M
High Current Charge Pump DC-to-DC Converter
TC962
Features
• Pin Compatible With TC7662/ICL7662/SI7661
• High Output Current 80mA
• No External Diodes Required
• Wide Operating Range 3V to 18V
• Low Output Impedance 28Ω Typ.
• No Low Voltage Terminal Required
• Application Zener On-Chip
• OSC Frequency Doubling Pin Option for Smaller
Output Capacitors
Applications
• Laptop Computers
• Disk Drives
• Process Instrumentation
• µP-Based Controllers
Device Selection Table
Part
Number
TC962COE 16-Pin SOIC Wide 0°C to +70°C
TC962CPA 8-Pin Plastic DIP 0°C to +70°C
TC962EPA 8-Pin Plastic DIP -40°C to +85°C
TC962IJA 8-Pin CERDIP -25°C to +85°C
TC962MJA 8-Pin CERDIP -55°C to +125°C
Package
Operating
Temp.
Range
General Description
The TC962 is an advanced version of the industry
standard TC7662 high voltage DC-to-DC converter.
Using improved design techniques and CMOS
construction, the TC962 can source as much as 80mA
versus the 7662’s 20mA capability.
As an inverter, the TC962 can put out voltages as high
as 18V and as low as 3V without the need for external
diodes. The output impedance of the device is a low
28Ω (with the proper capacitors), voltage conversion
efficiency is 99.9%, and power conversion efficiency is
97%.
The low voltage terminal (pin 6) required in some
TC7662 applications has been eliminated. Grounding
this terminal will double the oscillator frequency from
12kHz to 24kHz. This will allow the use of smaller
capacitors for the same output current and ripple, in
most applications. Only two external capacitors are
required for inverter applications. In the event an
external clock is needed to drive the TC962 (such as
paralleling), driving this pin directly will cause the
internal oscillator to sync to the external clock.
Pin 1, which is used as a test pin on the 7662, is a
voltage reference zener on the TC962. This zener
(6.4V at 5mA) has a dynamic impedance of 12Ω and is
intended for use where the TC962 is supplying current
to external regulator circu itry and a reference is neede d
for the regulator circuit. (See Section 3.0 Applications
Information).
The TC962 is compatible with the LTC1044, SI7661
and ICL7662. It should be used in designs that require
greater power and/or less input to output voltage drop.
It offers superior performance over the ICL7660S.
Package Type
16-Pin SOIC Wide
Zener
NC
C
NC
GND
NC
C
NC
1
2
+
3
4
TC962COE
5
6
–
7
8
8-Pin DIP
8-Pin CERDIP
Zener
1
+
C
–
C
•
TC962CPA
2
TC962EPA
3
TC962IJA
4
TC962MJA
Cathode
GND
2002 Microchip Technology Inc. DS21484B-page 1
V
8
C
7
6
FREQ x 2
V
5
DD
OSC
OUT
Cathode
16
15
14
13
12
11
10
9
V
DD
NC
C
OSC
NC
FREQ x 2
NC
V
OUT
NC
TC962
Functional Block Diagram
FREQ x 2
OSC/C
Timing
Zener
Cathode
6
–
7
II
+
–
Comparator
with Hysteresis
1
6.4V
8
V
DD
TC962
Level
Q
F/F
C
Q
V
REF
Shift
Level
Shift
Level
Shift
P SW1
N SW4
N SW2
2
+
+
CAP
C
P
External
OUT
GND
3
+
C
R
EXT
Level
Shift
N SW3
4
CAP
–
5
V
OUT
R
L
DS21484B-page 2 2002 Microchip Technology Inc.
TC962
1.0 ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings*
Supply Voltage (VDD to GND)..............................+18V
Input Voltage Any Pin
......................... (V
Current Into Any Pin............................................10mA
ESD Protection ................................................±2000V
Output Short Circuit ........... Continuous (at 5.5V Input)
Package Power Dissipation (T
SOIC.......................................................760 mW
PDIP........................................................730 mW
CERDIP ..................................................800 mW
Package Thermal Resistance
CERDIP, Rθ
PDIP, Rθ
J-A
............................................140°C/W
J-A
Operating Temperature Range
CPA, COE .......................................0°C to +70°C
IJA................................................-25°C to +85°C
EPA ..............................................-40°C to +85°C
MJA............................................-55°C to +125°C
Storage Temperature Range .............-65°C to +150°C
+0.3) to (VSS -0.3) (Note 1)
DD
≤ 70°C)
A
.........................................90°C/W
*Stresses above those listed under "Absolute Maximum
Ratings" may cause permanent damage to the device. These
are stress ratings only and functional operation of the device
at these or any other conditions above those indicated in the
operation sections of the specifications is not implied.
Exposure to Absolute Maximum Rating conditions for
extended periods may affect device reliability.
TC962 ELECTRICAL SPECIFICATIONS
Electrical Characteristics: VDD = 15V, TA = 25°C (See Figure 3-1) unless otherwise noted.
Symbol Parameter Min Typ Max Units Test Conditions
V
DD
I
S
R
O
F
OSC
P
EFF
V
DEF
V
Z
Z
ZT
Note 1: Connecting any input terminal to voltages greater than V+ or less than GND may cause destructive latch-up. It is recommended that no
Supply Voltage 3 — 18 V
Supply Current
V
= 15V
DD
= 5V
V
DD
Output Source
Resistance
Oscillator Frequency —
Power Efficiency 93
Voltage Efficiency 99
Zener Voltage 6.0 6.2 6.4 V IZ = 5mA
Zener Impedance — 12 — Ω IL = 2.5mA to 7.5mA
inputs from sources operating from external supplies be applied prior to "power up" of the TC962.
—
—
—
—
—
—
—
—
—
—
—
—
—
96
—
510
560
650
190
210
210
32
35
—
12
24
97
—
99.9
—
—
—
700
—
—
—
—
—
37
40
50
—
—
—
—
—
—
—
µAR
Ω I
kHz Pin 6 Open
%RL = 2kΩ
%RL = ∞
= ∞
L
TA = +25°C
≤ T
≤ +70°C
0
A
≤ T
-55°C
T
= +25°C
A
≤ T
≤ +70°C
0
A
≤ T
-55°C
= 20mA, VDD = 15V
L
= 80mA, VDD = 15V
I
L
= 3mA, VDD = 5V
I
L
Pin 6 GND
Over temperature range
A
A
≤ +125°C
≤ +125°C
2002 Microchip Technology Inc. DS21484B-page 3
TC962
2.0 PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 2-1.
TABLE 2-1: PIN FUNCTION TABLE
Pin No.
(8-Pin DIP)
(8-Pin CERDIP)
1 Zener Cathode Cathode of internal zener diode.
2C
3 GND Ground terminal.
4C
5V
6 FREQ x 2 If grounded, frequency doubles.
7C
8V
Symbol Description
+
-
OUT
OSC
DD
Positive side of external CP capacitor (pump cap).
Negative side of external CP capacitor (pump cap).
Output voltage.
Capacitor to GND will decrease frequency.
Input voltage.
Pin No.
(16-Pin SOIC)
1 Zener Cathode Cathode of internal zener diode.
2 NC No connect.
3C
4 NC No connect.
5 GND Ground terminal.
6 NC No connect.
7C
8 NC No connect.
9 NC No connect.
10 V
11 NC No connec t.
12 FREQ x 2 If grounded, frequency doubles.
13 NC No connect.
14 C
15 NC No connect.
16 V
Symbol Description
+
-
OUT
OSC
DD
Positive side of external CP capacitor (pump cap).
Negative side of external CP capacitor (pump cap).
Output voltage.
Capacitor to GND will decrease frequency.
Input voltage.
DS21484B-page 4 2002 Microchip Technology Inc.
TC962
OUT
3.0 APPLICATIONS INFORMATION
3.1 Theory of Operation
The TC962 is a capacitive pump (som etimes cal led a
switched capacitor circuit), where four MOSFET
switches control the charge and discharge of a
capacitor.
The functional block diagram shows how the switching
action works. SW1 and SW2 are turned on simultaneously, charging C
assumes that the on resistance of the MOSFETs in
series with the capacitor results in a charging time
(3 time constants) that is less than the on time provi ded
by the oscillator frequency as shown:
3 (R
DS(ON) CP
In the next cycle, SW1 and SW2 are turned off and after
a very short interval of all switches being off (this
prevents large currents from occurring due to cross
conduction), SW3 and SW4 are turned on. The charge
is then transferred to CR, but with the polarity
in C
P
inverted. In this way, a neg ative voltage is now derived.
An oscillator supplies pulses to a flip-flop that is then
fed to a set of level shifters. These level shifters then
drive each set of switches at one-half the oscillator
frequency.
The oscillator has two pi ns that control the frequency of
oscillation. Pin 7 can have a capacitor added that is
returned to ground. This will low e r the frequ en cy of th e
oscillator by adding c apa cit an ce to the timing cap acito r
to the supply voltage, VIN. This
P
) < CP/(0.5 f
OSC
)
internal to the TC962. Grounding pin 6 will turn on a
current source and double the frequency. This will
double the charge current going into the internal
capacitor, as well a s any capacitor added to pin 7.
A zener diode has be en add ed to the TC96 2 f or use as
a referenc e in b uildin g extern al regu lator s. This zener
runs from pin 1 to ground.
3.2 Latch Up
All CMOS structures contain a parasitic SCR. Care
must be tak en to p revent any i nput f rom goin g above or
below the supply rail, or latch up will occur. The result
C
R
and VSS.
DD
I
I
R
10µF
+
S
+
V
(+5V)
L
L
V
OUT
(–5V)
of latch up is an effective short between V
Unless the power supply input has a current limit, this
latch up phenomen a will result in da mage to the de vice.
(See AN763 Latch-up Protection of CMOS ICs.)
FIGURE 3-1: TEST CIRCUIT
690
NC
C
1
2
+
10µF
P
3
4
TC962
8
7
C
OSC
5
FIGURE 3-2: TYPICAL APPLICATIONS
Combined Negative Converter and Positive Multiplier
+
V
1
2
+
10µF
TC962
TC962
3
4
C
P1
C
P2
1
2
+
10µF
C
P1
3
4
8
7
6
V
OUT
5
10µF
+
8
7
6
5
+
+
V
+
10µF
C
P2
= –V
1
2
3
4
V
+
TC962
D1
V
D2
C
R1
Split V+ In Half
+
V
1
2
10µF
V
=
OUT
+
2V –2V
10µF
D
+
+
C
P
3
4
TC962
8
7
6
5
+
C
R
V
10µF
Positive Voltage MultiplierLowering Output Resistance by Paralleling Devices
+
V
8
7
6
5
V
C
R
OUT
10µF
+
1
2
TC962
3
4
8
7
6
5
V
D1
V
D2
10µF
C
P
C
V
=
OUT
+
2V –2V
++
10µF
P
D
2002 Microchip Technology Inc. DS21484B-page 5
TC962
4.0 TYPICAL CHARACTERISTICS
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are pro vided for information al purposes only. The performance chara cteristics listed h erein are
not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Circuit of Figure 3-1, CP = CR = 10µF, C
Supply Current vs. Temperature
700
600
500
+
400
300
200
SUPPLY CURRENT (µA)
100
0
-60 -40 -20 0 20 40 60 80 100 120 140
TEMPERATURE (°C)
Output Resistance vs. Temperature
80
70
Ω
60
+
V = 5V IL = 3mA
50
40
30
OUTPUT RESISTANCE ( )
20
10
-60 -40 -20 0 20 40 60 80 100 120 140
V = 15V IL = 20mA
TEMPERATURE (°C)
V = 15V
+
V = 15V
+
PESR
≈ C
RESR
≈ 1Ω.
Oscillator Frequency vs. C
10k
1k
100
FREQUENCY (Hz)
10
10 100 1000 10,000
1
CAPACITANCE (pF)
Current vs. Zener Voltage
TA = +25°C
50
40
30
20
CURRENT (mA)
10
0
4.5
4.0
5.5 6.0 6.5 7.0
ZENER VOLTAGE (V)
OSC
TA = +25°C
Frequency vs. Temperature
20
18
16
14
12
10
FREQUENCY (kHz)
8
6
-60 -40 -20 0 20 40 60 80 100 120 140
C
= FREQ x 2 = OPEN
OSC
TEMPERATURE (°C)
Power Conversion Efficiency vs. I
100
90
EFFICIENCY
80
70
60
50
40
30
20
10
POWER CONVERSION EFFICIENCY (%)
0
824405672
16 32 48 64 80
TA = +25°C
SUPPLY
CURRENT
LOAD CURRENT (mA)
LOAD
150
135
120
105
90
75
60
45
SUPPLY CURRENT (mA)
30
15
0
Output Resistance vs. Input Voltage
110
100
90
Ω
80
70
3mA
60
50
40
30
OUTPUT RESISTANCE ( )
20
10
0
20mA
4 8 12 16 20
2 6 10 14 18
INPUT VOLTAGE (V)
TA = +25°C
DS21484B-page 6 2002 Microchip Technology Inc.
5.0 PACKAGING INFORMATION
)
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)
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)
)
.
.
)
)
)
)
)
)
)
)
)
)
)
)
)
3
)
)
)
)
3
)
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)
)
)
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)
)
)
)
)
)
)
)
)
)
8-Pi
P
5.1 Package Marking Information
Package marking data not available at this time.
5.2 Package Dimensions
8-Pin CDIP (Narrow)
.110 (2.79
.090 (2.29
.300 (7.62
.230 (5.84
TC962
.055 (1.40) MAX
.200 (5.08
.160 (4.06
.200 (5.08
.125 (3.18
n Plastic DI
.045 (1.14
.030 (0.76
.400 (10.16
.370 (9.40
.065 (1.65
.045 (1.14
.400 (10.16
.348 (8.84
.020 (0.51
.016 (0.41
.070 (1.78
.040 (1.02
.020 (0.51) MIN
.040 (1.02
.020 (0.51
.150 (3.81
.260 (6.60
.240 (6.10
.015 (0.38
.008 (0.20
.320 (8.13
.290 (7.37
.400 (10.16
.320 (8.13
Dimensions: inches (mm)
.310 (7.87
.290 (7.37
.200 (5.08
.140 (3.56
.150 (3.81
.115 (2.92
.110 (2.79
.090 (2.29
.022 (0.56
.015 (0.38
.040 (1.02
.020 (0.51
.015 (0.38
.008 (0.20
.400 (10.16
.310 (7.87
Dimensions: inches (mm)
2002 Microchip Technology Inc. DS21484B-page 7
TC962
(
)
)
)
)
Package Dimensions (Continued)
16-Pin SOIC (Wide)
PIN 1
.413 (10.49)
.398 (10.10)
.050 (1.27) TYP.
.019 (0.48)
.014 (0.36)
.299 (7.59)
.291 (7.40)
.012 (0.30)
.004 (0.10)
.419 (10.65)
.398 (10.10)
.104 (2.64)
.097 (2.46)
8°
.050 (1.27
.016 (0.40
.013
0.33
.009 (0.23
Dimensions: inches (mm)
DS21484B-page 8 2002 Microchip Technology Inc.
TC962
Sales and Support
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1. Your local Microchip sales office
2. The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277
3. The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
New Customer Notification System
Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
2002 Microchip Technology Inc. DS21484B-page9
TC962
NOTES:
DS21484B-page10 2002 Microchip Technology Inc.
TC962
Information contained in this publication regarding device
applications and the like is intended through suggestion only
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
No representation or warranty is given and no liability is
assumed by Microchip Technology Incorporated with respect
to the accuracy or use of such information, or infringement of
patents or other intellectual property rights arising from such
use or otherwise. Use of Microchip’s products as critical components in life support systems is not authorized except with
express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property
rights.
Trademarks
The Microchip name and logo, the Microchip logo, FilterLab,
EELOQ, microID, MPLAB, PIC, PICmicro, PICMASTER,
K
PICSTART, PRO MATE, SEEVAL and The Embedded Cont rol
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dsPIC, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB,
In-Circuit Serial Programming, ICSP, ICEPIC, microPort,
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MXDEV, PICC, PICDEM, PICDEM.net, rfPIC, Select Mode
and T otal Endurance are trademarks of Microchip T echnology
Incorporated in the U.S.A.
Serialized Quick Turn Programming (SQTP) is a service mark
of Microchip Technology Incorpora ted in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2002, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
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The Company’s quality system processes and
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code hoppin g
2002 Microchip Technology Inc. DS21484B-page 11
M
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Microchip Technology SRL
Centro Direzionale Colleoni
Palazzo Taurus 1 V. Le Colleoni 1
20041 Agrate Brianza
Milan, Italy
Tel: 39-039-65791-1 Fax: 39-039-6899883
United Kingdom
Arizona Microchip Technology Ltd.
505 Eskdale Road
Winnersh Triangle
Wokingham
Berkshire, England RG41 5TU
Tel: 44 118 921 5869 Fax: 44-118 921-5820
03/01/02
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DS21484B-page 12 2002 Microchip Technology Inc.
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