Microchip Technology WINC3400 User Manual

ATWINC3400-MR210CA

IEEE 802.11 b/g/n Network Controller Module with

Integrated Bluetooth Low Energy 4.0

Introduction

The ATWINC3400-MR210CA is an IEEE 802.11 b/g/n RF/Baseband/Medium Access Control (MAC) network controller module with Bluetooth Low Energy technology that is compliant with Bluetooth version

4.0. This module is optimized for low power and high performance mobile applications. This module features small form factor when integrating Power Amplifier (PA), Low-Noise Amplifier (LNA), Transmit/ Receive (T/R) switch (for Wi-Fi and Bluetooth), Power Management Unit (PMU), and Chip Antenna. The ATWINC3400-MR210CA module requires a 32.768 kHz clock for Sleep operation.

The ATWINC3400-MR210CA module utilizes highly optimized IEEE 802.11 Bluetooth coexistence protocols, and provides Serial Peripheral Interface (SPI) to interface with the host controller.

Features

Wi-Fi features:

• IEEE 802.11 b/g/n RF/PHY/MAC

• IEEE 802.11 b/g/n (1x1) with single spatial stream, up to 72 Mbps PHY rate in 2.4 GHz ISM band

• Integrated chip antenna

• Superior sensitivity and range via advanced PHY signal processing

• Advanced equalization and channel estimation

• Advanced carrier and timing synchronization

• Supports Soft-AP

• Supports IEEE 802.11 WEP, WPA, and WPA2

• Superior MAC throughput through hardware accelerated two-level A-MSDU/A-MPDU frame aggregation and block acknowledgment

• On-chip memory management engine to reduce the host load

• Operating temperature range from -40°C to +85°C

• Wi-Fi Alliance® certified for connectivity and optimizations

– ID: WFA62065

• Integrated on-chip microcontroller

• SPI host interface

• Integrated Flash memory for Wi-Fi and Bluetooth system software

• Low leakage on-chip memory for state variables

• Fast AP re-association (150 ms)

• On-chip network stack to offload MCU

– Integrated network IP slack to minimize the host CPU requirements

• Network features: Firmware version 1:2:x

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– TCP, UDP, DHCP, ARP, HTTP, SSL, DNS, and SNTP

Bluetooth features:

• Bluetooth 4.0 (Bluetooth Low Energy) certifications

– Controller QD ID - 77870

– Host QD ID - 77451

• Class 2 transmission

• Adaptive Frequency Hopping (AFH)

• Superior sensitivity and range

ATWINC3400-MR210CA

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Introduction......................................................................................................................1

Features.......................................................................................................................... 1

1. Ordering Information and Module Marking................................................................ 5

2. Block Diagram........................................................................................................... 6

3. Pinout and Package Information............................................................................... 7

3.1. Package Description.................................................................................................................. 10

4. Electrical Characteristics..........................................................................................11

4.1. Absolute Maximum Ratings........................................................................................................11

4.2. Recommended Operating Conditions........................................................................................ 11

4.3. DC Characteristics..................................................................................................................... 12

4.4. IEEE 802.11 b/g/n Radio Performance...................................................................................... 12

4.5. Bluetooth Radio Performance.................................................................................................... 14

4.6. Timing Characteristics................................................................................................................ 16

5. Power Management................................................................................................ 21

5.1. Device States............................................................................................................................. 21

5.2. Controlling Device States...........................................................................................................21

5.3. Power-Up/Down Sequence........................................................................................................22

5.4. Digital I/O Pin Behavior During Power-Up Sequences...............................................................23

6. Clocking...................................................................................................................24

6.1. Low-Power Clock....................................................................................................................... 24

7. CPU and Memory Subsystem................................................................................. 25

7.1. Processor................................................................................................................................... 25

7.2. Memory Subsystem....................................................................................................................25

7.3. Nonvolatile Memory....................................................................................................................25

8. WLAN Subsystem................................................................................................... 27

8.1. MAC........................................................................................................................................... 27

8.2. PHY............................................................................................................................................28

8.3. Radio..........................................................................................................................................28

9. Bluetooth Low Energy 4.0....................................................................................... 30

10. External Interfaces...................................................................................................31

10.1. Interfacing with the Host Microcontroller.................................................................................... 31

10.2. SPI Interface...............................................................................................................................32

10.3. UART Interface...........................................................................................................................34

11. Application Reference Design................................................................................. 35

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ATWINC3400-MR210CA

11.1. Host Interface - SPI.................................................................................................................... 35

12. Module Outline Drawings........................................................................................ 37

13. Design Consideration.............................................................................................. 38

13.1. Module Placement and Routing Guidelines............................................................................... 38

13.2. Antenna Performance................................................................................................................ 39

14. Reflow Profile Information....................................................................................... 41

14.1. Storage Condition.......................................................................................................................41

14.2. Solder Paste...............................................................................................................................41

14.3. Stencil Design............................................................................................................................ 41

14.4. Baking Conditions...................................................................................................................... 41

14.5. Soldering and Reflow Condition................................................................................................. 41

15. Module Assembly Considerations........................................................................... 44

16. Regulatory Approval................................................................................................45

16.1. United States..............................................................................................................................45

16.2. Canada.......................................................................................................................................46

16.3. Europe........................................................................................................................................48

16.4. Other Regulatory Information..................................................................................................... 49

17. Reference Documentation.......................................................................................50

18. Document Revision History..................................................................................... 51

The Microchip Web Site................................................................................................ 52

Customer Change Notification Service..........................................................................52

Customer Support......................................................................................................... 52

Product Identification System........................................................................................53

Microchip Devices Code Protection Feature................................................................. 53

Legal Notice...................................................................................................................53

Trademarks................................................................................................................... 53

Quality Management System Certified by DNV.............................................................54

Worldwide Sales and Service........................................................................................55

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1. Ordering Information and Module Marking

2 1

Device name

MR: Industrial

2: OTA with shield

1: Reserved

C: Chip antenna

Revision letter

Software version

ATWINC3400

A xxx

The following table provides the ordering details for the ATWINC3400-MR210CA module.

Table 1-1. Ordering Details

ATWINC3400-MR210CA

Model Number Ordering Code Package Description

ATWINC3400MR210CA

Note:

1. 'xxx' in the preceding table and following figure denotes the software version. Order code changes as per the software version. For example, current version of the software is v1.22, so its equivalent order code is ATWINC3400-MR210CA122.

2. CE certification pending.

The following figure illustrates the ATWINC3400-MR210CA module marking information.

Figure 1-1. Marking Information

ATWINC3400-MR210CAxxx 122.43 x

14.73 x 2.0 mm

Certified module with chip antenna

Regulatory Information

FCC, IC, CE

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2. Block Diagram

ATWINC3400 IC

The following figure shows the block diagram of the ATWINC3400-MR210CA module.

Figure 2-1. ATWINC3400-MR210CA Module Block Diagram

ATWINC3400-MR210CA

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3. Pinout and Package Information

ATWINC3400-MR210CA

MODULE

J10

J11

J12

J13

J14

J15

J16

J17

J18

J19

J20

J21

J22

J23

J24

J25

J26

J27

J28

J29

J30

J31

J32

J33

J34

J35

J36

GND

I2C_SDA_M

I2C_SCL_M

IRQN

GPIO20

GPIO19

GPIO18

GPIO17

GND

GPIO7

SPI_MOSI

SPI_SSN

SPI_MISO

SPI_SCK

GPIO8

GND

RTC_CLK

CHIP_EN

VBAT

UART_RXD

UART_TXD

GPIO4

GPIO3

GND

VDDIO

BT_RXD

BT_TXD

RESETN

N/C

SPI_CFG

GND

I2C_SDA_S

I2C_SCL_S

This package contains an exposed paddle that must be connected to the system board ground. The ATWINC3400-MR210CA module pin assignment is shown in following figure.

Figure 3-1. ATWINC3400-MR210CA Module Pin Assignment

ATWINC3400-MR210CA

The following table provides the ATWINC3400-MR210CA module pin description.

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ATWINC3400-MR210CA

Table 3-1. ATWINC3400-MR210CA Module Pin Description

Pin # Pin Name Pin Type Description

1 GND GND Ground pin.

2 SPI_CFG Digital Input Serial Peripheral Interface pin, which must be

died to VDDIO.

3 NC - No connection.

4 NC - No connection.

5 NC - No connection.

6 NC - No connection.

7 RESETN Digital Input • Active-low hard Reset pin.

• When the Reset pin is asserted low, the module is in the Reset state. When the Reset pin is asserted high, the module functions normally.

• This pin must connect to a host output that is low by default on power-up. If the host output is tri-stated, add a 1 MOhm pull down resistor to ensure a low level at power-up.

8 BT_TXD Digital I/O,

Programmable pull up

9 BT_RXD Digital I/O,

Programmable pull up

10 I2C_SDA_S Digital I/O,

Programmable pull up

11 I2C_SCL_S Digital I/O,

Programmable pull up

12 VDDIO Power Digital I/O power supply.

13 GND GND Ground pin.

14 GPIO3 Digital I/O,

Programmable pull up

Bluetooth UART transmit data output pin.

Bluetooth UART receive data input pin.

• I2C Slave data pin.

• Used only for debug development purposes. It is recommended to add a test point for this pin.

• I2C is the default configuration. <TBD>

• I2C Slave clock pin.

• Used only for debug development purposes. It is recommended to add a test point for this pin.

• I2C is the default configuration. <TBD>

General Purpose Input/Output pin.

15 GPIO4 Digital I/O,

Programmable pull up

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General Purpose Input/Output pin.

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ATWINC3400-MR210CA

Pin # Pin Name Pin Type Description

16 UART_TXD Digital I/O,

Programmable pull up

17 UART_RXD Digital I/O,

Programmable pull up

18 VBAT Power Power supply pin for DC/DC converter and PA.

19 CHIP_EN Digital Input • PMU enable pin.

20 RTC_CLK Digital I/O,

Programmable pull up

• Wi-Fi UART TxD output pin.

• Used only for debug development purposes. It is recommended to add a test point for this pin.

• Wi-Fi UART RxD input pin.

• Used only for debug development purposes. It is recommended to add a test point for this pin.

• When the CHIP_EN pin is asserted high, the module is enbled. When the CHIP_EN pin is asserted low, the module is disabled or put into Power-Down mode.

• Connect to a host output that is low by default at power-up. If the host output is tri-stated, add a 1 MOhm pull down resistor if necessary to ensure a low level at power-up.

• RTC Clock input pin.

• This pin must connect to a 32.768 kHz clock source.

21 GND GND Ground pin.

22 GPIO8 Digital I/O,

Programmable pull up

23 SPI_SCK Digital I/O,

Programmable pull up

24 SPI_MISO Digital I/O,

Programmable pull up

25 SPI_SSN Digital I/O,

Programmable pull up

26 SPI_MOSI Digital I/O,

Programmable pull up

27 GPIO7 Digital I/O,

Programmable pull up

28 GND GND Ground pin.

29 GPIO17 Digital I/O,

Programmable pull up

30 GPIO18 Digital I/O,

Programmable pull up

General Purpose Input/Output pin.

SPI clock pin.

SPI MISO (Master In Slave Out) pin.

Active-low SPI SSN (Slave Select) pin.

SPI MOSI (Master Out Slave In) pin.

General Purpose Input/Output pin.

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ATWINC3400-MR210CA

Pin # Pin Name Pin Type Description

31 GPIO19 Digital I/O,

32 GPIO20 Digital I/O,

33 IRQN Digital output,

34 I2C_SCL_M Digital I/O,

35 I2C_SDA_M Digital I/O,

36 GND GND Ground pin.

37 PADDLE VSS Power Connect to system board ground.

3.1 Package Description

The following table provides the ATWINC3400-MR210CA module package dimensions.

Programmable pull up

General Purpose Input/Output pin.

• ATWINC3400-MR210CA module host interrupt request output pin.

• This pin must connect to a host interrupt pin.

I2C Master clock pin.

I2C Master data pin.

Table 3-2. ATWINC3400-MR210CA Module Package Information

Parameter Value Unit

Pad count 36 -

Package size 22.43 x 14.73 mm

Total thickness 2.09

Pad pitch 1.20

Pad width 0.81

Exposed pad size 4.4 x 4.4

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4. Electrical Characteristics

This chapter provides an overview of the electrical characteristics of the ATWINC3400-MR210CA module.

4.1 Absolute Maximum Ratings

The following table provides the absolute maximum ratings for the ATWINC3400-MR210CA module.

Table 4-1. ATWINC3400-MR210CA Module Absolute Maximum Ratings

Symbol Parameter Min. Max. Unit

VDDIO I/O supply voltage -0.3 5.0 V

VBAT Battery supply voltage -0.3 5.0

ATWINC3400-MR210CA

AIN

ESDHBM

Digital input voltage -0.3 VDDIO

Analog input voltage -0.3 1.5

Eelectrostatic dischage Human Body Model

-1000, -2000 (see notes below)

+1000, +2000 (see

notes below)

(HBM)

Storage temperature -65 150 ºC

- Junction temperature - 125

- RF input power - 23 dBm

1. VIN corresponds to all the digital pins.

2. For V

ESDHBM

, each pin is classified as Class 1, or Class 2, or both:

2.1. The Class 1 pins include all the pins (both analog and digital).

2.2. The Class 2 pins include all digital pins only.

2.3. V

ESDHBM

is ±1 kV for Class 1 pins. V

ESDHBM

is ± 2 kV for Class 2 pins.

Caution: Stresses beyond those listed under “Absolute Maximum Ratings” cause permanent damage to the device. This is a stress rating only. The functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods affects the device reliability.

4.2 Recommended Operating Conditions

The following table provides the recommended operating conditions for the ATWINC3400-MR210CA module.

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Table 4-2. ATWINC3400-MR210CA Module Recommended Operating Conditions

Symbol Parameter Min. Typ. Max. Units

VDDIO I/O supply voltage

VBAT Battery supply voltage

- Operating temperature -40 - 85

Note:

1. I/O supply voltage is applied to the VDDIO pin.

2. Battery supply voltage is applied to the VBAT pin.

3. The ATWINC3400-MR210CA module is functional across this range of voltages; however, optimal RF performance is guaranteed for VBAT in the range ≥ 3.0V VBAT ≤ 4.2V.

4.3 DC Characteristics

The following table provides the DC characteristics for the ATWINC3400-MR210CA module digital pads.

Table 4-3. DC Electrical Characteristics

(1)

(2)(3)

ATWINC3400-MR210CA

2.7 3.3 3.6 V

3.0 3.6 4.2 V

Symbol Parameter Min Typ Max Unit

Input Low

-0.30 - 0.60 V

Voltage

Input High

VDDIO-0.60 - VDDIO+0.30

Voltage

Output Low

- - 0.45

Voltage

Output High

VDDIO-0.50 - -

Voltage

- Output Load

- - 20 pF

Capacitance

- Digital Input

- - 6 Load Capacitance

4.4 IEEE 802.11 b/g/n Radio Performance

4.4.1 Receiver Performance

The receiver performance is tested under following conditions:

• VBAT = 3.3V

• VDDIO = 3.3V

• Temp = 25°C

• Measured after RF matching network

The following table provides the receiver performance characteristics for the ATWINC3400-MR210CA module.

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ATWINC3400-MR210CA

Table 4-4. IEEE 802.11 Receiver Performance Characteristics

Parameter Description Min. Typ. Max. Unit

Frequency - 2,412 - 2,472 MHz

Sensitivity 802.11b 1 Mbps DSSS - -95.0 - dBm

2 Mbps DSSS - -93.5 -

5.5 Mbps DSSS - -90.0 -

11 Mbps DSSS - -86.0 -

Sensitivity 802.11g 6 Mbps OFDM - -90.0 - dBm

9 Mbps OFDM - -88.5 -

12 Mbps OFDM - -86.0 -

18 Mbps OFDM - -84.5 -

24 Mbps OFDM - -82.0 -

36 Mbps OFDM - -78.5 -

48 Mbps OFDM - -74.5 -

Sensitivity 802.11n (BW=20 MHz, 800ns GI)

Maximum receive signal level

Adjacent channel rejection

54 Mbps OFDM - -73.0 -

MCS 0 - -89.0 - dBm

MCS 1 - -87.0 -

MCS 2 - -84.0 -

MCS 3 - -81.5 -

MCS 4 - -78.0 -

MCS 5 - -74.0 -

MCS 6 - -72.0 -

MCS 7 - -70.0 -

1-11 Mbps DSSS - 0 - dBm

6-54 Mbps OFDM - 0 -

MCS 0 - 7 (800ns GI) - 0 -

1 Mbps DSSS (30 MHz offset) - 50 - dB

11 Mbps DSSS (25 MHz offset) - 43 -

6 Mbps OFDM (25 MHz offset) - 40 -

54 Mbps OFDM (25 MHz offset) - 25 -

MCS 0 – 20 MHz BW (25 MHz offset)

MCS 7 – 20 MHz BW (25 MHz offset)

- 40 -

- 20 -

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4.4.2 Transmitter Performance

The transmitter performance is tested under following conditions:

• VBAT = 3.3V

• VDDIO = 3.3V

• Temp = 25°C

The following table provides the transmitter performance characteristics for the ATWINC3400-MR210CA module.

Table 4-5. IEEE 802.11 Transmitter Performance Characteristics

Parameter Description Minimum Typical Max. Unit

Frequency - 2,412 - 2,472 MHz

Output power 802.11b 1 Mbps - 16.7

Tx power accuracy - - ±1.5

ATWINC3400-MR210CA

802.11b 11 Mbps - 17.5

802.11g OFDM 6 Mbps - 18.3

802.11g OFDM 54 Mbps - 13.0

802.11n HT20 MCS 0 (800ns GI)

802.11n HT20 MCS 7 (800ns GI)

- 17.5

- 12.5

(1)

(2)

- dBm

- dB

Carrier suppression - - 30.0 - dBc

Harmonic output power (Radiated, Regulatory mode)

Note:

1. Measured at IEEE 802.11 specification compliant EVM/Spectral mask.

2. Measured after RF matching network.

3. Operating temperature range is -40°C to +85°C. RF performance guaranteed at room temperature of 25°C with a 2-3dB change at boundary conditions.

4. With respect to Tx power, different (higher/lower) RF output power settings may be used for specific antennas and/or enclosures, in which case recertification may be required.

5. The availability of some specific channels and/or operational frequency bands are country dependent and should be programmed at the host product factory to match the intended destination. Regulatory bodies prohibit exposing the settings to the end user. This requirement needs to be taken care of via host implementation.

4.5 Bluetooth Radio Performance

4.5.1 Receiver Performance

The receiver performance is tested under following conditions:

• VBAT = 3.3V

- - -41 dBm/MHz

- - -41

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ATWINC3400-MR210CA

• VDDIO = 3.3V

• Temp: 25°C

• Measured after RF matching network.

The following table provides the Bluetooth receiver performance characteristics for the ATWINC3400MR210CA module.

Table 4-6. Bluetooth Receiver Performance Characteristics

Parameter Description Min. Typ. Max. Unit

Frequency - 2,402 - 2,480 MHz

Sensitivity (ideal Tx) Bluetooth Low Energy (GFSK) - -92.5 - dBm

Maximum receive signal level

Interference performance (Bluetooth Low Energy)

4.5.2 Transmitter Performance

The transmitter performance is tested under following conditions:

• VBAT = 3.3V

• VDDIO = 3.3V

• Temp: 25°C

• Measured after RF matching network.

Bluetooth Low Energy (GFSK) - -3.5 -

Co-channel - 12 dB

adjacent + 1 MHz - 0 -

adjacent - 1 MHz - 3 -

adjacent + 2 MHz(image frequency)

adjacent - 2 MHz - -41 -

adjacent + 3 MHz (adjacent to image)

adjacent - 3 MHz - -35 -

adjacent + 4 MHz - -45 -

adjacent - 4 MHz - -30 -

adjacent +5 MHz - -34 -

adjacent - 5 MHz - -30 -

- -25 -

- -35 -

The following table provides the Bluetooth transmitter performance characteristics for the ATWINC3400MR210CA module.

Table 4-7. Bluetooth Transmitter Performance Characteristics

Parameter Description Min. Typ. Max. Unit

Frequency - 2,402 - 2,480 MHz

Output power Bluetooth Low Energy (GFSK) - 3.2 3.7 dBm

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ATWINC3400-MR210CA

Parameter Description Min. Typ. Max. Unit

In-band spurious emission (Bluetooth Low Energy)

4.6 Timing Characteristics

4.6.1 I2C Slave Timing

The I2C Slave timing diagram for the ATWINC3400-MR210CA module is shown in the following figure.

Figure 4-1. I2C Slave Timing Diagram

N+2 (Image frequency) - -33 -

N + 3 (Adjacent to image

- -32 -

frequency)

N-2 - -50 -

N-3 - -49 -

The following table provides the I2C Slave timing parameters for the ATWINC3400-MR210CA module.

Table 4-8. I2C Slave Timing Parameters

Parameter Symbol Min. Max. Units Remarks

SCL Clock Frequency f

SCL Low Pulse Width t

SCL High Pulse Width t

SCL, SDA Fall Time t

SCL, SDA Rise Time t

START Setup Time t

START Hold Time t

SDA Setup Time t

SDA Hold Time t

SCL

SUSTA

HDSTA

SUDAT

HDDAT

Draft Datasheet Preliminary

0 400 kHz -

1.3 -

µs

0.6 - -

- 300

0.6 -

This is dictated by external components

µs

0.6 - -

100 - ns -

0 - ns Slave and Master Default

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ATWINC3400-MR210CA

Parameter Symbol Min. Max. Units Remarks

STOP Setup Time t

Bus Free Time Between STOP and START

Glitch Pulse Reject t

4.6.2 SPI Slave Timing

The SPI Slave timing for the ATWINC3400-MR210CA module is provided in the following figures.

Figure 4-2. SPI Slave Clock Polarity and Clock Phase Timing

SUSTO

BUF

40 - µs

Master Programming Option

0.6 -

µs

1.3 - -

0 50 ns -

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+ 38 hidden pages

Microchip Technology WINC3400 User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual

Introduction

Features

Table of Contents

1. Ordering Information and Module Marking

2. Block Diagram

3. Pinout and Package Information

3.1 Package Description

4. Electrical Characteristics

4.1 Absolute Maximum Ratings

4.2 Recommended Operating Conditions

4.3 DC Characteristics

4.4 IEEE 802.11 b/g/n Radio Performance

4.4.1 Receiver Performance

4.4.2 Transmitter Performance

4.5 Bluetooth Radio Performance

4.5.1 Receiver Performance

4.5.2 Transmitter Performance

4.6 Timing Characteristics

4.6.1 I2C Slave Timing

4.6.2 SPI Slave Timing