10 HIGH) or bank selected by BA0, BA1 (LOW). The address inputs also provide the op-code during a LOAD MODE REGISTER command.

A8, B9, B8, C9, C8, D9, DQ0–DQ15 I/O Data Input/Output: Data bus D8, E9, E1, D2, D1, C2,

C1, B2, B1, A2

E2, G1 NC – No Connect: These pins should be left unconnected.

G1 is a no connect for this part but may be used as A12 in future designs.

A7, B3, C7, D3 VDDQ Supply DQ Power: Provide isolated power to DQs for improved noise immunity.

A3, B7, C3, D7 VSSQ Supply DQ Ground: Provide isolated ground to DQs for improved noise immunity.

A9, E7, J9 VDD Supply Power Supply: Voltage dependant on option.

A1, E3, J1 V

SS Supply Ground.

11

256Mb: x4, x8, x16

SDRAM

BALL DESCRIPTIONS

60-BALL FBGA SYMBOL TYPE DESCRIPTION

K2 CLK Input Clock: CLK is driven by the system clock. All SDRAM input signals are sampled

on the positive edge of CLK. CLK also increments the internal burst counter and controls the output registers.

L2 CKE Input Clock Enable: CKE activates (HIGH) and deactivates (LOW) the CLK signal.

Deactivating the clock provides PRECHARGE POWER-DOWN and SELF REFRESH operation (all banks idle), ACTIVE POWER-DOWN (row active in any bank) or CLOCK SUSPEND operation (burst/access in progress). CKE is synchronous except after the device enters power-down and self refresh modes, where CKE becomes asynchronous until after exiting the same mode. The input buffers, including CLK, are disabled during power-down and self refresh modes, providing low standby power. CKE may be tied HIGH.

L8 CS# Input Chip Select: CS# enables (registered LOW) and disables (registered HIGH) the

command decoder. All commands are masked when CS# is registered HIGH. CS# provides for external bank selection on systems with multiple banks. CS# is considered part of the command code.

J8, K7, J7 CAS#, RAS#, Input Command Inputs: CAS#, RAS#, and WE# (along with CS#) define the

WE# command being entered.

J2 DQM, Input Input/Output Mask: DQM is sampled HIGH and is an input mask signal for

write accesses and an output enable signal for read accesses. Input data is masked during a WRITE cycle. The output buffers are placed in a High-Z state (two-clock latency) when during a READ cycle.

M8, M7 BA0, BA1 Input Bank Address Input(s): BA0 and BA1 define to which bank the ACTIVE, READ,

WRITE or PRECHARGE command is being applied. These pins also provide the op-code during a LOAD MODE REGISTER command

N7, P8, P7, R8, R1, P2, P1, A0–A12 Input Address Inputs: A0–A11 are sampled during the ACTIVE command (row-

N2, N1, M2, N8, M1, L1 address A0–A11) and READ/WRITE command (column-address A0–A8; with A10

defining auto precharge) to select one location out of the memory array in the respective bank. A10 is sampled during a PRECHARGE command to determine if all banks are to be precharged (A10 HIGH) or bank selected by BA0, BA1 (LOW). The address inputs also provide the op-code during a LOAD MODE REGISTER command.

C7, F7, F2, C2 DQ0–DQ3 (x4) I/O Data Input/Output: Data bus

A8, C7, D8, F7, F2, D1, C2, DQ0–DQ7 (x8) I/O Data Input/Output: Data bus

A1

A1, A8, B1, B8, D1, D2, D7, NC x4 No Connect: These pins should be left unconnected.

D8, E1, E8, G1, G2, G7, G1 is a no connect for this part but may be used as A12 in future designs.

G8, H1, H8, J1, K1, K8, L7

B1, B8, D2, D7, E1, E8, G1, NC x8 No Connect: These pins should be left unconnected.

G2, G7, G8, H1, H8, J1, K1, G1 is a no connect for this part but may be used as A12 in future designs.

K8, L7

B7, C1, E7, F1 VDDQ Supply DQ Power: Provide isolated power to DQs for improved noise immunity.

B2, C8, E2, F8 VSSQ Supply DQ Ground: Provide isolated ground to DQs for improved noise immunity.

A7, R7 VDD Supply Power Supply: Voltage dependant on option.

A2, H2, R2 V

SS Supply Ground.

12

256Mb: x4, x8, x16

SDRAM

FUNCTIONAL DESCRIPTION

In general, the 256Mb SDRAMs (16 Meg x 4 x 4 banks, 8 Meg x 8 x 4 banks and 4 Meg x 16 x 4 banks) are quadbank DRAMs that operate at 3.3V and include a synchronous interface (all signals are registered on the positive edge of the clock signal, CLK). Each of the x4’s 67,108,864-bit banks is organized as 8,192 rows by 2,048 columns by 4 bits. Each of the x8’s 67,108,864-bit banks is organized as 8,192 rows by 1,024 columns by 8 bits. Each of the x16’s 67,108,864-bit banks is organized as 8,192 rows by 512 columns by 16 bits.

Read and write accesses to the SDRAM are burst oriented; accesses start at a selected location and continue for a programmed number of locations in a programmed sequence. Accesses begin with the registration of an ACTIVE command, which is then followed by a READ or WRITE command. The address bits registered coincident with the ACTIVE command are used to select the bank and row to be accessed (BA0 and BA1 select the bank, A0–A12 select the row). The address bits (x4: A0–A9, A11; x8: A0–A9; x16: A0–A8) registered coincident with the READ or WRITE command are used to select the starting column location for the burst access.

Prior to normal operation, the SDRAM must be initialized. The following sections provide detailed information covering device initialization, register definition, command descriptions and device operation.

Initialization

SDRAMs must be powered up and initialized in a predefined manner. Operational procedures other than those specified may result in undefined operation. Once power is applied to VDD and VDDQ (simultaneously) and the clock is stable (stable clock is defined as a signal cycling within timing constraints specified for the clock pin), the SDRAM requires a 100µs delay prior to issuing any command other than a COMMAND INHIBIT or NOP. Starting at some point during this 100µs period and continuing at least through the end of this period, COMMAND INHIBIT or NOP commands should be applied.

Once the 100µs delay has been satisfied with at least one COMMAND INHIBIT or NOP command having been applied, a PRECHARGE command should be applied. All banks must then be precharged, thereby placing the device in the all banks idle state.

Once in the idle state, two AUTO REFRESH cycles must be performed. After the AUTO REFRESH cycles are complete, the SDRAM is ready for mode register programming. Because the mode register will power up in an unknown state, it should be loaded prior to applying any operational command.

Register Definition

MODE REGISTER

The mode register is used to define the specific mode of operation of the SDRAM. This definition includes the selection of a burst length, a burst type, a CAS latency, an operating mode and a write burst mode, as shown in Figure 1. The mode register is programmed via the LOAD MODE REGISTER command and will retain the stored information until it is programmed again or the device loses power.

Mode register bits M0–M2 specify the burst length, M3 specifies the type of burst (sequential or interleaved), M4–M6 specify the CAS latency, M7 and M8 specify the operating mode, M9 specifies the write burst mode, and M10 and M11 are reserved for future use. Address A12 (M12) is undefined but should be driven LOW during loading of the mode register.

The mode register must be loaded when all banks are idle, and the controller must wait the specified time before initiating the subsequent operation. Violating either of these requirements will result in unspecified operation.

Burst Length

Read and write accesses to the SDRAM are burst oriented, with the burst length being programmable, as shown in Figure 1. The burst length determines the maximum number of column locations that can be accessed for a given READ or WRITE command. Burst lengths of 1, 2, 4 or 8 locations are available for both the sequential and the interleaved burst types, and a fullpage burst is available for the sequential type. The full-page burst is used in conjunction with the BURST TERMINATE command to generate arbitrary burst lengths.

Reserved states should not be used, as unknown operation or incompatibility with future versions may result.

When a READ or WRITE command is issued, a block of columns equal to the burst length is effectively selected. All accesses for that burst take place within this block, meaning that the burst will wrap within the block if a boundary is reached. The block is uniquely selected by A1–A9, A11 (x4), A1–A9 (x8) or A1–A8 (x16) when the burst length is set to two; by A2–A9, A11 (x4), A2–A9 (x8) or A2–A8 (x16) when the burst length is set to four; and by A3–A9, A11 (x4), A3–A9 (x8) or A3–A8 (x16) when the burst length is set to eight. The remaining (least significant) address bit(s) is (are) used to select the starting location within the block. Full-page bursts wrap within the page if the boundary is reached.

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256Mb: x4, x8, x16

SDRAM

NOTE: 1. For full-page accesses: y = 2,048 (x4); y = 1,024

(x8); y = 512 (x16).

2. For a burst length of two, A1-A9, A11 (x4); A1-A9 (x8); or A1-A8 (x16) select the block-of-two burst; A0 selects the starting column within the block.

3. For a burst length of four, A2-A9, A11 (x4); A2-A9 (x8); or A2-A8 (x16) select the block-of-four burst; A0-A1 select the starting column within the block.

4. For a burst length of eight, A3-A9, A11 (x4); A3-A9 (x8); or A3-A8 (x16) select the block-of-eight burst; A0-A2 select the starting column within the block.

5. For a full-page burst, the full row is selected and A0-A9, A11 (x4); A0-A9 (x8); or A0-A8 (x16) select the starting column.

6. Whenever a boundary of the block is reached within a given sequence above, the following access wraps within the block.

7. For a burst length of one, A0-A9, A11 (x4); A0-A9 (x8); or A0-A8 (x16) select the unique column to be accessed, and mode register bit M3 is ignored.

Table 1

Burst Definition

Burst Starting Column Order of Accesses Within a Burst

Length Address Type = Sequential Type = Interleaved

A0

2

00-1 0-1 11-0 1-0

A1 A0

0 0 0-1-2-3 0-1-2-3

4

0 1 1-2-3-0 1-0-3-2 1 0 2-3-0-1 2-3-0-1 1 1 3-0-1-2 3-2-1-0

A2 A1 A0

0 0 0 0-1-2-3-4-5-6-7 0-1-2-3-4-5-6-7 0 0 1 1-2-3-4-5-6-7-0 1-0-3-2-5-4-7-6 0 1 0 2-3-4-5-6-7-0-1 2-3-0-1-6-7-4-5

8

0 1 1 3-4-5-6-7-0-1-2 3-2-1-0-7-6-5-4 1 0 0 4-5-6-7-0-1-2-3 4-5-6-7-0-1-2-3 1 0 1 5-6-7-0-1-2-3-4 5-4-7-6-1-0-3-2 1 1 0 6-7-0-1-2-3-4-5 6-7-4-5-2-3-0-1 1 1 1 7-0-1-2-3-4-5-6 7-6-5-4-3-2-1-0

Full n = A0-A11/9/8

Cn, Cn + 1, Cn + 2

Page

Cn + 3, Cn + 4...

Not Supported

(y) (location 0-y)

…Cn - 1,

Cn…

Figure 1

Mode Register Definition

Burst Type

Accesses within a given burst may be programmed to be either sequential or interleaved; this is referred to as the burst type and is selected via bit M3.

The ordering of accesses within a burst is determined by the burst length, the burst type and the starting column address, as shown in Table 1.

M3 = 0

1

2

4

8

Reserved

Full Page

M3 = 1

1

2

4

8

Reserved

Operating Mode

Standard Operation

All other states reserved

0-0-Defined

-

0

1

Burst Type

Sequential

Interleaved

CAS Latency

Reserved

2

3

Reserved

Burst Length

M0

0

1

0

1

0

1

0

1

Burst LengthCAS Latency BT

A9

A7

A6 A5 A4

A3A8A2A1A0

Mode Register (Mx)

Address Bus

9

7

654

382

1

0

M1

0

1

0

1

M2

0

1

M3

M4

0

1

0

1

0

1

0

1

M5

0

1

0

1

M6

0

1

M6-M0

M8

M7

Op Mode

A10

A11

10

11

Reserved* WB

0

1

Write Burst Mode

Programmed Burst Length

Single Location Access

M9

*Should program

M12, M11, M10 = “0, 0, 0”

to ensure compatibility

with future devices.

A12

12

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256Mb: x4, x8, x16

SDRAM

Operating Mode

The normal operating mode is selected by setting M7 and M8 to zero; the other combinations of values for M7 and M8 are reserved for future use and/or test modes. The programmed burst length applies to both READ and WRITE bursts.

Test modes and reserved states should not be used because unknown operation or incompatibility with future versions may result.

Write Burst Mode

When M9 = 0, the burst length programmed via M0-M2 applies to both READ and WRITE bursts; when M9 = 1, the programmed burst length applies to READ bursts, but write accesses are single-location (nonburst) accesses.

CAS Latency

The CAS latency is the delay, in clock cycles, between the registration of a READ command and the availability of the first piece of output data. The latency can be set to two or three clocks.

If a READ command is registered at clock edge n, and the latency is m clocks, the data will be available by clock edge n + m. The DQs will start driving as a result of the clock edge one cycle earlier (n + m - 1), and provided that the relevant access times are met, the data will be valid by clock edge n + m. For example, assuming that the clock cycle time is such that all relevant access times are met, if a READ command is registered at T0 and the latency is programmed to two clocks, the DQs will start driving after T1 and the data will be valid by T2, as shown in Figure 2. Table 2 below indicates the operating frequencies at which each CAS latency setting can be used.

Reserved states should not be used as unknown operation or incompatibility with future versions may result.

Figure 2

CAS Latency

CLK

DQ

T2T1 T3T0

CAS Latency = 3

LZ

D

OUT

t

OH

t

COMMAND

NOPREAD

t

AC

NOP

T4

NOP

DON’T CARE

UNDEFINED

CLK

DQ

T2T1 T3T0

CAS Latency = 2

LZ

D

OUT

t

OH

t

COMMAND

NOPREAD

t

AC

NOP

Table 2

CAS Latency

ALLOWABLE OPERATING

FREQUENCY (MHz)

CAS CAS

SPEED LATENCY = 2 LATENCY = 3

-7E ≤ 133 ≤ 143

-75 ≤ 100 ≤ 133

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256Mb: x4, x8, x16

SDRAM

TRUTH TABLE 1 – COMMANDS AND DQM OPERATION

(Note: 1)

NAME (FUNCTION) CS# RAS# CAS# WE# DQM ADDR DQs NOTES

COMMAND INHIBIT (NOP) H XXXX X X

NO OPERATION (NOP) L H H H X X X

ACTIVE (Select bank and activate row) L L H H X Bank/Row X 3

READ (Select bank and column, and start READ burst) L H L H L/H8Bank/Col X 4

WRITE (Select bank and column, and start WRITE burst) L H L L L/H8Bank/Col Valid 4

BURST TERMINATE L H H L X X Active

PRECHARGE (Deactivate row in bank or banks) L L H L X Code X 5

AUTO REFRESH or SELF REFRESH L L L H X X X 6, 7 (Enter self refresh mode)

LOAD MODE REGISTER L L L L X Op-Code X 2

Write Enable/Output Enable ––––L – Active 8

Write Inhibit/Output High-Z ––––H – High-Z 8

Truth Tables appear following the Operation section; these tables provide current state/next state information.

Commands

Truth Table 1 provides a quick reference of available commands. This is followed by a written description of each command. Three additional

NOTE: 1. CKE is HIGH for all commands shown except SELF REFRESH.

2. A0-A11 define the op-code written to the mode register, and A12 should be driven LOW.

3. A0-A12 provide row address, and BA0, BA1 determine which bank is made active.

4. A0-A9, A11 (x4); A0-A9 (x8); or A0-A8 (x16) provide column address; A10 HIGH enables the auto precharge feature (nonpersistent), while A10 LOW disables the auto precharge feature; BA0, BA1 determine which bank is being read from or written to.

5. A10 LOW: BA0, BA1 determine the bank being precharged. A10 HIGH: All banks precharged and BA0, BA1 are “Don’t Care.”

6. This command is AUTO REFRESH if CKE is HIGH, SELF REFRESH if CKE is LOW.

7. Internal refresh counter controls row addressing; all inputs and I/Os are “Don’t Care” except for CKE.

8. Activates or deactivates the DQs during WRITEs (zero-clock delay) and READs (two-clock delay).

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256Mb: x4, x8, x16

SDRAM

COMMAND INHIBIT

The COMMAND INHIBIT function prevents new commands from being executed by the SDRAM, regardless of whether the CLK signal is enabled. The SDRAM is effectively deselected. Operations already in progress are not affected.

NO OPERATION (NOP)

The NO OPERATION (NOP) command is used to perform a NOP to an SDRAM which is selected (CS# is LOW). This prevents unwanted commands from being registered during idle or wait states. Operations already in progress are not affected.

LOAD MODE REGISTER

The mode register is loaded via inputs A0-A11 (A12 should be driven LOW.) See mode register heading in the Register Definition section. The LOAD MODE REGISTER command can only be issued when all banks are idle, and a subsequent executable command cannot be issued until tMRD is met.

ACTIVE

The ACTIVE command is used to open (or activate) a row in a particular bank for a subsequent access. The value on the BA0, BA1 inputs selects the bank, and the address provided on inputs A0-A12 selects the row. This row remains active (or open) for accesses until a PRECHARGE command is issued to that bank. A PRECHARGE command must be issued before opening a different row in the same bank.

READ

The READ command is used to initiate a burst read access to an active row. The value on the BA0, BA1 inputs selects the bank, and the address provided on inputs A0-A9, A11 (x4), A0-A9 (x8), or A0-A8 (x16) selects the starting column location. The value on input A10 determines whether or not auto precharge is used. If auto precharge is selected, the row being accessed will be precharged at the end of the READ burst; if auto precharge is not selected, the row will remain open for subsequent accesses. Read data appears on the DQs subject to the logic level on the DQM inputs two clocks earlier. If a given DQM signal was registered HIGH, the corresponding DQs will be High-Z two clocks later; if the DQM signal was registered LOW, the DQs will provide valid data.

WRITE

The WRITE command is used to initiate a burst write access to an active row. The value on the BA0, BA1 inputs selects the bank, and the address provided on inputs A0-A9; A11 (x4); A0-A9 (x8); or A0-A8 (x16) selects the starting column location. The value on input A10 determines whether or not auto precharge is used. If auto precharge is selected, the row being accessed will be precharged at the end of the WRITE burst; if auto precharge is not selected, the row will remain open for subsequent accesses. Input data appearing on the DQs is written to the memory array subject to the DQM input logic level appearing coincident with the data. If a given DQM signal is registered LOW, the corresponding data will be written to memory; if the DQM signal is registered HIGH, the corresponding data inputs will be ignored, and a WRITE will not be executed to that byte/column location.

PRECHARGE

The PRECHARGE command is used to deactivate the open row in a particular bank or the open row in all banks. The bank(s) will be available for a subsequent row access a specified time (tRP) after the PRECHARGE command is issued. Input A10 determines whether one or all banks are to be precharged, and in the case where only one bank is to be precharged, inputs BA0, BA1 select the bank. Otherwise BA0, BA1 are treated as “Don’t Care.” Once a bank has been precharged, it is in the idle state and must be activated prior to any READ or WRITE commands being issued to that bank.

AUTO PRECHARGE

Auto precharge is a feature which performs the same individual-bank PRECHARGE function described above, without requiring an explicit command. This is accomplished by using A10 to enable auto precharge in conjunction with a specific READ or WRITE command. A PRECHARGE of the bank/row that is addressed with the READ or WRITE command is automatically performed upon completion of the READ or WRITE burst, except in the full-page burst mode, where AUTO PRECHARGE does not apply. Auto precharge is nonpersistent in that it is either enabled or disabled for each individual READ or WRITE command.

Auto precharge ensures that the precharge is initiated at the earliest valid stage within a burst. The user must not issue another command to the same bank until the precharge time (tRP) is completed. This is determined as if an explicit PRECHARGE command was issued at the earliest possible time, as described for each burst type in the Operation section of this data sheet.

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256Mb: x4, x8, x16

SDRAM

BURST TERMINATE

The BURST TERMINATE command is used to truncate either fixed-length or full-page bursts. The most recently registered READ or WRITE command prior to the BURST TERMINATE command will be truncated, as shown in the Operation section of this data sheet.

AUTO REFRESH

AUTO REFRESH is used during normal operation of the SDRAM and is analogous to CAS#-BEFORE-RAS# (CBR) REFRESH in conventional DRAMs. This command is nonpersistent, so it must be issued each time a refresh is required. All active banks must be precharged prior to issuing an AUTO REFRESH command. The AUTO REFRESH command should not be issued until the minimum tRP has been met after the PRECHARGE command as shown in the operations section.

The addressing is generated by the internal refresh controller. This makes the address bits “Don’t Care” during an AUTO REFRESH command. The 256Mb SDRAM requires 8,192 AUTO REFRESH cycles every 64ms (tREF), regardless of width option. Providing a distributed AUTO REFRESH command every 7.81µs will meet the refresh requirement and ensure that each row is refreshed. Alternatively, 8,192 AUTO REFRESH commands can be issued in a burst at the minimum cycle rate (tRFC), once every 64ms.

SELF REFRESH

The SELF REFRESH command can be used to retain data in the SDRAM, even if the rest of the system is powered down. When in the self refresh mode, the SDRAM retains data without external clocking. The SELF REFRESH command is initiated like an AUTO REFRESH command except CKE is disabled (LOW). Once the SELF REFRESH command is registered, all the inputs to the SDRAM become “Don’t Care” with the exception of CKE, which must remain LOW.

Once self refresh mode is engaged, the SDRAM provides its own internal clocking, causing it to perform its own AUTO REFRESH cycles. The SDRAM must remain in self refresh mode for a minimum period equal to

t

RAS and may remain in self refresh mode for an indefi-

nite period beyond that.

The procedure for exiting self refresh requires a sequence of commands. First, CLK must be stable (stable clock is defined as a signal cycling within timing constraints specified for the clock pin) prior to CKE going back HIGH. Once CKE is HIGH, the SDRAM must have NOP commands issued (a minimum of two clocks) for

t

XSR because time is required for the completion of any

internal refresh in progress.

Upon exiting the self refresh mode, AUTO REFRESH commands must be issued every 7.81µs or less as both SELF REFRESH and AUTO REFRESH utilize the row refresh counter.

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256Mb: x4, x8, x16

SDRAM

Operation

BANK/ROW ACTIVATION

Before any READ or WRITE commands can be issued to a bank within the SDRAM, a row in that bank must be “opened.” This is accomplished via the ACTIVE command, which selects both the bank and the row to be activated (see Figure 3).

After opening a row (issuing an ACTIVE command), a READ or WRITE command may be issued to that row, subject to the tRCD specification. tRCD (MIN) should be divided by the clock period and rounded up to the next whole number to determine the earliest clock edge after the ACTIVE command on which a READ or WRITE command can be entered. For example, a tRCD specification of 20ns with a 125 MHz clock (8ns period) results in 2.5 clocks, rounded to 3. This is reflected in Figure 4, which covers any case where 2 < tRCD (MIN)/

t

CK ≤ 3.

(The same procedure is used to convert other specification limits from time units to clock cycles.)

A subsequent ACTIVE command to a different row in the same bank can only be issued after the previous active row has been “closed” (precharged). The minimum time interval between successive ACTIVE commands to the same bank is defined by tRC.

A subsequent ACTIVE command to another bank can be issued while the first bank is being accessed, which results in a reduction of total row-access overhead. The minimum time interval between successive ACTIVE commands to different banks is defined by

t

RRD.

Figure 4

Example: Meeting tRCD (MIN) When 2 < tRCD (MIN)/tCK

<<

<

3

CLK

T2T1 T3T0

t

COMMAND

NOPACTIVE

READ or

WRITE

T4

NOP

RCD

DON’T CARE

Figure 3

Activating a Specific Row in a

Specific Bank

CS#

WE#

CAS#

RAS#

CKE

CLK

A0-A12

ROW

ADDRESS

HIGH

BA0, BA1

BANK

ADDRESS

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256Mb: x4, x8, x16

SDRAM

Upon completion of a burst, assuming no other commands have been initiated, the DQs will go High-Z. A full-page burst will continue until terminated. (At the end of the page, it will wrap to the start address and continue.)

Data from any READ burst may be truncated with a subsequent READ command, and data from a fixedlength READ burst may be immediately followed by data from a READ command. In either case, a continuous flow of data can be maintained. The first data element from the new burst follows either the last element of a completed burst or the last desired data element of a longer burst that is being truncated. The new READ command should be issued x cycles before the clock edge at which the last desired data element is valid, where x equals the CAS latency minus one.

READs

READ bursts are initiated with a READ command,

as shown in Figure 5.

The starting column and bank addresses are provided with the READ command, and auto precharge is either enabled or disabled for that burst access. If auto precharge is enabled, the row being accessed is precharged at the completion of the burst. For the generic READ commands used in the following illustrations, auto precharge is disabled.

During READ bursts, the valid data-out element from the starting column address will be available following the CAS latency after the READ command. Each subsequent data-out element will be valid by the next positive clock edge. Figure 6 shows general timing for each possible CAS latency setting.

Figure 5

READ Command

Figure 6

CAS Latency

CLK

DQ

T2T1 T3T0

CAS Latency = 3

LZ

DOUT

t

OH

t

COMMAND

NOPREAD

t

AC

NOP

T4

NOP

DON’T CARE

UNDEFINED

CLK

DQ

T2T1 T3T0

CAS Latency = 2

LZ

DOUT

t

OH

t

COMMAND

NOPREAD

t

AC

NOP

CS#

WE#

CAS#

RAS#

CKE

CLK

COLUMN ADDRESS

x4 A0–A9: x8 A0–A8: x16

A0–A9, A11:

A10

BA0,1

HIGH

ENABLE AUTO PRECHARGE

DISABLE AUTO PRECHARGE

BANK

ADDRESS

A12: x4 A11, A12: x8 A9, A11, A12: x16

MICRON MT48LC32M8A2FB-75, MT48LC64M4A2TG-7E, MT48LC16M16A2FG-75 Datasheet

Specifications and Main Features

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