MICRO CRYSTAL RV 2123-C2 Datasheet

100% leadfree, RoHS - compliant

RV-2123-C2

Real Time Clock Module with SPI Bus

DIMENSIONS

Package: Recommended Solder Pad:

±0,2

5,0

1,0

2
,
0

±

2
,

3

6
,

0

0,4

5
3

,
0

2
,

1
.

x
a

m

1,0 1,0 1,0 1,0

0,6

4,6

All dimensions in mm typical

9
,

0

0

2

,

,

4

2

9
,

0

Ultra low power consumption 130nA
Xtal integrated solution.
Frequency-Offset Trimming Register
Miniature SMT ceramic package
Very tight frequency tolerance
SPI Bus Interface (SCL up to 8 MHz)
Programmable Clock-output
Low aging
Time keeping mode down to 1.1 V
Programmable alarm, timer and

BLOCK DIAGRAM:

DESCRIPTION:

This RTC IC has been specially designed to achieve an ultra-low power
consumption of typically 130nA

@ V

3.0V in time-keeping mode.

DD

The very small SMT ceramic-package combines the 32.768 kHz crystal
unit with the CMOS-based oscillator and real-time-clock circuitry.
The calendar function tracks year, month, date, and day-of-the-week with
built-in century and leap-year fl ags. The clock function tracks minute and
second in 24-hour format. Programmable alarm setting and universal
timer functions increase fl exibility.
For pick-and-place equipment, the parts are available in 12 mm tape:
7” (178 mm) reel with 1'000 parts
13” (330 mm) reel with 5'000 parts

CLKOUT

CLKOE

IN T

DIVIDER

OSCILLATOR

32.768 kHz

MONITOR

2

10

8

CLOCK

OUTPU T

INTERRUPT

and

FREQUENCY-OFFSET

COMPENSATION

OFFSET FUNCTION

0D

0E

0F

00

01

OFFSET

TIMER FUNCTION

Timer / CLKOUT Control

Countdown Timer

CONTROL

Control / Status 1

Control / S tatus 2

V

DD

V

SS

CE

SCL

SDI

SDO

POWER-ON

1

6

7

3

4

5

RESET

WATCH DOG

SPI –4wire

IN TER FA CE

02

03

04

05

06

07

08

09

0A

0B

0C

TIME

OS / Seconds

VL / Minutes

Hours

Days

Weekdays

Months

Years

ALARM FUNCTION

Minute

Hour

Day

Weekday

Version 1.2/04.2009

ELECTRICAL CHARACTERISTICS

100.0

110.0

120.0

130.0

140.0

150.0

160.0

170.0

180.0

190.0

200.0

AT 25°C:

Symbol Condition Min. Typ. Max Unit

Supply voltage V

Supply voltage V

Current consumption
during access

Current consumption
Time keeping mode

I

I

DDO

SPI Bus Active 1.6 5.5 V

DD

DD

DD

Time keeping 1.1 5.5 V

fscl=1 MHz VDD 3 V

fscl=4.5 MHz VDD 3 V

fscl=0 Hz, VDD 3 V

fscl=0 Hz, VDD 1 V

30 80 μA

250 400 μA

130 180 nA

110 160 nA

CLKOUT frequency Programmable 32768...to...1 Hz

Frequency tolerance ΔF/F @ 25°C ±10 / ±20

1)

ppm

Aging fi rst year max. ΔF/F @ 25°C ± 3 ppm

ppm

–0.035

/

Frequency vs. temp. ΔF/F

O

20 ≤ T0 ≤ 30

1) Tighter and wider frequency tolerances on request.

(T - T0)2 ±10%

°C²

ppm

ENVIRONMENTAL

CHARACTERISTICS:

TERMINATIONS AND
PROCESSING:

CURRENT CONSUMPTION vs.

POWER SUPPLY VOLTAGE:

Conditions Max. Dev.

Storage temp. range –55 to +125°C

Industrial operating temp. range –40 to +85°C

Shock resistance

Vibration resistance

5000 g, 0.3 ms, ½ sine +/-5 ppm

ΔF/F

ΔF/F

20 g / 10–2000 Hz +/-5 ppm

Package-Type Termination Processing

SON 10-pin

[nA]

DD

I

For SMD mounting

Au fl ashed pads

Refl ow soldering

260°C / 20 s max.

PIN CONNECTIONS
TOP VIEW:

0.0 1.0 2.0 3.0 4.0 5.0 6.0

V

[V]

DD

Pin Connection

Product Marking

#6 #10

2123

#1 #5

Pin 1 Index

All specifications subject to change without notice. 04.09

1VDDPower Supply Voltage

2 CLKOUT Frequency output

3 SCL Serial clock input

4 SDI Serial Data In

5 SDO Serial Data Out

6

7 CE Chip Enable

8 INT Interrupt output

9 NC not connected

10 CLKOE CLK output enable

V

SS

Ground

Micro Crystal AG Tel. [phone]
Mühlestrasse 14 Fax [phone]
CH-2540 Grenchen [e-mail]
Switzerland www.microcrystal.com

Version 1.2/04.2009