Microchip Technology TC1427COA, TC1426CPA, TC1426COA, TC1428CPA, TC1428COA Datasheet

M

A

6COA

3

, 4

5

COA

2

3

5

6

8

5

8COA

C

2

1.2A Dual High-Sp eed MOSFET Drivers

TC1426/TC1427/TC1428

Features

•Low Cost

• Latch-Up Protected: Will Withstand 500mA
Reverse Output Current

• ESD Protected ±2kV

• High Peak Output Current: 1.2A

• Wide Operating Range

- 4.5V to 16V

• High Capacitive Load Drive Capability: 1000pF in
38nsec

• Low Delay Time: 75nsec Max

• Logic Input Threshold Independent of Supply
Voltage

• Output Voltage Swing to Within 25mV of Ground
or V

DD

• Low Output Impedance: 8Ω

Applications

• Power MOSFET Drivers

• Switched Mode Power Supplies

• Pulse Transformer Drive

• Small Motor Controls

• Print Head Drive

Device Selection Table

Part Number Package Temp. Range

TC1426COA 8-Pin SOIC 0°C to +70°C

TC1426CPA 8-Pin PDIP 0°C to +70°C

TC1427COA 8-Pin SOIC 0°C to +70°C

TC1427CPA 8-Pin PDIP 0°C to +70°C

TC1428COA 8-Pin SOIC 0°C to +70°C

TC1428CPA 8-Pin PDIP 0°C to +70°C

Package Type

8-Pin PDIP/SOIC

NC

1

IN A

2

TC1426CPA

GND

3

IN B

4

2, 4 7, 5

Inverting

NC

IN A

TC142

GND

IN B

2

Inverting

NC = No connection

7,

NC

78OUT A

6

V

DD

5

OUT B

NC

78OUT A

V

6

DD

5

OUT B

NC

IN A

GND

IN B

NC

IN A

GND

IN B

1

2

TC1427CPA

3

4

2, 4 7, 5

Noninverting

TC1427

2, 47,

Noninverting

NC

78OUT A

6

V

DD

5

OUT B

NC

OUT A

V

DD

OUT B

NC

IN A

GND

IN B

N

1

2

TC1428CPA

3

4

27

45

TC142

45

7

NC

78OUT

6

V

DD

OUT B

5

NC

78OUT A

V

6

DD

5

OUT B

General Description

The TC1426/TC1427/ TC1428 are a fa mily of 1.2 A dual
high-speed drivers. CMOS fabrication is used for low
power consumption and high efficienc y.

These devices are fa bricated using a n epit axial lay er to
effectively short out the intrinsic parasitic transistor
responsible for CMOS latch-up. They incorporate a
number of other design and process refinements to
increase their long-term reliability.

The TC1426 is compat ible with the bipolar DS0026, but
only draws 1/5 of the quiescent current. The TC1426/
TC1427/TC1428 are also compatible with the TC426/
TC427/TC428, but wit h 1.2A peak out put current rath er
than the 1.5A of the TC426/TC427/TC428 devic es .

Other compatible drivers are the TC4426/TC4427/
TC4428 and the TC4426A/TC4427A/TC4428A. The
TC4426/TC4427/TC4428 have the added feature that
the inputs c an with sta nd negat ive v olt age u p to 5 V wi th
diode protection circuits. The TC4426A/TC4427A/
TC4428A have matched input to output leading edge
and falling edge delays, t
short duration puls es in the 25 nanoseconds rang e. Al l
of the above drivers are pin compatible.

The high-input impedance TC1426/TC1427/TC1428
drivers are CM OS/TTL input-co mpatible , do not require
the speed-up needed by the bipolar devices, and can
be directly driven by most PWM ICs.

This family of devic es i s av ai la ble in inverting and non­inverting versions. Specifications have been optimized
to achieve low-cost and high-performance devices,
well-suited for the high-volume manufacturer.

and tD2, for processing

D1

 2002 Microchip Technology Inc. DS21393B-page 1

TC1426/TC1427/TC1428

GND

Functional Block Diagram

+

V

≈500µA

≈2.5mA

Input

NOTE: TC1428 has one inverting and one noninverting driver.

Ground any unused driver input.

TC1426 Inverting

TC1427 Noninverting

TC1428 Inverting/Noninverting

Noninverting

Output

Inverting

Output

(TC1426)(TC1427)

DS21393B-page 2  2002 Microchip Technology Inc.

TC1426/TC1427/TC1428

1.0 ELECTRICAL
CHARACTERISTICS

Absolute Maximum Ratings*

Supply Voltage.....................................................+18V

*Stresses above those listed under "Absolute Maximum
Ratings" may cause permanent damage to the device. These
are stress ratings only and functional operation of the device
at these or any other conditions above those indicated in the
operation sections of the specifications is not implied.
Exposure to Absolute Maximum Rating conditions for
extended periods may affect device reliability.

Input Voltage, Any Terminal

................................... V

Power Dissipation (T

≤ 70°C)

A

+ 0.3V to GND – 0.3V

DD

PDIP........................................................ 730mW

SOIC........................................................ 470mW

Derating Factor

PDIP........................................................8mW/

SOIC........................................................4mW/

°C
°C

Operating Temperature Range

C Version.........................................0°C to +70°C

Storage Temperature Range ............. -65°C to +150°C

TC1426/TC1427/TC1428 ELECTRICAL SPECIFICATIONS

Electrical Characteristics: TA = +25°C, with 4.5V ≤ V

Symbol Parameter Min Typ Max Units Test Conditions

Input

V

IH

V

IL

I

IN

Output

V

OH

V

OL

R

O

I

PK

I

REV

Switching Ti me (Note 1)
t

R

t

F

t

D1

t

D2

Power Supply

I

S

Note 1: Switching times ensured by design.

Logic 1, High Input Voltage 3 —— V
Logic 0, Low Input Voltage ——0.8 V
Input Current -1 — 1 µA0V ≤ V

High Output Voltage VDD – 0.025 —— V Figure 3-1, Figure 3-2
Low Output Voltage ——0.025 V Figure 3-1, Figure 3-2
Output Resistance —

Peak Output Current — 1.2 — A
Latch-Up Current

Withstand Reverse Current

Rise Time ——35 nsec Figure 3-1, Figure 3-2
Fall Time ——25 nsec Figure 3-1, Figure 3-2
Delay Time ——75 nsec Figure 3-1, Figure 3-2
Delay Time ——75 nsec Figure 3-1, Figure 3-2

Power Supply Current —

≤ 16V, unless otherwise noted.

DD

—

— >500 — mA

—

12

8

—
—

18
12

0.5

Ω I

9

mA VIN = 3V (Both Inputs)

≤ V

IN

DD

= 10mA, VDD = 16V

OUT

V

= 0V (Both Inputs)

IN

 2002 Microchip Technology Inc. DS21393B-page 3

TC1426/TC1427/TC1428

TC1426/TC1427/TC1428 ELECTRICAL SPECIFICATIONS (CONTINUED)

Electrical Characteristics: Over operating temperature range with 4.5V ≤ V

Symbol Parameter Min Typ Max Units Test Conditions

Input

V

IH

V

IL

I

IN

Logic 1, High Input Voltage 3 —— V
Logic 0, Low Input Voltage ——0.8 V
Input Curre n t -10 — 10 µA0V ≤ V

Output

V
V
R

I

REV

OH
OL
O

High Output Voltage VDD – 0.025 —— V Figure 3-1, Figure 3-2
Low Output Voltage ——0. 025 V Figure 3-1 , Figure 3-2
Output Resistance —

Latch-Up Current

—
— >500 — mA

15
10

Withstand Reverse Current
Switching Time (Note 1)
t

R

t

F

t

D1

t

D2

Rise Time ——60 nsec Figure 3-1, Figure 3-2

Fall Time ——40 nsec Figure 3-1, Figure 3-2

Delay Time ——125 nsec Figure 3-1, Figure 3-2

Delay Time ——125 nsec Figure 3-1, Figure 3-2

Power Supply

I

S

Note 1: Switching times ensured by design.

Power Supply Current —

—

—
—

≤ 16V, unless otherwise noted.

DD

23

Ω I

= 10mA, VDD = 16V

OUT

18

13

0.7

mA VIN = 3V (Both Inputs)

= 0V (Both Inputs)

V

IN

≤ V

IN

DD

DS21393B-page 4  2002 Microchip Technology Inc.

2.0 PIN DESCRIPTIONS

The descriptions of the pins are listed in Table 2-1.

TABLE 2-1: PIN FUNCTION TABLE

Pin No.

(8-Pin PDIP,

SOIC)

1 NC No connec tion.

2 IN A Control input A, TTL/CMOS compatible logic input.

3 GND Ground.

4 IN B Control input B, TTL/CMOS compatible logic input.

5 OUT B Output B, CMOS totem-pole output.

6V

7 OUT A Output A, CMOS totem-pole output.

8 NC No connec tion.

Symbol Description

DD

Supply input, 4.5V to 16V.

TC1426/TC1427/TC1428

 2002 Microchip Technology Inc. DS21393B-page 5

TC1426/TC1427/TC1428

2

6

)

C

t

6V

t

pF

C

t

6V

t

pF

2

7

)

3.0 APPLICATIONS INFORMATION

3.1 SUPPLY BYPASSING

Large curre nts are required to cha rge and discharge
capacitive loads quickly. For example, charging a
1000pF load to 16V in 25nsec requires a 0.8A current
from the device’s power supply.

To guarantee low supply impedance over a wide
frequency range, a parallel capacitor combination is
recommended for supply bypassing. Low-inductance
ceramic MLC capacitors with short lead lengths
(<0.5-in.) should be used. A 1.0µF film capacitor in
parallel with one or two 0.1µF ceramic MLC capacitors
normally provides adequate bypassing.

3.2 GROUNDING

The TC1426 and TC1428 contain inverting drivers.
Individual ground returns for the input and output
circuits or a ground plane should be used. This will
reduce negative feedback that causes degradation in
switching speed characteristics.

FIGURE 3-1: INVERTING DRIVER

SWITCHING TIME

Test Circuit

= 1

3.3 INPUT STAGE

The input voltage level changes the no-load or
quiescent supply current. The N-channel MOSFET
input stage transistor drives a 2.5mA current source
load. With a logic "1" input, the maximum quiescent
supply current is 9mA. Logic "0" input level signals
reduce quiescent current to 500µA maximum. Unused

driver inputs must be connected to V

Minimum power dissipation occurs for logic "0" inputs
for the TC1426/TC1427/TC1428.

The drivers are designed with 100mV of hysteresis.
This provides clean tran sitions and minimizes out put
stage current spiking when changing states. Input
voltage thresholds are approximately 1.5V, making a
logic "1" input any volt age greate r than 1 .5V up to V
Input current is less than 1µA over this range.

The TC1426/TC1427/TC1428 may be directly driven
by the TL494, SG1526/27, TC38C42, TC170 and
similar switch-mode power supply integrated circuits.

FIGURE 3-2: NONINVERTING DRIVER

SWITCHING TIME

Test Circuit

= 1

or GND.

DD

DD

.

+5V

Input

V

Output

0V

DD

0V

Inpu

10%

TC142

1/2 TC1428

t

D1

90%

10%

.1F ML

Outpu

= 1000

MKS-

.1F ML

Outpu

= 1000

MKS-

Inpu

TC142

1/2 TC1428

90%

t

D2

t

F

t

R

10%

90%

+5V

Input

V

Output

0V

DD

0V

10%

90%

90%

t

D1

10%

t

R

90%

t

D2

10%

t

F

DS21393B-page 6  2002 Microchip Technology Inc.

TC1426/TC1427/TC1428

4.0 TYPICAL CHARACTERISTIC S

Note: The graphs and tables provided following this note are a statistical summary based on a limited number of

samples and are pro vided for information al purposes only. The performance characte ristics listed herei n are
not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.

Rise Time vs. Supply Voltage

550

440

330

220

TIME (nsec)

110

0

579111315

VDD (V)

= +25

T

A

10,000pF

4700pF

2200pF

°C

Rise and Fall Times vs. Temperature

40

= 1000pF

C

L

V

DD

32

24

16

TIME (nsec)

8

= +15V

t

RISE

t

FALL

Fall Time vs. Supply Voltage

330

264

198

132

TIME (nsec)

66

0

57 9111315

VDD (V) VDD (V)

Delay Time vs. Temperature

60

= 1000pF

C

L

V

= +15V

DD

54

t

48

42

TIME (nsec)

36

D2

t

D1

= +25

T

A

10,000pF

4700pF

2200pF

Delay Time vs. Supply Voltage

°C

80

70

60

50

TIME (nsec)

40

30

5

t

D1

7

9

Supply Current vs. Capacitive Load

30

CL = 1000pF
V

= +15V

DD

24

= +25

T

°C

A

18

12

6

SUPPLY CURRENT (mA)

CL = 1000pF

= +25

T

A

t

D2

11

500kHz

200kHz

°C

13

20kHz

15

0

25 45 65 85 105

TEMPERATURE (°C)

Rise Time vs. Capacitive Load

1000

= +25

°C

T

A

5

V

DD

100

TIME (nsec)

10

10

V

DD

100

CAPACITIVE LOAD (pF)

15

V

DD

1000

125

10,000

0

25 45 65 85 105 125

TEMPERATURE (°C)

Fall Time vs. Capacitive Load

1000

= +25

T

°C

A

5 V

1000

15V

DD

DD

100

TIME (nsec)

10

100

10 V

DD

CAPACITIVE LOAD (pF)

10,000

0

100 520 940 1360 1780 2200

CAPACITIVE LOAD (pF)

Supply Current vs. Frequency

100

CL = 1000pF

= +25

T

°C

A

80

60

40

20

SUPPLY CURRENT (mA)

0

10

100 1000

FREQUENCY (kHz)

V

= 15V

DD

V

= 10V

DD

V = 5V

DD

10,000

 2002 Microchip Technology Inc. DS21393B-page 7

TC1426/TC1427/TC1428

00

00

000

00

00

600

04070100110120

)

P

s

C

TYPICAL CHARACTERISTICS (CONTINUED)

Low-State Output Resistance

15

100mA

13

11

ΩR ( )

OUT

9

7

5

579111315

50mA

10mA

VDD (V) VDD (V)

= +25

T

°

C

A

Quiescent Power Supply

Current vs. Supply Voltage

20

BOTH INPUTS LOGIC "0"

15

10

5

SUPPLY VOLTAGE (V)

High-State Output Resistance

50

42

100mA

34

(Ω)

OUT

26

R

50mA

18

10mA

10

579111315

= +25

T

°

C

A

Quiescent Power Supply

Current vs. Supply Voltage

20

BOTH INPUTS LOGIC "1"

15

10

SUPPLY VOLTAGE (V)

5

Crossover Energy Loss

-8

10

-9

10

A (sec)

-10

10

4 6 8 1012141618

V

(V)

DD

0

0 50 100 150 200 300

SUPPLY CURRENT (µA)

1

14

12

1

Pin SOI

MAX. POWER (mW)

4

2

102

Pin DI

0

1

400

234 56

SUPPLY CURRENT (mA)

Thermal Derating Curve

AMBIENT TEMPERATURE (C

DS21393B-page 8  2002 Microchip Technology Inc.

5.0 PACKAGING INFORMATION

)

)

)

)

)

)

)

)

)

)

)

)

)

)

)

)

)

)

)

)

)

)

)

)

P

.

)

)

)

)

)

)

)

)

)

)

)

)

)

)

)

)

C

5.1 Package Marking Information

Package marking data not available at this time.

5.2 Package Dimensions

-Pin Plastic DI

TC1426/TC1427/TC1428

.260 (6.60
.240 (6.10

.045 (1.14
.030 (0.76

.200 (5.08
.140 (3.56

.150 (3.81
.115 (2.92

.110 (2.79
.090 (2.29

-Pin SOI

.400 (10.16

.348 (8.84

.022 (0.56
.015 (0.38

.157 (3.99
.150 (3.81

.070 (1.78
.040 (1.02

.244 (6.20
.228 (5.79

.040 (1.02
.020 (0.51

.310 (7.87
.290 (7.37

.015 (0.38
.008 (0.20

.400 (10.16

.310 (7.87

Dimensions: inches (mm)

.050 (1.27) TYP

.197 (5.00
.189 (4.80

.069 (1.75
.053 (1.35

.020 (0.51
.013 (0.33

 2002 Microchip Technology Inc. DS21393B-page 9

.010 (0.25
.004 (0.10

.050 (1.27
.016 (0.40

Dimensions: inches (mm)

.010 (0.25
.007 (0.18

TC1426/TC1427/TC1428

NOTES:

DS21393B-page 10  2002 Microchip Technology Inc.

TC1426/TC1427/TC1428

Sales and Support

Data Sheets

Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recom­mended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:

1. Your local Microchip sales office

2. The Microchip Corporate Literature Center U.S. FAX: [phone]

3. The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.

New Customer Notification System

Register on our web site (www.microchip.com/cn) to receive the most current information on our products.

 2002 Microchip Technology Inc. DS21393B-page11

TC1426/TC1427/TC1428

NOTES:

DS21393B-page12  2002 Microchip Technology Inc.

TC1426/TC1427/TC1428

Information contained in this publication regarding device
applications and the like is intended through suggestion only
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
No representation or warranty is given and no liability is
assumed by Microchip Technology Incorporated with respect
to the accuracy or use of such information, or infringement of
patents or other intellectual property rights arising from such
use or otherwise. Use of Microchip’s products as critical com­ponents in life support systems is not authorized except with
express written approval by Microchip. No licenses are con­veyed, implicitly or otherwise, under any intellectual property
rights.

Trademarks

The Microchip name and logo, the Microchip logo, FilterLab,

EELOQ, microID, MPLAB, PIC, PICmicro, PICMASTER,

K

PICSTART, PRO MATE, SEEVAL and The Embedded Co ntrol

Solutions Company are registered trademarks of Microchip Tech­nology Incorporated in the U.S.A. and other countries.

dsPIC, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB,
In-Circuit Serial Programming, ICSP, ICEPIC, microPort,
Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM,
MXDEV, PICC, PICDEM, PICDEM.net, rfPIC, Select Mode
and T otal Endurance are trademarks of Microchip Technology
Incorporated in the U.S.A.

Serialized Quick Turn Programming (SQTP) is a service mark
of Microchip Technology Incorporated in the U.S.A.

All other trademarks mentioned herein are property of their
respective companies.

© 2002, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.

Printed on recycled paper.

Microchip received QS-9000 quality system
certification for its worldwide headquarters,
design and wafer fabrication facilities in
Chandler and Tempe, Arizona in July 1999
and Mountain View, California in March 2002.
The Company’s quality system processes and
procedures are QS-9000 compliant for its
PICmicro

devices, Serial EEPROMs, micrope ri ph era ls,
non-volatile memory and ana l og pro duc ts. In
addition, Microchip’s quality system for the
design and manufacture of development
systems is ISO 9001 certified.

®

8-bit MCUs, KEELOQ

®

code hoppin g

 2002 Microchip Technology Inc. DS21393B-page 13

M

WORLDWIDE SALES AND SERVICE

AMERICAS

Corporate Office

2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: [phone] Fax: [phone]
Technical Support: 480-792-7627
Web Address: http://www.microchip.com

Rocky Mountain

2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: [phone] Fax: [phone]

Atlanta

500 Sugar Mill Road, Suite 200B
Atlanta, GA 30350
Tel: [phone] Fax: [phone]

Boston

2 Lan Drive, Suite 120
Westford, MA 01886
Tel: [phone] Fax: [phone]

Chicago

333 Pierce Road, Suite 180
Itasca, IL 60143
Tel: [phone] Fax: [phone]

Dallas

4570 Westgrove Drive, Suite 160
Addison, TX 75001
Tel: [phone] Fax: [phone]

Detroit

Tri-Atria Office Building
32255 Northwestern Highway, Suite 190
Farmington Hills, MI 48334
Tel: [phone] Fax: [phone]

Kokomo

2767 S. Albright Road
Kokomo, Indiana 46902
Tel: [phone] Fax: [phone]

Los Angeles

18201 Von Karman, Suite 1090
Irvine, CA 92612
Tel: [phone] Fax: [phone]

New York

150 Motor Parkway, Suite 202
Hauppauge, NY 11788
Tel: [phone] Fax: [phone]

San Jose

Microchip Technology Inc.
2107 North First Street, Suite 590
San Jose, CA 95131
Tel: [phone] Fax: [phone]

Toronto

6285 Northam Drive, Suite 108
Mississauga, Ontario L4V 1X5, Cana da
Tel: [phone] Fax: [phone]

ASIA/PACIFIC

Australia

Microchip Technology Australia Pty Ltd
Suite 22, 41 Rawson Street
Epping 2121, NSW
Australia
Tel: [phone] Fax: [phone]

China - Beij ing

Microchip Technology Consulting (Shanghai)
Co., Ltd., Beijing Liaison Office
Unit 915
Bei Hai Wan Tai Bldg.
No. 6 Chaoyangmen Beidajie
Beijing, 100027, No. China
Tel: [phone] Fax: [phone]

China - Chengdu

Microchip Technology Consulting (Shanghai)
Co., Ltd., Chengdu Liaison Office
Rm. 2401, 24th Floor,
Ming Xing Financial Tower
No. 88 TIDU Street
Chengdu 610016, China
Tel: [phone] Fax: [phone]

China - Fuzhou

Microchip Technology Consulting (Shanghai)
Co., Ltd., Fuzhou Liaison Office
Unit 28F, World Trade Plaza
No. 71 Wusi Road
Fuzhou 350001, China
Tel: [phone] Fax: [phone]

China - Shanghai

Microchip Technology Consulting (Shanghai)
Co., Ltd.
Room 701, Bldg. B
Far East International Plaza
No. 317 Xian Xia Road
Shanghai, 200051
Tel: [phone] Fax: [phone]

China - Shenzhen

Microchip Technology Consulting (Shanghai)
Co., Ltd., Shenzhen Liaison Office
Rm. 1315, 13/F, Shenzhen Kerry Centre,
Renminnan Lu
Shenzhen 518001, China
Tel: [phone] Fax: [phone]

Hong Kong

Microchip Technology Hongkong Ltd.
Unit 901-6, Tower 2, Metroplaza
223 Hing Fong Road
Kwai Fong, N.T., Hong Kong
Tel: [phone] Fax: [phone]

India

Microchip Technology Inc.
India Liaison Office
Divyasree Chambers
1 Floor, Wing A (A3/A4)
No. 11, O’Shaugnessey Road
Bangalore, 560 025, India
Tel: [phone] Fax: [phone]

Japan

Microchip Technology Japan K.K.
Benex S-1 6F
3-18-20, Shinyokohama
Kohoku-Ku, Yokohama-shi
Kanagawa, 222-0033, Japan
Tel: [phone] Fax: [phone]

Korea

Microchip Technology Korea
168-1, Youngbo Bldg. 3 Floor
Samsung-Dong, Kangnam-Ku
Seoul, Korea 135-882
Tel: [phone] Fax: [phone]

Singapore

Microchip Technology Singapore Pte Ltd.
200 Middle Road
#07-02 Prime Centre
Singapore, 188980
Tel: [phone] Fax: [phone]

Taiwan

Microchip Technology Taiwan
11F-3 , No. 20 7
Tung Hua North Road
Taipei, 105, Taiwan
Tel: [phone] Fax: [phone]

EUROPE

Denmark

Microchip Technology Nordic ApS
Regus Business Centre
Lautrup hoj 1-3
Ballerup DK-2750 Denmark
Tel: [phone] Fax: [phone]

France

Microchip Technology SARL
Parc d’Activite du Moulin de Massy
43 Rue du Saule Trapu
Batiment A - ler Etage
91300 Massy, France
Tel: [phone] Fax: [phone]

Germany

Microchip Technology GmbH
Gustav-Heinemann Ring 125
D-81739 Munich, Germany
Tel: [phone] Fax: [phone]

Italy

Microchip Technology SRL
Centro Direzionale Colleoni
Palazzo Taurus 1 V. Le Colleoni 1
20041 Agrate Brianza
Milan, Italy
Tel: [phone] Fax: [phone]

United Kingdom

Arizona Microchip Technology Ltd.
505 Eskdale Road
Winnersh Triangle
Wokingham
Berkshire, England RG41 5TU
Tel: [phone] Fax: [phone]

03/01/02

' &'

DS21393B-page 14  2002 Microchip Technology Inc.