Micron MT48LC2M32B2 User Manual

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Page 1

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64Mb: x32

SDRAM

SYNCHRONOUS DRAM

FEATURES

• PC100 functionality

• Fully synchronous; all signals registered on positive edge of system clock

• Internal pipelined operation; column address can be changed every clock cycle

• Internal banks for hiding row access/precharge

• Programmable burst lengths: 1, 2, 4, 8, or full page

• Auto Precharge, includes CONCURRENT AUTO PRECHARGE, and Auto Refresh Modes

• Self Refresh Mode

• 64ms, 4,096-cycle refresh (15.6µs/row)

• LVTTL-compatible inputs and outputs

• Single +3.3V ±0.3V power supply

• Supports CAS latency of 1, 2, and 3

OPTIONS MARKING

• Configuration 2 Meg x 32 (512K x 32 x 4 banks) 2M32B2

• Plastic Package - OCPL 86-pin TSOP (400 mil) TG

• Timing (Cycle Time)

5ns (200 MHz) -5

5.5ns (183 MHz) -55 6ns (166 MHz) -6 7ns (143 MHz) -7

• Operating Temperature Range Commercial (0° to +70°C) None Extended (-40°C to +85°C) IT

NOTE: 1. Off-center parting line

2. Available on -7

Part Number Example:

MT48LC2M32B2TG-7

MT48LC2M32B2 - 512K x 32 x 4 banks

For the latest data sheet, please refer to the Micron Web site: www.micron.com/sdramds

PIN ASSIGNMENT (TOP VIEW)

86-PIN TSOP

DQ0

DQ1 DQ2

DQ3 DQ4

DQ5 DQ6

DQ7

DQM0

WE# CAS# RAS#

CS#

NC BA0 BA1

A10

DQM2

DQ16

DQ17 DQ18

DQ19 DQ20

DQ21 DQ22

DQ23

1 2 3

4 5 6

7 8 9

10 11 12

13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32

33 34 35

36 37 38

39 40 41

42 43

85 84 83 82 81 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44

DQ15

DQ14 DQ13

DQ12 DQ11

DQ10 DQ9

DQ8

V DQM1

CLK CKE

A9 A8 A7 A6 A5 A4 A3

DQM3

DQ31

DQ30 DQ29

DQ28 DQ27

DQ26 DQ25

DQ24

KEY TIMING PARAMETERS

Note: The # symbol indicates signal is active LOW.

SPEED CLOCK ACCESS TIME SETUP HOLD

GRADE FREQUENCY CL = 3* TIME TIME

-5 200 MHz 4.5ns 1.5ns 1ns

-55 183 MHz 5ns 1.5ns 1ns

-6 166 MHz 5.5ns 1.5ns 1ns

-7 143 MHz 5.5ns 2ns 1ns

*CL = CAS (READ) latency

Configuration 512K x 32 x 4 banks Refresh Count 4K Row Addressing 2K (A0-A10) Bank Addressing 4 (BA0, BA1) Column Addressing 256 (A0-A7)

2 Meg x 32

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64Mb: x32

SDRAM

64Mb (x32) SDRAM PART NUMBER

PART NUMBER ARCHITECTURE

MT48LC2M32B2TG 2 Meg x 32

GENERAL DESCRIPTION

The 64Mb SDRAM is a high-speed CMOS, dynamic random-access memory containing 67,108,864-bits. It is internally configured as a quad-bank DRAM with a synchronous interface (all signals are registered on the positive edge of the clock signal, CLK). Each of the 16,777,216-bit banks is organized as 2,048 rows by 256 columns by 32 bits.

Read and write accesses to the SDRAM are burst oriented; accesses start at a selected location and continue for a programmed number of locations in a programmed sequence. Accesses begin with the registration of an ACTIVE command, which is then followed by a READ or WRITE command. The address bits registered coincident with the ACTIVE command are used to select the bank and row to be accessed (BA0, BA1 select the bank, A0-A10 select the row). The address bits registered coincident with the READ or WRITE command are used to select the starting column location for the burst access.

The SDRAM provides for programmable READ or WRITE burst lengths of 1, 2, 4, or 8 locations, or the full page, with a burst terminate option. An auto precharge function may be enabled to provide a self-timed row precharge that is initiated at the end of the burst sequence.

The 64Mb SDRAM uses an internal pipelined architecture to achieve high-speed operation. This architecture is compatible with the 2n rule of prefetch architectures, but it also allows the column address to be changed on every clock cycle to achieve a high-speed, fully random access. Precharging one bank while accessing one of the other three banks will hide the precharge cycles and provide seamless, high-speed, random-access operation.

The 64Mb SDRAM is designed to operate in 3.3V, low-power memory systems. An auto refresh mode is provided, along with a power-saving, power-down mode. All inputs and outputs are LVTTL-compatible.

SDRAMs offer substantial advances in DRAM operating performance, including the ability to synchronously burst data at a high data rate with automatic column-address generation, the ability to interleave between internal banks to hide precharge time and the capability to randomly change column addresses on each clock cycle during a burst access.

Page 3

TABLE OF CONTENTS

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SDRAM

Functional Block Diagram - 2 Meg x 32 ................. 4

Pin Descriptions ..................................................... 5

Functional Description ......................................... 6

Initialization ...................................................... 6

Mode Register ............................................... 6

Burst Length ............................................ 6

Burst Type ............................................... 7

CAS Latency ............................................ 8

Operating Mode ...................................... 8

Write Burst Mode .................................... 8

Commands ............................................................ 9

Truth Table 1 (Commands and DQM Operation) ............ 9

Command Inhibit ............................................. 10

No Operation (NOP) .......................................... 10

Load Mode Register ........................................... 10

Active ................................................................ 10

Read ................................................................ 10

Write ................................................................ 10

Precharge ........................................................... 10

Auto Precharge .................................................. 10

Burst Terminate ................................................. 11

Auto Refresh ...................................................... 11

Self Refresh ........................................................ 11

Operation ............................................................... 12

Bank/Row Activation ........................................ 12

Reads ................................................................ 13

Writes ................................................................ 19

Precharge ........................................................... 21

Power-Down ...................................................... 21

Clock Suspend .................................................. 22

Burst Read/Single Write .................................... 22

Concurrent Auto Precharge .............................. 23

Write with Auto Precharge ............................... 24

Truth Table 2 (CKE) ................................................ 25

Truth Table 3 (Current State, Same Bank) ..................... 26

Truth Table 4 (Current State, Different Bank) ................. 28

Absolute Maximum Ratings .................................. 30

DC Electrical Characteristics

and Operating Conditions ...................................... 30

DD Specifications and Conditions ......................... 30

Capacitance ............................................................ 32

AC Electrical Characteristics (Timing Table) .... 32

AC Electrical Characteristics ................................... 34

Timing Waveforms

Initialize and Load Mode Register .................... 36

Power-Down Mode .......................................... 37

Clock Suspend Mode ........................................ 38

Auto Refresh Mode ........................................... 39

Self Refresh Mode ............................................. 40

Reads

Read – Single Read ....................................... 41

Read – Without Auto Precharge ................. 42

Read – With Auto Precharge ....................... 43

Alternating Bank Read Accesses .................. 44

Read – Full-Page Burst ................................. 45

Read – DQM Operation .............................. 46

Writes

Write – Single Write ..................................... 47

Write – Without Auto Precharge ................ 48

Write – With Auto Precharge ...................... 49

Alternating Bank Write Accesses ................. 50

Write – Full-Page Burst ................................ 51

Write – DQM Operation ............................. 52

Page 4

WE#

CAS#

RAS#

CKE

CLK

CS#

CONTROL

LOGIC

DECODE

COMMAND

MODE REGISTER

REFRESH

COUNTER

FUNCTIONAL BLOCK DIAGRAM

2 Meg x 32 SDRAM

BANK2

BANK1

BANK0

ROW-

ADDRESS

MUX

BANK0

ROW-

ADDRESS

LATCH

DECODER

2048

BANK0

MEMORY

ARRAY

(2,048 x 256 x 32)

SENSE AMPLIFIERS

8192

BANK3

4 4

DATA

OUTPUT

64Mb: x32

SDRAM

DQM0DQM3

A0-A10,

BA0, BA1

ADDRESS

BANK

CONTROL

LOGIC

COLUMNADDRESS

COUNTER/

LATCH

I/O GATING

DQM MASK LOGIC

READ DATA LATCH

WRITE DRIVERS

256

(x32)

COLUMN

DECODER

DATA INPUT

DQ0- DQ31

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64Mb: x32

SDRAM

PIN DESCRIPTIONS

PIN NUMBERS SYMBOL TYPE DESCRIPTION

68 CLK Input Clock: CLK is driven by the system clock. All SDRAM input signals are

sampled on the positive edge of CLK. CLK also increments the internal burst counter and controls the output registers.

67 CKE Input Clock Enable: CKE activates (HIGH) and deactivates (LOW) the CLK signal.

Deactivating the clock provides PRECHARGE POWER-DOWN and SELF REFRESH operation (all banks idle), ACTIVE POWER-DOWN (row active in any bank) or CLOCK SUSPEND operation (burst/access in progress). CKE is synchronous except after the device enters power-down and self refresh modes, where CKE becomes asynchronous until after exiting the same mode. The input buffers, including CLK, are disabled during power-down and self refresh modes, providing low standby power. CKE may be tied HIGH.

20 CS# Input Chip Select: CS# enables (registered LOW) and disables (registered HIGH) the

command decoder. All commands are masked when CS# is registered HIGH. CS# provides for external bank selection on systems with multiple banks. CS# is considered part of the command code.

17, 18, 19 WE#, CAS#, Input Command Inputs: WE# , CAS#, and RAS# (along with CS#) define the

RAS# command being entered.

16, 71, 28, 59 DQM0- Input Input/Output Mask: DQM is sampled HIGH and is an input mask signal

DQM3 for write accesses and an output enable signal for read accesses. Input data

is masked during a WRITE cycle. The output buffers are placed in a High-Z state (two-clock latency) during a READ cycle. DQM0 corresponds to DQ0DQ7; DQM1 corresponds to DQ8-DQ15; DQM2 corresponds to DQ16-DQ23; and DQM3 corresponds to DQ24-DQ31. DQM0-DQM3 are considered same state when referenced as DQM.

22, 23 BA0, BA1 Input Bank Address Input(s): BA0 and BA1 define to which bank the ACTIVE, READ,

WRITE or PRECHARGE command is being applied.

25-27, 60-66, 24 A0-A10 Input Address Inputs: A0-A10 are sampled during the ACTIVE command (row-

address A0-A10) and READ/WRITE command (column-address A0-A7 with A10 defining auto precharge) to select one location out of the memory array in the respective bank. A10 is sampled during a PRECHARGE command to determine if all banks are to be precharged (A10 HIGH) or bank selected by BA0, BA1 (LOW). The address inputs also provide the op-code during a LOAD MODE REGISTER command.

2, 4, 5, 7, 8, 10, 11, 13, DQ0-DQ31 Input/ Data I/Os: Data bus. 74, 76, 77, 79, 80, 82, 83, Output 85, 31, 33, 34, 36, 37, 39, 40, 42, 45, 47, 48, 50, 51,

53, 54, 56

14, 21, 30, 57, 69, 70, 73 NC – No Connect: These pins should be left unconnected. Pin 70 is reserved

for SSTL reference voltage supply.

3, 9, 35, 41, 49, 55, 75, 81 VDDQ Supply DQ Power Supply: Isolated on the die for improved noise immunity.

6, 12, 32, 38, 46, 52, 78, 84 VSSQ Supply DQ Ground: Provide isolated ground to DQs for improved noise immunity.

1, 15, 29, 43 V

44, 58, 72, 86 V

Supply Power Supply: +3.3V ±0.3V. (See note 27 on page 35.)

Supply Ground.

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64Mb: x32

SDRAM

FUNCTIONAL DESCRIPTION

In general, this 64Mb SDRAM (512K x 32 x 4 banks) is a quad-bank DRAM that operates at 3.3V and includes a synchronous interface (all signals are registered on the positive edge of the clock signal, CLK). Each of the 16,777,216-bit banks is organized as 2,048 rows by 256 columns by 32-bits.

Read and write accesses to the SDRAM are burst oriented; accesses start at a selected location and continue for a programmed number of locations in a programmed sequence. Accesses begin with the registration of an ACTIVE command, which is then followed by a READ or WRITE command. The address bits registered coincident with the ACTIVE command are used to select the bank and row to be accessed (BA0 and BA1 select the bank, A0-A10 select the row). The address bits (A0-A7) registered coincident with the READ or WRITE command are used to select the starting column location for the burst access.

Prior to normal operation, the SDRAM must be initialized. The following sections provide detailed information covering device initialization, register definition, command descriptions and device operation.

Initialization

SDRAMs must be powered up and initialized in a predefined manner. Operational procedures other than those specified may result in undefined operation. Once power is applied to VDD and VDDQ (simultaneously) and the clock is stable (stable clock is defined as a signal cycling within timing constraints specified for the clock pin), the SDRAM requires a 100µs delay prior to issuing any command other than a COMMAND INHIBIT or a NOP. Starting at some point during this 100µs period and continuing at least through the end of this period, COMMAND INHIBIT or NOP commands should be applied.

Once the 100µs delay has been satisfied with at least one COMMAND INHIBIT or NOP command having been applied, a PRECHARGE command should be applied. All banks must then be precharged, thereby placing the device in the all banks idle state.

Once in the idle state, two AUTO REFRESH cycles must be performed. After the AUTO REFRESH cycles are complete, the SDRAM is ready for Mode Register programming. Because the Mode Register will power up in an unknown state, it should be loaded prior to applying any operational command.

MODE REGISTER

The Mode Register is used to define the specific mode of operation of the SDRAM. This definition includes the selection of a burst length, a burst type, a CAS latency, an operating mode and a write burst mode, as shown in Figure 1. The Mode Register is programmed via the LOAD MODE REGISTER command and will retain the stored information until it is programmed again or the device loses power.

Mode Register bits M0-M2 specify the burst length, M3 specifies the type of burst (sequential or interleaved), M4-M6 specify the CAS latency, M7 and M8 specify the operating mode, M9 specifies the write burst mode, and M10 is reserved for future use.

The Mode Register must be loaded when all banks are idle, and the controller must wait the specified time before initiating the subsequent operation. Violating either of these requirements will result in unspecified operation.

Burst Length

Read and write accesses to the SDRAM are burst oriented, with the burst length being programmable, as shown in Figure 1. The burst length determines the maximum number of column locations that can be accessed for a given READ or WRITE command. Burst lengths of 1, 2, 4, or 8 locations are available for both the sequential and the interleaved burst types, and a fullpage burst is available for the sequential type. The full-page burst is used in conjunction with the BURST TERMINATE command to generate arbitrary burst lengths.

Reserved states should not be used, as unknown operation or incompatibility with future versions may result.

When a READ or WRITE command is issued, a block of columns equal to the burst length is effectively selected. All accesses for that burst take place within this block, meaning that the burst will wrap within the block if a boundary is reached. The block is uniquely selected by A1-A7 when the burst length is set to two; by A2-A7 when the burst length is set to four; and by A3-A7 when the burst length is set to eight. The remaining (least significant) address bit(s) is (are) used to select the starting location within the block. Full-page bursts wrap within the page if the boundary is reached.

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64Mb: x32

SDRAM

Burst Type

Accesses within a given burst may be programmed to be either sequential or interleaved; this is referred to as the burst type and is selected via bit M3.

The ordering of accesses within a burst is determined by the burst length, the burst type and the starting column address, as shown in Table 1.

Figure 1

Mode Register Definition

Reserved* WB

1. *Should program

A10, BA0, and BA1= “0” to ensure compatibility with future device

Op Mode

654

0-0-Defined

A10

A3A8A2A1A0

382

Burst lengthCAS Latency BT

M1M2

000

001

010

011

100

101

110

111

M4M5M6

000

001

010

011

100

101

110

111

M6 - M0

Operating Mode

Standard operation

All other states reserved

A6 A5 A4

Address Bus

Mode Register (Mx)

Burst Length

M3 = 0

Reserved

Full Page

Burst Type

Sequential

Interleave

CAS Latency

M3 = 1

Reserved

Table 1

Burst Definition

Burst Starting Column Order of Accesses Within a Burst

Length Address Type = Sequential Type = Interleaved

A2 A1 A0

0 0 0 0-1-2-3-4-5-6-7 0-1-2-3-4-5-6-7 0 0 1 1-2-3-4-5-6-7-0 1-0-3-2-5-4-7-6 0 1 0 2-3-4-5-6-7-0-1 2-3-0-1-6-7-4-5

0 1 1 3-4-5-6-7-0-1-2 3-2-1-0-7-6-5-4 1 0 0 4-5-6-7-0-1-2-3 4-5-6-7-0-1-2-3 1 0 1 5-6-7-0-1-2-3-4 5-4-7-6-1-0-3-2 1 1 0 6-7-0-1-2-3-4-5 6-7-4-5-2-3-0-1 1 1 1 7-0-1-2-3-4-5-6 7-6-5-4-3-2-1-0

Full n = A0-A7 Page (256) (Location 0 -256)

NOTE: 1. For a burst length of two, A1-A7 select the block-

of-two burst; A0 selects the starting column within the block.

2. For a burst length of four, A2-A7 select the blockof-four burst; A0-A1 select the starting column within the block.

3. For a burst length of eight, A3-A7 select the blockof-eight burst; A0-A2 select the starting column within the block.

4. For a full-page burst, the full row is selected and A0-A7 select the starting column.

5. Whenever a boundary of the block is reached within a given sequence above, the following access wraps within the block.

6. For a burst length of one, A0-A7 select the unique column to be accessed, and mode register bit M3 is ignored.

00-1 0-1 11-0 1-0

A1 A0

0 0 0-1-2-3 0-1-2-3 0 1 1-2-3-0 1-0-3-2 1 0 2-3-0-1 2-3-0-1 1 1 3-0-1-2 3-2-1-0

Cn, Cn + 1, Cn + 2

Cn + 3, Cn + 4...

…Cn - 1,

Not Supported

Cn…

Write Burst Mode

Programmed Burst Length

Single Location Access

Page 8

CAS Latency

The CAS latency is the delay, in clock cycles, between the registration of a READ command and the availability of the first piece of output data. The latency can be set to one, two or three clocks.

If a READ command is registered at clock edge n, and the latency is m clocks, the data will be available by clock edge n + m. The DQs will start driving as a result of the clock edge one cycle earlier (n + m - 1), and provided that the relevant access times are met, the data will be valid by clock edge n + m. For example, assuming that the clock cycle time is such that all relevant access times are met, if a READ command is registered at T0 and the latency is programmed to two clocks, the DQs will start driving after T1 and the data will be valid by T2, as shown in Figure 2. Table 2 below indicates the operating frequencies at which each CAS latency setting can be used.

Figure 2

CAS Latency

64Mb: x32

SDRAM

Reserved states should not be used as unknown operation or incompatibility with future versions may result.

Operating Mode

The normal operating mode is selected by setting M7 and M8 to zero; the other combinations of values for M7 and M8 are reserved for future use and/or test modes. The programmed burst length applies to both READ and WRITE bursts.

Test modes and reserved states should not be used because unknown operation or incompatibility with future versions may result.

Write Burst Mode

When M9 = 0, the burst length programmed via M0-M2 applies to both READ and WRITE bursts; when M9 = 1, the programmed burst length applies to READ bursts, but write accesses are single-location (nonburst) accesses.

CLK

COMMAND

CLK

COMMAND

CLK

COMMAND

CAS Latency = 1

CAS Latency = 2

NOPREAD

OUT

NOPREAD

CAS Latency = 3

T2T1T0

T2T1 T3T0

NOP

T2T1 T3T0

NOP

Table 2

CAS Latency

ALLOWABLE OPERATING

FREQUENCY (MHz)

CAS CAS CAS

SPEED LATENCY = 1 LATENCY = 2 LATENCY = 3

- 5 - - ≤ 200

-55 - - ≤ 183

- 6 ≤ 50 ≤ 100 ≤ 166

- 7 ≤ 50 ≤ 100 ≤ 143

OUT

NOP

OUT

DON’T CARE

UNDEFINED

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64Mb: x32

SDRAM

Commands

Truth Table 1 provides a quick reference of available commands. This is followed by a written description of each command. Three additional Truth Tables

TRUTH TABLE 1 – COMMANDS AND DQM OPERATION

(Note: 1)

NAME (FUNCTION) CS# RAS# CAS# WE# DQM ADDR DQs NOTES

COMMAND INHIBIT (NOP) H XXXX X X

NO OPERATION (NOP) L H H H X X X

ACTIVE (Select bank and activate row) L L H H X Bank/Row X 3

READ (Select bank and column, and start READ burst) L H L H L/H8Bank/Col X 4

WRITE (Select bank and column, and start WRITE burst) L H L L L/H8Bank/Col Valid 4

BURST TERMINATE L H H L X X Active

PRECHARGE (Deactivate row in bank or banks) L L H L X Code X 5

AUTO REFRESH or SELF REFRESH L L L H X X X 6, 7 (Enter self refresh mode)

LOAD MODE REGISTER L L L L X Op-Code X 2

Write Enable/Output Enable ––––L – Active 8

Write Inhibit/Output High-Z ––––H – High-Z 8

appear following the Operation section; these tables provide current state/next state information.

NOTE: 1. CKE is HIGH for all commands shown except SELF REFRESH.

2. A0-A10 define the op-code written to the Mode Register.

3. A0-A10 provide row address, BA0 and BA1 determine which bank is made active.

4. A0-A7 provide column address; A10 HIGH enables the auto precharge feature (nonpersistent), while A10 LOW disables the auto precharge feature; BA0 and BA1 determine which bank is being read from or written to.

5. A10 LOW: BA0 and BA1 determine the bank being precharged. A10 HIGH: All banks precharged and BA0 and BA1 are “Don’t Care.”

6. This command is AUTO REFRESH if CKE is HIGH; SELF REFRESH if CKE is LOW.

7. Internal refresh counter controls row addressing; all inputs and I/Os are “Don’t Care” except for CKE.

8. Activates or deactivates the DQs during WRITEs (zero-clock delay) and READs (two-clock delay). DQM0 controls DQ0-DQ7; DQM1 controls DQ8-DQ15; DQM2 controls DQ16-DQ23; and DQM3 controls DQ24-DQ31.

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SDRAM

COMMAND INHIBIT

The COMMAND INHIBIT function prevents new commands from being executed by the SDRAM, regardless of whether the CLK signal is enabled. The SDRAM is effectively deselected. Operations already in progress are not affected.

NO OPERATION (NOP)

The NO OPERATION (NOP) command is used to perform a NOP to an SDRAM which is selected (CS# is LOW). This prevents unwanted commands from being registered during idle or wait states. Operations already in progress are not affected.

LOAD MODE REGISTER

The mode register is loaded via inputs A0-A10. See mode register heading in the Register Definition section. The LOAD MODE REGISTER command can only be issued when all banks are idle, and a subsequent executable command cannot be issued until tMRD is met.

ACTIVE

The ACTIVE command is used to open (or activate) a row in a particular bank for a subsequent access. The value on the BA0 and BA1 inputs selects the bank, and the address provided on inputs A0-A10 selects the row. This row remains active (or open) for accesses until a PRECHARGE command is issued to that bank. A PRECHARGE command must be issued before opening a different row in the same bank.

WRITE

The WRITE command is used to initiate a burst write access to an active row. The value on the BA0 and BA1 inputs selects the bank, and the address provided on inputs A0-A7 selects the starting column location. The value on input A10 determines whether or not auto precharge is used. If auto precharge is selected, the row being accessed will be precharged at the end of the WRITE burst; if auto precharge is not selected, the row will remain open for subsequent accesses. Input data appearing on the DQs is written to the memory array subject to the DQM input logic level appearing coincident with the data. If a given DQM signal is registered LOW, the corresponding data will be written to memory; if the DQM signal is registered HIGH, the corresponding data inputs will be ignored, and a WRITE will not be executed to that byte/column location.

PRECHARGE

The PRECHARGE command is used to deactivate the open row in a particular bank or the open row in all banks. The bank(s) will be available for a subsequent row access a specified time (tRP) after the PRECHARGE command is issued. Input A10 determines whether one or all banks are to be precharged, and in the case where only one bank is to be precharged, inputs BA0 and BA1 select the bank. Otherwise BA0 and BA1 are treated as “Don’t Care.” Once a bank has been precharged, it is in the idle state and must be activated prior to any READ or WRITE commands being issued to that bank.

READ

The READ command is used to initiate a burst read access to an active row. The value on the BA0 and BA1 (B1) inputs selects the bank, and the address provided on inputs A0-A7 selects the starting column location. The value on input A10 determines whether or not auto precharge is used. If auto precharge is selected, the row being accessed will be precharged at the end of the READ burst; if auto precharge is not selected, the row will remain open for subsequent accesses. Read data appears on the DQs subject to the logic level on the DQM inputs two clocks earlier. If a given DQMx signal was registered HIGH, the corresponding DQs will be High-Z two clocks later; if the DQMx signal was registered LOW, the corresponding DQs will provide valid data. DQM0 corresponds to DQ0-DQ7, DQM1 corresponds to DQ8-DQ15, DQM2 corresponds to DQ16DQ23 and DQM3 corresponds to DQ24-DQ31.

AUTO PRECHARGE

Auto precharge is a feature which performs the same individual-bank PRECHARGE function described above, without requiring an explicit command. This is accomplished by using A10 to enable auto precharge in conjunction with a specific READ or WRITE command. A PRECHARGE of the bank/row that is addressed with the READ or WRITE command is automatically performed upon completion of the READ or WRITE burst, except in the full-page burst mode, where auto precharge does not apply. Auto precharge is nonpersistent in that it is either enabled or disabled for each individual READ or WRITE command.

Auto precharge ensures that the precharge is initiated at the earliest valid stage within a burst. The user must not issue another command to the same bank until the precharge time (tRP) is completed. This is determined as if an explicit PRECHARGE command was issued at the earliest possible time, as described for each burst type in the Operation section of this data sheet.

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SDRAM

BURST TERMINATE

The BURST TERMINATE command is used to truncate either fixed-length or full-page bursts. The most recently registered READ or WRITE command prior to the BURST TERMINATE command will be truncated, as shown in the Operation section of this data sheet.

AUTO REFRESH

AUTO REFRESH is used during normal operation of the SDRAM and is analagous to CAS#-BEFORE-RAS# (CBR) REFRESH in conventional DRAMs. This command is nonpersistent, so it must be issued each time a refresh is required.

The addressing is generated by the internal refresh controller. This makes the address bits “Don’t Care” during an AUTO REFRESH command. The 64Mb SDRAM requires 4,096 AUTO REFRESH cycles every 64ms (tREF), regardless of width option. Providing a distributed AUTO REFRESH command every 15.625µs will meet the refresh requirement and ensure that each row is refreshed. Alternatively, 4,096 AUTO REFRESH commands can be issued in a burst at the minimum cycle rate (tRC), once every 64ms.

SELF REFRESH

The SELF REFRESH command can be used to retain data in the SDRAM, even if the rest of the system is powered down. When in the self refresh mode, the SDRAM retains data without external clocking. The SELF REFRESH command is initiated like an AUTO REFRESH command except CKE is disabled (LOW). Once the SELF REFRESH command is registered, all the inputs to the SDRAM become “Don’t Care” with the exception of CKE, which must remain LOW.

Once self refresh mode is engaged, the SDRAM provides its own internal clocking, causing it to perform its own AUTO REFRESH cycles. The SDRAM must remain in self refresh mode for a minimum period equal to

RAS and may remain in self refresh mode for an indefi-

nite period beyond that.

The procedure for exiting self refresh requires a sequence of commands. First, CLK must be stable (stable clock is defined as a signal cycling within timing constraints specified for the clock pin) prior to CKE going back HIGH. Once CKE is HIGH, the SDRAM must have NOP commands issued (a minimum of two clocks) for

XSR because time is required for the completion of any

internal refresh in progress.

Upon exiting SELF REFRESH mode, AUTO REFRESH commands must be issued every 15.625ms or less as both SELF REFRESH and AUTO REFRESH utililze the row refresh counter.

Page 12

64Mb: x32

CS#

WE#

CAS#

RAS#

CKE

CLK

A0–A10

ROW

ADDRESS

HIGH

BA0, BA1

BANK

ADDRESS

SDRAM

Operation

BANK/ROW ACTIVATION

Before any READ or WRITE commands can be issued to a bank within the SDRAM, a row in that bank must be “opened.” This is accomplished via the ACTIVE command, which selects both the bank and the row to be activated. See Figure 3.

After opening a row (issuing an ACTIVE command), a READ or WRITE command may be issued to that row, subject to the tRCD specification. tRCD (MIN) should be divided by the clock period and rounded up to the next whole number to determine the earliest clock edge after the ACTIVE command on which a READ or WRITE command can be issued. For example, a tRCD specification of 20ns with a 125 MHz clock (8ns period) results in 2.5 clocks, rounded to 3. This is reflected in Figure 4, which covers any case where 2 < tRCD (MIN)/tCK - 3. (The same procedure is used to convert other specification limits from time units to clock cycles.)

A subsequent ACTIVE command to a different row in the same bank can only be issued after the previous active row has been “closed” (precharged). The minimum time interval between successive ACTIVE commands to the same bank is defined by tRC.

A subsequent ACTIVE command to another bank can be issued while the first bank is being accessed, which results in a reduction of total row-access overhead. The minimum time interval between successive ACTIVE commands to different banks is defined by

RRD.

Figure 3

Activating a Specific Row in a

Specific Bank

Figure 4

Example: Meeting tRCD (MIN) When 2 < tRCD (MIN)/tCK - 3

T2T1 T3T0

CLK

COMMAND

NOPACTIVE

RCD (MIN)

RCD (MIN) +0.5 tCK

RCD (MIN) = 20ns, tCK = 8ns

RCD (MIN) x tCK

where x = number of clocks for equation to be true.

NOP

READ or

WRITE

DON’T CARE

Page 13

READs

READ bursts are initiated with a READ command, as shown in Figure 5.

The starting column and bank addresses are provided with the READ command, and auto precharge is either enabled or disabled for that burst access. If auto precharge is enabled, the row being accessed is precharged at the completion of the burst. For the generic READ commands used in the following illustrations, auto precharge is disabled.

During READ bursts, the valid data-out element from the starting column address will be available following the CAS latency after the READ command. Each subsequent data-out element will be valid by the next positive clock edge. Figure 6 shows general timing for each possible CAS latency setting.

64Mb: x32

SDRAM

Upon completion of a burst, assuming no other commands have been initiated, the DQs will go High-Z. A full-page burst will continue until terminated. (At the end of the page, it will wrap to column 0 and continue.)

Data from any READ burst may be truncated with a subsequent READ command, and data from a fixedlength READ burst may be immediately followed by data from a READ command. In either case, a continuous flow of data can be maintained. The first data element from the new burst follows either the last element of a completed burst or the last desired data element of a longer burst that is being truncated. The new READ command should be issued x cycles before the clock edge at which the last desired data element is valid, where x equals the CAS latency minus one. This is shown in Figure 7 for CAS latencies of one, two and

CLK

CKE

CS#

RAS#

CAS#

WE#

A0–A7

A8, A9

A10

BA0, 1

Figure 5

READ Command

HIGH

COLUMN ADDRESS

ENABLE AUTO PRECHARGE

DISABLE AUTO PRECHARGE

ADDRESS

BANK

CLK

COMMAND

CLK

COMMAND

CLK

COMMAND

Figure 6

CAS Latency

CAS Latency = 1

NOPREAD

CAS Latency = 2

NOPREAD

T2T1T0

NOPREAD

OUT

T2T1 T3T0

NOP

T2T1 T3T0

NOP

OUT

NOP

OUT

CAS Latency = 3

DON’T CARE

UNDEFINED

Page 14

64Mb: x32

SDRAM

three; data element n + 3 is either the last of a burst of four or the last desired of a longer burst. This 64Mb SDRAM uses a pipelined architecture and therefore does not require the 2n rule associated with a prefetch architecture. A READ command can be initiated on any

Figure 7

Consecutive READ Bursts

T2T1 T4T3 T5T0

CLK

COMMAND

ADDRESS

CLK

READ NOP NOP NOP

BANK, COL n

CAS Latency = 1

NOP

OUT

D n + 1

T2T1 T4T3 T6T5T0

clock cycle following a previous READ command. Fullspeed random read accesses can be performed to the same bank, as shown in Figure 8, or each subsequent READ may be performed to a different bank.

READ

X = 0 cycles

BANK,

COL b

OUT

D n + 2

D n + 3

OUT

COMMAND

ADDRESS

READ NOP NOP NOP NOP

BANK, COL n

CAS Latency = 2

NOP

OUT

D n + 1

T2T1 T4T3 T6T5T0

CLK

COMMAND

ADDRESS

READ NOP NOP NOP NOP

BANK, COL n

CAS Latency = 3

NOP

OUT

NOTE: Each READ command may be to either bank. DQM is LOW.

READ

X = 1 cycle

BANK,

COL b

D n + 2

READ

BANK,

COL b

OUT

n + 1

X = 2 cycles

D n + 3

OUT

n + 2

OUT

D n + 3

OUT

NOP

OUT

DON’T CARE

Page 15

CLK

64Mb: x32

SDRAM

Figure 8

Random READ Accesses

T2T1 T4T3T0

COMMAND

ADDRESS

CLK

COMMAND

ADDRESS

READ NOP

BANK, COL n

CAS Latency = 1

READ READ READ

BANK, COL a

BANK,

COL x

OUT

BANK, COL m

OUT

T2T1 T4T3 T5T0

READ NOP

BANK, COL n

READ READ READ NOP

BANK, COL a

CAS Latency = 2

BANK,

COL x

BANK, COL m

OUT

T2T1 T4T3 T6T5T0

CLK

COMMAND

ADDRESS

READ NOP NOP

BANK, COL n

READ

BANK, COL a

CAS Latency = 3

READ READ NOP

BANK,

COL x

BANK,

COL m

OUT

NOTE: Each READ command may be to either bank. DQM is LOW.

DON’T CARE

Page 16

64Mb: x32

DON’T CARE

READ NOP NOPNOP NOP

DQM

CLK

OUT

T2T1 T4T3T0

COMMAND

ADDRESS

BANK,

COL n

WRITE

DIN b

BANK, COL b

NOTE: A CAS latency of three is used for illustration. The

READ command

may be to any bank, and the WRITE command may be to any bank.

SDRAM

Data from any READ burst may be truncated with a subsequent WRITE command, and data from a fixedlength READ burst may be immediately followed by data from a WRITE command (subject to bus turnaround limitations). The WRITE burst may be initiated on the clock edge immediately following the last (or last desired) data element from the READ burst, provided that I/O contention can be avoided. In a given system design, there may be a possibility that the device driving the input data will go Low-Z before the SDRAM DQs go High-Z. In this case, at least a single-cycle delay should occur between the last read data and the WRITE command.

Figure 9

READ to WRITE

T2T1 T4T3T0

CLK

DQM

COMMAND

ADDRESS

READ NOP NOP

BANK, COL n

NOP

DOUT n

WRITE

BANK, COL b

DIN b

The DQM input is used to avoid I/O contention, as shown in Figures 9 and 10. The DQM signal must be asserted (HIGH) at least two clocks prior to the WRITE command (DQM latency is two clocks for output buffers) to suppress data-out from the READ. Once the WRITE command is registered, the DQs will go High-Z (or remain High-Z), regardless of the state of the DQM signal; provided the DQM was active on the clock just prior to the WRITE command that truncated the READ command. If not, the second WRITE will be an invalid WRITE. For example, if DQM was low during T4 in Figure 10, then the WRITEs at T5 and T7 would be valid, while the WRITE at T6 would be invalid.

The DQM signal must be de-asserted prior to the WRITE command (DQM latency is zero clocks for input buffers) to ensure that the written data is not masked. Figure 9 shows the case where the clock frequency allows for bus contention to be avoided without adding a NOP cycle, and Figure 10 shows the case where the additional NOP is needed.

Figure 10

READ to WRITE with

Extra Clock Cycle

DON’T CARE

NOTE: A CAS latency of three is used for illustration. The

command ma

be to any bank, and the WRITE command

READ

Page 17

64Mb: x32

SDRAM

A fixed-length READ burst may be followed by, or truncated with, a PRECHARGE command to the same bank (provided that auto precharge was not activated), and a full-page burst may be truncated with a PRECHARGE command to the same bank. The PRECHARGE command should be issued x cycles before the clock edge at which the last desired data element is valid, where x equals the CAS latency minus one. This is shown in Figure 11 for each possible CAS

Figure 11

READ to PRECHARGE

T2T1 T4T3 T6T5T0

CLK

COMMAND

ADDRESS

READ NOP NOP NOP NOP

BANK a,

COL n

CAS Latency = 1

NOP

OUT

n + 1

latency; data element n + 3 is either the last of a burst of four or the last desired of a longer burst. Following the PRECHARGE command, a subsequent command to the same bank cannot be issued until tRP is met. Note that part of the row precharge time is hidden during the access of the last data element(s).

In the case of a fixed-length burst being executed to completion, a PRECHARGE command issued at the optimum time (as described above) provides the same

OUT

n + 2

PRECHARGE

X = 0 cycles

BANK

(a or all)

OUT

n + 3

ACTIVE

BANK a,

ROW

CLK

COMMAND

ADDRESS

BANK a,

CLK

COMMAND

ADDRESS

BANK a,

NOTE: DQM is LOW.

T2T1 T4T3 T6T5T0

READ NOP NOP NOP NOPNOP

COL

CAS Latency = 2

T2T1 T4T3 T6T5T0

READ NOP NOP NOP NOPNOP

COL

CAS Latency = 3

PRECHARGE

X = 1 cycle

BANK

(a or all)

OUT

n + 1

OUT

n + 2

n + 3

OUT

ACTIVE

BANK a,

ROW

OUT

PRECHARGE

BANK

(a or all)

OUT

n + 1

X = 2 cycles

D n + 2

OUT

D n + 3

ACTIVE

BANK a,

ROW

OUT

DON’T CARE

Page 18

64Mb: x32

SDRAM

operation that would result from the same fixed-length burst with auto precharge. The disadvantage of the PRECHARGE command is that it requires that the command and address buses be available at the appropriate time to issue the command; the advantage of the PRECHARGE command is that it can be used to truncate fixed-length or full-page bursts.

Full-page READ bursts can be truncated with the

BURST TERMINATE command, and fixed-length READ

Figure 12

Terminating a READ Burst

T2T1 T4T3 T6T5T0

CLK

COMMAND

ADDRESS

READ NOP NOP NOP

BANK, COL n

CAS Latency = 1

NOP

OUT

D n + 1

bursts may be truncated with a BURST TERMINATE command, provided that auto precharge was not activated. The BURST TERMINATE command should be issued x cycles before the clock edge at which the last desired data element is valid, where x equals the CAS latency minus one. This is shown in Figure 12 for each possible CAS latency; data element n + 3 is the last desired data element of a longer burst.

OUT

D n + 2

BURST

TERMINATE

X = 0 cycles

OUT

D n + 3

NOP

CLK

COMMAND

ADDRESS

CLK

COMMAND

ADDRESS

T2T1 T4T3 T6T5T0

OUT

D n + 1

BURST

TERMINATE

X = 1 cycle

OUT

n + 2

OUT

n + 3

READ NOP NOP NOP

BANK, COL n

CAS Latency = 2

NOP

OUT

T2T1 T4T3 T6T5T0

OUT

BURST

TERMINATE

OUT

n + 1

X = 2 cycles

OUT

n + 2

READ NOP NOP NOP NOP

BANK, COL n

CAS Latency = 3

NOP

OUT

D n + 3

NOP

NOTE: DQM is LOW.

DON’T CARE

Page 19

WRITEs

CLK

DIN

T2T1 T3T0

COMMAND

ADDRESS

NOP NOPWRITE

n + 1

NOP

BANK,

COL n

WRITE bursts are initiated with a WRITE command,

as shown in Figure 13.

The starting column and bank addresses are provided with the WRITE command, and auto precharge is either enabled or disabled for that access. If auto precharge is enabled, the row being accessed is precharged at the completion of the burst. For the generic WRITE commands used in the following illustrations,auto precharge is disabled.

During WRITE bursts, the first valid data-in element will be registered coincident with the WRITE command. Subsequent data elements will be registered on each successive positive clock edge. Upon completion of a fixed-length burst, assuming no other commands have been initiated, the DQs will remain High-Z and any additional input data will be ignored (see Figure

14). A full-page burst will continue until terminated. (At the end of the page, it will wrap to column 0 and continue.)

Data for any WRITE burst may be truncated with a subsequent WRITE command, and data for a fixedlength WRITE burst may be immediately followed by data for a WRITE command. The new WRITE command

64Mb: x32

SDRAM

can be issued on any clock following the previous WRITE command, and the data provided coincident with the new command applies to the new command. An example is shown in Figure 15. Data n + 1 is either the last of a burst of two or the last desired of a longer burst. This 64Mb SDRAM uses a pipelined architecture and therefore does not require the 2n rule associated with a prefetch architecture. A WRITE command can be initiated on any clock cycle following a previous WRITE command. Full-speed random write accesses within a page can be performed to the same bank, as shown in Figure 16, or each subsequent WRITE may be performed to a different bank.

Figure 14

WRITE Burst

CLK

CKE

CS#

RAS#

CAS#

WE#

A0–A7

A8, A9

A10

Figure 13

WRITE Command

HIGH

COLUMN ADDRESS

ENABLE AUTO PRECHARGE

DISABLE AUTO PRECHARGE

CLK

COMMAND

ADDRESS

Figure 15

WRITE to WRITE

NOPWRITE WRITE

BANK,

COL n

n + 1

T2T1T0

BANK,

COL b

DON’T CARE

BA0, 1

BANK

ADDRESS

NOTE: DQM is LOW. Each WRITE command may

be to any bank.

Page 20

64Mb: x32

SDRAM

Data for any WRITE burst may be truncated with a subsequent READ command, and data for a fixedlength WRITE burst may be immediately followed by a READ command. Once the READ command is registered, the data inputs will be ignored, and WRITEs will not be executed. An example is shown in Figure 17. Data n + 1 is either the last of a burst of two or the last desired of a longer burst.

Data for a fixed-length WRITE burst may be followed by, or truncated with, a PRECHARGE command to the same bank (provided that auto precharge was not activated), and a full-page WRITE burst may be truncated with a PRECHARGE command to the same bank. The PRECHARGE command should be issued

WR after the clock edge at which the last desired input data element is registered. The “two-clock” write-back requires at least one clock plus time, regardless of fre-

Figure 16

Random WRITE Cycles

T2T1 T3T0

CLK

COMMAND

ADDRESS

WRITE

BANK, COL n

NOTE: Each WRITE command may be to any bank. DQM is LOW.

WRITE

BANK,

COL a

WRITE WRITE

BANK,

COL x

BANK,

COL m

DON’T CAR

quency, in auto precharge mode. In addition, when truncating a WRITE burst, the DQM signal must be used to mask input data for the clock edge prior to, and the clock edge coincident with, the PRECHARGE command. An example is shown in Figure 18. Data n + 1 is either the last of a burst of two or the last desired of a longer burst. Following the PRECHARGE command, a subsequent command to the same bank cannot be issued until tRP is met. The precharge will actually begin coincident with the clock-edge (T2 in Figure 18) on

a “one-clock” second clock on a “two-clock”

WR and sometime between the first and

WR (between T2 and T3

in Figure 18.)

In the case of a fixed-length burst being executed to completion, a PRECHARGE command issued at the optimum time (as described above) provides the same operation that would result from the same fixed-length burst with auto precharge. The disadvantage of the PRECHARGE command is that it requires that the command and address buses be available at the appropriate time to issue the command; the advantage of the PRECHARGE command is that it can be used to truncate fixed-length or full-page bursts.

Figure 18

WRITE to PRECHARGE

CLK

WR = 1 CLK (tCK > tWR)

DQM

COMMAND

T2T1 T4T3T0

NOPWRITE

PRECHARGE

NOPNOP

ACTIVE

NOP

DQM

BANK a,

COL n

BANK a,

COL n

length of two.

Figure 17

ADDRESS

WRITE to READ

T2T1 T3T0

CLK

COMMAND

BANK,

COL n

DIN

ADDRESS

NOPWRITE

n + 1

READ NOP NOP

BANK, COL b

T4 T5

NOP

DOUT

DON’T CARE

b + 1

WR = 2 CLK (when tWR > tCK)

COMMAND

ADDRESS

OUT

NOTE: DQM could remain LOW in this example if the WRITE burst is a fixed

n + 1

NOPWRITE

n + 1

BANK

(a or all)

NOP

PRECHARGE

BANK

(a or all)

BANK a,

ROW

NOPNOP

ACTIVE

BANK a,

ROW

DON’T CARE

Page 21

64Mb: x32

DON’T CARE

RAS

RCD

All banks idle

Input buffers gated off

Exit power-down mode.

()(

)

()(

)

()(

)

CKS

> t

CKS

COMMAND

NOP ACTIVE

Enter power-down mode.

NOP

CLK

CKE

()(

)

()(

)

SDRAM

Fixed-length or full-page WRITE bursts can be truncated with the BURST TERMINATE command. When truncating a WRITE burst, the input data applied coincident with the BURST TERMINATE command will be ignored. The last data written (provided that DQM is LOW at that time) will be the input data applied one clock previous to the BURST TERMINATE command. This is shown in Figure 19, where data n is the last desired data element of a longer burst.

Figure 19

Terminating a WRITE Burst

T2T1T0

CLK

COMMAND

ADDRESS

WRITE

BANK, COL n

DIN

BURST

TERMINATE

COMMAND

(ADDRESS)

(DATA)

NOTE: DQMs are LOW.

Figure 20

PRECHARGE Command

CLK

CKE

HIGH

PRECHARGE

The PRECHARGE command (Figure 20) is used to deactivate the open row in a particular bank or the open row in all banks. The bank(s) will be available for

a subsequent row access some specified time (

RP) after the PRECHARGE command is issued. Input A10 determines whether one or all banks are to be precharged, and in the case where only one bank is to be precharged, inputs BA0 and BA1 select the bank. When all banks are to be precharged, inputs BA0 and BA1 are treated as “Don’t Care.” Once a bank has been precharged, it is in the idle state and must be activated prior to any READ or WRITE commands being issued to that bank.

POWER-DOWN

Power-down occurs if CKE is registered LOW coincident with a NOP or COMMAND INHIBIT when no accesses are in progress (see Figure 21). If power-down occurs when all banks are idle, this mode is referred to as precharge power-down; if power-down occurs when there is a row active in either bank, this mode is referred to as active power-down. Entering power-down deactivates the input and output buffers, excluding CKE, for maximum power savings while in standby. The device may not remain in the power-down state longer than the refresh period (64ms) since no refresh operations are performed in this mode.

The power-down state is exited by registering a NOP or COMMAND INHIBIT and CKE HIGH at the desired clock edge (meeting

CKS).

Figure 21

Power-Down

CS#

RAS#

CAS#

WE#

A0–A9

A10

BA0, 1

All Banks

Bank Selected

BANK

ADDRESS

Page 22

CLOCK SUSPEND

The clock suspend mode occurs when a column access/burst is in progress and CKE is registered LOW. In the clock suspend mode, the internal clock is deactivated, “freezing” the synchronous logic.

For each positive clock edge on which CKE is sampled LOW, the next internal positive clock edge is suspended. Any command or data present on the input pins at the time of a suspended internal clock edge is ignored; any data present on the DQ pins remains driven; and burst counters are not incremented, as long as the clock is suspended. (See examples in Figures 22 and 23.)

64Mb: x32

SDRAM

Clock suspend mode is exited by registering CKE HIGH; the internal clock and related operation will resume on the subsequent positive clock edge.

BURST READ/SINGLE WRITE

The burst read/single write mode is entered by programming the write burst mode bit (M9) in the Mode Register to a logic 1. In this mode, all WRITE commands result in the access of a single column location (burst of one), regardless of the programmed burst length. READ commands access columns according to the programmed burst length and sequence, just as in the normal mode of operation (M9 = 0).

Figure 22

CLOCK SUSPEND During WRITE Burst

T2T1 T4T3 T5T0

CLK

CKE

INTERNAL

CLOCK

COMMAND

ADDRESS

NOP

WRITE

BANK,

COL n

n + 1

NOPNOP

n + 2

DON’T CARE

Figure 23

CLOCK SUSPEND During READ Burst

T2T1 T4T3 T6T5T0

CLK

CKE

INTERNAL

CLOCK

COMMAND

ADDRESS

READ NOP NOP NOP

BANK, COL n

NOTE: For this example, CAS latency = 2, burst length = 4 or greater, and

DQM is LOW.

NOP

OUT

D n + 1

OUT

n + 2

n + 3

DON’T CARE

OUT

Page 23

CONCURRENT AUTO PRECHARGE

An access command to (READ or WRITE) another bank while an access command with auto precharge enabled is executing is not allowed by SDRAMs, unless the SDRAM supports CONCURRENT AUTO PRECHARGE. Micron SDRAMs support CONCURRENT AUTO PRECHARGE. Four cases where CONCURRENT AUTO PRECHARGE occurs are defined below.

READ with auto precharge

1. Interrupted by a READ (with or without auto

precharge): A READ to bank m will interrupt a READ

Figure 24

READ With Auto Precharge Interrupted by a READ

T2T1 T4T3 T6T5T0

CLK

64Mb: x32

SDRAM

on bank n, CAS latency later. The PRECHARGE to bank n will begin when the READ to bank m is registered (Figure 24).

2. Interrupted by a WRITE (with or without auto precharge): A WRITE to bank m will interrupt a READ on bank n when registered. DQM should be used two clocks prior to the WRITE command to prevent bus contention. The PRECHARGE to bank n will begin when the WRITE to bank m is registered (Figure 25).

COMMAND

Internal States

BANK n

BANK m

ADDRESS

READ - AP

BANK n

Page Active READ with Burst of 4 Interrupt Burst, Precharge

Page Active READ with Burst of 4

BANK n,

COL a

CAS Latency = 3 (BANK n)

READ - AP

BANK m

BANK m,

COL d

CAS Latency = 3 (BANK m)

NOP

RP - BANK n

OUT

NOP NOPNOPNOP

OUT

a + 1

NOP

Idle

RP - BANK m

Precharge

OUT

D d + 1

Figure 25

READ With Auto Precharge Interrupted by a WRITE

COMMAND

Internal States

CLK

BANK n

BANK m

T2T1 T4T3 T6T5T0

READ - AP

BANK n

Page

READ with Burst of 4 Interrupt Burst, Precharge

Active

Page Active WRITE with Burst of 4

NOP

WRITE - AP

BANK m

RP -

BANK

NOPNOPNOPNOP

NOP

Idle

WR -

BANK

Write-Back

DQM

BANK n,

COL a

ADDRESS

CAS Latency = 3 (BANK n)

NOTE: 1. DQM is HIGH at T2 to prevent D

OUT

-a+1 from contending with DIN-d at T4.

BANK m,

COL d

OUT

d + 1

d + 2

d + 3

DON’T CARE

Page 24

WRITE WITH AUTO PRECHARGE

3. Interrupted by a READ (with or without auto precharge): A READ to bank m will interrupt a WRITE on bank n when registered, with the data-out appearing CAS latency later. The PRECHARGE to bank n will begin after tWR is met, where tWR begins when the READ to bank m is registered. The last valid WRITE to bank n will be data-in registered one clock prior to the READ to bank m (Figure 26).

Figure 26

WRITE With Auto Precharge Interrupted by a READ

T2T1 T4T3 T6T5T0

CLK

64Mb: x32

SDRAM

4. Interrupted by a WRITE (with or without auto precharge): A WRITE to bank m will interrupt a WRITE on bank n when registered. The PRECHARGE to bank n will begin after begins when the WRITE to bank m is registered. The last valid data WRITE to bank n will be data registered one clock prior to a WRITE to bank m (Figure

27).

WR is met, where tWR

COMMAND

BANK n

Internal States

BANK m

ADDRESS

NOTE: 1. DQM is LOW.

WRITE - AP

BANK n

Page Active WRITE with Burst of 4 Interrupt Burst, Write-Back Precharge

Page Active READ with Burst of 4

BANK n,

COL a

a + 1

READ - AP

BANK m

WR - BANK n

BANK m,

COL d

CAS Latency = 3 (BANK m)

NOPNOPNOPNOP

RP - BANK n

Figure 27

WRITE With Auto Precharge Interrupted by a WRITE

T2T1 T4T3 T6T5T0

CLK

COMMAND

Internal States

BANK n

BANK m

WRITE - AP

BANK n

Page Active WRITE with Burst of 4 Interrupt Burst, Write-Back Precharge

Page Active WRITE with Burst of 4

NOP

WRITE - AP

BANK m

WR - BANK n

NOP NOP

OUT

d + 1

NOPNOPNOPNOP

NOP

RP - BANK n

RP - BANK m

OUT

WR - BANK m

Write-Back

ADDRESS

BANK n,

COL a

a + 1

a + 2

NOTE: 1. DQM is LOW.

BANK m,

COL d

d + 1

d + 2

d + 3

DON’T CARE

Page 25

TRUTH TABLE 2 – CKE

(Notes: 1-4)

64Mb: x32

SDRAM

CKE

n-1

CKE

CURRENT STATE COMMAND

ACTION

L L Power-Down X Maintain Power-Down

Self Refresh X Maintain Self Refresh

Clock Suspend X Maintain Clock Suspend

L H Power-Down COMMAND INHIBIT or NOP Exit Power-Down 5

Self Refresh COMMAND INHIBIT or NOP Exit Self Refresh 6

Clock Suspend X Exit Clock Suspend 7

H L All Banks Idle COMMAND INHIBIT or NOP Power-Down Entry

All Banks Idle AUTO REFRESH Self Refresh Entry

Reading or Writing VALID Clock Suspend Entry

H H See Truth Table 3

NOTE: 1. CKEn is the logic state of CKE at clock edge n; CKE

was the state of CKE at the previous clock edge.

n-1

2. Current state is the state of the SDRAM immediately prior to clock edge n.

3. COMMANDn is the command registered at clock edge n, and ACTIONn is a result of COMMANDn.

4. All states and sequences not shown are illegal or reserved.

5. Exiting power-down at clock edge n will put the device in the all banks idle state in time for clock edge n + 1 (provided that tCKS is met).

6. Exiting self refresh at clock edge n will put the device in the all banks idle state once tXSR is met. COMMAND INHIBIT or NOP commands should be issued on any clock edges occurring during the tXSR period. A minimum of two NOP commands must be provided during tXSR period.

7. After exiting clock suspend at clock edge n, the device will resume operation and recognize the next command at clock edge n + 1.

NOTES

Page 26

64Mb: x32

SDRAM

TRUTH TABLE 3 – CURRENT STATE BANK n, COMMAND TO BANK n

(Notes: 1-6; notes appear below and on next page)

CURRENT STATE CS# RAS# CAS# WE# COMMAND (ACTION) NOTES

Any H X X X COMMAND INHIBIT (NOP/Continue previous operation)

L H H H NO OPERATION (NOP/Continue previous operation)

L L H H ACTIVE (Select and activate row)

Idle L L L H AUTO REFRESH 7

LLLLLOAD MODE REGISTER 7

L L H L PRECHARGE 11

L H L H READ (Select column and start READ burst) 10

Row Active L H L L WRITE (Select column and start WRITE burst) 10

L L H L PRECHARGE (Deactivate row in bank or banks) 8

Read L H L H READ (Select column and start new READ burst) 10

(Auto L H L L WRITE (Select column and start WRITE burst) 10

Precharge L L H L PRECHARGE (Truncate READ burst, start PRECHARGE) 8

Disabled) L H H L BURST TERMINATE 9

Write L H L H READ (Select column and start READ burst) 10

(Auto L H L L WRITE (Select column and start new WRITE burst) 10

Precharge L L H L PRECHARGE (Truncate WRITE burst, start PRECHARGE) 8

Disabled) L H H L BURST TERMINATE 9

NOTE: 1. This table applies when CKE

met (if the previous state was self refresh).

2. This table is bank-specific, except where noted, i.e., the current state is for a specific bank and the commands shown are those allowed to be issued to that bank when in that state. Exceptions are covered in the notes below.

3. Current state definitions:

Idle: The bank has been precharged, and tRP has been met.

Row Active: A row in the bank has been activated, and tRCD has been met. No data bursts/

accesses and no register accesses are in progress.

Read: A READ burst has been initiated, with auto precharge disabled, and has not yet

terminated or been terminated.

Write: A WRITE burst has been initiated, with auto precharge disabled, and has not yet

terminated or been terminated.

4. The following states must not be interrupted by a command issued to the same bank. COMMAND INHIBIT or NOP commands, or allowable commands to the other bank should be issued on any clock edge occurring during these states. Allowable commands to the other bank are determined by its current state and Truth Table 3, and according to Truth Table 4.

Precharging: Starts with registration of a PRECHARGE command and ends when tRP is met.

Once tRP is met, the bank will be in the idle state.

Row Activating: Starts with registration of an ACTIVE command and ends when tRCD is met. Once

Read w/Auto

Precharge Enabled: Starts with registration of a READ command with auto precharge enabled and

RCD is met, the bank will be in the row active state.

ends when tRP has been met. Once tRP is met, the bank will be in the idle state.

was HIGH and CKEn is HIGH (see Truth Table 2) and after tXSR has been

n-1

Page 27

NOTE (continued):

Write w/Auto

Precharge Enabled: Starts with registration of a WRITE command with auto precharge enabled and

5. The following states must not be interrupted by any executable command; COMMAND INHIBIT or NOP commands must be applied on each positive clock edge during these states.

Refreshing: Starts with registration of an AUTO REFRESH command and ends when tRC is met.

Accessing Mode

Precharging All: Starts with registration of a PRECHARGE ALL command and ends when

6. All states and sequences not shown are illegal or reserved.

7. Not bank-specific; requires that all banks are idle.

8. May or may not be bank-specific; if all banks are to be precharged, all must be in a valid state for precharging.

9. Not bank-specific; BURST TERMINATE affects the most recent READ or WRITE burst, regardless of bank.

10. READs or WRITEs listed in the Command (Action) column include READs or WRITEs with auto precharge enabled and READs or WRITEs with auto precharge disabled.

11. Does not affect the state of the bank and acts as a NOP to that bank.

64Mb: x32

SDRAM

ends when tRP has been met. Once tRP is met, the bank will be in the idle state.

Once tRC is met, the SDRAM will be in the all banks idle state.

MRD has been met. Once tMRD is met, the SDRAM will be in the all banks idle

state.

Once tRP is met, all banks will be in the idle state.

RP is met.

Page 28

64Mb: x32

SDRAM

TRUTH TABLE 4 – CURRENT STATE BANK n, COMMAND TO BANK m

(Notes: 1-6; notes appear below and on next page)

CURRENT STATE CS# RAS# CAS# WE# COMMAND (ACTION) NOTES

Any H X X X COMMAND INHIBIT (NOP/Continue previous operation)

L H H H NO OPERATION (NOP/Continue previous operation)

Idle XXXXAny Command Otherwise Allowed to Bank m

Row L L H H ACTIVE (Select and activate row)

Activating, L H L H READ (Select column and start READ burst) 7

Active, or L H L L WRITE (Select column and start WRITE burst) 7

Precharging L L H L PRECHARGE

Read L L H H ACTIVE (Select and activate row)

(Auto L H L H READ (Select column and start new READ burst) 7, 10

Precharge L H L L WRITE (Select column and start WRITE burst) 7, 11

Disabled) L L H L PRECHARGE 9

Write L L H H ACTIVE (Select and activate row)

(Auto L H L H READ (Select column and start READ burst) 7, 12

Precharge L H L L WRITE (Select column and start new WRITE burst) 7, 13

Disabled) L L H L PRECHARGE 9

Read L L H H ACTIVE (Select and activate row)

(With Auto L H L H READ (Select column and start new READ burst) 7, 8, 14

Precharge) L H L L WRITE (Select column and start WRITE burst) 7, 8, 15

L L H L PRECHARGE 9

Write L L H H ACTIVE (Select and activate row)

(With Auto L H L H READ (Select column and start READ burst) 7, 8, 16

Precharge) L H L L WRITE (Select column and start new WRITE burst) 7, 8, 17

L L H L PRECHARGE 9

NOTE: 1. This table applies when CKE

met (if the previous state was self refresh).

2. This table describes alternate bank operation, except where noted; i.e., the current state is for bank n and the commands shown are those allowed to be issued to bank m (assuming that bank m is in such a state that the given command is allowable). Exceptions are covered in the notes below.

3. Current state definitions:

Idle: The bank has been precharged, and tRP has been met.

Row Active: A row in the bank has been activated, and tRCD has been met. No data bursts/

accesses and no register accesses are in progress.

Read: A READ burst has been initiated, with auto precharge disabled, and has not yet

terminated or been terminated.

Write: A WRITE burst has been initiated, with auto precharge disabled, and has not yet

terminated or been terminated.

Read w/Auto

Precharge Enabled: Starts with registration of a READ command with auto precharge enabled, and

ends when tRP has been met. Once tRP is met, the bank will be in the idle state.

was HIGH and CKEn is HIGH (see Truth Table 2) and after tXSR has been

n-1

Page 29

NOTE (continued):

4. AUTO REFRESH, SELF REFRESH, and LOAD MODE REGISTER commands may only be issued when all banks are idle.

5. A BURST TERMINATE command cannot be issued to another bank; it applies to the bank represented by the current state only.

6. All states and sequences not shown are illegal or reserved.

7. READs or WRITEs to bank m listed in the Command (Action) column include READs or WRITEs with auto precharge enabled and READs or WRITEs with auto precharge disabled.

8. CONCURRENT AUTO PRECHARGE: Bank n will initiate the auto precharge command when its burst has been interrupted by bank m’s burst.

9. Burst in bank n continues as initiated.

10. For a READ without auto precharge interrupted by a READ (with or without auto precharge), the READ to bank m will interrupt the READ on bank n, CAS latency later (Figure 7).

11. For a READ without auto precharge interrupted by a WRITE (with or without auto precharge), the WRITE to bank m will interrupt the READ on bank n when registered (Figures 9 and 10). DQM should be used one clock prior to the WRITE command to prevent bus contention.

12. For a WRITE without auto precharge interrupted by a READ (with or without auto precharge), the READ to bank m will interrupt the WRITE on bank n when registered (Figure 17), with the data-out appearing CAS latency later. The last valid WRITE to bank n will be data-in registered one clock prior to the READ to bank m.

13. For a WRITE without auto precharge interrupted by a WRITE (with or without auto precharge), the WRITE to bank m will interrupt the WRITE on bank n when registered (Figure 15). The last valid WRITE to bank n will be data-in registered one clock prior to the READ to bank m.

14. For a READ with auto precharge interrupted by a READ (with or without auto precharge), the READ to bank m will interrupt the READ on bank n, CAS latency later. The PRECHARGE to bank n will begin when the READ to bank m is registered (Figure 24).

15. For a READ with auto precharge interrupted by a WRITE (with or without auto precharge), the WRITE to bank m will interrupt the READ on bank n when registered. DQM should be used two clocks prior to the WRITE command to prevent bus contention. The PRECHARGE to bank n will begin when the WRITE to bank m is registered (Figure 25).

16. For a WRITE with auto precharge interrupted by a READ (with or without auto precharge), the READ to bank m will interrupt the WRITE on bank n when registered, with the data-out appearing CAS latency later. The PRECHARGE to bank n will begin after tWR is met, where tWR begins when the READ to bank m is registered. The last valid WRITE to bank n will be data-in registered one clock prior to the READ to bank m (Figure 26).

17. For a WRITE with auto precharge interrupted by a WRITE (with or without auto precharge), the WRITE to bank m will interrupt the WRITE on bank n when registered. The PRECHARGE to bank n will begin after tWR is met, where tWR begins when the WRITE to bank m is registered. The last valid WRITE to bank n will be data registered one clock prior to the WRITE to bank m (Figure 27).

64Mb: x32

SDRAM

Page 30

64Mb: x32

SDRAM

ABSOLUTE MAXIMUM RATINGS*

Voltage on VDD, VDDQ Supply

Relative to VSS .............................................. -1V to +4.6V

Voltage on Inputs, NC or I/O Pins

Relative to V Operating Temperature, T

Extended Temperature .......................... -40°C to +85°C

Storage Temperature (plastic) ............ -55°C to +150°C

Power Dissipation ........................................................ 1W

SS .............................................. -1V to +4.6V

............................

0°C to +70°C

*Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only, and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability.

DC ELECTRICAL CHARACTERISTICS AND OPERATING CONDITIONS

(Notes: 1, 6, 27; notes appear on page 35) (VDD, VDDQ = +3.3V ±0.3V)

PARAMETER/CONDITION SYMBOL MIN MAX UNITS NOTES

SUPPLY VOLTAGE VDD, VDDQ 3 3.6 V 27

INPUT HIGH VOLTAGE: Logic 1; All inputs VIH 2VDD + 0.3 V 22

INPUT LOW VOLTAGE: Logic 0; All inputs VIL -0.3 0.8 V 22

INPUT LEAKAGE CURRENT: Any input 0V ≤ VIN ≤ VDD II -5 5 µA (All other pins not under test = 0V)

OUTPUT LEAKAGE CURRENT: DQs are disabled; 0V ≤ VOUT ≤ VDDQIOZ -5 5 µA

OUTPUT LEVELS: VOH 2.4 – V Output High Voltage (IOUT = -4mA) Output Low Voltage (IOUT = 4mA) VOL –0.4V

Page 31

64Mb: x32

SDRAM

IDD SPECIFICATIONS AND CONDITIONS

(Notes: 1, 6, 11, 13, 27; notes appear on page 35) (VDD, VDDQ = +3.3V ±0.3V)

MAX

PARAMETER/CONDITION SYMBOL -6 -7 UNITS NOTES

OPERATING CURRENT: Active Mode; IDD1 150 130 mA 3, 18, Burst = 2; READ or WRITE; tRC = tRC (MIN); 19, 26 CAS latency = 3

STANDBY CURRENT: Power-Down Mode; IDD2 22mA CKE = LOW; All banks idle

STANDBY CURRENT: Active Mode; CS# = HIGH; I CKE = HIGH; All banks active after

RCD met; 19, 26

No accesses in progress

OPERATING CURRENT: Burst Mode; Continuous burst; IDD4 180 160 mA 3, 18, READ or WRITE; All banks active, 19, 26 CAS latency = 3

AUTO REFRESH CURRENT:

RFC = tRFC (MIN) IDD5 225 225 mA 3, 12,

CAS latency = 3; CKE, CS# = HIGH 18, 19,

SELF REFRESH CURRENT: CKE ≤ 0.2V IDD6 22mA4

DD3 60 50 mA 3, 12,

26, 29

IDD SPECIFICATIONS AND CONDITIONS

(Notes: 1, 6, 11, 13, 27; notes appear on page 35) (VDD, VDDQ = +3.3V ±0.3V)

MAX

PARAMETER/CONDITION SYMBOL -5 -55 UNITS NOTES

OPERATING CURRENT: Active Mode; IDD1 200 190 mA 3, 18, Burst = 2; READ or WRITE; tRC = tRC (MIN); 19, 26 CAS latency = 3

STANDBY CURRENT: Power-Down Mode; IDD2 22mA CKE = LOW; All banks idle

STANDBY CURRENT: Active Mode; CS# = HIGH; IDD3 80 70 mA 3, 12, CKE = HIGH; All banks active after tRCD met;

19, 26

No accesses in progress

OPERATING CURRENT: Burst Mode; Continuous burst; IDD4 280 260 mA 3, 18, READ or WRITE; All banks active, 19, 26 CAS latency = 3

AUTO REFRESH CURRENT: CAS latency = 3; CKE, CS# = HIGH 18, 19,

SELF REFRESH CURRENT: CKE ≤ 0.2V IDD6 22mA4

RFC = tRFC (MIN) IDD5 225 225 mA 3, 12,

26, 29

Page 32

64Mb: x32

SDRAM

CAPACITANCE

(Note: 2; notes appear on page 35)

PARAMETER SYMBOL MIN MAX UNITS

Input Capacitance: CLK CI1 2.5 4.0 pF

Input Capacitance: All other input-only pins CI2 2.5 4.0 pF

Input/Output Capacitance: DQs CIO 4.0 6.5 p F

ELECTRICAL CHARACTERISTICS AND RECOMMENDED AC OPERATING CONDITIONS

(Notes: 5, 6, 8, 9, 11; notes appear on page 35)

AC CHARACTERISTICS -5 -55 PARAMETER SYMBOL MIN MAX MIN MAX UNITS NOTES

Access time from CLK CL = 3 (pos. edge) CL = 2

CL = 1 Address hold time Address setup time CLK high-level width CLK low-level width Clock cycle time CL = 3

CL = 2

CL = 1 CKE hold time CKE setup time CS#, RAS#, CAS#, WE#, DQM hold time CS#, RAS#, CAS#, WE#, DQM setup time Data-in hold time Data-in setup time Data-out high-impedance time CL = 3

CL = 2

CL = 1 Data-out low-impedance time Data-out hold time ACTIVE to PRECHARGE command ACTIVE to ACTIVE command period AUTO REFRESH period ACTIVE to READ or WRITE delay Refresh period (4,096 rows) PRECHARGE command period ACTIVE bank a to ACTIVE bank b command Transition time WRITE recovery time Exit SELF REFRESH to ACTIVE command

AC (3) 4.5 5 ns

AC (2) - - ns

AC (1) - - ns

AH 1 1 ns

AS 1.5 1.5 ns

CH 2 2 ns

CL 2 2 ns

CK (3) 5 5.5 ns 23

CK (2) - - ns 23

CK (1) - - ns 23

CKH 1 1 ns

CKS 1.5 1.5 ns

CMH 1 1 ns

CMS 1.5 1.5 ns

DH 1 1 ns

DS 1.5 1.5 ns

HZ (3) 4.5 5 ns 10

HZ (2) - - ns 10

HZ (1) - - ns 10

LZ 1 1 ns

OH 1.5 2 ns

RAS 38.7 120k 38.7 120k ns

RC 55 55 ns

RFC 60 60 ns

RCD 15 16.5 ns

REF 64 64 ms

RP 15 16.5 ns

RRD 10 11 ns 25

T 0.3 1.2 0.3 1.2 ns 7

WR 2 2

XSR 55 55 ns 20

CK 24

Page 33

64Mb: x32

SDRAM

ELECTRICAL CHARACTERISTICS AND RECOMMENDED AC OPERATING CONDITIONS

(Notes: 5, 6, 8, 9, 11; notes appear on page 35)

AC CHARACTERISTICS -6 -7 PARAMETER SYMBOL MIN MAX MIN MAX UNITS NOTES

Access time from CLK CL = 3 (pos. edge) CL = 2

CL = 1 Address hold time Address setup time CLK high-level width CLK low-level width Clock cycle time CL = 3

CL = 2

CL = 1 CKE hold time CKE setup time CS#, RAS#, CAS#, WE#, DQM hold time CS#, RAS#, CAS#, WE#, DQM setup time Data-in hold time Data-in setup time Data-out high-impedance time CL = 3

CL = 2

Exit SELF REFRESH to ACTIVE command

AC (3) 5. 5 5.5 ns

AC (2) 7. 5 8 ns

AC (1) 17 17 ns

AH 1 1 ns

AS 1.5 2 ns

CH 2.5 2.75 ns

CL 2.5 2.75 ns

CK (3) 6 7 ns 23

CK (2) 10 10 ns 23

CK (1) 20 20 ns 23

CKH 1 1 ns

CKS 1.5 2 ns

CMH 1 1 ns

CMS 1.5 2 ns

DH 1 1 ns

DS 1.5 2 ns

HZ (3) 5.5 5.5 ns 10

HZ (2) 7.5 8 ns 10

HZ (1) 17 17 ns 10

LZ 1 1 ns

OH 2 2.5 ns

RAS 42 120k 42 120k ns

RC 60 70 ns

RFC 60 70 ns

RCD 18 20 ns

REF 64 64 ms

RP 18 20 ns

RRD 12 14 ns 25

T 0.3 1.2 0.3 1.2 ns 7

WR 1CLK+ 1CLK+

CK 24

6ns 7ns

12ns 14ns ns 28

XSR 70 70 ns 20

Page 34

AC FUNCTIONAL CHARACTERISTICS

(Notes: 5, 6, 7, 8, 9, 11; notes appear on page 35)

64Mb: x32

SDRAM

PARAMETER SYMBOL - 5 -5 5 -6 -7 UNITS NOTES

READ/WRITE command to READ/WRITE command CKE to clock disable or power-down entry mode CKE to clock enable or power-down exit setup mode DQM to input data delay DQM to data mask during WRITEs DQM to data high-impedance during READs WRITE command to input data delay Data-in to ACTIVE command CL = 3

CL = 2

CL = 1 Data-in to PRECHARGE command Last data-in to burst STOP command Last data-in to new READ/WRITE command Last data-in to PRECHARGE command LOAD MODE REGISTER command to ACTIVE or REFRESH command Data-out to high-impedance from PRECHARGE command CL = 3

CL = 2

CL = 1

CCD 1111tCK 17

CKED 1111tCK 14

PED 1111tCK 14

DQD 0000tCK 17

DQM 0000tCK 17

DQZ 2222tCK 17

DWD 0000tCK 17

DAL (3) 5555tCK 15, 21

DAL (2) - - 4 4

DAL (1) - - 3 3

DPL 2222tCK 16, 21

BDL 1111tCK 17

CDL 1111tCK 17

RDL 2222tCK 16, 21

MRD 2222tCK 26

ROH (3) 3333tCK 17

ROH (2) - - 2 2

ROH (1) - - – 1

CK 15, 21

CK 17

Page 35

NOTES

1. All voltages referenced to VSS.

2. This parameter is sampled. VDD, VDDQ = +3.3V; f = 1 MHz, TA = 25°C; pin under test biased at 1.4V. AC can range from 0pF to 6pF.

3. IDD is dependent on output loading and cycle rates. Specified values are obtained with minimum cycle time and the outputs open.

4. Enables on-chip refresh and address counters.

5. The minimum specifications are used only to indicate cycle time at which proper operation over the full temperature range (0°C ≤ TA ≤ +70°C and

-40°C ≤ TA ≤ +85°C for IT parts) is ensured.

6. An initial pause of 100µs is required after powerup, followed by two AUTO REFRESH commands, before proper device operation is ensured. (VDD and VDDQ must be powered up simultaneously. VSS and VSSQ must be at same potential.) The two AUTO REFRESH command wake-ups should be repeated any time the tREF refresh requirement is exceeded.

7. AC characteristics assume tT = 1ns.

8. In addition to meeting the transition rate specification, the clock and CKE must transit between VIH and VIL (or between VIL and VIH) in a monotonic manner.

30p

9. Outputs measured at 1.5V with equivalent load:

10.tHZ defines the time at which the output achieves the open circuit condition; it is not a reference to VOH or VOL. The last valid data element will meet

OH before going High-Z.

11. AC timing and IDD tests have VIL = .25 and VIH = 2.75, with timing referenced to 1.5V crossover point.

12. Other input signals are allowed to transition no more than once in any two-clock period and are otherwise at valid VIH or VIL levels.

64Mb: x32

SDRAM

13. IDD specifications are tested after the device is properly initialized.

14. Timing actually specified by tCKS; clock(s) specified as a reference only at minimum cycle rate.

15. Timing actually specified by tWR plus tRP; clock(s) specified as a reference only at minimum cycle rate.

16. Timing actually specified by tWR.

17. Required clocks are specified by JEDEC functionality and are not dependent on any timing parameter.

18. The IDD current will decrease as the CAS latency is reduced. This is due to the fact that the maximum cycle rate is slower as the CAS latency is reduced.

19. Address transitions average one transition every two clocks.

20. CLK must be toggled a minimum of two times during this period.

21. Based on tCK = 143 MHz for -7, 166 MHz for -6, 183 MHz for -55, and 200 MHz for -5.

22. VIH overshoot: VIH(MAX) = VDDQ + 1.2V for a pulse width ≤ 3ns, and the pulse width cannot be greater than one third of the cycle rate. VIL undershoot: VIL(MIN) = -1.2V for a pulse width ≤ 3ns, and the pulse width cannot be greater than one third of the cycle rate.

23. The clock frequency must remain constant during access or precharge states (READ, WRITE, including tWR, and PRECHARGE commands). CKE may be used to reduce the data rate.

24. Auto precharge mode only.

25. JEDEC and PC100 specify three clocks.

26.tCK = 7ns for -7, 6ns for -6, 5.5ns for -5.5, and 5ns for -5.

27. VDD(MIN) = 3.135V for -6, -55, and -5 speed grades.

28. Check factory for availability of specially screened devices having tWR = 10ns. tWR = 1 tCK for 100 MHz and slower (tCK = 10ns and higher) in manual precharge.

Page 36

CLK

CKE

COMMAND

64Mb: x32

SDRAM

INITIALIZE AND LOAD MODE REGISTER

T0 T1 Tn + 1 To + 1 Tp + 1 Tp + 2 Tp + 3

()(

)

CKS

()(

)

()(

)

CMS

()(

)

()(

NOP

)

CKH

CMH

CMS

PRECHARGE NOP

CMH

()(

)

()(

)

()(

)

()(

)

()(

)

()(

)

CMS

CMH

AUTO

REFRESH

()(

)

()(

)

()(

)

()(

)

()(

)

AUTO

REFRESH

()(

)

()(

)

()(

)

()(

)

()(

)

LOAD MODE

NOP

ACTIVENOP NOPNOP

()(

A10

)

()(

)

()(

)

()(

)

()(

)

()(

)

()(

)

()(

)

()(

)

T = 100µs

(MIN)

High-Z

DQM 0-3

A0-A9

BA0, BA1

Power-up: V

and

CK stable

TIMING PARAMETERS

ALL BANKS

SINGLE BANK

ALL

BANKS

Precharge all banks

RFC

()(

)

()(

)

()(

)

()(

)

()(

)

()(

)

()(

)

()(

)

AUTO REFRESH

()(

)

()(

)

()(

)

()(

)

()(

)

()(

)

()(

)

()(

)

()(

)

AUTO REFRESH

RFC

()(

)

()(

)

()(

)

()(

)

()(

)

()(

)

()(

)

()(

)

CODE

Program Mode Register

MRD

ROW

BANK

1, 2, 5

DON’T CARE

UNDEFINED

-5 -6 -7

SYMBOL* M IN M AX MIN M AX MIN MAX UNITS

AH111ns

AS 1.5 1.5 2 ns

CH 2 2.5 2.75 ns

CL 2 2.5 2.75 ns

CLK (3) 5 6 7 ns

CLK (2) 10 10 ns

CLK (1) 20 20 ns

SYMBOL* MIN MAX MIN MAX MIN MAX UNITS

CKH 1 1 1 ns

CKS 1.5 1.5 2 ns

CMH111ns

CM S 1.5 1.5 2 n s

MRD222tCK

R FC 60 60 70 n s

RP 15 18 20 n s

-5 -6 -7

*CAS latency indicated in parentheses.

NOTE: 1. The Mode Register may be loaded prior to the AUTO REFRESH cycles if desired.

2. Outputs are guaranteed High-Z after command is issued.

Page 37

64Mb: x32

SDRAM

CLK

CKE

COMMAND

DQM 0-3

A0-A9

A10

BA0, BA1

Precharge all

active banks

POWER-DOWN MODE

T0 T1 T2 Tn + 1 Tn + 2

CKS

CMH

CMS

PRECHARGE NOP NOP ACTIVENOP

ALL BANKS

SINGLE BANK

BANK(S)

High-Z

CKH

Two clock cycles

CKS

Input buffers gated off while in

()(

)

()(

)

()(

)

()(

)

()(

)

()(

)

()(

)

()(

)

()(

)

()(

)

()(

)

()(

)

()(

)

()(

)

CKS

power-down mode All banks idle, enter power-down mode

Exit power-down mode

All banks idle

ROW

BANK

DON’T CARE

UNDEFINED

TIMING PARAMETERS

-5 -6 -7

SYMBOL* MIN MAX MIN MAX MIN MAX UNITS

AH111ns

AS 1.5 1.5 2 ns

CH 2 2.5 2.75 ns

CL 2 2.5 2.75 ns

CK (3) 5 6 7 ns

CK (2) 10 10 ns

SYMBOL* MIN MAX MIN MAX MIN MAX UNITS

CK (1) 20 20 ns

CKH 1 1 1 ns

CKS 1.5 1.5 2 ns

CMH111ns

CM S 1.5 1.5 2 n s

*CAS latency indicated in parentheses.

NOTE: 1. Violating refresh requirements during power-down may result in a loss of data.

-5 -6 -7

Page 38

64Mb: x32

SDRAM

CLK

CKE

COMMAND

DQM0-3

A0-A9

A10

BA0, BA1

CLOCK SUSPEND MODE

T0 T1 T2 T3 T4 T5 T6 T7 T8 T9

CKS

CMS

COLUMN m

BANK

CKH

CMH

CMS

CMH

CKStCKH

OUT

m + 1

NOPNOP NOP NOPNOPREAD WRITE

COLUMN e

BANK

OUT

NOP

OUT

e + 1

TIMING PARAMETERS

-5 -6 -7

SYMBOL* MIN MAX MIN MAX MIN MAX UNITS

AC (3) 4.5 5.5 5.5 n s

AC (2) 7.5 8 ns

AC (1) 17 17 ns

AH111ns

AS 1.5 1.5 2 ns

CH 2 2.5 2.75 ns

CL 2 2.5 2.75 ns

CK (3) 5 6 7 ns

CK (2) – 10 10 ns

CK (1) – 20 20 ns

CKH 1 1 1 ns

*CAS latency indicated in parentheses.

DON’T CARE

UNDEFINED

-5 -6 -7

SYMBOL* MIN MAX MIN MAX MIN MAX UNITS

CKS 1.5 1.5 2 ns

CMH111ns

CM S 1.5 1.5 2 n s

DH111ns

DS 1.5 1.5 2 n s

HZ (3 ) 4.5 5.5 5.5 n s

HZ (2) – 7.5 8 ns

HZ (1) – 17 17 ns

LZ111ns

OH 1.5 2 2.5 ns

NOTE: 1. For this example, the burst length = 2, the CAS latency = 3, and auto precharge is disabled.

2. A8 and A9 = “Don’t Care.”

Page 39

AUTO REFRESH MODE

64Mb: x32

SDRAM

CLK

CKE

COMMAND

DQM 0–3

A0–A9

A10

BA0, BA1

T0 T1 T2 Tn + 1 To + 1

CKS

CMS

ALL BANKS

SINGLE BANK

BANK(S)

CKH

CMH

NOP

AUTO

REFRESH

()(

)

()(

)

()(

)

()(

)

()(

)

()(

)

()(

)

()(

)

()(

)

()(

)

()(

)

()(

)

()(

)

AUTO

REFRESH

()(

)

()(

)

()(

)

()(

)

NOPNOP

NOPNOPPRECHARGE

()(

)

()(

)

()(

)

()(

)

()(

)

()(

)

()(

)

()(

)

()(

)

ACTIVE

ROW

BANK

High-Z

Precharge all

active banks

RFC

()(

)

RFC

()(

)

UNDEFINEDDON’T CARE

DON’T CARE

TIMING PARAMETERS

-5 -6 -7

SYMBOL* MIN MAX MIN MAX MIN MAX UNITS

AH111ns

AS 1.5 1.5 2 ns

CH 2 2.5 2.75 ns

CL 2 2.5 2.75 ns

CK (3) 5 6 7 ns

CK (2) 10 10 ns

CK (1) 20 20 ns

SYMBOL* MIN MAX MIN MAX MIN MAX UNITS

CKH 1 1 1 ns

CKS 1.5 1.5 2 ns

CMH111ns

CM S 1.5 1.5 2 n s

R FC 60 60 70 n s

RP 15 18 20 n s

*CAS latency indicated in parentheses.

-5 -6 -7

Page 40

CLK

CKE

COMMAND

DQM 0-3

SELF REFRESH MODE

T0 T1 T2 Tn + 1 To + 1 To + 2

CKH

CKS

CMS

CMH

PRECHARGE NOP NOP

CKS

AUTO

REFRESH

> t

RAS

()(

)

()(

)

()(

)

()(

)

()(

)

()(

)

()(

)

()(

)

()(

)

()(

)

()(

)

CKS

()(

)

()(

)

()(

)

()(

)

64Mb: x32

SDRAM

AUTO

REFRESH

A0-A9

ALL BANKS

A10

SINGLE BANK

BA0, BA1

BANK(S)

High-Z

Precharge all

active banks

TIMING PARAMETERS

()(

)

()(

)

()(

)

()(

)

()(

)

()(

)

()(

Enter self refresh mode

)

Exit self refresh mode

(Restart refresh time base)

XSR

()(

)

()(

)

()(

)

()(

)

()(

)

()(

)

()(

)

DON’T CARE

CLK stable prior to exiting

self refresh mode

UNDEFINED

-5 -6 -7

SYMBOL* MIN MAX MIN MAX MIN MAX UNITS

AH111ns

AS 1.5 1.5 2 ns

CH 2 2.5 2.75 ns

CL 2 2.5 2.75 ns

CK (3) 5 6 7 ns

CK (2) 10 10 ns

CK (1) 20 20 ns

SYMBOL* MIN MAX MIN MAX MIN MAX UNITS

CKH 1 1 1 ns

CKS 1.5 1.5 2 ns

CMH111ns

CM S 1.5 1.5 2 n s

RAS 38.7 120,000 42 120,000 42 120,000 ns

RP 15 18 20 n s

XS R 55 70 70 n s

-5 -6 -7

*CAS latency indicated in parentheses.

Page 41

64Mb: x32

SDRAM

CLK

CKE

COMMAND

DQM /

DQML, DQMH

A0-A9

A10

BA0, BA1

SINGLE READ

T0 T1 T2 T4T3 T5

CKS

CMS

ROW

BANK

CKH

CMH

RCD

RAS

CMS

COLUMN

DISABLE AUTO PRECHARGE

CMH

BANK BANK BANK

CAS Latency

PRECHARGEACTIVE NOP READ NOP ACTIVE

ALL BANKS

SINGLE BANK

DOUT

ROW

DON’T CARE

TIMING PARAMETERS

-5 -6 -7

SYMBOL* MIN MAX MIN MAX MIN MAX UNITS

AC (3) 4.5 5.5 5.5 n s

AC (2) - 7.5 8 ns

AC (1) - 17 17 ns

AH111ns

AS 1.5 1.5 2 ns

CH 2 2.5 2.75 ns

CL 2 2.5 2.75 ns

CK (3) 5 6 7 ns

CK (2) - 10 10 ns

CK (1) - 20 20 ns

CKH 1 1 1 ns

CKS 1.5 1.5 2 ns

SYMBOL* MIN MAX MIN MAX MIN MAX UNITS

CMH111ns

CM S 1.5 1.5 2 n s

HZ (3 ) 4.5 5.5 5.5 n s

HZ (2) - 7.5 8 ns

HZ (1) - 17 17 ns

LZ111ns

OH 1.5 2 2.5 ns

RAS 38.7 120,000 42 120,000 42 120,000 ns

RC 55 60 70 n s

R CD 15 18 20 n s

RP 15 18 20 n s

*CAS latency indicated in parentheses.

NOTE: 1. For this example, the burst length = 1, the CAS latency = 2, and the READ burst is followed by a “manual” PRECHARGE.

2. A8, A9 = “Don’t Care.”

-5 -6 -7

Page 42

64Mb: x32

SDRAM

CLK

CKE

COMMAND

DQM 0-3

A0-A9

A10

BA0, BA1

READ – WITHOUT AUTO PRECHARGE

T0 T1 T2 T4T3 T5 T6 T7 T8

CKS

CMS

ROW

BANK

CKH

CMH

RCD

RAS

CMS

COLUMN m

DISABLE AUTO PRECHARGE

CMH

BANK BANK BANK

OUT

m + 1

CAS Latency

PRECHARGENOPNOP NOPACTIVE NOP READ NOP ACTIVE

ALL BANKS

SINGLE BANK

OUT

m + 2D

OUT

m + 3

ROW

TIMING PARAMETERS

-5 -6 -7

SYMBOL* MIN MAX MIN MAX MIN MAX UNITS

AC (3) 4.5 5.5 5.5 n s

AC (2) - 7.5 8 ns

AC (1) - 17 17 ns

AH111ns

AS 1.5 1.5 2 ns

CH 2 2.5 2.75 ns

CL 2 2.5 2.75 ns

CK (3) 5 6 7 ns

CK (2) - 10 10 ns

CK (1) - 20 20 ns

CKH 1 1 1 ns

CKS 1.5 1.5 2 ns

SYMBOL* MIN MAX MIN MAX MIN MAX UNITS

CMH111ns

CM S 1.5 1.5 2 n s

HZ (3 ) 4.5 5.5 5.5 n s

HZ (2) - 7.5 8 ns

HZ (1) - 17 17 ns

LZ111ns

OH 1.5 2 2.5 ns

RAS 38.7 120,000 42 120,000 42 120,000 ns

RC 55 60 70 n s

R CD 15 18 20 n s

RP 15 18 20 n s

*CAS latency indicated in parentheses.

NOTE: 1. For this example, the burst length = 4, the CAS latency = 2, and the READ burst is followed by a “manual” PRECHARGE.

2. A8 and A9 = “Don’t Care.”

-5 -6 -7

DON’T CARE

UNDEFINED

Page 43

64Mb: x32

SDRAM

CLK

CKE

COMMAND

DQM 0-3

A0-A9

A10

BA0, BA1

READ – WITH AUTO PRECHARGE

T0 T1 T2 T4T3 T5 T6 T7 T8

CKS

CMS

ROW

BANK

CKH

CMH

RCD

RAS

CMS

COLUMN m

ENABLE AUTO PRECHARGE

BANK

CMH

CAS Latency

NOPNOP NOPACTIVE NOP READ NOP ACTIVENOP

OUT

m + 1

OUT

m + 2D

OUT

m + 3

ROW

BANK

TIMING PARAMETERS

-5 -6 -7

SYMBOL* MIN MAX MIN MAX MIN MAX UNITS

AC (3) 4.5 5.5 5.5 n s

AC (2) - 7.5 8 ns

AC (1) - 17 17 ns

AH111ns

AS 1.5 1.5 2 ns

CH 2 2.5 2.75 ns

CL 2 2.5 2.75 ns

CK (3) 5 6 7 ns

CK (2) - 10 10 ns

CK (1) - 20 20 ns

CKH 1 1 1 ns

CKS 1.5 1.5 2 ns

*CAS latency indicated in parentheses.

NOTE: 1. For this example, the burst length = 4, and the CAS latency = 2.

2. A8 and A9 = “Don’t Care.”

SYMBOL* MIN MAX MIN MAX MIN MAX UNITS

CMH111ns

CM S 1.5 1.5 2 n s

HZ (3 ) 4.5 5.5 5.5 n s

HZ (2) - 7.5 8 ns

HZ (1) - 17 17 ns

LZ111ns

OH 1.5 2 2.5 ns

RAS 38.7 120,000 42 120,000 42 120,000 ns

RC 55 60 70 n s

R CD 15 18 20 n s

RP 15 18 20 n s

DON’T CARE

UNDEFINED

-5 -6 -7

Page 44

64Mb: x32

SDRAM

CLK

CKE

COMMAND

DQM 0-3

A0-A9

A10

BA0, BA1

ALTERNATING BANK READ ACCESSES

T0 T1 T2 T4T3 T5 T6 T7 T8

CKS

CMS

ROW

BANK 0 BANK 0 BANK 4 BANK 4

CKH

CMH

RCD - BANK 0

RAS - BANK 0

RC - BANK 0

RRD

CMS

COLUMN m

ENABLE AUTO PRECHARGE

CMH

CAS Latency - BANK 0

NOP NOPACTIVE NOP READ NOP ACTIVE

ACTIVE

ROW

OUT

RCD - BANK 4

ENABLE AUTO PRECHARGE

OUT

m + 1

READ

COLUMN b

OUT

m + 2D

CAS Latency - BANK 4

OUT

m + 3

RP - BANK 0

ROW

BANK 0

OUT

RCD - BANK 0

DON’T CARE

UNDEFINED

TIMING PARAMETERS

-5 -6 -7

SYMBOL* MIN MAX MIN MAX MIN MAX UNITS

AC (3) 4.5 5.5 5.5 n s

AC (2) - 7.5 8 ns

AC (1) - 17 17 ns

AH111ns

AS 1.5 1.5 2 ns

CH 2 2.5 2.75 ns

CL 2 2.5 2.75 ns

CK (3) 5 6 7 ns

CK (2) - 10 10 ns

CK (1) - 20 20 ns

CKH 1.5 1 1 ns

SYMBOL* MIN MAX MIN MAX MIN MAX UNITS

CKS 1.5 1.5 2 ns

CMH111ns

CM S 1.5 1.5 2 n s

LZ111ns

OH 1.5 2 2.5 ns

RAS 38.7 120,000 42 120,000 42 120,000 ns

RC 55 60 70 n s

R CD 15 18 20 n s

RP 15 18 20 n s

R RD 10 12 14 n s

*CAS latency indicated in parentheses.

NOTE: 1. For this example, the burst length = 4, and the CAS latency = 2.

2. A8 and A9 = “Don’t Care.”

-5 -6 -7

Page 45

64Mb: x32

SDRAM

CLK

CKE

COMMAND

DQM 0-3

A0-A9

A10

BA0, BA1

READ – FULL-PAGE BURST

T0 T1 T2 T4T3 T5 T6 Tn + 1 Tn + 2 Tn + 3 Tn + 4

CKS

CMS

ROW

BANK

CKH

CMH

RCD

NOPNOP NOPACTIVE NOP READ NOP BURST TERMNOP NOP

CMS

CMH

COLUMN m

BANK

CAS Latency

Dout m

256 locations within same row

OUT

m+1

Full page completed

Full-page burst does not self-terminate.

Can use BURST TERMINATE command.

()(

)

()(

)

()(

)

()(

)

()(

)

()(

)

()(

)

()(

)

()(

)

()(

)

()(

)

()(

)

()(

)

()(

)

()(

)

()(

)

OUT

m+2

()(

)

OUT

m-1

OUT

NOP

OUT

m+1

DON’T CARE

UNDEFINED

TIMING PARAMETERS

-5 -6 -7

SYMBOL* MIN MAX MIN MAX MIN MAX UNITS

AC (3) 4.5 5.5 5.5 n s

AC (2) - 7.5 8 ns

AC (1) - 17 17 ns

AH111ns

AS 1.5 1.5 2 ns

CH 2 2.5 2.75 ns

CL 2 2.5 2.75 ns

CK (3) 5 6 7 ns

CK (2) - 10 10 ns

CK (1) - 20 20 ns

SYMBOL* MIN MAX MIN MAX MIN MAX UNITS

CKH 1 1 1 ns

CKS 1.5 1.5 2 ns

CMH111ns

CM S 1.5 1.5 2 n s

HZ (3) 4.5 5 5.5 ns

HZ (2) - 7.5 8 ns

HZ (1) - 17 17 ns

LZ111ns

OH 1.5 2 2.5 ns

R CD 15 18 20 n s

*CAS latency indicated in parentheses.

NOTE: 1. For this example, the CAS latency = 2.

2. A8 and A9 = “Don’t Care.”

3. Page left open; no tRP.

-5 -6 -7

Page 46

64Mb: x32

SDRAM

CLK

CKE

COMMAND

DQM 0-3

A0-A9

A10

BA0, BA1

READ – DQM OPERATION

T0 T1 T2 T4T3 T5 T6 T7 T8

CKS

CMS

ROW

BANK

CKH

CMH

RCD

CMS

COLUMN m

ENABLE AUTO PRECHARGE

DISABLE AUTO PRECHARGE

BANK

CMH

CAS Latency

NOPNOP NOPACTIVE NOP READ NOPNOP NOP

OUT

m + 2

OUT

m + 3D

TIMING PARAMETERS

-5 -6 -7

SYMBOL* MIN MAX MIN MAX MIN MAX UNITS

AC (3) 4.6 5.5 5.5 n s

AC (2) - 7.5 8 ns

AC (1) - 17 17 ns

AH111ns

AS 1.5 1.5 2 ns

CH 2 2.5 2.75 ns

CL 2 2.5 2.75 ns

CK (3) 5 6 7 ns

CK (2) - 10 10 ns

CK (1) - 20 20 ns

*CAS latency indicated in parentheses.

DON’T CARE

UNDEFINED

-5 -6 -7

SYMBOL* MIN MAX MIN MAX MIN MAX UNITS

CKH 1 1 1 ns

CKS 1.5 1.5 2 ns

CMH111ns

CM S 1.5 1.5 2 n s

HZ (3) 4.5 5 5.5 ns

HZ (2) - 7.5 8 ns

HZ (1) - 17 17 ns

LZ111ns

OH 1.5 2 2.5 ns

R CD 15 18 20 n s

NOTE: 1. For this example, the CAS latency = 2.

2. A8 and A9 = “Don’t Care.”

Page 47

SINGLE WRITE

64Mb: x32

SDRAM

CLK

CKE

COMMAND

DQM /

DQML, DQMH

A0-A9

A10

BA0, BA1

T0 T1 T2 T4T3 T5 T6

CKH

CKS

CMS

ACTIVE NOP WRITE NOP PRECHARGE ACTIVE

ROW

BANK

CMH

CMS

CMH

COLUMN m

DISABLE AUTO PRECHARGE

BANK BANK BANK

NOP

ALL BANKS

SINGLE BANK

DIN m

RCD

RAS

ROW

DON’T CARE

TIMING PARAMETERS

-5 -6 -7

SYMBOL* MIN MAX MIN MAX MIN MAX UNITS

AH111ns

AS 1.5 1.5 2 ns

CH 2 2.5 2.75 ns

CL 2 2.5 2.75 ns

CK (3) 5 6 7 ns

CK (2) 10 10 ns

CK (1) 20 20 ns

CKH 1 1 1 ns

CKS 1.5 1.5 2 ns

SYMBOL* MIN MAX MIN MAX MIN MAX UNITS

CMH111ns

CM S 1.5 1.5 2 n s

DH111ns

DS 1.5 1.5 2 n s

RAS 38.7 120,000 42 120,000 42 120,000 ns

RC 55 60 70 n s

R CD 15 18 20 n s

RP 15 18 20 n s

WR 2 tC K 12 14 n s

*CAS latency indicated in parentheses.

NOTE: 1. For this example, the burst length = 4, and the WRITE burst is followed by a “manual” PRECHARGE.

2. 10ns is required between <DIN m> and the PRECHARGE command, regardless of frequency, to meet tWR.

3. A8, A9 = “Don’t Care.”

-5 -6 -7

Page 48

64Mb: x32

SDRAM

CLK

CKE

COMMAND

DQM 0-3

A0-A9

A10

BA0, BA1

SINGLE BANK

ALL BANKs

WRITE – WITHOUT AUTO PRECHARGE

T0 T1 T2 T4T3 T5 T6 T7 T8

CKS

CMS

ROW

BANK

CKH

CMH

RCD

RAS

NOPNOP NOPACTIVE NOP WRITE NOPPRECHARGE ACTIVE

CMS

CMH

COLUMN m

DISABLE AUTO PRECHARGE

BANK BANK BANK

DIN m

DIN m + 1 DIN m + 2 DIN m + 3

ROW

TIMING PARAMETERS

-5 -6 -7

SYMBOL* MIN MAX MIN MAX MIN MAX UNITS

AH111ns

AS 1.5 1.5 2 ns

CH 2 2.5 2.75 ns

CL 2 2.5 2.75 ns

CK (3) 5 6 7 ns

CK (2) 10 10 ns

CK (1) 20 20 ns

CKH 1 1 1 ns

CKS 1.5 2 2 ns

SYMBOL* MIN MAX MIN MAX MIN MAX UNITS

CMH111ns

CM S 1.5 1.5 2 n s

DH111ns

DS 1.5 1.5 2 n s

RAS 38.7 120,000 42 120,000 42 120,000 ns

RC 55 60 70 n s

R CD 15 18 20 n s

RP 15 18 20 n s

tWR4

*CAS latency indicated in parentheses.

NOTE: 1. For this example, the burst length = 4, and the WRITE burst is followed by a “manual” PRECHARGE.

2. Faster frequencies require two clocks (when tWR > tCK).

3. A8 and A9 = “Don’t Care.”

4.tWR of 1 CLK available if running 100 MHz or slower. Check factory for availability.

-5 -6 -7

2 tC K 12 14 n s

DON’T CARE

Page 49

64Mb: x32

SDRAM

CLK

CKE

COMMAND

DQM 0-3

A0-A9

A10

BA0, BA1

WRITE – WITH AUTO PRECHARGE

T0 T1 T2 T4T3 T5 T6 T7 T8 T9

CKS

CMS

ROW

BANK

CKH

CMH

RCD

RAS

NOPNOP NOPACTIVE NOP WRITE NOP ACTIVE

CMS

CMH

COLUMN m

ENABLE AUTO PRECHARGE

BANK BANK

DIN m

DIN m + 1 DIN m + 2 DIN m + 3

NOP NOP

ROW

TIMING PARAMETERS

-5 -6 -7

SYMBOL* MIN MAX MIN MAX MIN MAX UNITS

AH111ns

AS 1.5 1.5 2 ns

CH 2 2.5 2.75 ns

CL 2 2.5 2.75 ns

CK (3) 5 6 7 ns

CK (2) 10 10 ns

CK (1) 20 20 ns

CKH 1 1 1 ns

CKS 1.5 2 2 ns

CMH 1 1 1 ns

*CAS latency indicated in parentheses.

NOTE: 1. For this example, the burst length = 4.

2. Faster frequencies require two clocks (when tWR > tCK).

3. A8 and A9 = “Don’t Care.”

DON’T CARE

-5 -6 -7

SYMBOL* MIN MAX MIN MAX MIN MAX UNITS

CMS 1.5 1.5 2 ns

DH111ns

DS 1.5 1.5 2 ns

RA S 38.7 120,000 42 120,000 42 120,000 ns

RC 55 60 70 n s

R C D 15 18 20 n s

RP 15 18 20 n s

WR 2 tCK 1 CLK+ 1 CLK+ ns

Page 50

64Mb: x32

SDRAM

CLK

CKE

COMMAND

DQM /

DQML, DQMH

A0-A9

A10

BA0, BA1

ALTERNATING BANK WRITE ACCESSES

T0 T1 T2 T3 T4 T5 T6 T7 T8 T9

CKS

CMS

ROW

BANK 0 BANK 0 BANK 1

CKH

CMH

RCD - BANK 0

RAS - BANK 0

RC - BANK 0

RRD

CMS

CMH

COLUMN m

ENABLE AUTO PRECHARGE

DIN m

DIN m + 1 DIN m + 2 DIN m + 3

NOP NOPACTIVE NOP WRITE NOP NOP ACTIVE

ACTIVE WRITE

ROW

RCD - BANK 1

COLUMN b

ENABLE AUTO PRECHARGE

WR - BANK 0

BANK 1

DIN b

DIN b + 1 DIN b + 3

RP - BANK 0

DIN b + 2

ROW

BANK 0

RCD - BANK 0

WR - BANK 1

TIMING PARAMETERS

-5 -6 -7

SYMBOL* MIN MAX MIN MAX MIN MAX UNITS

AH111ns

AS 1.5 1.5 2 ns

CH 2 2.5 2.75 ns

CL 2 2.5 2.75 ns

CK (3) 5 6 7 ns

CK (2) 10 10 ns

CK (1) 20 20 ns

CKH 1 1 1 ns

CKS 1.5 2 2 ns

CMH111ns

CM S 1.5 1.5 2 ns

SYMBOL* MIN MAX MIN MAX MIN MAX UNITS

DH111ns

DS 1.5 1.5 2 n s

RAS 38.7 42 120,000 42 120,000 ns

RC 55 60 70 n s

R CD 15 18 20 n s

RP 15 18 20 n s

R RD 10 12 14 n s

WR 2 tCK 1 CLK+ 1 CLK+ ns

*CAS latency indicated in parentheses.

NOTE: 1. For this example, the burst length = 4.

2. Faster frequencies require two clocks (when tWR > tCK).

3. A8 and A9 = “Don’t Care.”

-5 -6 -7

Page 51

WRITE – FULL-PAGE BURST

64Mb: x32

SDRAM

CLK

CKE

COMMAND

DQM 0-3

A0-A9

A10

BA0, BA1

T0 T1 T2 T3 T4 T5 Tn + 1 Tn + 2 Tn + 3

CKS

CMS

CKH

CMH

ROW

BANK

RCD

CMS

COLUMN m

BANK

DIN m

CMH

NOPNOP NOPACTIVE NOP WRITE BURST TERMNOP NOP

DIN m + 1 DIN m + 2 DIN m + 3

()(

)

()(

)

()(

)

()(

)

()(

)

()(

)

()(

)

()(

)

()(

)

()(

)

()(

)

()(

)

()(

)

()(

)

()(

)

DIN m - 1

()(

)

Full-page burst does

256 locations within same row

not self-terminate. Can use BURST TERMINATE command to stop.

Full page completed

2, 3

DON’T CARE

TIMING PARAMETERS

-5 -6 -7

SYMBOL* MIN MAX MIN MAX MIN MAX UNITS

AH111ns

AS 1.5 1.5 2 ns

CH 2 2.5 2.75 ns

CL 2 2.5 2.75 ns

CK (3) 5 6 7 ns

CK (2) 10 10 ns

CK (1) 20 20 ns

SYMBOL* MIN MAX MIN MAX MIN MAX UNITS

CKH 1 1 1 ns

CKS 1.5 1.5 2 ns

CMH111ns

CMS 1.5 2 2 ns

DH111ns

DS 1.5 1.5 2 n s

R CD 15 18 20 n s

*CAS latency indicated in parentheses.

NOTE: 1. A8 and A9 = “Don’t Care.”

2.tWR must be satisfied prior to PRECHARGE command.

3. Page left open; no tRP.

-5 -6 -7

Page 52

64Mb: x32

SDRAM

CLK

CKE

COMMAND

DQM 0-3

A0-A9

A10

BA0, BA1

DIN m + 3

WRITE – DQM OPERATION

T0 T1 T2 T3 T4 T5 T6 T7

CKS

CMS

ROW

BANK

CKH

CMH

CMS

CMH

BANK

DIN m

COLUMN m

ENABLE AUTO PRECHARGE

DISABLE AUTO PRECHARGE

NOPNOP NOPACTIVE NOP WRITE NOPNOP

DIN m + 2

RCD

TIMING PARAMETERS

-5 -6 -7

SYMBOL* MIN MAX MIN MAX MIN MAX UNITS

AH111ns

AS 1.5 1.5 2 ns

CH 2 2.5 2.75 ns

CL 2 2.5 2.75 ns

CK (3) 5 6 7 ns

CK (2) 10 10 ns

CK (1) 20 20 ns

*CAS latency indicated in parentheses.

DON’T CARE

-5 -6 -7

SYMBOL* MIN MAX MIN MAX MIN MAX UNITS

CKH 1 1 1 ns

CKS 1.5 2 2 ns

CMH111ns

CM S 1.5 1.5 2 n s

DH111ns

DS 1.5 1.5 2 n s

R CD 15 18 20 n s

NOTE: 1. For this example, the burst length = 4.

2. A8 and A9 = “Don’t Care.”

Page 53

86-PIN PLASTIC TSOP (400 MIL)

64Mb: x32

SDRAM

PIN #1 ID

.50 TYP

22.22 ±.08

R .75 (2X)

0.20

R 1.00

(2X)

+.07

-.03

1.20 MAX

.61

.10 (2X)

2.80 (2X)

10.16 ±.08

.10

11.76 ±.10

.15

SEE DETAIL A

+.03

-.02

.10

+.10

-.05 .50 ±.10

DETAIL A

GUAGE PLANE

.80 TYP

.25

NOTE: 1. All dimensions in millimeters

MAX

or typical where noted.

MIN

2. Package width and length do not include mold protrusion; allowable mold protrusion is 0.025mm per side.

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E-mail: prodmktg@micronsemi.com, Internet: http://www.micronsemi.com, Customer Comment Line: 800-932-4992

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