Microchip Technology TC7129 General Description Manual

TC7129

4-1/2 Digit Analog-to-Digital Converters with

On-Chip LCD Drivers

Features

• Count Resolution: ±19,999

• Resolution on 200mV Scale: 10µV

• True Differential Input and Reference

• Low Power Consumption: 500µA at 9V

• Direct LCD Driver for 4-1/2 D ig it s , Dec im al Po ints,
Low Battery Indicator, and Continuity Indicator

• Overrange and Underrange Outputs

• Range Select Input: 10:1

• High Common Mode Rejection Ratio: 110 dB

• External Phase Compensation Not Required

Applications

• Full-Featured Multimeters

• Digital Measu rem en t Dev ic es

Device Selection Table

Package

Code

TC7129CPL Normal 40-Pin PDIP 0°C to +70°C
TC7129CKW Formed 44-Pin PQFP 0°C to +70°C
TC7129CLW – 44-Pin PLCC 0°C to +70°C

Pin

Layout

Package

Temperature

Range

General Description

The TC7129 is a 4-1/2 di git Analog-to-Dig ital Con verter
(ADC) that directly drives a multiplexed Liquid Crystal
Display (LCD). Fabricated in high-performance, low­power CMOS, the TC7129 ADC is designed specifi­cally for high-resolution, battery-powered digital multi­meter applications. The traditional dual-slope method
of A/D conversion has been enhanced with a succes­sive integration technique to produce readings accu­rate to better than 0.005% of full-scale and resolution
down to 10 µV per count.

The TC7129 includes f eatures impor tant to multimeter
applications. It detects and ind icat es l ow bat ter y con di­tion. A continuity outp ut drives an annunciator on the
display and can be used with an external driver to sound
an audible alarm. Overrange and underrange o utputs,
along with a range-ch ange input, provi de the ability to
create auto-ranging instruments. For snapshot read­ings, the TC7129 includes a latch-and-hold input to
freeze the present reading. This combination of features
makes the TC7129 the ideal choice for full-featured
multimeter and digital measurement applications.

Typical Application

Low Battery

20

27262524232221

*

0.1 µF

10 kΩ

+

9V

 2004 Microchip Technology Inc. DS21459C-page 1

13141516171819

12

TC7129

29

28

+

1 µF

150 kΩ

9

1011

323130

–

Continuity

8

3534

36

20
kΩ

100 kΩ

*Note: RC network between pins 26 and 28 is not required.

+

0.1
µF

V

33

IN

39

3837

V+

5 pF

1234567

120 kHz

40

330 kΩ

10 pF

0.1 µF

V+

TC7129

Package Types

ANNUNICATOR

B2, C2, LO BATT

Display

Output

Lines

B

, C1, CONT

1

A

F1, E1, DP

A

F2, E2, DP

B3, C

A

F3, E3, DP

B4, C

A4, G4, D

F4, E4, DP

OSC3

, G1, D

1

, G2, D

2

MINUS

3

,

, G3, D

3

4

V

DP4/OR

OSC1

BC

,

BP

BP

BP

DISP

40-Pin PDIP

1

2

3

4

5

1

6

1

7

8

2

9

2

10

11

3

12

3

13

5

14

4

15

4

16

3

17

2

18

1

19

20

TC7129CPL

40

39

38

37

36

35

34

33

32

31

30

29

28

27

26

25

24

23

22

21

OSC2

DP

1

DP

2

RANGE

DGND

REF LO

REF HI

IN HI

IN LO

BUFF

-

C

REF

C

+

REF

COMMON

CONTINUITY

INT OUT

INT IN

V+

V-

LATCH/HOLD

DP3/UR

, E1, DP

F

1

B2, C2, BATT

, G2, D

A

2

F2, E2, DP

B3, C

MINUS

3

,

A

, G3, D

3

F3, E3, DP

B4, C

A4, G4, D

F4, E4, DP

44-Pin QFP 44-Pin PLCC

1

, D

, CONT

1

1

, G

, C

1

1

ANNUNCIATOR

OSC3

A

44 43 42 41 39 3840

1

1

B

OSC1NCOSC2

2

3

2

4

2

5

NC

6

7

3

8

3

BC

9

4

5

,

10

4

11

4

12 13 14 15 17 18

BP3BP

1

2

BP

TC7129CKW

16

/OR

4

DISP

V

DP

NC

/UR

3

DP

1DP2

DP

RANGE

37 36 35 34

19 20 21 22

V-

V+

DGND

33

32

31

30

29

28

27

26

25

24

23

INT IN

REF LO

REF HI

IN HI

IN LO

BUFF

NC

C

-

REF

C

+

REF

COMMON

CONTINUITY

INT OUT

F1, E1, DP

B2, C2, BATT

, G2, D

A

2

F2, E2, DP

B3, C

3

,

A

, G3, D

3

F3, E3, DP

B4, C

A4, G4, D

F4, E4, DP

MINUS

NC

BC

4

,

LATCH/HOLD

1

, D

, CONT

1

1

, G

, C

1

1

A

B

6543 1442

7

1

8

9

2

10

2

11

12

13

3

3

5

4

4

18 19 20 21 23 24

3BP2

BP

ANNUNCIATOR

OSC3

OSC1NCOSC2

TC7129CLW

22

1

/OR

BP

DISP

4

V

DP

NC

/UR

3

DP

DP1DP2RANGE

43 42 41 40

25 26 27 28

V-

V+

LATCH/HOLD

DGND

39

38

37

36

35

34

33

3214

3115

3016

2917

INT IN

REF LO

REF HI

IN HI

IN LO

BUFF

NC

-

C

REF

C

+

REF

COMMON

CONTINUITY

INT OUT

DS21459C-page 2  2004 Microchip Technology Inc.

TC7129

1.0 ELECTRICAL

CHARACTERISTICS

Absolute Maximum Ratings*

Supply Voltage (V+ to V-).......................................15V

*Stresses above those listed under “Absolute Maximum
Ratings” may cause permanent damage to the device. These
are stress ratings only and functional operation of the device
at these or any other conditions above those indicated in the
operation sections of the specifications is not implied.
Exposure to Absolute Maximum Rating conditions for
extended periods may affect device reliability.

Reference Voltage (REF HI or REF LO)........ V+ to V–

Input Voltage (IN HI or IN LO) (Note 1).......... V+ to V–

.......................................... V+ to (DGND – 0.3V)

V

DISP

Digital Input (Pins 1, 2, 19, 20,

21, 22, 27, 37, 39, 40).......................... DGND to V+

Analog Input (Pins 25, 29, 30) ....................... V+ to V–

Package Power Dissipation (T

≤ 70°C)

A

Plastic DIP .....................................................1.23W

PLCC .............................................................1.23W

Plastic QFP....................................................1.00W

Operating Temperature Range ...............0°C to +70°C

Storage Temperature Range..............-65°C to +150°C

TC7129 ELECTRICAL SPECIFICATIONS

Electrica l Characteristics: V+ to V– = 9V, V

Pin numbers refer to 40-pin DIP.

Symbol Parameter Min Typ Max Unit Test Conditions

= 1V, TA = +25°C, f

REF

= 120 kHz, unless otherwise indicated.

CLK

Input

Zero Input Reading –0000 0000 +0000 Counts V
Zero Reading Drift — ±0.5 — µV/°C V
Ratiometric Reading 9996 — 10000 Counts VIN = V

= 0V, 200 mV scale

IN

= 0V, 0°C < TA < +70°C

IN

= 1000 mV,

REF

Range = 2V

Range Change Accuracy 0.9999 1.0000 1.0001 Ratio V

= 1V on High Range,

IN

= 0.1V on Low Range

V

IN

RE Rollover Error — 1 2 Counts VIN– = VIN+ = 199 mV
NL Linearity Error — 1 — Counts 200mV Scale
CMRR Common Mode Rejection Ratio — 110 — dB V

= 1V, VIN = 0V,

CM

200 mV scale

CMVR Common Mode Voltage Range — (V-) +

—VV

IN

= 0V

1.5

— (V+) – 1 — V 200mV scale

e

N

Noise (Peak-to-Peak Value not
Exceeded 95% of Time)

I

IN

Input Leakage Current — 1 10 pA VIN = 0V, pins 32, 33
Scale Factor Temperature

Coefficient

— 14—µV

P-PVIN

— 2 7 ppm/°C V

= 0V

200 mV scale

= 199 mV,

IN

0°C < T
External V

< +70°C

A

REF

= 0 ppm/°C

Note 1: Input voltages may exceed supply voltages, provided input current is limited to ±400 µA. Currents above

this value may result in invalid display readings, but will not destroy the device if limited to ±1 mA.
Dissipation ratings assume device is mounted with all leads soldered to printed circuit board.

 2004 Microchip Technology Inc. DS21459C-page 3

TC7129

TC7129 ELECTRICAL SPECIFICATIONS (CONTINUED)

Electrica l Characteristics: V+ to V– = 9V, V

Pin numbers refer to 40-pin DIP.

Symbol Parameter Min Typ Max Unit Test Conditions
Power

V

COM

Common Voltage 2.8 3.2 3.5 V V+ to pin 28
Common Sink Current — 0.6 — mA ∆Common = +0.1V
Common Source Current — 10 — µA ∆Common = -0.1V

DGND Digital Ground Voltage 4.5 5.3 5.8 V V+ to pin 36, V+ to V– = 9V

Sink Current — 1.2 — mA ∆DGND = +0.5V
Supply Voltage Range 6 9 12 V V+ to V–

I

S

Supply Current Excluding
Common Current

f

CLK

Clock Frequency — 120 360 kHz

Resistance — 50 — kΩ V

V

DISP

Low Battery Flag Activation
Voltage

Digital

Continuity Comparator Threshold
Voltages

Pull-down C urrent — 2 10 µA Pins 37, 38, 39
“Weak Output” Current

Sink/Source
Pin 22 Source Current — 40 — µA

Pin 22 Sink Current — 3 — µA

Note 1: Input voltages may exceed supply voltages, provided input current is limited to ±400 µA. Currents above

this value may result in invalid display readings, but will not destroy the device if limited to ±1 mA.
Dissipation ratings assume device is mounted with all leads soldered to printed circuit board.

= 1V, TA = +25°C, f

REF

= 120 kHz, unless otherwise indicated.

CLK

— 0.8 1.3 mA V+ to V– = 9V

to V+

DISP

6.3 7.2 7.7 V V+ to V–

100 200 — mV V

— 200 400 mV V

pin 27 = High

OUT

pin 27 = Low

OUT

— 3/3—µA Pins 20, 21 sink/sourc e
— 3/9—µA Pin 27 sink/source

DS21459C-page 4  2004 Microchip Technology Inc.

TC7129

2.0 PIN DESCRIPTIONS

Descriptions of the pins are listed in Table 2-1.

TABLE 2-1: PIN FUNCTION TABLE

Pin No.

40-Pin PDIP

1 40 2 OSC1 Input to first clock inverter.
2 41 3 OSC3 Output of second clock inverter.
3 42 4 ANNUNCIATOR Backplane square wave output for driving annunciators.
443 5B
544 6A
617F
728B

839A

9410F
10 5 11 B
11 7 13 A
12 8 14 F
13 9 15 B
14 10 16 A
15 11 17 F
16 12 18 BP
17 13 19 BP
18 14 20 BP
19 15 21 V
20 16 22 DP

21 18 24 DP

22 19 25 LATCH

23 20 26 V– Negative power supply terminal.
24 21 27 V+ Positive power supply terminal and positive rail for display

25 22 28 INT IN Input to integrator amplifier.
26 23 29 INT OUT Output of integrator amplifier.
27 24 30 CONTINUITY Input: When low, continuity flag on the display is off. When high,

28 25 31 COMMON Sets common mode voltage of 3.2V below V+ for DE, 10X, etc.

29 26 32 C
30 27 33 C
31 29 35 BUFFER Output of buffer amplifier.
32 30 36 IN LO Negative input voltage terminal.
33 31 37 IN HI Positive input voltage terminal.
34 32 38 REF HI Positive reference voltage.
35 33 39 REF LO Negative reference voltage

Pin No.

44-Pin PQFP

Pin No.

44-Pin PLCC

Symbol Function

, C1, CONT Output to display segments.

1

, G1, D

1

, E1, DP

1

, C2,

2

Output to display segments.

1

Output to display segments.

1

Output to display segments.

LO BATT

, G2, D

2

, E2, DP

2

, C3, MINUS O u tp ut to display se g m ents.

3

, G3, D

3

, E3, DP

3

, C4, BC

4

, D4, G

4

, E4, DP

4

3
2
1

DISP

/OR Input: When high, turns on most significant decimal point.

4

/UR Input: Second-most significant decimal point on when high.

3

Output to display segments.

2

Output to display segments.

2

Output to display segments.

3

Output to display segments.

3

Output to display segments.

5

Output to display segments.

4

Output to display segments.

4

Backplane #3 output to display.
Backplane #2 output to display.
Backplane #1 output to display.
Negative rail for display drivers.

Output: Pulled high when result count exceeds ±19,999.

Output: Pulled high when result count is less than ±1000.

/HOLD Input: When floating, ADC operates in Free Run mode. When

pulled high, the last displayed reading is held. When pulled low,
the result counter contents are shown incrementing during the
de-integrate phase of cycle.
Output: Negative going edge occurs when the data latches are
updated. Can be used for converter status signal.

drivers.

continuity flag is on.
Output: High when voltage between inputs i s less than +200 mV .
Low when voltage between inputs is more than +200 mV.

Can be used as pre-regulator for external reference.

+ Positive side of external reference capacitor.

REF

– Negative side of external reference capacitor.

REF

 2004 Microchip Technology Inc. DS21459C-page 5

TC7129

TABLE 2-1: PIN FUNCTION TABLE (CONTINUED)

Pin No.

40-Pin PDIP

36 34 40 DGND Internal ground reference for digital section. See Section 4.2.1

37 35 41 RANGE 3 µA pull-down for 200 mV scale. Pulled high externally for 2V

38 36 42 DP
39 37 43 DP
40 38 44 OSC2 Output of first clock inverter. Input of second clock inverter.
— 6,17, 28, 39 12, 23, 34, 1 NC No connection.

Pin No.

44-Pin PQFP

Pin No.

44-Pin PLCC

Symbol Function

“±5V Power Supply”.

scale.

2

1

Internal 3 µA pull-down. When high, decimal point 2 will be on.
Internal 3 µA pull-down. When high, decimal point 1 will be on.

DS21459C-page 6  2004 Microchip Technology Inc.

TC7129

3.0 DETAILED DESCRIPTION

(All pin designations refer to 40-pin PDIP.)
The TC7129 is designed to be the heart of a high-

resolution analog measurement instrument. The only
additional components required are a few passive
elements: a voltage reference, a LCD and a power
source. Most component values are not critical;
substitutes can be chosen based on the information
given below.

The basic circuit for a digital multimeter application is
shown in Figure 3-1. See Section 4.0 “Typical Appli-
cations”, for variations. Typical values for each
component are shown. The sections below give
component selection criteria.

3.1 Oscillator (X

The primary criterion for selecting the crystal oscillator
is to choose a frequency tha t achieves maxim um rejec­tion of line frequency noise. To do this, the integration
phase should last an integral number of line cycles.
The integration phase of the TC7129 is 10,000 clock
cycles on the 200 mV range and 1000 clock cycles on
the 2V range. One cl ock c yc le is eq ua l to tw o os cil la t or
cycles. For 60 Hz rejection, the oscillator frequency
should be chosen so that the period of one line cycle
equals the integration time for the 2V range.

, CO1, CO2, RO)

OSC

The resistor and cap acitor values are not crit ica l; those
shown work for most applications. In some situations,
the capacitor values may have to be adjusted to
compensate for parasitic capacitance in the circuit. The
capacitors can be low-cost ceramic devices.

Some applications can use a simple RC network
instead of a crystal oscillator. The RC oscillator has
more potential for jitter, especially in the least
significant digit. See Section 4.5 “RC Oscillator”.

3.2 Integrating Resistor (R

The integrating resistor sets the charging current for
the integrating capacitor. Choo se a v alu e that provides
a current between 5 µA and 20 µA at 2V , the maxim um
full-scale input. The typical value chosen gives a
charging current of 13.3 µA:

INT

)

EQUATION 3-1:

I

CHARGE

Too high a value for R
noise pickup and increases errors due to leakage
current. Too low a value degrades the linearity of the
integration, leading to inaccurate readings.

2V

=

INT

13.3 µA

150 kΩ

increases the sensitivity to

EQUATION 3-1:

1/60 second = 16.7 msec =

1000 clock cycles *2 OSC cycles/ clock cycle

OSC Frequency

This equation gi ves an osc illa tor f requenc y of 120kHz.
A similar calculation gives an optimum frequency of
100 kHz for 50 Hz rejection.

 2004 Microchip Technology Inc. DS21459C-page 7

TC7129

Low Battery Continuity

V+

20

DP

4

/OR

DP

3

/UR

V

DISP

LATCH/

HOLD

V–

V+

+

INT IN

9V

13141516171819

Display Drive Outputs

CONTINUITY

COMMON

INT OUT

27262524232221

28

C

INT

0.1 µF

150 kΩ

10 kΩ
R

BIAS

12

TC7129

C

C

REF

REF

+

–

29

C

+

REF

1 µF

R

INT

9

1011

BUFF

IN LO

323130

– +

0.1
µF

C

V

IN HI

33

IF

IN

8

REF HI

R

IF

100 kΩ

REF LO

DGND

3534

36

R

REF

20

kΩ

ANNUNC

RANGE

DP

2

3837

D

REF

OSC3

DP

1

39

1234567

OSC1

OSC2

40

C

RF

0.1 µF

5 pF

120

kHz

330 kΩ

R

O

10 pF

V+

C

O1

Crystal

C

O2

Figure 3-1: Standard Circuit.

3.3 Integrating Capacitor (C

The charge stored in the integrating capacitor during
the integrate phase is directly proportional to the input
voltage. The primary selection criterion for C
choose a value that gives the highest voltage swing
while remaining within the high-linearity portion of the
integrator output ran ge. An integrat or swing of 2V i s the
recommended value. The capacitor value can be
calculated using the following equation:

INT

)

is to

INT

EQUATION 3-1:

x I

t

INT

V

SWING

INT

Where t

C

=

INT

is the integration time.

INT

Using the values derived above (assuming 60 Hz
operation), the equation becomes:

EQUATION 3-2:

C

16.7 msec x 13.3 µA

=

INT

2V

= 0.1 µA

The capacitor should have low dielectric absorption to
ensure good integration linearity. Polypropylene and
Teflon® capacitors are usually suitable. A good
measurement of the dielectric absorption is to connect
the reference capacitor across the inputs by
connecting:

Pin-to-Pin:

20 → 33 (C

30 → 32 (C

+ to IN HI)

REF

– to IN LO)

REF

A reading between 10,000 and 9998 is acceptable;
anything lower indicates unacceptably high dielectric
absorption.

3.4 Reference Capacitor (C

REF

)

The reference capacitor stores the reference voltage
during several phases of the measurement cycle. Low
leakage is the primary selection criterion for this com­ponent. The value must be high enough to offset the
effect of stray cap acit anc e at the c ap acito r terminals . A
value of at least 1 µF is recommended.

DS21459C-page 8  2004 Microchip Technology Inc.

3.5 Voltage Reference
(D

, R

REF

REF

, R

The reference potentiometer (R

BIAS

, CRF)

) provides an

REF

adjustment for adjusting the reference voltage; any
value above 20 kΩ is adequate. The bias resistor

) limits the current through D

(R

BIAS

150 µA. The reference filter capacitor (C
RC filter with R

to help eliminate noise.

BIAS

to less than

REF

) forms an

RF

3.6 Input Filter (RIF, CIF)

For added stability, an RC input noise filter is usually
included in the circuit. The input filter resistor value
should not exceed 100 kΩ. A typical RC time constant
value is 16.7 msec to help reject line frequency noise.
The input filter capacitor should have low leakage for a
high-impedance input.

+5V

0.1 µF

0.1 µF

0.1 µF

36

DGND

TC7129

24

V+

REF HI

REF LO

COMMON

IN HI

IN LO

V–

23

TC7129

34

35

28

33

V

32

IN

+

–

3.7 Battery

The typical circuit uses a 9V battery as a power so urce.
However , a ny v alue b etwee n 6V a nd 12V can b e use d.
For operation from batteries with voltages lower than
6V and for operation from power supplies, see

Section 4.2 “Powering the TC7129”.

4.0 TYPICAL APPLICATIONS

4.1 TC7129 as a Replacement Part

The TC7129 is a direct pin-f or-pi n rep lac ement part for
the ICL7129. Note , howev er, that the ICL7129 require s
a capacitor an d resistor between pins 26 and 28 for
phase compensation. Since the TC7129 uses internal
phase compensat ion, these p art s are not requir ed and,
in fact, must be removed from the circuit for stable
operation.

4.2 Powering the TC7129

While the most common power source for the TC7129
is a 9V battery, there are other possibilities. Some of
the more common ones are explained below.

4.2.1 ±5V Power Supply

Measurements are made with respect to power supply
ground. DGND (pin 36) is set intern ally to about 5V less

+ (pin 24); it is not inte nded to be a p ower su pply

than V
input and must not be tied directly to power supply
ground. It can be used as a refe rence for externa l logic,
as explaine d i n Section 4.3 “Connecting to External
Logic”, (see Figure 4-1).

-5V

Figure 4-1: Powering the TC7129 From a ±5V Pow er Supply.

4.2.2 Low Voltage Battery Source

A battery with voltage between 3.8V and 6V can be
used to power the TC7129 when used with a voltage
doubler circuit, as shown in Figure 4-2. The voltage
doubler uses the TC7660 DC-to-DC voltage converter
and two external capacitors.

24

+

3.8V
to
6V

8

TC7660

3

2

4

5

36

+

10 µF

+

V+

REF HI

DGND

REF LO

COMMON

TC7129

V–

10 µF

IN HI

IN LO

23

34

35

28

33

32

+

V

IN

–

Figure 4-2: Powering the TC7129 From a Low-Voltage Battery.

 2004 Microchip Technology Inc. DS21459C-page 9

TC7129

–

4.2.3 +5V Power Supply

Measurements are made with respect to power supply
ground. COMMON (pin 28) is connected to REF LO
(pin 35). A voltage doubler is needed, since the supply
voltage is less than the 6V minimum needed by the
TC7129. DGND (pin 36) must be isolated from power
supply ground (see Figure 4-3).

+5V

24

V+

0.1 µF

34

TC7129

35

36

8

V+

TC7660

GND

3

0.1 µF

2

4

5

10 µF

DGND

+

10 µF

+

28

33

32

V–

23

+

V

IN

+

V

24

External

Logic

I

LOGIC

36

TC7129

DGND

23

V-

Figure 4-4: Extern al Logi c Refere nc ed Directly to DGND.

V+

24

External

Logic

TC7129

Figure 4-3: Powering the TC7129 From a +5V Power Supply.

4.3 Connecting to External Logic

External logic can be directly referenced to DGND
(pin 36), provided that the supply current of the externa l
logic does not exceed the sink current of DGND
(Figure 4-4). A safe value for DGND sink current is

1.2 mA. If the sink current is expected to exceed this
value, a buffer is recommended (see Figure4-5).

–

36

+

DGND

I

LOGIC

23

V–

Figure 4-5: Extern al Logi c Refere nc ed to DGND with Buffer.

4.4 Temperature Compensation

For most applications , V
directly to DGND (pin 36). For applications with a wide
temperature range, some LCDs require that the drive
levels vary with temperature to maintain good viewing
angle and display contrast. Figure 4-6 shows two
circuits that c an be adjus ted to give t emperat ure com ­pensation of about 10mV/°C between V+ (pin 24) and

. The diode between DGND and V

V

DISP

have a low turn-on voltage because V
exceed 0.3V below DGND.

(pin 19) can be conne cted

DISP

DISP

DISP

should

cannot

DS21459C-page 10  2004 Microchip Technology Inc.

TC7129

V+

1N4148

39 kΩ

200 kΩ

24

TC7129

5 kΩ

75 kΩ

–

+

19

V

DISP

36

DGND

23

V–

Figure 4-6: Temperature Compensating Circuits.

4.5 RC Oscillator

For applications in which 3-1/2 digit (100 µV) resolution
is sufficient, an RC oscillator is adequate. A recom­mended value for the capacitor is 51 pF. Other values
can be used as long as the y a re s ufficiently larger than
the circuit parasitic capacitance. The resistor value is
calculated as:

EQUATION 4-1:

0.45

R =

Freq * C

For 120 kHz frequency and C = 51 pF, the calculated
value of R is 75kΩ. The RC oscillator and the crystal
oscillator circuits are shown in Figu re 4-7.

TC7129

1 40 2

Ω

270 k

10 pF

V+

V+

5 pF

120 kHz

V+

20 kΩ

39 kΩ

2N2222

19

36

18 kΩ

24

TC7129

V

DISP

DGND

23

V–

4.6 Measuring Techniques

Two im portant techn iques are used in the TC7129: suc­cessive integration and digital auto-zeroing. Succes­sive integration is a refinement to the traditional dual­slope conversion technique.

4.7 Dual-Slope Conversion

A dual-slope conversion has two basic phases: inte­grate and de-integra te. During the integrate phase, th e
input signal is integrated for a fixed period of time; the
integrated volt age level is thus proporti onal to the inp ut
voltage. During the de-integrate phase, the integrated
voltage is ram pe d d ow n at a fixed slope, and a counter
counts the clock cycles until the integrator voltage
crosses zero . T he co un t is a me as u rem en t o f t he ti me
to ramp the integrated v oltag e to zero and i s, therefor e,
proportional to the input voltage being measured. This
count can then be sc aled an d disp layed as a mea sure­ment of the input vol tage. F igure 4-8 shows the phases
of the dual-slope conversion.

Integrate

De-integrate

Zero
Crossing

TC7129

1 40 2

75 k

Ω

51 pF

Time

Figure 4-8: Dual-Slope Conversion.

The dual-slope method has a fundamental limitation.
The count can onl y stop on a c lock cycle, s o t hat me a­surement accuracy is limited to the clock frequency. In

Figure 4-7: Oscillator Circuits.

addition, a delay in the zero-crossing comparator can
add to the inaccuracy. Figure 4-9 shows these errors in
an actual measurement.

 2004 Microchip Technology Inc. DS21459C- page 11

TC7129

r

Integrate

Time

De-integrate

Clock Pulses

Figure 4-9: Accuracy Errors in Dual-Slope Conversion.

Zero Integrate

and Latch

INT

1

Integrate

DE

1

De-integrate

REST X10

Overshoot due to zero-crossing between
clock pulses

Integrator Residue Voltage

Overshoot caused by comparato
delay of 1 clock pulse

DE

2

REST X10

DE

3

Zero Integrate

TC7129

Note: Shaded area greatly expanded in time and amplitude.

Figure 4-10: Integration Waveform.

Integrator

Residual Voltage

DS21459C-page 12  2004 Microchip Technology Inc.

TC7129

4.8 Successive Integration

The successive integration tech nique picks up where
dual-slope conversion ends. The overshoot voltage
shown in Figure 4-9 (called the “integrator residue
voltage”) is me asured to obtain a correction to the initial
count. Figure 4-10 shows the cycles in a successive
integration measurement.

The waveform shown is for a ne gative input s ignal. The
sequence of ev ents during the measure ment cycle is
shown in Table 4-1.

TABLE 4-1: MEASUREMENT CYCLE

SEQUENCE

Phase Description

INT

Input signal is integrated for fixed time (1000 clock

1

cycles on 2V scale, 10,000 on 200 mV).
Integrator voltage is ramped to zero. Counter

DE

1

counts up until zero-crossing to produce reading
accurate to 3-1/2 digits. Residue represents an
overshoot of the actual input voltage.

REST Rest; circuit settles.

X10 Residue voltage is amplified 10 times and inverted.

Integrator voltage is ramped to zero. Counter

DE

2

counts down until zero-crossing to correct reading
to 4-1/2 digits. Residue represents an undershoot
of the actual input voltage.

REST Rest; circuit settles.

X10 Residue voltage is amplified 10 times and inverted.

Integrator voltage is ramped to zero. Counter

DE

3

counts up until zero-crossing to correct reading to
5-1/2 digits. Residue is discarded.

4.9 Digital Auto-Zeroing

To eliminate the effect of amplifier offset errors, the
TC7129 uses a digi tal auto-z eroing tech nique. Afte r the
input voltage is measured as described above, the
measurement is repeated with the inputs shorted
internally. The reading with inputs shorted is a
measurement of the internal errors and is subtracted
from the previous reading to obtain a corrected
measurement. Digit al auto -zeroing el iminates the need
for an external auto-zeroing capacitor used in other
ADCs.

4.10 Inside the TC7129

Figure 4-11 shows a simplified block diagram of the
TC7129.

 2004 Microchip Technology Inc. DS21459C- page 13

TC7129

Low Battery Continuity

OSC1

OSC2

OSC3

RANGE

L/H

CONT

V–

DGND

V+

TC7129

Segment Drives

Latch, Decode Display Multiplexer

Up/Down Results Counter

Sequence Counter/Decoder

Control Logic

Analog Section

Backplane

Drives

Annunciator

Drive

V

DISP

DP

1

DP

2

UR/DP

OR/DP

REF HI

REF LO

INT OUT

INT IN

3

4

COMMON INHIIN

LO

Figure 4-11: TC7129 Functional Block Diagram.

IN HI

Common

IN LO

Continuity

INT

INT

1

INT

1

,

–

V

200 mV

REF HI

2

+

C

REF

REF LO

DE

DE

DE- DE+

DE+

DE–

INT

–

+

Continuity
Comparator

500 k

–

+

ZI, X10

REST

Ω

Buffer

R

INT

Figure 4-12: Integrator Block Diagram.

BUFF

C

INT

Integrator

–

+

100 pF

TC7129

X10

10

Comparator 1

pF

+

–

To Display Driver

To Digital
Section

Comparator 2

DS21459C-page 14  2004 Microchip Technology Inc.

4.11 Integrator Section

The integrator section includes the integrator, compar­ator, input buffer amplifier and analog switches (see
Table 4-2) used to change the circuit configuration
during the separate measurement phases described
earlier. (See Figure 4-12).

TABLE 4-2: SWITCH LEGENDS

Label Description

Label Meaning.

DE Open during all de-integrate phases.

DE– Closed during all de-integrate phases when

input voltage is negative.

DE+ Closed during all de-integrate phases when

INT

INT

INT Open during both integrate phases.

REST Closed during the rest phase.

X10 Closed during the X10 phase.
X10 Open during the X10 phase.

The buffer amp li fier has a common mode inp ut vol t age
range from 1.5V above V– to 1V be low V+. The integra­tor amplifier can swing to within 0.3V of the rails.
However, for best linearity, the swing is usually limited
to within 1V. Both amplifiers can supply up to 80 µA of
output current, but should be limited to 20 µA for good
linearity.

input voltage is positive.
Closed during the first integrate phase

1

(measurement of the input voltage).
Closed during the second integrate phase

2

(measurement of the amplifier offset).

ZI Closed during the zero integrate phase.

TC7129

–

IN HI

COM

IN LO

CONT

200 mV

V

–

+

500 k

Ω

Figure 4-13: Continuity Indicator Circuit.

TC7129

DP4/OR, Pin 20

/UR, Pin 21

DP

LATCH/HOLD Pin 22

CONTINUITY, Pin 27

3

Figure 4-14: Input/Output Pin Schematic.

500 kΩ

+

Buffer

TC7129

To Display Driver

(Not Latched)

4.12 Continuity Indicator

A comparator with a 200 mV threshold is connected
between IN HI (pin 33) and IN LO (pin 32). Whenever
the voltage between inputs is less than 200mV, the
CONTINUITY output (pin 27) will be pulled high,
activating the continuity annunciator on the display.
The continuity pin c an also be us ed as an input to drive
the continuity annunciator directly from an external
source (see Figure 4-13).

A schematic of the input/o utput nature of thi s pin is also
shown in Figure 4-14.

4.13 Common and Digital Ground

The common and digital ground (DGND) outputs are
generated from internal zener diodes. The voltage
between V+ and DGND is the internal supply voltage
for the digital section of the TC7129. Common can
source approximately 12 µA; DGND has essentially no
source capability (se e Figure4-15).

 2004 Microchip Technology Inc. DS21459C- page 15

TC7129

24

V+

–

+

12 µA

N

Logic

Section

3.2V

COM

28

5V

36

P

DGND

TC7129

N

23

V–

Figure 4-15: Digital Ground (DGND) and Common Outputs.

4.14 Low Battery

The low battery annun ciato r turns o n whe n supp ly vo lt­age between V– and V+ drop s below 6.8V. The internal
zener diode has a threshold of 6.3V. When the supply
voltage drop s below 6.8V, the transistor tied to V– turn s
off pulling the “Low Battery” point high.

4.15 Sequence and Results Counter

A sequence counter and associated control logic pro­vide signals that operate the analog switches in the
integrator section . The comparat or output from the inte­grator gates the res ults coun ter. The resul ts count er is
a six-sectio n up/down decade co unter that holds the
intermediate results from each successive integration.

4.16 Overrange and Underrange Outputs

When the results counter holds a value greater than
±19,999, the DP
When the results counter value is less than ±1000, the
DP3/UR output (Pin 21) is driven high. Both s ignal s are
valid on the falling edge of LATCH
not change until the end of the next conversion cycle.
The signals are upd ated a t the end o f each conv ersion,
unless the L
21 can also be used as inputs for external control of
decimal point s 3 a nd 4. Fig ure 4-14 shows a schematic
of the input/output nature of these pins.

/OR output (Pin 20) is driven high.

4

/HOLD (L/H) and do

/H input (Pin 22) is held high. Pins 20 and

4.17 LATCH/Hold

The L/H output goes low during the last 100 cycles of
each conversion. This pulse latches the conversion
data into the display driv er secti on of the TC7129. Thi s
pin can also be used as an inp ut. When dr iven high, th e
display will not be updated; the previous reading is
displayed. When driven low, the display reading is not
latched; the sequence counter reading will be
displayed. Since the counter is counting much faster
than the backplanes are being updated, the reading
shown in this mode is somewhat erratic.

4.18 Display Driver

The TC7129 drives a triplexed LCD with three back­planes. The LCD can include decimal points, polarity
sign and annunciators for continuity and low battery.
Figure 4-16 shows the assignment of the display
segments to the backplanes and segment drive lines.
The backplane drive frequency is obtained by dividing
the oscillator freq uency by 1200. Thi s result s in a b ack­plane drive frequency of 100 Hz for 60 Hz operation
(120 kHz crystal) and 83.3 Hz for 50 Hz operation
(100 kHz crystal).

Backplane waveforms are shown in Figure 4-17.
These appear on outputs BP
and 18). They remain the s am e, re gard less of the seg­ments being driven.

Other display output lines (pins 4 through 15) have
waveforms that vary depending on the displayed
values. Figure 4-18 shows a set of waveforms for the
A, G, D outputs (pins 5, 8, 11 and 14) for several
combinations of “ON” segments.

The ANNUNCIATOR DRIVE output (pin 3) is a square
wave, running at the backplane frequency (100 Hz or

83.3 H z) with a peak-to-peak voltage equal to DGND
voltage. Connec ting an an nunci ator to pin 3 turn s it on;
connecting it to its backplane turns it off.

, BP2, BP3 (pins 16, 17

1

DS21459C-page 16  2004 Microchip Technology Inc.

TC7129

Low Battery

Continuity

BP

BP

1

2

Backplane
Connections

BP

3

Low Battery Continuity

E

DP

F

4

4

4

,

,

G

D

A

4

4

4

,

,

C

BC

B

4

4

4

,

,

F

E

DP

3

3

3

,

,

G

D

A

3

3

3

,

,

C

MINUS

B

3

3

,

,

B

1

,

A

1

,

F

1

,

B

2

,

A

2

,

F

2

,

C

Continuity

1

,

G

D

1

,

E

DP

1

,

C

Low Battery

2

,

G

D

2

,

E

DP

2

,

1

1

2

2

Figure 4-16: Display Segment Assignments.

BP

1

BP

2

BP

3

Figure 4-17: Backplane Waveforms.

b Segment

Line

All Off

a Segment

On

d, g Off

a, g On

d Off

All On

Figure 4-18: Typical Display Output Waveforms.

V
V

V
V

V
V

V
V

V
V

V
V

V
V

V
V

DD
H

L

DISP

DD
H

L

DISP

DD
H

L

DISP

DD
H

L

DISP

 2004 Microchip Technology Inc. DS21459C- page 17

TC7129

5.0 PACKAGING INFORMATION

5.1 Package Marking Information

Package mar k ing data not available a this time.

5.2 Taping Forms

Pin 1

User Direction of Feed

P, Pitch

Pin 1

W, Width
of Carrier

Tape

S tandard Reel Component Orientation

Component Taping Orientation for 44-Pin PQFP Devices

User Direction of Feed

Reverse Reel Component Orientation

PIN 1

W

P

Standard Reel Component Orientation
for TR Suffix Device

Carrier Tape, Number of Components Per Reel and Reel Size

Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size

44-Pin PQFP 24 mm 16 mm 500 13 in

Note: Drawing does not represent total number of pins.

DS21459C-page 18  2004 Microchip Technology Inc.

40-Lead Plastic Dual In-line (P) – 600 mil Body (PDIP)

E1

D

TC7129

2

n

E

β

eB

Number of Pins
Pitch

Lead Thickness

Mold Draft Angle Top
Mold Draft Angle Bottom

* Controlling Parameter

§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MO-011
Drawing No. C04-016

1

A

c

A1

n
p

c

α
β

B1
B

MILLIMETERSINCHES*Units

4040

0.38.015A1Base to Seating Plane

α

A2

L

p

MAXNOMMINMAXNOMMINDimension Limits

2.54.100

4.834.454.06.190.175.160ATop to Seating Plane

4.063.813.56.160.150.140A2Molded Package Thickness

15.8815.2415.11.625.600.595EShoulder to Shoulder W idth

14.2213.8413.46.560.545.530E1Molded Package Width

52.4552.2651.942.0652.0582.045DOverall Length

3.433.303.05.135.130.120LTip to Seating Plane

0.380.290.20.015.012.008

1.781.270.76.070.050.030B1Upper Lead Width

0.560.460.36.022.018.014BLower Lead Width

17.2716.5115.75.680.650.620eBOverall Row Spacing §
1510515105
1510515105

 2004 Microchip Technology Inc. DS21459C- page 19

TC7129

44-Lead Plastic Leaded Chip Carrier (LW) – Square (PLCC)

E

E1

#leads=n1

D

D1

2

n

1

CH2 x 45° CH1 x 45°

A3

α

A2

c

Number of Pins
Pitch

Molded Package Thickness

Side 1 Chamfer Height

Footprint Length
Lead Thickness

Lower Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom

* Controlling Parameter

§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MO-047
Drawing No. C04-048

E2

β

n
p

A2

A3

D2

c

α
β

.145 .153 .160 3.68 3.87 4.06

A

35°

B1

B

p

D2

MILLIMETERSINCHES*Units

4444

.028 .035 0.71 0.89

0.51.020A1Standoff §

A1

MAXNOMMINMAXNOMMINDimension Limits

1.27.050
1111n1Pins per Side

4.574.394.19.180.173.165AOverall Height

0.860.740.61.034.029.024

1.271.141.02.050.045.040CH1Corner Chamfer 1

0.250.130.00.010.005.000CH2Corner Chamfer (others)

17.6517.5317.40.695.690.685EOverall Width

17.6517.5317.40.695.690.685DOverall Length

16.6616.5916.51.656.653.650E1Molded Package Width

16.6616.5916.51.656.653.650D1Molded Package Length

16.0015.7514.99.630.620.590E2Footprint Width

16.0015.7514.99.630.620.590

0.330.270.20.013.011.008

0.810.740.66.032.029.026B1Upper Lead Width

0.530.510.33.021.020.013B
10501050
10501050

DS21459C-page 20  2004 Microchip Technology Inc.

TC7129

44-Lead Plastic Quad Flatpack (KW) 10x10x2.0 mm Body, 1.95/ 0.25 mm Lea d Form (PQFP)

E

E1

p

D

D1

2
1

B

n

c

Units INCHES MILLIMETERS*

Dimension Limits MIN NOM MAX MIN NOM MAX
Number of Pins
Pitch
Overall Height A - - .096 - - 2.45
Molded Package Thickness A2 .077 .079 .083 1.95 2.00 2.10
Standoff § A1 .010 - - 0.25 - ­Foot Length L .029 .035 .041 0.73 0.88 1.03
Footprint (Reference)
Foot Angle
Overall Width E .547 BSC 13.90 BSC
Overall Length D .547 BSC 13.90 BSC
Molded Package Width E1 .394 BSC 10.00 BSC
Molded Package Length D1 .394 BSC 10.00 BSC
Lead Thickness
Lead Width B .012 - .018 0.30 - 0.45
Mold Draft Angle Top
Mold Draft Angle Bottom

*Controlling Parameter

§ Significant Characteristic

Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions
shall not exceed .010" (0.254mm) per side.

JEDEC Equivalent: MO-112 AA-1

Drawing No. C04-119

n
p

(F)

f

c

a

b

CHAMFER VARIES

a

f

.004 - .009 0.11 - 0.23

A2

L

A1

44 44

.031 BSC 0.80 BSC

--

0° 3.5° 7° 0° 3.5° 7°

5° - 16° 5° - 16°
5° - 16° 5° - 16°

(F)

b

1.95 REF..077 REF.

A

 2004 Microchip Technology Inc. DS21459C- page 21

TC7129

NOTES:

DS21459C-page 22  2004 Microchip Technology Inc.

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.

PART NO. XX

Device

Device: TC7129: 4-1/2 Digit Analog-to-Digital Converter

X

Temp.

Pkg

XX

Taping

Direction

Examples:

a) TC7129CPL: 40-Pin PDIP
b) TC7129CKW713: 44-Pi n PQFP

c) TC7129CLW: 44-Pin PLCC

TC7129

Tape and Reel

Temperature: C = 0°C to +70°C

Package: PL = 40-Pin PDIP

Taping Direction: 713 = Standard Taping

I = -25°C to +85°C

KW = 40-Pin PQFP
LW = 44-Pin PLCC
JL = 40-Pin CDIP

Sales and Support

Data Sheets

Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and
recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:

1. Your local Microchip sales office

2. The Microchip Corporate Literature Center U.S. FAX: [phone]

3. The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.

Customer Notification System

Register on our web site (www.microchip.com/cn) to receive the most current information on our products.

 2004 Microchip Technology Inc. DS21459C-page 21

TC7129

NOTES:

DS21459C-page 22  2004 Microchip Technology Inc.

Note the following details of the code protection feature on Microchip devices:

• Microchip products meet the specification contained in their particular Microchip Data Sheet.

• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.

• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

• Microchip is willing to work with the customer who is concerned about the integrity of their code.

• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are com mitted to continuously improving the code protect ion f eatures of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digit al Mill ennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Information contained in this publication regarding device
applications and the like is intended through suggestion only
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
No representation or warranty is given and no liability is
assumed by Microchip Technology Incorporated with respect
to the accuracy or use of such information, or infringement of
patents or other intellectual property rights arising from such
use or otherwise. Use of Microchip’s products as critical
components in life support systems is not authorized except
with express written approval by Microchip. No licenses are
conveyed, implicitly or otherwise, under any intellectual
property rights.

Trademarks

The Microchip name and logo, the Microchip logo, Accuron,
dsPIC, K

EELOQ, microID, MPLAB, PIC, PICmicro,

PICSTART, PRO MATE, PowerSmart, rfPIC, and
SmartShunt are registered trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.

AmpLab, FilterLab, MXDEV, MXLAB, PICMASTER, SEEVAL,
SmartSensor and The Embedded Control Solutions Company
are registered trademarks of Microchip Technology
Incorporated in the U.S.A.

Analog-for-the-Digital Age, Application Maestro, dsPICDEM,
dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR,
FanSense, FlexROM, fuzzyLAB, In-Circuit Serial
Programming, ICSP, ICEPIC, Migratable Memory, MPASM,
MPLIB, MPLINK, MPSIM, PICkit, PICDEM, PICDEM.net,
PICLAB, PICtail, PowerCal, PowerInfo, PowerMate,
PowerTool, rfLAB, rfPICDEM, Select Mode, Smart Serial,
SmartTel and Total Endurance are trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.

SQTP is a service mark of Microchip T echnology Incorporated
in the U.S.A.

All other trademarks mentioned herein are property of their
respective companies.

© 2004, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.

Printed on recycled paper.

Microchip received ISO/TS-16949:2002 quality system certification for
its worldwide headquarters, design and wafer fabrication facilities in
Chandler and Tempe, Arizona and Mountain View, California in
October 2003. The Company’s quality system processes and
procedures are for its PICmicro
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.

®

8-bit MCUs, KEELOQ

®

code hopping

 2004 Microchip Technology Inc. DS21459C-page 23

WORLDWIDE SALES AND SERVICE

AMERICAS

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Tel: [phone]
Fax: [phone]

China - Shanghai

Far East International Plaza
Shanghai, 200051
Tel: [phone]
Fax: [phone]

China - Shenzhen

United Plaza
Shenzhen 518033, China
Tel: [phone]
Fax: [phone]

China - Shunde

Foshan City, Guangdong 52 83 03 , Ch ina
Tel: [phone]
Fax: [phone]

China - Qingdao

Fullhope Plaza,
Qingdao 266071, China
Tel: [phone]
Fax: [phone]

India

Divyasree Chambers
Bangalore, 560 025, India
Tel: [phone] Fax: [phone]

India

International Trade Tower
New Delhi, 110019, India
Tel: [phone]
Fax: [phone]

Japan

Yokohama, Kanagawa, 222-0033, Japan
Tel: [phone]
Fax: [phone]

Korea

Samsung-Dong, Kangnam-Ku
Seoul, Korea 135-882
Tel: [phone]
Fax: [phone] or 82-2-558-5934

Singapore

Singapore, 188980
Tel: [phone]
Fax: [phone]

Taiwan

Kaohsiung Branch
Kaohsiung 806, Taiwan
Tel: [phone]
Fax: [phone]

Taiwan

Taiwan Branch
Taipei City, 104, Taiwan
Tel: [phone]
Fax: [phone]

Taiwan

Taiwan Branch
Hsinchu City 300, Taiwan
Tel: [phone]
Fax: [phone]

EUROPE

Austria

Austria
Tel: [phone]
Fax: [phone]

Denmark

Regus Business Centre
Ballerup DK-2750 Denmark
Tel: [phone]
Fax: [phone]

France

91300 Massy, France
Tel: [phone]
Fax: [phone]

Germany

D-85737 Ismaning, Germany
Tel: [phone]
Fax: [phone]

Italy

Milan, Italy
Tel: [phone]
Fax: [phone]

Netherlands

NL-5152 JR, Drunen, Netherlands
Tel: [phone]
Fax: [phone]

United Kingdom

Wokingham
Berkshir e, England RG41 5T U
Tel: [phone]
Fax: [phone]

08/16/04

DS21459B-page 24  2004 Microchip Technology Inc.

Mouser Electronics

Authorized Distributor

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TC7129CLW713