Microchip Technology TC1173-2.5VOA, TC1173-5.0VUA, TC1173-3.3VUA, TC1173-3.0VUA, TC1173-3.0VOA Datasheet
...
TC1173
300mA CMOS LDO w ith Shutdo wn ERROR Output and Bypass
Features
• Extremely Low Supply Current for Longer Battery Life
• Very Low Dr opout Voltage
• 300mA Output Current
• Standard or Custom Output Voltages
• ERROR
Output Can Be Used as a Low Battery
Detector or Processor Reset Generator
• Power Saving Shutdown Mode
• Bypass Input for Ultra Quiet Operation
• Over Current and O ver Temperature Protection
• Space-Saving MSOP Package Option
Applications
• Battery Operated Systems
• PortableComputers
• Medical Instruments
• Instrumentation
• Cellular/GSM/PHSPhones
• Linear Post-Regulators for SMPS
• Pagers
Device Selection Table
Part Number Package
TC1173-xxVOA 8-Pin SOIC -40°C to +125°C
TC1173-xxVUA 8-Pin MSO P -40°C to +125°C
NOTE: xx indicates outputvoltages
Available Output Voltages: 2.5, 2.8, 3.0, 3.3, 5.0.
Otheroutputvoltagesareavailable.Please contactMicrochip
T echnology Inc. for details.
Junction
Temp. Range
General Description
The TC1173 is a precision output (typically ±0.5%)
CMOS low dropout regulator. Total supply current is
typically 50µA at full load ( 20 to 60 times lower than in
bipolar regulators).
TC1173 key features include ultra low noise operation
(plus optional Bypass input); very low dropout voltage
(typically 240mV at full load) and i nternal feed-forward
compensation for fast response to step changes in
load. An error output (ERROR
) is asserted when the
TC1173 is out-of-regulation (due to a low input voltage
or excessive output current). ERROR
low battery war ning or as a processor RESET
canbesetasa
signal
(with the addition of an external RC network). Supply
current is reduced to 0.05µA (typical) and V
ERROR
fall to zero when the shutdown input is low.
OUT
and
The TC1173 incorporates both over temperature and
over current pr otection. The TC1173 is stable with an
output capacitor of only 1µF and has a maximum
output current of 300mA.
Typical Application
V
OUT
1
V
C1
1µF
OUT
2
GND
+
TC1173
3
NC
45
Bypass
C
BYPASS
470pF
(Optional)
ERROR
Shutdown Control
(from Power Control Logic)
V
NC
SHDN
8
IN
7
6
R3
1M
V
IN
ERROR
Package Type
8-Pin MSOP
1
V
OUT
2
GND
Bypass
2002 Microchip TechnologyInc. DS21362B-page 1
NC
TC1173VUA
3
4
8
7
6
5
V
IN
NC
SHDN
ERROR
V
OUT
GND
Bypass
NC
8-Pin SOIC
1
2
TC1173VOA
3
4
8
7
6
5
V
IN
NC
SHDN
ERROR
TC1173
1.0 ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings*
Input Voltage .........................................................6.5V
Output Voltage..................(V
– 0.3V) to (VIN+0.3V)
SS
Stresses above those listed under "Absolute Maximum
Ratings" may cause permanent damage to the device. These
are stress ratings only and functional operation of the device
at these or any other conditions above those indicated in the
operation sections of the specifications is not implied.
Exposure to Absolute Maximum Rating conditions f or
extended periods may affectdevice reliability.
Power Dissipation................Internally Limited (Note 6)
Maximum Voltage on Any Pin ........V
Operating Temperature Range......-40°C < T
+0.3V to -0.3V
IN
<125°C
J
Storage Temperature..........................-65°C to +150°C
TC1173 ELECTRICAL SPECIFICATIONS
Electrical Characteristics: VIN=V
type specifications apply for junctiontemperaturesof -40°C to +125°C.
Symbol Parameter Min Typ Max Units Test Conditions
V
IN
I
OUTMAX
V
OUT
/∆TV
∆V
OUT
/∆V
∆V
OUT
∆V
OUT/VOUT
V
IN-VOUT
I
SS1
I
SS2
InputOperating Voltage 2.7 — 6.0 V Note 8
Maximum Output Current 300 ——mA
Output Voltage —
Temperature Coefficient — 40 —ppm/°CNote 2
OUT
Line Regulation — 0.05 0.35 %(VR+1V)≤ VIN ≤ 6V
IN
Load Regulation — 0.5 2.0 %IL= 0.1mA to I
DropoutVoltage —
Supply Current — 50 90 µA SHDN =V
Shutdown Supply Current — 0.05 0.5 µA SHDN =0V
PSRR Power Supply Rejection Ratio — 60 — dB F
I
OUTSC
∆V
OUT
/∆P
Output Short Circuit Current — 550 650 mA V
Thermal Regulation — 0.04 — V/W Note 5
D
eN Output Noise — 260 — nV/√Hz
Input
SHDN
V
IH
V
IL
SHDN Input High Threshold 45 ——%V
SHDN Input Low Threshold — — 15 %V
ERROR Output
V
MIN
V
OL
V
TH
V
OL
Note 1: VRis the user-programmed regulator output voltage setting.
2:
3: Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range
4: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value measured at a
5: Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or
6: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the
7: Hysteresis voltage is referenced by V
8: The minimum V
MinimumOperatingVoltage 1.0 — — V
Output Logic Low Voltage — — 400 mV 1 mA Flows to ERROR
ERROR Threshold Voltage — 0.95 x V
ERROR Positive Hysteresis — 50 — mV Note 7
TC V
=(V
OUT
OUTMAX–VOUTMIN
V
OUT
from 0.1mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal regulation specification.
1V differential.
line regulation effects. Specifications are for a current pulse equal to I
thermal resistance from junction-to-air (i.e., T
thermal shutdown. Please see Section 4.0 Thermal Considerations for more details.
has to justify the conditions: VIN≥ VR+V
IN
+1V,IL=0.1mA,CL=3.3µF, SHDN >VIH,TA= 25°C, unless otherwise noted. Boldface
OUT
V
R
–2.5%
—
—
V
±0.5%
R
240
—
20
80
V
R
—
+2.5%
30
160
480
V Note 1
mV I
=0.1mA
L
I
=100mA
L
I
=300mA(Note 4)
L
RE
OUT
≤ 1kHz
=0V
F=1kHz,C
R
=50Ω
LOAD
IN
IN
—V
R
6
)x10
x ∆T
at VIN= 6V for T = 10 msec.
LMAX
, θJA). Exceeding the maximum allowable power dissipation causes the device to initiate
A,TJ
.
R
and VIN≥ 2.7V for IL= 0.1mA to I
DROPOUT
OUTMAX
.
IH,
OUT
OUTMAX
=1µF,
(Note 3)
DS21362B-page 2
2002 Microchip TechnologyInc.
2.0 PIN DESCRIPTIONS
ThedescriptionsofthepinsarelistedinTable2-1.
TABLE 2-1: PIN FUNCTION TABLE
Pin No.
(8-Pin SOIC)
(8-Pin MSOP)
1V
2 GND Ground terminal.
3 NC No connect.
4 Bypass Reference bypass input. Connecting a 470pFto this input further reduces outputnoise.
5 ERROR
6 SHDN
7 NC No connect.
8V
Symbol Description
OUT
Regulated voltage output.
Out-of-RegulationFlag.(Open drain output). This output goes low whenV
by approximately – 5%.
Shutdown control input. The regulator is fully enabled when a logic high is applied to this input.
The regulator enters shutdown when a logiclowis appliedto thisinput. During shutdown, output
voltage falls to zero and supply current is reduced to 0.05µA(typical).
Unregulatedsupply input.
IN
TC1173
is out-of-tolerance
OUT
2002 Microchip TechnologyInc. DS21362B-page 3
TC1173
3.0 DETAILED DESCRIPTION
The TC1173 is a fixed output, l ow drop-out regulator.
Unlike bipolar regulators, the TC1173’s supply current
does not increase with load current. In addition, V
remains s table and within regulation over the entire
0mA t o I
OUTMAX
operating load current range, (an
important consideration in RTC and CMOS RAM
battery back-up applications).
Figure 3-1 shows a typical application circuit. The
regulator is enabled any time the shutdown input
(SHDN
) is at or above VIH, and shutdown (disabled)
when SHDN
is at or below VIL. SHDN may be
controlled by a CMOS logic gate, or I/O port of a
microcontroller. If the SHDN
input is not required, it
should be connected directly to the input s upply. While
in shutdown, supply current decreases to 0.05µA
(typical), V
falls to zero and ERROR is disabled.
OUT
FIGURE 3-1: TYPICAL APPLICATION
CIRCUIT
V
OUT
+
C1
1µF
(from Power Control Logic)
C
BYPASS
470pF
(Optional)
1
V
OUT
2
GND
TC1173
3
NC
4
Bypass
Shutdown Control
C3 required only if ERROR
is used as a processor RESET signal.
V
NC
SHDN
ERROR
8
IN
7
6
5
(see text)
1M
+
R3
C3
0.2µF
3.1 ERROR Output
ERROR is driven low whenever V
regulation by more than – 5% (typical). This condition
may be caused by low input voltage, output current
limiting, or thermal limiting. The ERROR
5% below rated V
regardless of t he programmed
OUT
output voltage value (e.g., ERROR
(typ.) for a 5.0V r egulator and 2.85V (typ.) for a 3.0V
regulator). ERROR
output operation is shown in
Figure 3-2.
Note that ERROR
V
, and inactive when V
TH
is active when V
is above VTH+VH.
OUT
As shown in Figure 3-1, ERROR
battery low flag, or as a processor RESET
the addition oftiming capacitor C3). R1 x C3 should be
chosen to maintain ERROR
RESET
input for at least 200 msec to allow time for the
below VIHof the processor
system to stabilize. Pull-up resistor R1 can be tied to
V
OUT,VIN
or any other voltage less than (VIN+0.3V).
falls out of
OUT
threshold is
=VOLat 4.75V
is at or below
OUT
canbeusedasa
OUT
C2
1µF
+
–
Battery
RESET or
Battery Low
signal (with
FIGURE 3-2: ERROR OU TPUT
OPERATION
V
OUT
V
ERROR
V
V
TH
IH
OL
HYSTERESIS (VH)
3.2 Output Capacitor
A1µF (min) capacitor from V
recommended. The output capacitor should have an
effective series resistance greater than 0.1Ω and less
than 5.0Ω.A1µF capacitor should be connected from
V
to GND if there is more t han 10 inches of wire
IN
betweenthe regulator and the AC filter capacitor,or if a
battery is used as the power source. Aluminum
electrolytic or tantalum capacitor types can be used.
(Since many aluminum electrolytic capacitors freeze at
approximately -30°C, solid tantalums are recommended for applications operating below -25°C.)
When operating f rom sources other than batteries,
supply-noise rejection and transient response can be
improved by i ncreasing the value of the input and
output capacitors and employing passive filtering
techniques.
to ground is
OUT
3.3 Bypass Input
A 470pF capacitor connected from the Bypass input to
ground reduces noise present on the internal
reference, which in turn significantly reduces output
noise.Ifoutputnoiseisnota concern,thisinputmaybe
left unconnected. Larger capacitor values may be
used, but resultsin a longer time period to rated output
voltage when power is initially applied.
DS21362B-page 4
2002 Microchip TechnologyInc.
TC1173
4.0 THERMAL CONSIDERATIONS
4.1 Thermal S hutdown
Integrated thermal protection circuitry shuts the
regulator off when die temperature exceeds 150°C.
The regulator remains off until the die temperature
drops to approximately 140°C.
4.2 Power Dissipation
The amount of power the regulator dissipates is
primarily a function of input and output voltage, and
output current. The following equation is used to
calculate worst case actual power dissipation:
EQUATION 4-1:
≈ (V
P
D
Where:
P
= Worst case actual power dissipation
D
V
= Maximum voltage on V
IN
MAX
V
I
LOAD
= Minimum regulator output voltage
OUT
MIN
= Maximum output (load) current
MAX
The maximum allowable power dissipation (Equation
4-2) is a function of the maximum ambient temperature
(T
), the maximum allowable die temperature
A
MAX
(T
) and the thermal resistance from junction-to-air
JMAX
(θ
). The 8-Pin SOIC package has a θJAof approxi-
JA
mately 160°C/Watt, while the 8- Pin MSOP package
has a θ
of approximately 200°C/Watt.
JA
–V
IN
MAX
OUT
MIN
)I
LOAD
IN
MAX
EQUATION 4-2:
P
=(T
DMAX
JMAX–TAMAX
θ
Where all terms ar e previously defined.
Equation 4-1 can b e used in conjunction with Equation
4-2 to ensure regulator thermal operation is within
limits. For example:
Given:
V
INMAX
V
OUTMIN
I
LOADMAX
T
JMAX
T
AMAX
θ
JA
= 3.0V ± 10%
= 2.7V ± 0.5%
= 250mA
= 125°C
=55°C
= 200°C/W
8-Pin MSOP Package
Find: 1. Actual power dissipation
2. Maximum allowable dissipation
Actual power dissipation:
≈ (V
P
D
INMAX–VOUTMIN)ILOADMAX
= [ (3.0 x 1.1) – (2.7 x .995)]250 x 10
= 155mW
Maximum allowable power dissipation:
P
DMAX
=(T
JMAX–TAMAX
θ
)
JA
= (125 – 55)
200
= 350mW
)
JA
–3
In this example, the TC1173 dissipates a maximum of
155mW; below the allowable limit of 350mW. I n a
similar manner, Equation 4-1 and Equation 4-2 can be
used to calculate m aximum current and/or input
voltage limits. For example, the maximum allowable
V
is found by substituting the maximum allowable
IN
power dissipation of 250mW into Equation 4-1, from
which V
INMAX
=4.1V.
4.3 Layout Considerations
The primary path of heat conduction out of the package
is via the package leads. Therefore, layouts having a
ground plane, wi de traces at the pads, and wide power
supply bus lines combine to lower θ
increase the maximum allowable power dissipation
limit.
and t herefore
JA
2002 Microchip TechnologyInc. DS21362B-page 5
TC1173
5
C
8
C
0
C
5
C
0
C
0
C
5.0 TYPICAL CHARACTERISTICS
Note: The graphs and tables provided f ollowing this note are a statisticalsummary based on a limited number of
samplesandareprovidedforinformational purposesonly.Theperformancecharacteristicslistedhereinare
not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range ( e.g., outside specified power supply range) and therefore outside the warranted range.
0.012
0.010
0.008
0.006
0.004
0.002
0.000
LINE REGULATION (%)
-0.002
-0.004
-40° -20°
0° 20° 40° 60° 80° 100° 120°
TEMPERATURE (
Supply Current
100.0
90.0
80.0
70.0
60.0
SUPPLY CURRENT (µA)
50.0
40.0
-40° -20°
0° 20° 40° 60° 80° 100° 120°
TEMPERATURE (°C)
Line Regulation
°C)
Output Noise
NOISE (µV/√HZ)
10.0
1.0
0.1
0.0
0.01
0.01 1
FREQUENCY (kHz)
10
R
C
LOAD
OUT
Dropout Voltage vs. Load Current
0.40
0.35
0.30
0.25
0.20
0.15
0.10
DROPOUT VOLTAGE (V)
0.05
0.00
0
50
12
7
2
-4
150
100
LOAD CURRENT (mA)
200 250 300
= 50Ω
= 1µF
100 1000
2.00
Load Regulation
1.80
1.60
1.40
1.20
1.00
0.80
0.60
LOAD REGULATION (%)
0.40
0.20
0.00
-40° -20° 0° 20° 40° 60° 80° 100° 120°
3.075
VIN = 4V
I
LOAD
C
LOAD
3.025
(V)
OUT
V
2.975
2.925
-40° -20°
1 to 300mA
1 to 100mA
TEMPERATURE (
V
vs. Temperature
OUT
= 100µA
= 3.3µF
0° 20° 40° 60° 80° 100° 120°
TEMPERATURE (°C)
1 to 50mA
°C)
DS21362B-page 6
2002 Microchip TechnologyInc.
6.0 PACKAGING INFORMATION
6.1 Package Marking Information
Package marking data not available at this time.
6.2 Taping Form
Component Taping Orientation for 8-Pin MSOP Devices
PIN 1
TC1173
User Direction of Feed
W
P
Standard Reel Component Orientation
for TR Suffix Device
Carrier Tape, Number of Components Per Reel and Reel Size
Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size
8-Pin MSOP 12 mm 8 mm 2500 13 in
Component Taping Orientation for 8-Pin SOIC (Narrow) Devices
User Direction of Feed
PIN 1
W
P
Standard Reel Component Orientation
for TR Suffix Device
Carrier Tape, Number of Components Per Reel and Reel Size
Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size
8-Pin SOIC (N) 12 mm 8 mm 2500 13 in
2002 Microchip TechnologyInc. DS21362B-page 7
TC1173
.
8
)
)
)
)
)
)
)
)
)
)
)
)
)
)
)
)
8
C
6.3 Package Dimensions
8-Pin MSOP
PIN 1
.026 (0.65) TYP.
.016 (0.40)
.010 (0.25)
-Pin SOI
.122 (3.10)
.114 (2.90)
.006 (0.15)
.002 (0.05)
.122 (3.10)
.114 (2.90)
.197 (5.00)
.189 (4.80)
.043 (1.10)
MAX.
6° MAX.
.008 (0.20)
.005 (0.13)
.028 (0.70)
.016 (0.40)
Dimensions: inches (mm)
DS21362B-page 8
.050 (1.27) TYP
.197 (5.00
.189 (4.80
.020 (0.51
.013 (0.33
.157 (3.99
.150 (3.81
.010 (0.25
.004 (0.10
.244 (6.20
.228 (5.79
.069 (1.75
.053 (1.35
.050 (1.27
.016 (0.40
.010 (0.25
.007 (0.18
Dimensions: inches (mm)
2002 Microchip TechnologyInc.
TC1173
SALES AND SUPPORT
Data Sheets
Products supportedby a preliminaryData Sheet may have an errata sheet describing minor operational differences and recommendedworkarounds.To determine if an erratasheet exists for a particulardevice, please contactoneof the following:
1. Your local Microchip sales office
2. The Microchip CorporateLiterature Center U.S. FAX: (480)792-7277
3. The Microchip Worldwide Site (www.microchip.com)
Pleasespecify which device, revision of silicon and Data Sheet (includeLiterature #) you are using.
New Customer Notification System
Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
2002 Microchip Technology Inc. DS21362B-page 9
TC1173
NOTES:
DS21362B-page 10 2002 Microchip Technology Inc.
TC1173
Information contained in this publication regarding device
applications and the like is intended through suggestion only
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
No representation or warranty is given and no liability is
assumed by Microchip Technology Incorporated with respect
to the accuracy or use of such information, or infringement of
patents or other intellectual property rights arising from such
use or otherwise. Use of Microchip’s products as critical components in life support systems is not authorized except with
express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property
rights.
Trademarks
The Microchip name and logo, the Microchip logo, FilterLab,
K
EELOQ,microID,MPLAB,PIC,PICmicro,PICMASTER,
PICSTART, PRO MATE, SEEVAL and The Embedded Control
SolutionsCompany areregiste red trademarksof MicrochipTechnologyIncorp or ated in the U.S.A. and other countries .
dsPIC, ECONOMONITOR, FanS ense, FlexROM, fuzzyLAB,
In-Circuit Serial Programming, ICSP, ICEPIC, microPort,
Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM,
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Mode and Total Endurance are trademarks of Microchip
TechnologyIncorporated in the U.S.A.
Serialized Quick Turn Programming (SQTP) is a service mark
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© 2002, Microchip T echnology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received QS-9000 quality system
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The Company’s quality system processes and
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2002 Microchip TechnologyInc. DS21362B-page 11
8-bit MCUs, KEELOQ®code hopping
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Japan
Microchip Technology Japan K.K.
Benex S-1 6F
3-18-20, Shinyokohama
Kohoku-Ku, Yokohama-shi
Kanagawa, 222-0033, Japan
Tel: 81-45-471- 6166 Fax: 81-45-471-6122
Korea
Microchip Technology Korea
168-1, Youngbo Bldg. 3 Floor
Samsung-Dong, Kangnam-Ku
Seoul, Korea 135-882
Tel: 82-2-554-7200 Fax: 82-2-558-5934
Singapore
Microchip Technology Singapore Pte Ltd.
200 Middle Road
#07-02 Prime Centre
Singapore, 188980
Tel: 65-6334-8870 Fax: 65-6334-8850
Taiwan
Microchip Technology Taiwan
11F-3, No. 207
Tung HuaNorth Road
Taipei, 105, Taiwan
Tel: 886-2-2717-7175 Fax: 886-2-2545-0139
EUROPE
Denmark
Microchip Technology Nordic ApS
Regus Business Centre
Lautrup hoj 1-3
Ballerup DK-2750 Denmark
Tel: 45 4420 9895 Fax: 45 4420 9910
France
Microchip Technology SARL
Parc d’Activite du Moulin de Massy
43 Rue du Saule Trapu
Batiment A - ler Etage
91300 Massy, France
Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79
Germany
Microchip Technology GmbH
Gustav-Heinemann Ring 125
D-81739 Munich, Germany
Tel: 49-89-627-144 0 Fax: 49-89-627-144-44
Italy
Microchip Technology SRL
Centro Direzionale Colleoni
Palazzo Taurus 1 V. Le Colleoni 1
20041 Agrate Brianza
Milan, Italy
Tel: 39-039-65791-1 Fax: 39-039-6899883
United Kingdom
Microchip Ltd.
505 Eskdale Road
Winnersh Triangle
Wokingham
Berkshire, EnglandRG41 5TU
Tel: 44 118 921 5869 Fax: 44-118921-5820
05/01/02
DS21362B-page 12
*DS21362B*
2002 Microchip Technology Inc.
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