Microchip Technology Inc 24LC08B-MT, 24LC16B-MT Datasheet

1997 Microchip Technology Inc. DS21224A-page 1
M
24LC08B/16B MODULES
FEATURES
• ISO 7816 compliant contact locations
• Single supply with operation from 2.5-5.5V
• Low power CMOS technology
- 1 mA active current typical
- 10 µ A standby current typical at 5.5V
• Organized as 4 or 8 blocks of 256 bytes (4 x 256 x 8) or (8 x 256 x 8)
• 2-wire serial interface bus, I
2
C 
compatible
• Schmitt trigger inputs for noise suppression
• Output slope control to eliminate ground bounce
• 100 kHz (2.5V) and 400kHz (5V) compatibility
• Self-timed write cycle (including auto-erase)
• Page-write buffer for up to 16 bytes
• 2 ms typical write cycle time for page-write
• ESD protection > 4,000V
• 1,000,000 ERASE/WRITE cycles guaranteed
• Data retention > 200 years
• Temperature range
DESCRIPTION
The Microchip Technology Inc. 24LC08B/16B are 8K and 16K bit Electrically Erasable PROMs in ISO mod­ules for smart card applications. The device is orga­nized as four or eight bloc ks of 256 x 8-bit memory with a 2-wire serial interface. The 24LC08B and 24LC16B also have a page-write capability for up to 16 bytes of data.
ISO MODULE LAYOUT
BLOCK DIAGRAM
- Commercial (C): 0˚C to +70˚C
VSS
SDA
SCL
V
DD
HV GENERATOR
EEPROM
ARRAY
PAGE LATCHES
YDEC
XDEC
SENSE AMP
R/W CONTROL
MEMORY
CONTROL
LOGIC
I/O
CONTROL
LOGIC
SDA SCL
V
CC
VSS
8K/16K I
2
C
Serial EEPROMs in ISO Micromodules
I
2
C is a trademark of Philips Corporation.
24LC08B/16B MODULES
DS21224A-page 2
1997 Microchip Technology Inc.
1.0 ELECTRICAL CHARACTERISTICS
1.1 Maxim
um Ratings*
V
CC
...................................................................................7.0V
All inputs and outputs w.r.t. V
SS
................-0.6V to V
CC
+1.0V
Storage temperature.....................................-65˚C to +150˚C
Ambient temp. with power applied................. -65˚C to +125˚C
Soldering temperature of leads (10 seconds).............+300˚C
ESD protection on all pins ..................................................≥ 4 kV
*Notice: Stresses above those listed under “Maximum ratings”
may cause permanent damage to the device. This is a stress rat­ing only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.
TABLE 1-1: PIN FUNCTION TABLE
Name Function
V
SS
Ground
SDA Serial Data
SCL Serial Clock V
CC
+2.5V to 5.5V Power Supply
TABLE 1-2 DC CHARACTERISTICS
All Parameters apply across the speci­fied operating ranges unless otherwise noted.
Commercial (C): Tamb = 0˚C to +70˚C, V
CC
= 2.5V to 5.5V
Parameter Symbol Min. Max. Units Conditions
SCL and SDA pins:
High level input voltage V
IH
0.7 V
CC
V (Note)
Low level input voltage V
IL
0.3 V
CC
V (Note)
Hysteresis of Schmitt trigger inputs V
HYS
0.05 V
CC
V Vcc ≥ 2.5V (Note)
Low level output voltage V
OL
0.40 V I
OL
= 3.0 mA, V
CC
= 4.5V
I
OL
= 2.1 mA, V
CC
= 2.5V
Input leakage current I
LI
-10 10
µ
A V
IN
= V
CC
or V
SS
Output leakage current I
LO
-10 10
µ
A V
OUT
= V
CC
or V
SS
Pin capacitance (all inputs/outputs) C
IN
,
C
OUT
10 pF V
CC
= 5.0V (Note)
Tamb = 25˚C, f = 1 MHz
Operating current I
CC
Write 3 mA V
CC
= 5.5V, SCL = 400 kHz
I
CC
Read 1 mA V
CC
= 5.5V, SCL = 400 kHz
Standby current I
CCS
100
µ
A V
CC
= 5.5V, SDA = SCL = V
CC
Note: This parameter is periodically sampled and not 100% tested.
24LC08B/16B MODULES
1997 Microchip Technology Inc. DS21224A-page 3
TABLE 1-3 AC CHARACTERISTICS
FIGURE 1-1: BUS TIMING DATA
All parameters apply across the specified operat­ing ranges unless otherwise noted.
Vcc = 2.5V to 5.5V Commercial (C): Tamb = 0 ° C to +70 ° C
Parameter Symbol
Vcc = 2.5V - 5.5V
STD MODE
Vcc = 4.5V - 5.5V
FAST MODE
Units Remarks
Min. Max. Min. Max.
Clock frequency F
CLK
100 400 kHz
Clock high time T
HIGH
4000 600 ns
Clock low time T
LOW
4700 1300 ns
SDA and SCL rise time T
R
1000 300 ns (Note 1)
SDA and SCL fall time T
F
300 300 ns (Note 1)
START condition hold time T
HD
:
STA
4000 600 ns After this period the first
clock pulse is generated
START condition setup time T
SU
:
STA
4700 600 ns Only relevant for repeated
START condition
Data input hold time T
HD
:
DAT
0 0 ns (Note 2)
Data input setup time T
SU
:
DAT
250 100 ns
STOP condition setup time T
SU
:
STO
4000 600 ns
Output valid from clock T
AA
3500 900 ns (Note 2)
Bus free time T
BUF
4700 1300 ns Time the bus must be free
before a new transmission can start
Output fall time from V
IH
minimum to V
IL
maximum
T
OF
250 20 +0.1
C
B
250 ns (Note 1), C
B
100 pF
Input filter spike suppression (SDA and SCL pins)
T
SP
50 50 ns (Notes 1, 3)
Write cycle time T
WC
10 10 ms Byte or Page mode
Endurance 1M 1M cycles 25 ° C, V
CC
= 5.0V, Block
Mode (Note 4)
Note 1: Not 100% tested. C
B
= total capacitance of one bus line in pF.
2:
As a transmitter, the device must provide an internal minimum delay time to bridge the undefined region (minimum 300 ns) of the falling edge of SCL to avoid unintended generation of START or STOP conditions.
3:
The combined T
SP
and V
HYS
specifications are due to Schmitt trigger inputs which provide improved noise
spike suppression. This eliminates the need for a TI specification for standard operation.
4:
This parameter is not tested but guaranteed by characterization. For endurance estimates in a specific application, please consult the Total Endurance Model which can be obtained on our BBS or website.
TSU:STA
TF
TLOW
THIGH
TR
THD:DAT TSU:DAT
TSU:STO
THD:STA
TBUF
TAA
TAA
TSP
THD:STA
SCL
SDA
IN
SDA OUT
24LC08B/16B MODULES
DS21224A-page 4 1997 Microchip Technology Inc.
2.0 PAD DESCRIPTIONS
2.1 SDA (Serial Data)
This is a Bi-directional pin used to transfer addresses and data into and data out of the device. It is an open drain terminal, therefore the SDA bus requires a pull-up resistor to V
CC (typical 10).
For normal data transfer SD A is allowed to change only during SCL low. Changes during SCL high are reserved for indicating the START and STOP condi­tions.
2.2 SCL (Serial Clock)
This input is used to synchronize the data transfer from and to the device.
3.0 FUNCTIONAL DESCRIPTION
The 24LC08B/16B supports a Bi-directional 2-wire bus and data transmission protocol. A device that sends data onto the bus is defined as transmitter, and a device receiving data as receiver. The bus has to be controlled by a master device which generates the serial clock (SCL), controls the bus access, and gener­ates the START and STOP conditions, while the 24LC08B/16B works as slave. Both, master and slave can operate as transmitter or receiver but the master device determines which mode is activated.
4.0 BUS CHARACTERISTICS
The following bus protocol has been defined:
• Data transfer may be initiated only when the bus is not busy.
• During data transfer, the data line must remain stable whenever the clock line is HIGH. Changes in the data line while the clock line is HIGH will be interpreted as a START or STOP condition.
Accordingly, the following bus conditions have been defined (Figure 5-2).
4.1 Bus not Busy (A)
Both data and clock lines remain HIGH.
4.2 Start Data Transfer (B)
A HIGH to LOW transition of the SDA line while the clock (SCL) is HIGH determines a START condition. All commands must be preceded by a START condi­tion.
4.3 Stop Data Transfer (C)
A LOW to HIGH transition of the SDA line while the clock (SCL) is HIGH determines a STOP condition. All operations must be ended with a STOP condition.
4.4 Data Valid (D)
The state of the data line represents valid data when, after a START condition, the data line is stable for the duration of the HIGH period of the clock signal.
The data on the line must be changed during the LOW period of the clock signal. There is one clock pulse per bit of data.
Each data transfer is initiated with a START condition and terminated with a STOP condition. The number of the data bytes transferred between the START and STOP conditions is determined by the master device and is theoretically unlimited, although only the last 16 will be stored when doing a write operation. When an overwrite does occur it will replace data in a first in first out fashion.
24LC08B/16B MODULES
1997 Microchip Technology Inc. DS21224A-page 5
4.5 Acknowledge
Each receiving device, when addressed, is obliged to generate an acknowledge after the reception of each byte. The master device must generate an extra clock pulse which is associated with this acknowledge bit.
The device that acknowledges, has to pull down the SDA line during the acknowledge cloc k pulse in such a way that the SDA line is stable LOW during the HIGH period of the acknowledge related clock pulse. Of course, setup and hold times must be taken into account. During reads, a master must signal an end of data to the slave by NOT generating an acknowledge bit on the last byte that has been clocked out of the slave. In this case, the slave (24LC08B/16B) will leave the data line HIGH to enable the master to generate the STOP condition.
5.0 DEVICE ADDRESSING
A control byte is the first byte received following the start condition from the master device. The control byte consists of a 4-bit control code, for the 24LC08B/16B this is set as 1010 binary for read and write operations. The next three bits of the control byte are the block select bits (B2, B1, B0). They are used by the master device to select which of the eight 256 word blocks of memory are to be accessed. These bits are in effect the three most significant bits of the word address.
The last bit of the control byte defines the operation to be performed. When set to one a read operation is selected, when set to zero a write operation is selected. Following the start condition, the 24LC08B/16B moni­tors the SDA bus checking the device type identifier being transmitted, upon a 1010 code the slave device outputs an acknowledge signal on the SDA line. Depending on the state of the R/W
bit, the 24LC08B/
16B will select a read or write operation.
FIGURE 5-1: CONTROL BYTE
ALLOCATION
FIGURE 5-2: DATA TRANSFER SEQUENCE ON THE SERIAL BUS
Note: The 24LC08B/16B does not generate any
acknowledge bits if an internal program­ming cycle is in progress.
Operation
Control
Code
Block Select R/W
Read 1010 Block Address 1 Write 1010 Block Address 0
SLAVE ADDRESS
1 0 1 0 B2 B1 B0
R/W A
START READ/WRITE
(A) (B) (D) (D) (A)(C)
START
CONDITION
ADDRESS OR
ACKNOWLEDGE
VALID
DATA
ALLOWED
TO CHANGE
STOP
CONDITION
SCL
SDA
24LC08B/16B MODULES
DS21224A-page 6 1997 Microchip Technology Inc.
6.0 WRITE OPERATIONS
6.1 Byte Write
Following the start condition from the master, the device code (4 bits), the block address (3 bits), and the R/W
bit which is a logic low is placed onto the bus by the master transmitter. This indicates to the addressed slave receiver that a b yte with a word address will follo w after it has generated an acknowledge bit during the ninth clock cycle. Therefore the ne xt byte transmitted b y the master is the word address and will be written into the address pointer of the 24LC08B/16B. After receiv­ing another acknowledge signal from the 24LC08B/16B the master device will transmit the data word to be writ­ten into the addressed memory location. The 24LC08B/ 16B acknowledges again and the master generates a stop condition. This initiates the internal write cycle, and during this time the 24LC08B/16B will not generate acknowledge signals (Figure 6-1).
6.2 Page Write
The write control byte, word address and the first data byte are transmitted to the 24LC08B/16B in the same way as in a byte write. But instead of generating a stop condition the master transmits up to 16 data bytes to the 24LC08B/16B which are temporarily stored in the on-chip page buffer and will be written into the memory after the master has transmitted a stop condition. After the receipt of each word, the four lower order address pointer bits are internally incremented by one. The higher order seven bits of the word address remains constant. If the master should transmit more than 16 words prior to generating the stop condition, the address counter will roll over and the previously received data will be overwritten. As with the byte write operation, once the stop condition is received an inter­nal write cycle will begin (Figure 6-2).
FIGURE 6-1: BYTE WRITE
FIGURE 6-2: PAGE WRITE
S P
BUS ACTIVITY MASTER
SDA LINE
BUS ACTIVITY
S T A R T
S T O P
CONTROL
BYTE
WORD
ADDRESS
DATA
A C K
A C K
A C K
S P
BUS ACTIVITY MASTER
SDA LINE
BUS ACTIVITY
S T A R T
CONTROL
BYTE
WORD
ADDRESS (n)
DATA n DATA n + 15
S T O P
A C K
A C K
A C K
A C K
A C K
DATA n + 1
24LC08B/16B MODULES
1997 Microchip Technology Inc. DS21224A-page 7
7.0 ACKNOWLEDGE POLLING
Since the device will not acknowledge during a write cycle, this can be used to determine when the cycle is complete (this feature can be used to maximize bus throughput). Once the stop condition for a write com­mand has been issued from the master, the device ini­tiates the internally timed write cycle. ACK polling can be initiated immediately . This inv olv es the master send­ing a start condition followed by the control byte for a write command (R/W
= 0). If the de vice is still b usy with the write cycle, then no ACK will be returned. If the cycle is complete, then the device will return the ACK and the master can then proceed with the next read or write command. See Figure 7-1 for flow diagram.
FIGURE 7-1: ACKNOWLEDGE POLLING
FLOW
8.0 READ OPERATIONS
Read operations are initiated in the same way as write operations with the exception that the R/W
bit of the slave address is set to one. There are three basic types of read operations: current address read, random read, and sequential read.
8.1 Current Address Read
The 24LC08B/16B contains an address counter that maintains the address of the last word accessed, inter­nally incremented by one. Therefore, if the previous access (either a read or write operation) was to address n, the next current address read operation would access data from address n + 1. Upon receipt of the slave address with R/W
bit set to one, the 24LC08B/16B issues an acknowledge and transmits the 8-bit data word. The master will not acknowledge the transfer but does generate a stop condition and the 24LC08B/16B discontinues transmission (Figure 8-1).
8.2 Random Read
Random read operations allow the master to access any memory location in a random manner. To perform this type of read operation, first the word address must be set. This is done by sending the word address to the 24LC08B/16B as part of a write operation. After the word address is sent, the master generates a start con­dition following the acknowledge. This terminates the write operation, but not before the internal address pointer is set. Then the master issues the control byte again but with the R/W
bit set to a one.The 24LC08B/ 16B will then issue an acknowledge and transmits the 8-bit data word. The master will not acknowledge the transfer but does generate a stop condition and the 24LC08B/16B discontinues transmission (Figure 8-2).
8.3 Sequential Read
Sequential reads are initiated in the same way as a ran­dom read except that after the 24LC08B/16B transmits the first data byte, the master issues an acknowledge as opposed to a stop condition in a random read. This directs the 24LC08B/16B to transmit the next sequen­tially addressed 8 bit word (Figure 8-3).
To provide sequential reads the 24LC08B/16B contains an internal address pointer which is incremented by one at the completion of each operation. This address pointer allows the entire memory contents to be serially read during one operation.
8.4 Noise Protection
The 24LC08B/16B employs a VCC threshold detector circuit which disables the internal erase/write logic if the V
CC is below 1.5 volts at nominal conditions.
The SCL and SDA inputs hav e Schmitt trigger and filter circuits which suppress noise spikes to assure proper device operation even on a noisy bus.
Send
Write Command
Send Stop
Condition to
Initiate Write Cycle
Send Start
Send Control Byte
with R/W = 0
Did Device
Acknowledge
(ACK = 0)?
Next
Operation
NO
YES
24LC08B/16B MODULES
DS21224A-page 8 1997 Microchip Technology Inc.
FIGURE 8-1: CURRENT ADDRESS READ
FIGURE 8-2: RANDOM READ
FIGURE 8-3: SEQUENTIAL READ
S P
BUS ACTIVITY MASTER
SDA LINE
BUS ACTIVITY
S T A R T
S T O P
CONTROL
BYTE
DATA n
A C K
N O
A C K
S P
S
BUS ACTIVITY MASTER
SDA LINE
BUS ACTIVITY
S T A R T
S T O P
CONTROL
BYTE
A C K
WORD
ADDRESS (n)
CONTROL
BYTE
S T A R T
DATA (n)
A C K
A C K
N
O
A C K
P
BUS ACTIVITY MASTER
SDA LINE
BUS ACTIVITY
S T O P
CONTROL
BYTE
A C K
N O
A C K
DATA n DATA n + 1 DATA n + 2 DATA n + X
A C K
A C K
A C K
24LC08B/16B MODULES
1997 Microchip Technology Inc. DS21224A-page 9
9.0 SHIPPING METHOD
The micromodules will be shipped to customers in clear plastic trays. Each tray holds 150 modules, and the trays can be stack ed in a manner similar to shipping die in waffle packs. A tray drawing with dimensions is shown in Figure 9-1.
FIGURE 9-1: TRAY DIMENSIONS
SMART CARD MODULES
14.000 [355.60]
12.040 [305.82]
9.374 [238.09]
0.500 [12.70]
0.980 [24.89] TYP
0.860 [21.84] TYP.
0.617 [15.68]
0.905 [22.99]
R 0.300 [7.62] TYP
R 0.270 [6.86] TYP
8.145 [206.88]
ANTISTATIC
24LC08B/16B MODULES
DS21224A-page 10 1997 Microchip Technology Inc.
FIGURE 9-2: MODULE DIMENSIONS
0.465 ± 0.002
[11.80 ± 0.05]
0.419 ± 0.002
[10.63 ± 0.05]
A A
0.270 [6.86] MAX.
0.232 ± 0.002
[5.90 ± 0.05]
R. 0.059 [1.50] (4X)
0.090 [2.29] MIN EPOXY
FREE AREA (TYP.)
0.1043 ± 0.002
[2.65 ± 0.05]
(8x)
0.146 ± 0.002
[3.71 ± 0.05]
0.174 ± 0.002
[4.42 ± 0.05]
0.209 ± 0.002
[5.31 ± 0.05]
TYP.
DEVICE SIDE
CONTACT SIDE
0.1043 ± 0.002
[2.65 ± 0.05]
0.285 [7.24] MAX
VIA HOLES (8x)
I.D. ¯ 0.026 [0.66]
O.D. ¯ 0.042 [1.06]
GOLD FLASH 3-7
0.004 [0.10] MAX.
COPPER BASE NICKEL PLATED, 150 MIN
GLOB SIZE
0.007 [0.18] MAX.
SECTION A-A
FR4 TAPE
DIE
m
IN
m
IN
0.015 [0.38] MAX.
0.0235 [0.60] MAX.
24LC08B/16B MODULES
1997 Microchip Technology Inc. DS21224A-page 11
24LC08B/16B MODULES PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
Sales and Support
Package: MT = Micromodules in trays
Temperature Range:
Blank = 0˚C to +70˚C
Device:
24LC08B 8K bit 2.5V I
2
C Serial EEPROM in ISO Module
24LC16B 16K bit 2.5V I2C Serial EEPROM in ISO Module
24LC08B/16B — /MT
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recom­mended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1. Your local Microchip sales office.
2. The Microchip Corporate Literature Center U.S. FAX: (602) 786-7277.
3. The Microchip’s Bulletin Board, via your local CompuServe number (CompuServe membership NOT required). Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
Information contained in this publication regarding device applications and the like is intended for suggestion only and may be superseded by updates. No representation or warranty is given and no liability is assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchip’s products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are convey ed, implicitly or otherwise, under any intellectual property rights. The Microchip logo and name are registered trademarks of Microchip Technology Inc. in the U.S.A. and other countries. All rights reserved. All other trademarks mentioned herein are the property of their respective companies.
DS21224A-page 12
1997 Microchip Technology Inc.
M
All rights reserved. © 1997, Microchip Technology Incorporated, USA. 9/97 Printed on recycled paper.
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