Microchip Technology TC7650CPD, TC7650CPA Datasheet

TC7650
Chopper Stabilized Operational Amplifier
Features
• Low Input Offset Voltage: 0.7µV Typ
• Low Input Offset Voltage Drift: 0.05µV/°C Max
• Low Input Bias Current: 10pA Max
• High Impedance DifferentialCMOS Inputs: 10
12
• High Open Loop Voltage Gain:120dB Min.
• Low Input NoiseVoltage: 2.0µVp-p
• High Slew Rate: 2.5V/µsec.
• Low Power Operation:20mW
• Output Clamp Speeds Recovery Time
• Compensated Internally for Stable Unity Gain Operation
• Direct Replacement for ICL7650
• Available in 8-Pin Plastic DIP and 14-Pin Plastic DIP Packages
Applications
• Instrumentation
• Medical Instrumentation
• Embedded Control
• Temperature Sensor Amplifier
• Strain GageAmplifier
Package Type
8-Pin DIP
1
C
A
INPUT
+
INPUT
2
TC7650CPA
3
V
SS
4
14-Pin DIP
C
B
1
C
A
2
NC
3
INPUT
+
INPUT
V
NC
SS
4
TC7650CPD
5
6
7
8
C
B
V
7
DD
6
OUTPUT
OUTPUT CLAMP
5
14
INT/EXT
13
EXT CLK IN
12
INT CLK OUT
V
11
DD
10
OUTPUT
9
OUTPUT CLAMP
C
8
RETN
Device Selection Table
Part
Number
TC7650CPA 8-PinPDIP 0°C to +70°C 5µV TC7650CPD 14-Pin PDIP 0°C to +70°C 5µV
Package
Temperature
Range
Max V
NC = NO INTERNAL CONNECTION
OS
2002 Microchip TechnologyInc. DS21463B-page 1
TC7650
General Description
The TC7650 CMOS chopper stabilized operational amplifier practically removes offset voltage error terms from system errorcalculations.The 5µVmaximum V
OS
specification, for example, represents a 15 times improvement over the industry standard OP07E. The 50nV/°C offset drift specification is over25 times lower than the OP07E. The increased performance elimi­nates V
trim procedures, periodic potentiometer
OS
adjustmentandthereliability problemscausedbydam­aged trimmers.
The TC7650 performance advantages are achieved without the additional manufacturing complexity and cost incurred with laser or "zener zap" V
trim tech-
OS
niques.
Functional Block Diagram
Output
Clamp
Inputs
Output Clamp
Circuit
Main Amplifier
The TC7650 nulling scheme corrects both DC V
OS
errors and VOSdrift errors with temperature. A nulling amplifieralternately correctsitsown V main amplifier V
error. Offset nulling voltages are
OS
errorsandthe
OS
stored on two user supplied external capacitors. The capacitors connect to the internal amplifier V
OS
null points. The main amplifier input signal is never switched. Switching spikes are not present at the TC7650 output.
The 14-pin dual-in-line package (DIP) has an external oscillatorinput to drive the nulling circuitry for optimum noise performance. Both the 8 and 14-pin DIPs have an output voltage clamp circuit to minimize overload recoverytime.
14-Pin DIP Only
Oscillator
AB
INT/EXT EXT CLK IN CLK OUT
Output
NULL
Null Amplifier
A
Null
*
For 8-Pin DIP, connect to V
Intermod
Compensation
BB
ss
BA
C
B
C
A
TC7650
*C
RETN
DS21463B-page 2
2002 Microchip TechnologyInc.
TC7650
1.0 ELECTRICAL CHARACTERISTICS
*Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the dev ice. These are stress ratingsonly and functional operation ofthe device at these or any ot her conditions above those indi-
ABSOLUTE MAXIMUM RATINGS*
Total SupplyVoltage (VDDto VSS) .......................+18V
Input Voltage.................... (V
+0.3V)to (VSS–0.3V)
DD
cated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for ex tended periods my affect device reliability.
StorageTemperature Range..............-65°C to +150°C
Voltage on Oscillator Control Pins...............V
DD
to V
SS
Duration of Output Short Circuit.....................Indefinite
Current Into Any Pin............................................10mA
WhileOperating(Note 3)............................100µA
Package Power Dissipat ion (T
70°C)
A
8-Pin Plastic DIP.......................................730mW
14-Pin Plastic DIP.....................................800mW
Operating Temper ature Range
C Device .......................................... 0°C to +70°C
TC7652 ELECTRICAL SPECIFICATIONS
Electrical Characteristics: VDD=+5V,VSS=-5V,CA=CB=0.1µF, TA= +25°C, unless otherwise indicated.
Symbol Parameter Min. Typ Max Units Test Conditions
Input
V
OS
V
/T Input Offset Voltage A verage
OS
I
BIAS
I
OS
e
NP-P
I
N
R
IN
CMVR Common Mode Voltage Range -5 -5.2 to +2 +1.6 V CMRR Common Mode Rejection Ratio 120 130 dB CMVR = -5V to +1.5V
Output
A Large Signal Voltage Gain 120 130 dB R V
OUT
Dynamic
B
W
S
R
t
R
f
CH
Supply
V
DD,VSS
I
S
PSRR Power Supply Rejection Ratio 120 130 dB V Note 1: See " Output Clamp" discussion.
Input Offset Voltage
Temperature Coefficient Offset Voltage vs. Time 100 nV/
Input Bias Current
Input Offset Current 0.5 pA Input Noise Voltage 2 µV Input Noise Current — Input Resistance 10
Output Voltage Swing (Note 24.7
Clamp ON Current 25 70 200 µAR Clamp OFF Current 1 pA -4V < V
Unity Gain Bandwidth 2.0 MHz Unity Gain (+1) Slew Rate 2.5 V/µsec CL= 50pF, RL= 10k Rise Time 0.2 µsec Overshoot 20 % Internal Chopping Frequency 120 200 375 Hz Pins 12–14 Open (DIP)
Operating Supply Range 4.5 16 V Supply Current 2 3.5 mA No Load
2: Output clamp not connected. See typical characteristics curves for output swing versus clamp current characteristics. 3: Limiting input current to 100µA is recommended to avoid latch-up problems.
— — 0.01 0.05 µV/°C Operating Temperature Range
— —
±0.7 ±1.0
1.5 35
100
0.01
±4.85 ±4.95
±5
10 150 400
12
—pA/√Hz f=10Hz
— —
—µVTA= +25°C
Over Operating Temp Range
month
pA
TA= +25°C
pA
0°C ≤ T
pA
P-PRS
V V
A
-25°C ≤ T
= 100, 0 to 10Hz
=10k
L
RL=10k R
= 100k
L
= 100kΩ (Note 1)
L
OUT
=±3Vto±8V
S
+70°C
A
+85°C
<+4V(Note 1)
2002 Microchip TechnologyInc. DS21463B-page 3
TC7650
2.0 PIN DESCRIPTIONS
ThedescriptionsofthepinsarelistedinTable2-1.
TABLE 2-1: PIN FUNCTION TABLE
Pin Number
Symbol Description
8-pin DIP 14-pin DIP
1,8 2,1 C
A,CB
Nulling capacitor pins 2 4 -INPUT Inverting Input 3 5 +INPUT Non-inverting Input 47 V
SS
59OUTPUT
Negative Power Supply
Output VoltageClamp
CLAMP 6 10 OUTPUT Output 711 V
DD
Positive Power Supply — 3,6 NC No internal connection —8C
RETN
Capacitor current return pin — 12 INT CLK OUT Internal Clock Output — 13 EXT CLK IN External Clock Input — 14 INT/EXT
Select Internal or External Clock
3.0 DETAILED DESCRIPTION
3.1 Theory of Operation
Figure 3-1 shows the major elements of the TC7650. There are two amplifiers (the main amplifier and the nulling amplifier), and both have offset null capability. The main amplifier is connected full-time from the input to the output. The nullingamplifier, underthe control of the chopping frequency oscillator and clock circuit, alternatelynulls itselfandthemainamplifier.Twoexter­nal capacitors provide the required storage of the null­ing potentials and the necessary nulling loop time constants. The nulling arrangement operates over the full common mode and power supply ranges, and is also independentofthe output level, thus giving excep­tionally high CMRR, PSRR and A
Careful balancing of the input switches minimizes chopper frequency charge injection at the input termi­nals, and the feed forward type injection into the com­pensationcapacitor that can cause outputspikes in this type of circuit.
The circuit's offset voltage compensation is easily shown. With the nulling inputs shorted, a voltage almost identical to the nulling amplifier offset voltage is stored on C
. The effective offset voltage at the null
A
amplifier input is:
EQUATION 3-1:
V
OSE
----------------- -V
=
AN1+
1
OSN
VOL
.
After the nulling amplifier is zeroed, the main amplifier is zeroed; the A s witches open and B switches close.
The output voltage equation i s:
EQUATION 3-2:
V
OUT=AM[VOSM
+(V+-V-)+AN(V+-V-)+ANV
OSE
]
EQUATION 3-3:
V
+
OSMVOSN
V
OUTAMAN
V+V-–()
---------------- -------------------------- -+= A
N
As desired, the device offset voltages are reduced by the high open loop gai n of the nulling amplifier.
3.2 Output Stage/Loading
The output circuit is a high impedance stage (approxi­mately 18k). With loads less than this, the chopper amplifier behaves in some ways like a trans-conduc­tance amplifier whose open-loop gain isproportional to load resistance. For example, the open loop gain will be 17dB lower with a 1kload than with a 10kload. If the amplifier is used strictly for DC, the lower gain is of little consequence, since the DC gain is typically greaterthan 120dB, even with a1kload. In wideband applications, the best frequency response will be achieved with a load resistor of 10kor higher. This resultsin a s mooth 6dB/octave response from 0.1Hz to 2MHz, with phase shifts of less than 10° in the transi-
DS21463B-page 4
2002 Microchip TechnologyInc.
TC7650
tion region, where the main amplifier takes over from the null amplifier. The clock frequency sets the transi­tion region.
ing sum and difference frequencies, and causing dis­turbances to the gain and phase versus frequency characteristics near the chopping frequency. These effects are substantially reduced in the TC7650 by
3.3 Intermodulation
Previous chopper stabilized amplifiers have suffered from intermodulation effects between the chopper fre­quency and input signals. These arise because the finite AC gain of the amplifier results in a small AC sig­nal at the input. This is seen by the zeroing circuit as an
feeding the nulling circuit with a dynamic current corre­sponding to the compensation capacitor current in such a way as to cancel that portion of the input signal due to a finite AC gain. The intermodulation and gain/phase disturbances are held to very low values, and can gen­erally be ignored.
error signal, which is chopped and fed back, thus inject-
FIGURE 3-1: TC7650 CONTAI NS A NULLING AND MAIN AMPLIFIER. OFFSET CORRECTION
+
V
Analog Input
VOLTAGES ARE STORED ON TWO EXTERNAL CAPACITORS
+ Null
.
Main Amplifier
-
-
V
B
A
TC7650
+
Null
-
B
A
Null
Gain = A
M
C
B
C
A
Amplifier
V
OUT
Gain = A
FIGURE 3-2: NULLING CAPACITOR
CONNECTION
2
-
TC7650
3
+
1
V
DD
7
6
4
C
B
8
C
A
V
SS
V
V
DD
SS
11
4
-
TC7650
5
+
2
14-PIN PACKAGE 8-PIN PACKAGE
CAC
7
10
1
8
B
3.4 Nulling Capacitor Connection
The offset voltage correction capacitors are connected to C
and CB. The common capacitor connection is
A
made to V capacitorreturn (C The common connection should be made through a separatePCtraceorwiretoavoidvoltagedrops.The capacitorsoutside foil, if possible,shouldbe connected to C
RETN
(Pin 4) on the 8-pin packages and to
SS
,Pin8)onthe14-pinpackages.
RETN
or VSS.
, Offset = V
N
OSN
3.5 Clock Operation
The internal oscillator is set for a 200Hz nominal chop­pingfrequencyonboththe8-and14-pinDIPs.Withthe 14-pin DIP TC7650, the 200 Hz internal chopping fre­quency is available at the internal clock output (Pin 12). A 400Hz nominal signal will be present at the external clockinput pin (Pin 13) with INT/EXT is the internalclock signal before adivide-by-twooper­ation.
The 14-pin DIP device can be driven by an external clock. The INT/EXT
input (Pin 14) hasan internal pull­up and may be l eft open for internal clock operation. If an external clock is used, INT/EXT (Pin 7) to disable the internal clock. Theexternal clock signal is appliedto the external clock input (Pin 13).
The external clock amplitude should swing between V
and ground for power supplies up to ±6V and
DD
between V
+
and V+-6V for higher supply voltages.
At low frequencies the external clock duty cycle is not critical, since an internal divide-by-two gives the desired 50% switching duty cycle. The offset storage correction capacitorsare charged only whenthe exter­nal clock input is high. A 50% t o 80% external clock
highoropen. This
must be tied to V
SS
2002 Microchip TechnologyInc. DS21463B-page 5
TC7650
7
positive duty cycle is desired for frequencies above 500Hz to ensure transients settle before the internal switches open.
The external clock input can also be used as a strobe input. If a strobe signal is connected at the external clockinputsothatitisLOWduringthetimeanoverload signalis applied, neither capacitor will be charged. The leakage currents at t he capacitors pins arevery low. At 25°C a typical TC7650 willdrift less than 10µV/sec.
3.6 Output Clamp
Chopper-stabilized systems can show long recovery times from overloads. If the output is driven to either supply rail, output saturation occurs. The inputs are no longer held at a "virtual ground." The V treatsthedifferential signalas an offset and tries to cor­rect it by charging the external capacitors. The nulling circuit also saturates. Once the input signal returns to normal, the response time is lengthened by the long recovery time of the nulling amplifier and external capacitors.
Through an external clamp connection, the TC7650 eliminates the overload recovery problem by reduci ng the feedback network gain before the output voltage reaches either supply rail.
FIGURE 3-3: INTERNAL CLAMP CIRCUIT
Internal Positive Clamp Bias V+ - V
P-Channel
Output Clamp Pin
N-Channel
null circuit
OS
V+ - 0.
T
FIGURE 3-5: INVERTING AMPLIFIER WITH
OPTIONAL CLAMP
R
2
R
Input
*
Connect To V On 8-Pin DIP.
1
R
Clamp
TC7650
R
+
C
µ
0.1 F
C
*
(R For Full Clamp Effect
µ
0.1 F
Output
R2) 100 k
1
The output clamp circuit is shown in Figure 3-3, with typical inverting and non-inverting circuit connections shown in Figures 3-4 and 3-5. Output voltage versus clamp circuit current characteristics are shown in the typicaloperatingcurves.Fortheclamptobe fully effec­tive, the i mpedance across the clampoutput should be greater than 100kΩ.
3.7 Latch-Up Avoidance
Junction-isolated CMOS circuits inherently include a parasitic 4-layer (p-n-p-n) structure which has charac­teristics similar to an SCR. Under certain circum­stances this junction may be triggered into a low­impedance state,resultingin excessive supply current. To avoid this condition, no voltage greater t han 0.3V beyond the supply rails should be applied to anypin.In general, the amplifier supplies must be established either at the sametime or before any input signals are applied. If this is not possible, the drive circuits must limit input current flow to under 0.1mA to avoid latch­up.
FIGURE 3-4: NON-INVERTING AMPLIFIER
WITH OPTIONAL CLAMP
*
Connect To V On 8-Pin DIP.
Input
R3 + (R1/R2) ‡ 100 k For Full Clamp Effect
DS21463B-page 6
SS
0.1µF
C
+
R
TC7650
Clamp
*
C
R
3
Output
R
2
R
1
3.8 Thermoelectric Potentials
Precision DC measurements are ultimately limited by thermoelectric potentials developed in thermocouple junctions of dissimilar metals, alloys, silicon, etc. Unless all junctions are at the same temperature, ther­moelectric voltages, typically around 0.1µV/°C, but up to tens of µV/°C for some materials, will be generated. In ordertorealizethebenefitsextremely-lowoffsetvolt­ages provide, it is essential to take s pecial precautions to avoid temperature gradients. All components should be enclosed to eliminate air movement, especially thosecaused by power dissipatingelementsinthe sys­tem. Low thermoelectric co-efficient connections should be used where possible andpower supply volt­ages and power dissipation should be kept to a mini­mum. High impedance loads are preferable, and separationfrom surrounding heatdissipatingelements is advised.
2002 Microchip TechnologyInc.
TC7650
t
3.9 Pin Compatibility
On the 8-pin mini-DIP TC7650, the external null stor­age capacitors are connected to pins 1and 8. Onmost other operational amplifiers these are left open or are used for offset potentiometer or compensation capaci­tor connections.
For OP05 and OP07 operational amplifiers, t he replacement of the offset null potentiometer between pins 1 and8 by two capacitors from the pinsto V
SS
will convert the OP05/07 pin configurations for TC7650 operation. For LM108 devices, the compensation capacitoris replaced by the external nulling capacitors. The LM101/748/709 pinouts are modified similarly by removing any circuit connections to Pin 5. On the TC7650, Pin 5 is the output clamp connection.
Other operational amplifiers may use this pin as an off­set or compensation point.
The minor modifications needed to retrofit a TC7650 into existing sockets operating at reduced power sup­ply voltages make pr ototyping and circuit verification straightforward.
3.10 Input Guarding
High impedance, low leakage CMOS inputs allow the TC7650 to make measurements of high-impedance sources. Stray leakage paths can increase input cur­rents and decrease input resistance unless inputs are guarded.A guard is aconductivePCtrace surrounding the input terminals. The ring connects to a low imped­ance point at the same potential as the inputs. Stray leakagesare absorbed by the lowimpedance ring. The equal potential between ring and inputs prevents input leakagecurrents. Typicalguardconnections are shown in Figure 3-6.
The 14-pin DIP configuration has been specifically designed to ease input guarding. The pins adjacent to the inputs are unused.
In applications r equiring low leakage currents, boards should be cleaned thoroughly and blown dry after sol­dering. Protective coatings will prevent future board contamination.
FIGURE 3-6: INPUT GUARD CONNECTION
Inverting Amplifier
Input
R
1
R3*
R
2
-
+
Output
Noninverting Amplifier
R
2
*
R
R
1
NOTE: R3 =
3
Input
R
1 R2
R1 + R
-
+
Should Be Low Impedence For Optimum Guarding
2
Output
Follower
R3*
-
Outpu
Input
+
3.11 Component Selection
The two required capacitors,CAand CB, have optimum values, depending on the clock or choppingfrequency. For the preset internal clock, the correctvalue is 0.1µF. To maintain the same relationship between the chop­ping frequency and the nulling time constant, the capacitor values should be scaled in proportion to the external clock, if used. High quality film typecapacitors (such as Mylar) are preferred; ceramic or other lower grade capacitors may be suitablein some applications. For fast settling on initial turn-on, low dielectricabsorp­tion capacitors (such as polypropy lene) should be used. With c eramic capacitors, several seconds may be r equired to settle to 1µV.
2002 Microchip TechnologyInc. DS21463B-page 7
TC7650
(
g)
4.0 TYPICAL CHARACTERISTICS
Note: The graphs andtables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range ( e.g., outside specified power supplyrange) and therefore outside the warranted range.
1 mA
0.1 mA
0.01 mA
0.01 A
CLAMP CURRENT
0.01 nA
TA = +25˚C V
= ±5V
S
1 Am
0.1 A
m
m
1 nA
0.1 nA
1 pA
4.0 4.1 4.2 4.3 4.4 4.5 4.6 4.7 4.8 4.9 5.0
3.0 TA = +25˚C
2.6
2.2
1.8
SUPPLY CURRENT (mA)
1.4
1.0
5 6 7 8 9 101112 131415
Positive Clamp Current
vs. Output Voltage
OUTPUT VOLTAGE (V)
Supply Current vs.
Supply Voltage
SUPPLY VOLTAGE (V)
Negative Clamp Current
1 mA
1 Am
m
m
1 nA
1 pA
-4.0 -4.1 -4.2
TA = +25˚C V
= ±5V
S
0.1 mA
0.01 mA
0.1 A
0.01 A
CLAMP CURRENT
0.1 nA
0.01 nA
Gain/Phase vs. Frequency
30
20
10
0
10
20
GAIN (dB)
30
40
CLOSED-LOOP
–50
GAIN = 20
–60
1k 10k 100k 1M 10M
vs. Output Voltage
-4.4 -4.5 -4.6 -4.7 -4.8 -4.9 -5.0
-4.3
OUTPUT VOLTAGE (V)
PHASE
FREQUENCY (H )
z
GAIN
225
180
135
90
45
0
-45
-90
-135
-180
de
PHASE
DS21463B-page 8
2002 Microchip TechnologyInc.
5.0 PACKAGING INFORMATION
5.1 Package Marking Information
Package marking information not avai lable atthistime.
5.2 Package Dimensions
8-Pin Plastic DIP
PIN 1
.260 (6.60) .240 (6.10)
TC7650
.045 (1.14) .030 (0.76)
.200 (5.08) .140 (3.56)
.150 (3.81) .115 (2.92)
14-Pin PDIP (Narrow)
.400 (10.16)
.348 (8.84)
.110 (2.79) .090 (2.29)
.022 (0.56) .015 (0.38)
.770 (19.56) .745 (18.92)
.070 (1.78) .040 (1.02)
.040 (1.02) .020 (0.51)
.260 (6.60) .240 (6.10)
PIN 1
.015 (0.38) .008 (0.20)
Dimensions: inches (mm)
.310 (7.87) .290 (7.37)
.400 (10.16)
.310 (7.87)
.310 (7.87) .290 (7.37)
3˚MIN.
.200 (5.08) .140 (3.56)
.150 (3.81) .115 (2.92)
.110 (2.79) .090 (2.29)
2002 Microchip TechnologyInc. DS21463B-page 9
.070 (1.78) .045 (1.14)
.022 (0.56) .015 (0.38)
.040 (1.02) .020 (0.51)
.015 (0.38) .008 (0.20)
.400 (10.16)
.310 (7.87)
Dimensions: inches (mm)
3
˚
MIN.
TC7650
DS21463B-page 10
2002 Microchip TechnologyInc.
TC7650
SALES AND SUPPORT
Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences
and r ecommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1. Your localMicrochip sales office
2. The Microchip Corporate Literature CenterU.S. FAX: ( 480) 792-7277
3. The Microchip Worldwide Site (www.microchip.com) Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. New Customer Notification System Register on our web site (www.microchip.com/cn) to receive the mostcurrent information on our products.
2002 Microchip TechnologyInc. DS21463B-page 11
TC7650
NOTES:
DS21463B-page 12
2002 Microchip TechnologyInc.
Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. Itis your responsibility to ensure that your application meets with your specifications. No representation or warranty is given and no liability is assumed by Microchip Technology Incorporat ed with respect to the accuracy or use ofsuch information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use ofMicrochipsproductsascriticalcom­ponents in life support systems is not authorized except with express written approval by Microchip. No licenses are con­veyed, implicitly orotherwise, under any intellectual property rights.
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ASIA/PACIFIC
Australia
Microchip Technology Australia Pty Ltd Suite 22, 41Rawson Street Epping 2121, NSW Australia Tel: 61-2-9868-6733 Fax: 61-2-9868-6755
China - Beijing
Microchip Technology Consulting (Shanghai) Co., Ltd., Beijing Liaison Office Unit 915 Bei Hai Wan Tai Bldg. No. 6 Chaoyangmen Beidajie Beijing, 100027, No. China Tel: 86-10-85282100 Fax: 86-10-85282104
China - Chengdu
Microchip Technology Consulting (Shanghai) Co., Ltd., Chengdu Liaison Office Rm. 2401, 24th Floor, Ming Xing Financial Tower No. 88 TIDU Street Chengdu 610016, China Tel: 86-28-6766200 Fax: 86-28-6766599
China - Fuzhou
Microchip Technology Consulting (Shanghai) Co., Ltd., Fuzhou Liaison Office Unit 28F, World Trade Plaza No. 71 Wusi Road Fuzhou 350001, China Tel: 86-591-7503506 Fax: 86-591-7503521
China - Shanghai
Microchip Technology Consulting (Shanghai) Co., Ltd. Room 701, Bldg. B Far East International Plaza No. 317 Xian Xia Road Shanghai, 200051 Tel: 86-21-6275-5700 Fax: 86-21-6275-5060
China - Shenzhen
Microchip Technology Consulting (Shanghai) Co., Ltd., Shenzhen Liaison Office Rm. 1315, 13/F , Shenzhen Kerry Centre, Renminnan Lu Shenzhen 518001, China Tel: 86-755-2350361 Fax: 86-755-2366086
Hong Kong
Microchip Technology Hongkong Ltd. Unit 901-6, Tower 2, Metroplaza 223 Hing F ong Road Kwai Fong, N.T., HongKong Tel: 852-2401-1200 Fax: 852-2401-3431
India
Microchip Technology Inc. India Liaison Office Divyasree Chambers 1 Floor, Wing A (A3/A4) No. 11, OShaugnessey Road Bangalore, 560 025, India Tel: 91-80-2290061 Fax: 91-80-2290062
Japan
Microchip Technology Japan K.K. Benex S-1 6F 3-18-20, Shinyokohama Kohoku-Ku, Yokohama-shi Kanagawa, 222-0033, Japan Tel: 81-45-471- 6166 Fax: 81-45-471-6122
Korea
Microchip Technology Korea 168-1, Youngbo Bldg. 3Floor Samsung-Dong, K angnam-Ku Seoul, Korea 135-882 Tel: 82-2-554-7200 Fax: 82-2-558-5934
Singapore
Microchip Technology Singapore Pte Ltd. 200 Middle Road #07-02 Prime Centre Singapore, 188980 Tel: 65-6334-8870 Fax: 65-6334-8850
Ta iw an
Microchip Technology Taiwan 11F-3, No. 207 Tung Hua North Road Taipei, 105, Taiwan Tel: 886-2-2717-7175 Fax: 886-2-2545-0139
EUROPE
Denmark
Microchip Technology Nordic ApS Regus Business Centre Lautrup hoj 1-3 Ballerup DK-2750 Denmark Tel: 45 4420 9895 Fax: 45 4420 9910
France
Microchip Technology SARL Parc dActivite du Moulinde Massy 43 Rue du Saule Trapu Batiment A - ler Etage 91300 Massy, France Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79
Germany
Microchip Technology GmbH Gustav-Heinemann Ring 125 D-81739 Munich, Germany Tel: 49-89-627-144 0 Fax: 49-89-627-144-44
Italy
Microchip Technology SRL Centro Direzionale Colleoni Palazzo Taurus 1 V. Le Colleoni 1 20041 Agrate Brianza Milan, Italy Tel: 39-039-65791-1 Fax: 39-039-6899883
United Kingdom
Arizona Microchip Technology Ltd. 505 Eskdale Road Winnersh Triangle Wokingham Berkshire,England RG415TU Tel: 44 118 921 5869 Fax: 44-118 921-5820
03/01/02
DS21463B-page 14
2002 Microchip Technology Inc.
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